JPS6412555A - Formation of bump and device therefor - Google Patents

Formation of bump and device therefor

Info

Publication number
JPS6412555A
JPS6412555A JP62170042A JP17004287A JPS6412555A JP S6412555 A JPS6412555 A JP S6412555A JP 62170042 A JP62170042 A JP 62170042A JP 17004287 A JP17004287 A JP 17004287A JP S6412555 A JPS6412555 A JP S6412555A
Authority
JP
Japan
Prior art keywords
wire
ball
clamp
bump
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62170042A
Other languages
Japanese (ja)
Other versions
JPH0793305B2 (en
Inventor
Keizo Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62170042A priority Critical patent/JPH0793305B2/en
Publication of JPS6412555A publication Critical patent/JPS6412555A/en
Publication of JPH0793305B2 publication Critical patent/JPH0793305B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To form a bump in a short time by a method wherein an external force is applied to a wire so as to leave a connected part on an object and cut and separate the rest of the wire to form a bump material, which is pressed and formed into a shape with a flat upper face of a prescribed height. CONSTITUTION:A ball 5 is formed on the tip of a wire through a spark by applying a high voltage between the wire 1 and an electric torch rod 4 through the rod 4. Then, loosening a clamp 2, a capillary 3 is made to be pulled down to the prescribed position on an object such as a wafer and the like so as to bond the ball 5. Next, tightening the clamp 2, the capillary 3 is made to be pulled up above the ball 5 1-3 times as far as the length of a diameter of the wire 5 and the wire 5 is made to be swayed right and left with the clamp 2, so that cracks or the like takes place at the joint between the ball section and the wire section. And, the wire is pulled up through the clamp 2 so as to cut off the ball section from the wire section. Thereafter, the clamp 2 is made to be pulled down and the wire 1 is made to extend from the tip of the capillary 3, and this process is continuously performed in a repeating way. And thus, a ball bump 9 is formed, of which upper face is flattened through a ball forming plate 8.
JP62170042A 1987-07-07 1987-07-07 Bump forming method and bump forming apparatus Expired - Lifetime JPH0793305B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62170042A JPH0793305B2 (en) 1987-07-07 1987-07-07 Bump forming method and bump forming apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62170042A JPH0793305B2 (en) 1987-07-07 1987-07-07 Bump forming method and bump forming apparatus

Publications (2)

Publication Number Publication Date
JPS6412555A true JPS6412555A (en) 1989-01-17
JPH0793305B2 JPH0793305B2 (en) 1995-10-09

Family

ID=15897534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62170042A Expired - Lifetime JPH0793305B2 (en) 1987-07-07 1987-07-07 Bump forming method and bump forming apparatus

Country Status (1)

Country Link
JP (1) JPH0793305B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03188635A (en) * 1989-12-18 1991-08-16 Matsushita Electron Corp Bump leveling method of semiconductor device and manufacturing equipment
JPH03229423A (en) * 1990-02-05 1991-10-11 Matsushita Electron Corp Bump-forming apparatus
JPH0472734A (en) * 1990-07-13 1992-03-06 Matsushita Electron Corp Projected electrode formation device
JPH04116832A (en) * 1990-09-06 1992-04-17 Matsushita Electron Corp Method and device for leveling bump
JPH04180232A (en) * 1990-11-14 1992-06-26 Matsushita Electron Corp Method and apparatus for manufacturing semicnductor device
US5306664A (en) * 1991-05-16 1994-04-26 Seiko Epson Corp. Semiconductor device, method of forming bump electrode of a semiconductor device, method of packaging a semiconductor device, chip carrier tape, display device and electronic printing device incorporating the semiconductor device
JP2011053722A (en) * 2010-12-17 2011-03-17 Brother Industries Ltd Fixing device and image forming apparatus
CN111081843A (en) * 2019-12-12 2020-04-28 荆门欧曼凯机电设备有限公司 Linear curved surface light source production robot device
CN111081844A (en) * 2019-12-12 2020-04-28 荆门欧曼凯机电设备有限公司 Linear curved surface light source production robot production line

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56142656A (en) * 1980-04-09 1981-11-07 Fujitsu Ltd Semiconductor device
JPS59208751A (en) * 1983-05-13 1984-11-27 Hitachi Ltd Formation of bump
JPS61242045A (en) * 1985-04-19 1986-10-28 Matsushita Electric Ind Co Ltd Formation of bump and forming device thereof
JPS62150854A (en) * 1985-12-25 1987-07-04 Hitachi Ltd Formation of electrode and apparatus for same
JPS62154648A (en) * 1985-12-26 1987-07-09 Toshiba Corp Formation of bump

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56142656A (en) * 1980-04-09 1981-11-07 Fujitsu Ltd Semiconductor device
JPS59208751A (en) * 1983-05-13 1984-11-27 Hitachi Ltd Formation of bump
JPS61242045A (en) * 1985-04-19 1986-10-28 Matsushita Electric Ind Co Ltd Formation of bump and forming device thereof
JPS62150854A (en) * 1985-12-25 1987-07-04 Hitachi Ltd Formation of electrode and apparatus for same
JPS62154648A (en) * 1985-12-26 1987-07-09 Toshiba Corp Formation of bump

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03188635A (en) * 1989-12-18 1991-08-16 Matsushita Electron Corp Bump leveling method of semiconductor device and manufacturing equipment
JPH03229423A (en) * 1990-02-05 1991-10-11 Matsushita Electron Corp Bump-forming apparatus
JPH0472734A (en) * 1990-07-13 1992-03-06 Matsushita Electron Corp Projected electrode formation device
JPH04116832A (en) * 1990-09-06 1992-04-17 Matsushita Electron Corp Method and device for leveling bump
JPH04180232A (en) * 1990-11-14 1992-06-26 Matsushita Electron Corp Method and apparatus for manufacturing semicnductor device
US5306664A (en) * 1991-05-16 1994-04-26 Seiko Epson Corp. Semiconductor device, method of forming bump electrode of a semiconductor device, method of packaging a semiconductor device, chip carrier tape, display device and electronic printing device incorporating the semiconductor device
JP2011053722A (en) * 2010-12-17 2011-03-17 Brother Industries Ltd Fixing device and image forming apparatus
CN111081843A (en) * 2019-12-12 2020-04-28 荆门欧曼凯机电设备有限公司 Linear curved surface light source production robot device
CN111081844A (en) * 2019-12-12 2020-04-28 荆门欧曼凯机电设备有限公司 Linear curved surface light source production robot production line
CN111081843B (en) * 2019-12-12 2021-04-09 荆门欧曼凯机电设备有限公司 Linear curved surface light source production robot device
CN111081844B (en) * 2019-12-12 2021-04-09 荆门欧曼凯机电设备有限公司 Linear curved surface light source production robot production line

Also Published As

Publication number Publication date
JPH0793305B2 (en) 1995-10-09

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