JPS6393639U - - Google Patents
Info
- Publication number
- JPS6393639U JPS6393639U JP18933886U JP18933886U JPS6393639U JP S6393639 U JPS6393639 U JP S6393639U JP 18933886 U JP18933886 U JP 18933886U JP 18933886 U JP18933886 U JP 18933886U JP S6393639 U JPS6393639 U JP S6393639U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- chuck
- utility
- model registration
- wafer chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
図は本考案の一実施例を示し第１図は一部破断
側面図、第２図は第１図の２方向矢視図、第３図
はモニタウエハカセツトの正面図、第４図は第３
図の４―４線断面図、第５図はモニタウエハチヤ
ツクの断面図、第６図はプラグと分配具の断面図
である。
１２…ウエハ、１４…モニタウエハ、２１…モ
ニタウエハチヤツク、２４…ベローズ、３０…シ
リンダ。
The drawings show one embodiment of the present invention. Fig. 1 is a partially cutaway side view, Fig. 2 is a view taken in two directions from Fig. 1, Fig. 3 is a front view of the monitor wafer cassette, and Fig. 4 is a partially cutaway side view. 3
FIG. 5 is a sectional view of the monitor wafer chuck, and FIG. 6 is a sectional view of the plug and distributor. 12... Wafer, 14... Monitor wafer, 21... Monitor wafer chuck, 24... Bellows, 30... Cylinder.
Claims (1)
に隣接して設けられたモニタウエハチヤツクと、
同モニタウエハチヤツクを待機位置と前記ウエハ
チヤツクより前方の作動位置との両位置を選択的
に保持するための移動手段とを備えたことを特徴
とするウエハ搬送装置。 (2) 実用新案登録請求の範囲第１項記載のウエ
ハ搬送装置において、移送手段としてシリンダを
使用したことを特徴とするウエハ搬送装置。 (3) 実用新案登録請求の範囲第１項記載のウエ
ハ搬送装置において、ウエハチヤツクが真空吸着
式であり、同チヤツクへの真空圧力伝達手段とし
てベローズを使用したことを特徴とするウエハ搬
送装置。[Scope of Claim for Utility Model Registration] (1) In a wafer transport device, a monitor wafer chuck provided adjacent to the wafer chuck;
A wafer transfer device comprising a moving means for selectively holding the monitor wafer chuck in both a standby position and an operating position in front of the wafer chuck. (2) Utility Model Registration A wafer transfer device according to claim 1, characterized in that a cylinder is used as a transfer means. (3) Utility Model Registration The wafer transport device according to claim 1, characterized in that the wafer chuck is of a vacuum suction type, and a bellows is used as a means for transmitting vacuum pressure to the chuck.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18933886U JPS6393639U (en) | 1986-12-09 | 1986-12-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18933886U JPS6393639U (en) | 1986-12-09 | 1986-12-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6393639U true JPS6393639U (en) | 1988-06-17 |
Family
ID=31141545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18933886U Pending JPS6393639U (en) | 1986-12-09 | 1986-12-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6393639U (en) |
-
1986
- 1986-12-09 JP JP18933886U patent/JPS6393639U/ja active Pending