JPS6412555A - Formation of bump and device therefor - Google Patents
Formation of bump and device thereforInfo
- Publication number
- JPS6412555A JPS6412555A JP62170042A JP17004287A JPS6412555A JP S6412555 A JPS6412555 A JP S6412555A JP 62170042 A JP62170042 A JP 62170042A JP 17004287 A JP17004287 A JP 17004287A JP S6412555 A JPS6412555 A JP S6412555A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- ball
- clamp
- bump
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To form a bump in a short time by a method wherein an external force is applied to a wire so as to leave a connected part on an object and cut and separate the rest of the wire to form a bump material, which is pressed and formed into a shape with a flat upper face of a prescribed height. CONSTITUTION:A ball 5 is formed on the tip of a wire through a spark by applying a high voltage between the wire 1 and an electric torch rod 4 through the rod 4. Then, loosening a clamp 2, a capillary 3 is made to be pulled down to the prescribed position on an object such as a wafer and the like so as to bond the ball 5. Next, tightening the clamp 2, the capillary 3 is made to be pulled up above the ball 5 1-3 times as far as the length of a diameter of the wire 5 and the wire 5 is made to be swayed right and left with the clamp 2, so that cracks or the like takes place at the joint between the ball section and the wire section. And, the wire is pulled up through the clamp 2 so as to cut off the ball section from the wire section. Thereafter, the clamp 2 is made to be pulled down and the wire 1 is made to extend from the tip of the capillary 3, and this process is continuously performed in a repeating way. And thus, a ball bump 9 is formed, of which upper face is flattened through a ball forming plate 8.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62170042A JPH0793305B2 (en) | 1987-07-07 | 1987-07-07 | Bump forming method and bump forming apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62170042A JPH0793305B2 (en) | 1987-07-07 | 1987-07-07 | Bump forming method and bump forming apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6412555A true JPS6412555A (en) | 1989-01-17 |
JPH0793305B2 JPH0793305B2 (en) | 1995-10-09 |
Family
ID=15897534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62170042A Expired - Lifetime JPH0793305B2 (en) | 1987-07-07 | 1987-07-07 | Bump forming method and bump forming apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0793305B2 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03188635A (en) * | 1989-12-18 | 1991-08-16 | Matsushita Electron Corp | Bump leveling method of semiconductor device and manufacturing equipment |
JPH03229423A (en) * | 1990-02-05 | 1991-10-11 | Matsushita Electron Corp | Bump-forming apparatus |
JPH0472734A (en) * | 1990-07-13 | 1992-03-06 | Matsushita Electron Corp | Projected electrode formation device |
JPH04116832A (en) * | 1990-09-06 | 1992-04-17 | Matsushita Electron Corp | Method and device for leveling bump |
JPH04180232A (en) * | 1990-11-14 | 1992-06-26 | Matsushita Electron Corp | Method and apparatus for manufacturing semicnductor device |
US5306664A (en) * | 1991-05-16 | 1994-04-26 | Seiko Epson Corp. | Semiconductor device, method of forming bump electrode of a semiconductor device, method of packaging a semiconductor device, chip carrier tape, display device and electronic printing device incorporating the semiconductor device |
JP2011053722A (en) * | 2010-12-17 | 2011-03-17 | Brother Industries Ltd | Fixing device and image forming apparatus |
CN111081843A (en) * | 2019-12-12 | 2020-04-28 | 荆门欧曼凯机电设备有限公司 | Linear curved surface light source production robot device |
CN111081844A (en) * | 2019-12-12 | 2020-04-28 | 荆门欧曼凯机电设备有限公司 | Linear curved surface light source production robot production line |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56142656A (en) * | 1980-04-09 | 1981-11-07 | Fujitsu Ltd | Semiconductor device |
JPS59208751A (en) * | 1983-05-13 | 1984-11-27 | Hitachi Ltd | Formation of bump |
JPS61242045A (en) * | 1985-04-19 | 1986-10-28 | Matsushita Electric Ind Co Ltd | Formation of bump and forming device thereof |
JPS62150854A (en) * | 1985-12-25 | 1987-07-04 | Hitachi Ltd | Formation of electrode and apparatus for same |
JPS62154648A (en) * | 1985-12-26 | 1987-07-09 | Toshiba Corp | Formation of bump |
-
1987
- 1987-07-07 JP JP62170042A patent/JPH0793305B2/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56142656A (en) * | 1980-04-09 | 1981-11-07 | Fujitsu Ltd | Semiconductor device |
JPS59208751A (en) * | 1983-05-13 | 1984-11-27 | Hitachi Ltd | Formation of bump |
JPS61242045A (en) * | 1985-04-19 | 1986-10-28 | Matsushita Electric Ind Co Ltd | Formation of bump and forming device thereof |
JPS62150854A (en) * | 1985-12-25 | 1987-07-04 | Hitachi Ltd | Formation of electrode and apparatus for same |
JPS62154648A (en) * | 1985-12-26 | 1987-07-09 | Toshiba Corp | Formation of bump |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03188635A (en) * | 1989-12-18 | 1991-08-16 | Matsushita Electron Corp | Bump leveling method of semiconductor device and manufacturing equipment |
JPH03229423A (en) * | 1990-02-05 | 1991-10-11 | Matsushita Electron Corp | Bump-forming apparatus |
JPH0472734A (en) * | 1990-07-13 | 1992-03-06 | Matsushita Electron Corp | Projected electrode formation device |
JPH04116832A (en) * | 1990-09-06 | 1992-04-17 | Matsushita Electron Corp | Method and device for leveling bump |
JPH04180232A (en) * | 1990-11-14 | 1992-06-26 | Matsushita Electron Corp | Method and apparatus for manufacturing semicnductor device |
US5306664A (en) * | 1991-05-16 | 1994-04-26 | Seiko Epson Corp. | Semiconductor device, method of forming bump electrode of a semiconductor device, method of packaging a semiconductor device, chip carrier tape, display device and electronic printing device incorporating the semiconductor device |
JP2011053722A (en) * | 2010-12-17 | 2011-03-17 | Brother Industries Ltd | Fixing device and image forming apparatus |
CN111081843A (en) * | 2019-12-12 | 2020-04-28 | 荆门欧曼凯机电设备有限公司 | Linear curved surface light source production robot device |
CN111081844A (en) * | 2019-12-12 | 2020-04-28 | 荆门欧曼凯机电设备有限公司 | Linear curved surface light source production robot production line |
CN111081843B (en) * | 2019-12-12 | 2021-04-09 | 荆门欧曼凯机电设备有限公司 | Linear curved surface light source production robot device |
CN111081844B (en) * | 2019-12-12 | 2021-04-09 | 荆门欧曼凯机电设备有限公司 | Linear curved surface light source production robot production line |
Also Published As
Publication number | Publication date |
---|---|
JPH0793305B2 (en) | 1995-10-09 |
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