JPS6410640A - Wafer prober - Google Patents
Wafer proberInfo
- Publication number
- JPS6410640A JPS6410640A JP62166539A JP16653987A JPS6410640A JP S6410640 A JPS6410640 A JP S6410640A JP 62166539 A JP62166539 A JP 62166539A JP 16653987 A JP16653987 A JP 16653987A JP S6410640 A JPS6410640 A JP S6410640A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- supplying
- prober
- disposed along
- operating surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE:To improve remarkably working efficiency as compared with prior arts, and simplify equipment structure in the case of automating, by disposing a plurality of wafer supplying and accommodating parts in an array along the operating surface of a wafer-prober. CONSTITUTION:A plurality of wafer supplying and accommodating parts 9 are disposed along the operating surface 8a of a wafer-prober 8. A semiconductor wafer 10 accommodated in a wafer-cassette 6 is positioned for the semiconductor accepting height of a conveying part 11 by the wafer supplying and accommodating part 9 whose up-and-down moving shaft is driven. Then it is delivered to the conveying part 11, and carried on the mounting stand 12 of a measuring part 2. In usual equipments, the wafer supplying and accommodating part 4 is disposed along the side-surface of a wafer prober, but in the title equipment, it is disposed along the operating surface. Therefore, an operator's arm can exchange any wafer cassettes by the same distance transferring. Further, in the case of automatic conveying/exchanging, the arm of an automatic exchanging equipment and the like can be constituted by applying one kind of mechanism.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62166539A JPH07111988B2 (en) | 1987-07-03 | 1987-07-03 | Wafer prober |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62166539A JPH07111988B2 (en) | 1987-07-03 | 1987-07-03 | Wafer prober |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6410640A true JPS6410640A (en) | 1989-01-13 |
JPH07111988B2 JPH07111988B2 (en) | 1995-11-29 |
Family
ID=15833157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62166539A Expired - Lifetime JPH07111988B2 (en) | 1987-07-03 | 1987-07-03 | Wafer prober |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07111988B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5081448A (en) * | 1989-11-10 | 1992-01-14 | Wako Industrial Co., Ltd. | Differential pressure indicator with temperature compensation |
US5278494A (en) * | 1991-02-19 | 1994-01-11 | Tokyo Electron Yamanashi Limited | Wafer probing test machine |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6286835A (en) * | 1985-10-14 | 1987-04-21 | Nippon Kogaku Kk <Nikon> | Inspecting device for wafer |
JPS6336541A (en) * | 1986-07-30 | 1988-02-17 | Nikon Corp | Wafer inspection apparatus |
JPS6336540A (en) * | 1986-07-30 | 1988-02-17 | Nikon Corp | Wafer inspection apparatus |
-
1987
- 1987-07-03 JP JP62166539A patent/JPH07111988B2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6286835A (en) * | 1985-10-14 | 1987-04-21 | Nippon Kogaku Kk <Nikon> | Inspecting device for wafer |
JPS6336541A (en) * | 1986-07-30 | 1988-02-17 | Nikon Corp | Wafer inspection apparatus |
JPS6336540A (en) * | 1986-07-30 | 1988-02-17 | Nikon Corp | Wafer inspection apparatus |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5081448A (en) * | 1989-11-10 | 1992-01-14 | Wako Industrial Co., Ltd. | Differential pressure indicator with temperature compensation |
US5278494A (en) * | 1991-02-19 | 1994-01-11 | Tokyo Electron Yamanashi Limited | Wafer probing test machine |
Also Published As
Publication number | Publication date |
---|---|
JPH07111988B2 (en) | 1995-11-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071129 Year of fee payment: 12 |