JPS641721A - Epoxy polymer composition for sealing semiconductor - Google Patents

Epoxy polymer composition for sealing semiconductor

Info

Publication number
JPS641721A
JPS641721A JP15832087A JP15832087A JPS641721A JP S641721 A JPS641721 A JP S641721A JP 15832087 A JP15832087 A JP 15832087A JP 15832087 A JP15832087 A JP 15832087A JP S641721 A JPS641721 A JP S641721A
Authority
JP
Japan
Prior art keywords
epoxy resin
epoxy polymer
composition
polymer composition
high heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15832087A
Other languages
Japanese (ja)
Other versions
JPH0784512B2 (en
JPH011721A (en
Inventor
Ichiro Takahashi
Goro Okamoto
Hiromi Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP15832087A priority Critical patent/JPH0784512B2/en
Publication of JPH011721A publication Critical patent/JPH011721A/en
Publication of JPS641721A publication Critical patent/JPS641721A/en
Publication of JPH0784512B2 publication Critical patent/JPH0784512B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To obtain the titled composition having low modulus of elasticity and high heat shock resistance while maintaining high heat resistance, high water-vapor resistance and low coefficient of thermal expansion, containing a specific epoxy polymer.
CONSTITUTION: The aimed composition containing preferably ≥40wt.% based on an epoxy resin (preferably novolak type epoxy resin) of a cresol type trifunctional epoxy resin shown by the formula. The composition preferably contains a curing agent, a curing promoter, a filler, a flame-retardant, a mold release agent or a surface treatment.
COPYRIGHT: (C)1989,JPO&Japio
JP15832087A 1987-06-24 1987-06-24 Epoxy resin composition for semiconductor encapsulation Expired - Lifetime JPH0784512B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15832087A JPH0784512B2 (en) 1987-06-24 1987-06-24 Epoxy resin composition for semiconductor encapsulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15832087A JPH0784512B2 (en) 1987-06-24 1987-06-24 Epoxy resin composition for semiconductor encapsulation

Publications (3)

Publication Number Publication Date
JPH011721A JPH011721A (en) 1989-01-06
JPS641721A true JPS641721A (en) 1989-01-06
JPH0784512B2 JPH0784512B2 (en) 1995-09-13

Family

ID=15669059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15832087A Expired - Lifetime JPH0784512B2 (en) 1987-06-24 1987-06-24 Epoxy resin composition for semiconductor encapsulation

Country Status (1)

Country Link
JP (1) JPH0784512B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5159820A (en) * 1989-07-05 1992-11-03 Nippondenso Co., Ltd. Oil separator integrally mounted on compressor
US5310826A (en) * 1989-04-26 1994-05-10 Akzo N.V. Thiolic compound polymerization cocatalysts

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5310826A (en) * 1989-04-26 1994-05-10 Akzo N.V. Thiolic compound polymerization cocatalysts
US5159820A (en) * 1989-07-05 1992-11-03 Nippondenso Co., Ltd. Oil separator integrally mounted on compressor

Also Published As

Publication number Publication date
JPH0784512B2 (en) 1995-09-13

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