JPS63136352U - - Google Patents
Info
- Publication number
- JPS63136352U JPS63136352U JP2834287U JP2834287U JPS63136352U JP S63136352 U JPS63136352 U JP S63136352U JP 2834287 U JP2834287 U JP 2834287U JP 2834287 U JP2834287 U JP 2834287U JP S63136352 U JPS63136352 U JP S63136352U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- circuit board
- printed circuit
- resist layer
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Details Of Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例に係る表面実装用部
品の両面実装型プリント基板への半田付け構造を
一部断面して示す側面図、第２図は本考案の他の
実施例に係る半田付け構造を一部断面して示す側
面図である。
１：プリント基板、２：ＩＣ、３：リード、４
：レジスト層、５：半田、６：パツド。
FIG. 1 is a partially sectional side view showing a structure for soldering surface mount components to a double-sided printed circuit board according to one embodiment of the present invention, and FIG. FIG. 2 is a partially cross-sectional side view of the soldering structure. 1: Printed circuit board, 2: IC, 3: Lead, 4
: resist layer, 5: solder, 6: padded.
Claims (1)
より半田付けして実装する表面実装用部品におい
て、 上記リードの上部を覆うようにレジスト層を設
けたことを特徴とする表面実装用部品。[Scope of Claim for Utility Model Registration] A surface mount component in which leads are soldered and mounted on the surface of a printed circuit board using a reflow method, characterized in that a resist layer is provided to cover the upper part of the leads. parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2834287U JPS63136352U (en) | 1987-02-27 | 1987-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2834287U JPS63136352U (en) | 1987-02-27 | 1987-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63136352U true JPS63136352U (en) | 1988-09-07 |
Family
ID=30831210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2834287U Pending JPS63136352U (en) | 1987-02-27 | 1987-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63136352U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH023695A (en) * | 1988-06-18 | 1990-01-09 | Kuraray Co Ltd | Steroid derivative and production thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4989158A (en) * | 1972-12-29 | 1974-08-26 |
-
1987
- 1987-02-27 JP JP2834287U patent/JPS63136352U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4989158A (en) * | 1972-12-29 | 1974-08-26 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH023695A (en) * | 1988-06-18 | 1990-01-09 | Kuraray Co Ltd | Steroid derivative and production thereof |