JPS6410640A - Wafer prober - Google Patents

Wafer prober

Info

Publication number
JPS6410640A
JPS6410640A JP62166539A JP16653987A JPS6410640A JP S6410640 A JPS6410640 A JP S6410640A JP 62166539 A JP62166539 A JP 62166539A JP 16653987 A JP16653987 A JP 16653987A JP S6410640 A JPS6410640 A JP S6410640A
Authority
JP
Japan
Prior art keywords
wafer
supplying
prober
disposed along
operating surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62166539A
Other languages
Japanese (ja)
Other versions
JPH07111988B2 (en
Inventor
Hisashi Koike
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP62166539A priority Critical patent/JPH07111988B2/en
Publication of JPS6410640A publication Critical patent/JPS6410640A/en
Publication of JPH07111988B2 publication Critical patent/JPH07111988B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To improve remarkably working efficiency as compared with prior arts, and simplify equipment structure in the case of automating, by disposing a plurality of wafer supplying and accommodating parts in an array along the operating surface of a wafer-prober. CONSTITUTION:A plurality of wafer supplying and accommodating parts 9 are disposed along the operating surface 8a of a wafer-prober 8. A semiconductor wafer 10 accommodated in a wafer-cassette 6 is positioned for the semiconductor accepting height of a conveying part 11 by the wafer supplying and accommodating part 9 whose up-and-down moving shaft is driven. Then it is delivered to the conveying part 11, and carried on the mounting stand 12 of a measuring part 2. In usual equipments, the wafer supplying and accommodating part 4 is disposed along the side-surface of a wafer prober, but in the title equipment, it is disposed along the operating surface. Therefore, an operator's arm can exchange any wafer cassettes by the same distance transferring. Further, in the case of automatic conveying/exchanging, the arm of an automatic exchanging equipment and the like can be constituted by applying one kind of mechanism.
JP62166539A 1987-07-03 1987-07-03 Wafer prober Expired - Lifetime JPH07111988B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62166539A JPH07111988B2 (en) 1987-07-03 1987-07-03 Wafer prober

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62166539A JPH07111988B2 (en) 1987-07-03 1987-07-03 Wafer prober

Publications (2)

Publication Number Publication Date
JPS6410640A true JPS6410640A (en) 1989-01-13
JPH07111988B2 JPH07111988B2 (en) 1995-11-29

Family

ID=15833157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62166539A Expired - Lifetime JPH07111988B2 (en) 1987-07-03 1987-07-03 Wafer prober

Country Status (1)

Country Link
JP (1) JPH07111988B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5081448A (en) * 1989-11-10 1992-01-14 Wako Industrial Co., Ltd. Differential pressure indicator with temperature compensation
US5278494A (en) * 1991-02-19 1994-01-11 Tokyo Electron Yamanashi Limited Wafer probing test machine

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6286835A (en) * 1985-10-14 1987-04-21 Nippon Kogaku Kk <Nikon> Inspecting device for wafer
JPS6336541A (en) * 1986-07-30 1988-02-17 Nikon Corp Wafer inspection apparatus
JPS6336540A (en) * 1986-07-30 1988-02-17 Nikon Corp Wafer inspection apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6286835A (en) * 1985-10-14 1987-04-21 Nippon Kogaku Kk <Nikon> Inspecting device for wafer
JPS6336541A (en) * 1986-07-30 1988-02-17 Nikon Corp Wafer inspection apparatus
JPS6336540A (en) * 1986-07-30 1988-02-17 Nikon Corp Wafer inspection apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5081448A (en) * 1989-11-10 1992-01-14 Wako Industrial Co., Ltd. Differential pressure indicator with temperature compensation
US5278494A (en) * 1991-02-19 1994-01-11 Tokyo Electron Yamanashi Limited Wafer probing test machine

Also Published As

Publication number Publication date
JPH07111988B2 (en) 1995-11-29

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