JPS6411553U - - Google Patents
Info
- Publication number
- JPS6411553U JPS6411553U JP10456687U JP10456687U JPS6411553U JP S6411553 U JPS6411553 U JP S6411553U JP 10456687 U JP10456687 U JP 10456687U JP 10456687 U JP10456687 U JP 10456687U JP S6411553 U JPS6411553 U JP S6411553U
- Authority
- JP
- Japan
- Prior art keywords
- terminal pin
- lead
- ceramic semiconductor
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000001465 metallisation Methods 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 238000005219 brazing Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 1
- 229910052593 corundum Inorganic materials 0.000 description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の実施例であるセラミツク半
導体容器の部分断面斜視図であり、第２図はその
要部拡大断面図、第３図は従来のものの縦断面図
である。
１…セラミツク半導体容器、２…引出し端子用
ピン、３…スルーホールメタライズ、４…セラミ
ツク積層、５…オーバーコート用Ａｌ２Ｏ３コー
ト、６…Ａｌ２Ｏ３コート、７…銀ろう材、８，
９…ろう付パツト用メタライズ、１０…内部配線
用メタライズ、１１…孔部。
FIG. 1 is a partially sectional perspective view of a ceramic semiconductor container according to an embodiment of this invention, FIG. 2 is an enlarged sectional view of the main part thereof, and FIG. 3 is a longitudinal sectional view of a conventional container. 1... Ceramic semiconductor container, 2... Output terminal pin, 3... Through-hole metallization, 4... Ceramic lamination, 5... Al2O3 coat for overcoat, 6... Al2O3 coat, 7... Silver brazing filler metal, 8,
9...Metallization for brazing parts, 10...Metallization for internal wiring, 11...Hole.
Claims (1)
スト材を挟持したろう付パツト用メタライズ層を
介して、引出し端子用ピンを接合させてなるセラ
ミツク半導体容器。 A ceramic semiconductor container in which a lead-out terminal pin is bonded directly under the through-hole metallization via a metallized layer for brazing pads sandwiching alumina paste material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10456687U JPH0440284Y2 (en) | 1987-07-09 | 1987-07-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10456687U JPH0440284Y2 (en) | 1987-07-09 | 1987-07-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6411553U true JPS6411553U (en) | 1989-01-20 |
| JPH0440284Y2 JPH0440284Y2 (en) | 1992-09-21 |
Family
ID=31336399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10456687U Expired JPH0440284Y2 (en) | 1987-07-09 | 1987-07-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0440284Y2 (en) |
-
1987
- 1987-07-09 JP JP10456687U patent/JPH0440284Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0440284Y2 (en) | 1992-09-21 |