JPS639138A - Manufacture of wiring board with lead pin - Google Patents
Manufacture of wiring board with lead pinInfo
- Publication number
- JPS639138A JPS639138A JP15341386A JP15341386A JPS639138A JP S639138 A JPS639138 A JP S639138A JP 15341386 A JP15341386 A JP 15341386A JP 15341386 A JP15341386 A JP 15341386A JP S639138 A JPS639138 A JP S639138A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- wiring substrate
- hole
- lead pin
- lower surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000000034 method Methods 0.000 claims abstract description 27
- 230000009477 glass transition Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 12
- 238000010008 shearing Methods 0.000 abstract description 5
- 238000003825 pressing Methods 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明はリードピン付配線板の製造法に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a method for manufacturing a wiring board with lead pins.
（従来の技術）
配線板に外部回路板への導通用のリードピンを取りつけ
たリードピン付配線板の製造法については、例えば特公
昭５１−２５８１０号公報、特開昭５５−１０３７５１
号公報、特開昭５８−１５９３５５号公報、特開昭６０
−５９７５６号公報等で多数提案されている。(Prior art) Regarding the manufacturing method of a wiring board with lead pins in which lead pins for conduction to an external circuit board are attached to a wiring board, for example, Japanese Patent Publication No. 51-25810 and Japanese Patent Application Laid-open No. 55-103751 are known.
Publication No. 159355/1983, Japanese Patent Application Laid-Open No. 1983-159355
Many proposals have been made, such as in Publication No. -59756.
（発明が解決しようとする問題点）
しかしながら、これらはいずれも配線基板に予め明けら
れた貫通孔、貫通孔を金属化したスルーホール等のビン
孔にリードピンを挿入、固定する方式であるためリード
ピンのビン孔挿入に手間どり生産性を著しく低くしてい
る。(Problem to be solved by the invention) However, in all of these methods, the lead pin is inserted and fixed into a via hole such as a through hole drilled in advance in the wiring board or a through hole made of metal. It takes a lot of effort to insert the bottle holes, which significantly lowers productivity.
特に特開昭６０−５９７５６号公報に示されるプラスチ
ックチップキャリアーのようにリードピンの数が多いも
のでは、ビン孔にリードピンを挿入する工程は困難を極
め、更にプラスチックチップキャリアーの高密度化が進
みリードピンの数が増せば増すほどこの傾向は強まる。Particularly for plastic chip carriers with a large number of lead pins, such as the plastic chip carrier disclosed in JP-A No. 60-59756, the process of inserting the lead pins into the bottle holes is extremely difficult. This tendency becomes stronger as the number increases.
本発明はリードピンのピン孔挿入が簡単に行え生産性に
優れるリードビン付配線板の製造法を提供するものであ
る。The present invention provides a method for manufacturing a wiring board with lead bins that allows easy insertion of lead pins into pin holes and is highly productive.
（問題点を解決するための手段）
本発明は、配線基板の上下面にダイスを当て所定の荷重
を加え、基板の上下面に、対向する一対のリードピンと
ポンチを介してアクチュエータにて振動荷重を加え、基
板上下面の間を貫通する貫通孔を明け、この貫通孔内に
前記リードピンを挿入した状態でそのまま残すことによ
りリードピンのピン立てを行うようにしたものである。(Means for Solving the Problems) The present invention applies a predetermined load by applying a die to the upper and lower surfaces of a wiring board, and applies a vibration load to the upper and lower surfaces of the board using an actuator via a pair of opposing lead pins and a punch. In addition, a through hole is formed that penetrates between the upper and lower surfaces of the substrate, and the lead pin is inserted into the through hole and left as it is, so that the lead pin can be pinned.
第１図（Ａ）（［３）（Ｃ）にビン立て工程の概略を示
す、ｌは配線基板、２．３はそれぞれ上下側ダイス、４
は上側ポンチを兼用したリードピン、５は下側ポンチで
ある。Figures 1 (A) ([3] and (C)) show an outline of the bottle standing process, l is the wiring board, 2.3 are the upper and lower dies, 4
5 is a lead pin that also serves as an upper punch, and 5 is a lower punch.
先ず第１図（Ａ）のように配線基板１に２．３のダイス
を介してプレスにより所要の荷重、例えば１〜１０ｋｇ
／ｍ”を加え配線基板の上下面を拘束する。First, as shown in FIG. 1(A), a required load, for example 1 to 10 kg, is applied to the wiring board 1 by pressing through a 2.3 die.
/m” to restrain the upper and lower surfaces of the wiring board.
次に上下側ポンチ４．５を同一ストロークで振動を加え
、ダイス穴とポンチとの境界線下の配線基板剪断領域に
エネルギニを供給する。供給エネルギーはポンチ振動振
幅と周波数および加工時間で決まる。配線基板剪断領域
は上記供給エネルギーで局部加熱される。Next, the upper and lower punches 4.5 are vibrated with the same stroke to supply energy to the sheared area of the wiring board below the boundary line between the die hole and the punch. The supplied energy is determined by the punch vibration amplitude, frequency, and machining time. The wiring board shear region is locally heated by the supplied energy.
次に第１図（Ｂ）のようにこの熱軟化領域を剪断分離し
て基板の抜きかす６を抜き落とす。Next, as shown in FIG. 1(B), this thermally softened region is sheared and separated to remove the scraps 6 from the substrate.
次に上側ポンチ４を第１図（Ｃ）の位Ｉに変位させたの
ちにポンチ振動を停止する。上側ポンチ゛４はリードピ
ンを兼用しており、配線基板剪断領域の局部加熱が停止
し冷却されると共にリードピンと配線基板は固着される
。Next, after displacing the upper punch 4 to the position I as shown in FIG. 1(C), the punch vibration is stopped. The upper punch 4 also serves as a lead pin, and as the local heating of the sheared region of the wiring board is stopped and cooled, the lead pin and the wiring board are fixed.
最後に配線基板を取り出しダイス穴内に残った抜きかす
６を除去して加工を終了する。Finally, the wiring board is taken out and the punching residue 6 remaining in the die hole is removed to complete the processing.
第２図はピン立て装置の概略図である。FIG. 2 is a schematic diagram of the pin holding device.
この装置はプレス本体に固定された固定部分とアクチュ
エータ１３に接続された可動部分に大別される。This device is roughly divided into a fixed part fixed to the press body and a movable part connected to the actuator 13.
固定部分はプレス本体コンテナ１０．コンテナ据付台１
１、上側ダイス２、下側ダイス３、ダイス押え８から構
成される。The fixed part is the press body container 10. Container installation stand 1
1. Consists of an upper die 2, a lower die 3, and a die holder 8.
可動部分はフレーム１２、リードピン４、ピン押え７、
下側ポンチ５、下側ポンチ押え９から構成される。The movable parts are the frame 12, lead pin 4, pin holder 7,
It is composed of a lower punch 5 and a lower punch holder 9.
アクチュエータ１３は例えば電気油圧弁式の往復動形で
作動し、制御ユニットの波形モード設定により各種波形
を実現する。The actuator 13 operates, for example, in a reciprocating manner using an electro-hydraulic valve, and realizes various waveforms by setting the waveform mode of the control unit.
配線基板ｌをコンテナ１０内の上下側ダイス２．３の間
に挿入し、上側ダイス２のダイス押え８をねじ込むこと
によって配線基板はクランプされる。The wiring board 1 is inserted between the upper and lower dies 2.3 in the container 10, and the die holder 8 of the upper die 2 is screwed in to clamp the wiring board.
また、上側リードビン４、下側ポンチ５はフレーム１２
の締付ネジ７を締めることによって移動し配線基板１を
押える。この状態でアクチュエータ１３を振動させると
フレーム１２を介して上側リードピン４、下側ポンチ７
が振動し配線基板１に操り返し剪断変形を与える。In addition, the upper lead bin 4 and the lower punch 5 are connected to the frame 12.
By tightening the tightening screw 7, it moves and holds the wiring board 1. When the actuator 13 is vibrated in this state, the upper lead pin 4 and the lower punch 7 are vibrated through the frame 12.
vibrates and gives a shearing deformation to the wiring board 1.
第３図に振動波形の例を示す。Figure 3 shows an example of a vibration waveform.
波形パターンＩは徐々に配線基板破断を起こさせて材料
内部へのダメージ低減を行う行程、波形パターン■は振
動剪断工程、波形パターン■は無理のない剪断分離とバ
ニツの複合工程、波形パターン■はリードピンと基板穴
内壁との接合工程である。Waveform pattern I is a process that gradually causes the wiring board to break and reduces damage to the inside of the material, waveform pattern ■ is a vibration shearing process, waveform pattern ■ is a combined process of natural shear separation and banishing, and waveform pattern ■ is a process that reduces damage to the inside of the material. This is the process of joining the lead pin and the inner wall of the board hole.
尚ピン立て工程の前工程に予め基板をそのガラス転移点
温度近くに予熱しておくかあるいはピン立て工程中に基
板を外部から同時に加熱すると孔明は時間の短縮と加工
後のリードピンと配線基板の嵌合力が更に高められ、リ
ードピンの押し又は引抜き強度が向上する。In addition, if the board is preheated to near its glass transition temperature before the pin-making process, or if the board is simultaneously heated from the outside during the pin-making process, it will save time and reduce the temperature of the lead pins and wiring board after processing. The fitting force is further increased, and the push or pull strength of the lead pin is improved.
また、リードピンはその形状は丸棒状と限らず第４図（
Ａ）のような偏平つぶし形、第４図（Ｂ）のような放射
状つぶし形等の各種形状とすることにより配線基板とピ
ンの接合界面面積を増大させリードピンの押し又は引抜
き強度を向上することができる。またリードピンの先端
にリードピンの先端部と同一断面形状の薄い柱状物を介
在させておけば、熱軟化領域を剪断分離した配線基板の
抜きかす６を抜き落とす操作が容易となる。Also, the shape of the lead pin is not limited to a round bar shape, as shown in Figure 4 (
By forming various shapes such as a flat crushed shape as shown in A) and a radial crushed shape as shown in FIG. 4(B), the bonding interface area between the wiring board and the pin is increased and the push or pull strength of the lead pin is improved. Can be done. Furthermore, if a thin columnar object having the same cross-sectional shape as the tip of the lead pin is interposed at the tip of the lead pin, it becomes easy to remove the scraps 6 of the wiring board from which the thermally softened region has been sheared and separated.
第５図は、片面銅張積層板を用いて回路加工を−ａに行
われているサブトラクト法（エツチング法）によってリ
ードピン付配線板の製造工程を示すものである。FIG. 5 shows the manufacturing process of a wiring board with lead pins by the subtracting method (etching method) in which circuit processing is carried out in -a using a single-sided copper-clad laminate.
先ずガラスエポキシベース２１に銅箔２２を積層圧着し
た銅張８ＩＮ板を所定の寸法に切断する（Ａ）。First, a copper-clad 8IN board in which a copper foil 22 is laminated and pressure-bonded to a glass epoxy base 21 is cut into a predetermined size (A).
次にに前述したピン立での方法を用いて銅張積層板に貫
通穴を明は同時にリードピン２３を挿入し基板材料と接
合する（Ｂ）、この場合基板（銅張積層板）の銅箔の無
い裏側にポンチ兼用リードピン２３を圧接してピン立て
工程を行う、尚リードピン２３は配線基板に比べて硬く
熱膨張係数が小さく、適当な熱伝導率と機械強度を有す
るのが望ましい。Next, using the above-mentioned pin stand method, open a through hole in the copper clad laminate, insert the lead pin 23 at the same time, and connect it to the board material (B). In this case, the copper foil of the board (copper clad laminate) A pin-setting process is carried out by pressing a lead pin 23 which also serves as a punch on the back side where there is no surface.It is preferable that the lead pin 23 is harder than the wiring board, has a smaller coefficient of thermal expansion, and has appropriate thermal conductivity and mechanical strength.
次にピン立てされた配線基板に無電解銅めっき２４を施
しリードピン２３頭部と銅箔２２との電気的接続を行う
（Ｃ）。Next, electroless copper plating 24 is applied to the pinned wiring board to electrically connect the heads of lead pins 23 and copper foil 22 (C).
その後回路形成工程に移る０回路形成工程は従来数に知
られた方法を用いることができる。この図では怒光性ド
ライフィルムレジスト又は液状フォトレジストを配線基
板表面にラミネート又は塗布したのち回路パターンマス
クを用いて露光・現像・焼付およびエツチング操作を行
い所望の回路パターンを配線基板表面に形成する（Ｄ）
。The 0 circuit forming step, which is then followed by the circuit forming step, can use a method known in the prior art. In this figure, a photosensitive dry film resist or liquid photoresist is laminated or coated on the surface of a wiring board, and then a circuit pattern mask is used to perform exposure, development, baking, and etching operations to form a desired circuit pattern on the surface of the wiring board. (D)
.
（Ｅ）はこの工程の平面図である。(E) is a plan view of this step.
次いで半田レジスト形成、その他刻印等の仕上げ工程を
終えてリードピン付き配線板が形成される。Next, finishing steps such as solder resist formation and other markings are completed to form a wiring board with lead pins.
以上はサブトラクト法による回路形状による例を説明し
たがこの方式に限るものではな（、配線仕様のグレード
等に応じて、フルアディティブ法、セミアディティブ法
などを用いて回路形成を行うことができる。配線基板は
ガラスエポキシに限るものではなく要求されるリードピ
ン付き配線板の仕様に応じて祇エポキシ、祇フェノール
、ガラスポリイミド等々の基板にも適用できる。また予
め必要な回路加工がされている配線基板、内層に回路を
有する多層印刷配線基板等にも適用できる。Although an example of a circuit shape using the subtract method has been described above, the circuit is not limited to this method (depending on the grade of wiring specifications, etc., circuit formation can be performed using a full additive method, a semi-additive method, etc.). The wiring board is not limited to glass epoxy, but can also be applied to boards made of Gio epoxy, Gio phenol, glass polyimide, etc., depending on the specifications of the wiring board with lead pins required.Also, the wiring board has undergone the necessary circuit processing in advance. It can also be applied to multilayer printed wiring boards having circuits on the inner layer.
（発明の効果）
本発明の方法によれば、リードピンの配線基板へのビン
立てを容易に行うことができ、リードピン付き配線板を
極めて生産性良く製造することが出来る。(Effects of the Invention) According to the method of the present invention, it is possible to easily attach lead pins to a wiring board, and it is possible to manufacture a wiring board with lead pins with extremely high productivity.
第１図（Ａ）（Ｂ）（Ｃ）はピン立て工程を示す断面図
、第２図はピン立て装置の正面図、第３図は振動波形を
示すグラフ、第４図（Ａ）（Ｂ）はリードピンは形状を
示す正面図、側面図、平面図、第５図はリードピン付配
線板の製造工程を示すもので（Ａ）〜（Ｄ）は断面図、
（Ｅ）は平面図である。
符号の説明
１：配線基板
２．３：ダイス
４：リードピン
５：ポンチ
予１因
第３図
（ＡＩ ＣＢ”１
＋う口Figures 1 (A), (B), and (C) are cross-sectional views showing the pin-raising process, Figure 2 is a front view of the pin-raising device, Figure 3 is a graph showing vibration waveforms, and Figure 4 (A) (B). ) is a front view, side view, and plan view showing the shape of the lead pin, Figure 5 shows the manufacturing process of the wiring board with lead pin, and (A) to (D) are cross-sectional views.
(E) is a plan view. Explanation of symbols 1: Wiring board 2.3: Dice 4: Lead pin 5: Punch pre-1 cause Figure 3 (AI CB”1 + Mouth
Claims (1)
、配線基板の上下面に、対向する一対のリードピンとポ
ンチを介してアクチュエータにて振動荷重を加え、基板
上下面の間を貫通する貫通孔を明け、この貫通孔内に前
記リードピンを挿入した状態でそのまま残し、固定し、
必要な回路加工を行うことを特徴とするリードピン付配
線板の製造法。 ２、配線基板の上下面に、対向する一対のリードピンと
ポンチを介してアクチュエータにて振動荷重を加え、配
線基板上下面の間を貫通する貫通孔を明ける段階で、配
線基板をそのガラス転移点近くに加温しておく特許請求
の範囲第１項記載のリードピン付配線板の製造法。[Claims] 1. A die is applied to the upper and lower surfaces of the wiring board to apply a predetermined load, and an actuator is used to apply a vibration load to the upper and lower surfaces of the wiring board via a pair of opposing lead pins and a punch. A through hole is made that penetrates between the lower surfaces, and the lead pin is left inserted in this through hole and fixed,
A method for manufacturing a wiring board with lead pins, which is characterized by performing necessary circuit processing. 2. At the stage of applying a vibration load to the upper and lower surfaces of the wiring board using an actuator via a pair of opposing lead pins and a punch to create a through hole that passes between the upper and lower surfaces of the wiring board, the wiring board is brought to its glass transition point. A method for manufacturing a wiring board with lead pins according to claim 1, wherein the wiring board is heated nearby.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15341386A JPS639138A (en) | 1986-06-30 | 1986-06-30 | Manufacture of wiring board with lead pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15341386A JPS639138A (en) | 1986-06-30 | 1986-06-30 | Manufacture of wiring board with lead pin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS639138A true JPS639138A (en) | 1988-01-14 |
Family
ID=15561946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15341386A Pending JPS639138A (en) | 1986-06-30 | 1986-06-30 | Manufacture of wiring board with lead pin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS639138A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10356309B2 (en) | 2006-09-06 | 2019-07-16 | Apple Inc. | Portable electronic device for photo management |
-
1986
- 1986-06-30 JP JP15341386A patent/JPS639138A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10356309B2 (en) | 2006-09-06 | 2019-07-16 | Apple Inc. | Portable electronic device for photo management |
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