JPS6415377A - Method for forming patterned plating on base material - Google Patents

Method for forming patterned plating on base material

Info

Publication number
JPS6415377A
JPS6415377A JP17039087A JP17039087A JPS6415377A JP S6415377 A JPS6415377 A JP S6415377A JP 17039087 A JP17039087 A JP 17039087A JP 17039087 A JP17039087 A JP 17039087A JP S6415377 A JPS6415377 A JP S6415377A
Authority
JP
Japan
Prior art keywords
base material
stage
forming
printed pattern
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17039087A
Other languages
Japanese (ja)
Inventor
Naosuke Adachi
Takahiko Oe
Nobuyuki Otsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ADACHI SHIN SANGYO KK
Original Assignee
ADACHI SHIN SANGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ADACHI SHIN SANGYO KK filed Critical ADACHI SHIN SANGYO KK
Priority to JP17039087A priority Critical patent/JPS6415377A/en
Publication of JPS6415377A publication Critical patent/JPS6415377A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method

Abstract

PURPOSE:To reduce the labor and cost required for production in a process for executing metal plating by adopting the constitution consisting in preparing a vehicle for printing mixed with special powder to serve as a plating catalyst, printing this vehicle directly on a base material and subjecting only the printed pattern surface of this base material to electroless metal plating in the stage for applying metal plating. CONSTITUTION:The patterned plating is formed on the base material by the under-mentioned stages (a)-(e). (a) The stage for forming the powder 3 deposited with the catalyst metal 2 on the outside surface of fine powder nuclei 1 of inorg. and org. materials; (b) the stage for forming the vehicle 3 for printing by mixing the powder 3 with a binder resin 4 in the form of a soln.; (c) the stage for forming the printed pattern films 6 on the base material 10 for forming the patterned plating by using the vehicle 5 for printing; (d) the stage for curing the printed pattern films 6; and (e) the stage for immersing the base material 10 having the printed pattern films 6 into an electroless metal plating liquid 7 and depositing and forming the metal plating layer 8 over the entire surface of the printed pattern films 6 with the catalyst metal 2 of the powder 3 positioned on the surface of the films 6 as a base body for deposition.
JP17039087A 1987-07-07 1987-07-07 Method for forming patterned plating on base material Pending JPS6415377A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17039087A JPS6415377A (en) 1987-07-07 1987-07-07 Method for forming patterned plating on base material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17039087A JPS6415377A (en) 1987-07-07 1987-07-07 Method for forming patterned plating on base material

Publications (1)

Publication Number Publication Date
JPS6415377A true JPS6415377A (en) 1989-01-19

Family

ID=15904041

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17039087A Pending JPS6415377A (en) 1987-07-07 1987-07-07 Method for forming patterned plating on base material

Country Status (1)

Country Link
JP (1) JPS6415377A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0430930U (en) * 1990-07-07 1992-03-12
JPH04202672A (en) * 1990-11-29 1992-07-23 Matsushita Electric Ind Co Ltd Formation of electrode for ceramic electronic part
JP2002223095A (en) * 2001-01-24 2002-08-09 Dainippon Printing Co Ltd Manufacturing method of electromagnetic wave shield material and pattern formation method
JP2009263700A (en) * 2008-04-23 2009-11-12 Bridgestone Corp Electroless plating preprocessing agent, manufacturing method of light-transmissive electromagnetic wave shielding material, and light-transmissive electromagnetic wave shielding material
JP2013151759A (en) * 2007-07-17 2013-08-08 Samsung Display Co Ltd Method of patterning substrate
JP2019212506A (en) * 2018-06-06 2019-12-12 株式会社水田製作所 Indirect lighting unit using circuit board
JP2021037037A (en) * 2019-09-02 2021-03-11 株式会社ワイ・ケー電子 Shoehorn

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227618A (en) * 1975-07-15 1977-03-02 Rca Corp Device for positioning original disk for energy beam recorder
JPS6278179A (en) * 1985-09-30 1987-04-10 三菱電機株式会社 Electroless plating process for ceramic circuit substrate
JPS62128594A (en) * 1985-11-30 1987-06-10 古河電気工業株式会社 Formation of conducting circuit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227618A (en) * 1975-07-15 1977-03-02 Rca Corp Device for positioning original disk for energy beam recorder
JPS6278179A (en) * 1985-09-30 1987-04-10 三菱電機株式会社 Electroless plating process for ceramic circuit substrate
JPS62128594A (en) * 1985-11-30 1987-06-10 古河電気工業株式会社 Formation of conducting circuit

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0430930U (en) * 1990-07-07 1992-03-12
JPH04202672A (en) * 1990-11-29 1992-07-23 Matsushita Electric Ind Co Ltd Formation of electrode for ceramic electronic part
JP2002223095A (en) * 2001-01-24 2002-08-09 Dainippon Printing Co Ltd Manufacturing method of electromagnetic wave shield material and pattern formation method
JP2013151759A (en) * 2007-07-17 2013-08-08 Samsung Display Co Ltd Method of patterning substrate
JP2009263700A (en) * 2008-04-23 2009-11-12 Bridgestone Corp Electroless plating preprocessing agent, manufacturing method of light-transmissive electromagnetic wave shielding material, and light-transmissive electromagnetic wave shielding material
JP2019212506A (en) * 2018-06-06 2019-12-12 株式会社水田製作所 Indirect lighting unit using circuit board
JP2021037037A (en) * 2019-09-02 2021-03-11 株式会社ワイ・ケー電子 Shoehorn

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