JPS6413753U - - Google Patents
Info
- Publication number
- JPS6413753U JPS6413753U JP1987110397U JP11039787U JPS6413753U JP S6413753 U JPS6413753 U JP S6413753U JP 1987110397 U JP1987110397 U JP 1987110397U JP 11039787 U JP11039787 U JP 11039787U JP S6413753 U JPS6413753 U JP S6413753U
- Authority
- JP
- Japan
- Prior art keywords
- housing
- predetermined number
- attached
- conductive pattern
- current limiting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
第１図は本考案に係る灯具の一実施例を示す一
部破断状態の平面図、第２図及び第３図は同実施
例の正面図及び側面図、第４図は同実施例におけ
るＬＥＤチツプの実装状態を示す正面図、第５図
は第４図の−線断面図、第６図は従来例を示
す一部破断状態の平面図である。 １……ハウジング、１Ａ……反射枠、２……導
電パターン、３……ＬＥＤチツプ、４……金線、
５……電流制限用抵抗、６……ワイヤーハーネス
、７……アウターレンズ。
部破断状態の平面図、第２図及び第３図は同実施
例の正面図及び側面図、第４図は同実施例におけ
るＬＥＤチツプの実装状態を示す正面図、第５図
は第４図の−線断面図、第６図は従来例を示
す一部破断状態の平面図である。 １……ハウジング、１Ａ……反射枠、２……導
電パターン、３……ＬＥＤチツプ、４……金線、
５……電流制限用抵抗、６……ワイヤーハーネス
、７……アウターレンズ。
Claims (1)
- ハウジングの後部内面に所定数の反射枠を一体
に成形するとともに、所定形状の導電パターンを
形成して所定数のＬＥＤチツプ、電流制限用抵抗
、逆電圧保護ダイオードなどを装着し、ハウジン
グの前面にアウターレンズを取付けたことを特徴
とする灯具。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987110397U JPS6413753U (ja) | 1987-07-17 | 1987-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987110397U JPS6413753U (ja) | 1987-07-17 | 1987-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6413753U true JPS6413753U (ja) | 1989-01-24 |
Family
ID=31347517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987110397U Pending JPS6413753U (ja) | 1987-07-17 | 1987-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413753U (ja) |
-
1987
- 1987-07-17 JP JP1987110397U patent/JPS6413753U/ja active Pending