JPS6389242U - - Google Patents
Info
- Publication number
- JPS6389242U JPS6389242U JP18376086U JP18376086U JPS6389242U JP S6389242 U JPS6389242 U JP S6389242U JP 18376086 U JP18376086 U JP 18376086U JP 18376086 U JP18376086 U JP 18376086U JP S6389242 U JPS6389242 U JP S6389242U
- Authority
- JP
- Japan
- Prior art keywords
- arm
- semiconductor manufacturing
- transported
- transport mechanism
- transport
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000007723 transport mechanism Effects 0.000 claims description 6
- 230000032258 transport Effects 0.000 claims 4
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 1
Landscapes
- Load-Engaging Elements For Cranes (AREA)
- Special Conveying (AREA)
Description
第１図は本考案の一実施例を示す半導体製造装
置における搬送機構の動作説明図、第２図は従来
の搬送機構の動作説明図、第３図は本考案の他の
実施例を示す半導体製造装置における搬送機構の
説明図である。
１０，２０……基底部、１１，２１……側壁、
１２，２４……ウエハキヤリア、１３，２５……
搬送アーム、１４，２６……傾斜部（搬送アーム
）、１５，２７……係合溝、１６，２８……傾斜
部（ウエハキヤリア）、１７……側溝、１８……
車輪、１９……ブロツク、２２……ウエハキヤリ
アの移動経路、２３……搬送アームの逃げ溝。
FIG. 1 is an explanatory diagram of the operation of a transport mechanism in a semiconductor manufacturing apparatus showing one embodiment of the present invention, FIG. 2 is an explanatory diagram of the operation of a conventional transport mechanism, and FIG. 3 is a diagram illustrating another embodiment of the present invention for semiconductors. It is an explanatory view of a conveyance mechanism in a manufacturing device. 10, 20... Base part, 11, 21... Side wall,
12, 24...Wafer carrier, 13, 25...
Transfer arm, 14, 26... Inclined part (transfer arm), 15, 27... Engagement groove, 16, 28... Inclined part (wafer carrier), 17... Side groove, 18...
Wheels, 19... Block, 22... Wafer carrier movement path, 23... Relief groove of transfer arm.
Claims (1)
導体製造装置における搬送機構において、 前記被搬送物は搬送アームが挿入される係合溝
を有し、該係合溝には前記搬送アームが摺動する
傾斜部を形成し、かつ、前記搬送アームの移動方
向に対して前記被搬送物の移動を阻止する手段を
具備し、前記搬送アームと前記被搬送物の傾斜部
が摺動することによつて前記アームの移動方向に
対して垂直方向の前記被搬送物の移動を所定距離
自動的に生ぜしめるようにしたことを特徴とする
半導体製造装置における搬送機構。 (2) 前記被搬送物はウエハキヤリアであること
を特徴とする実用新案登録請求の範囲第１項記載
の半導体製造装置における搬送機構。 (3) 前記搬送アームの先端部には前記係合溝の
傾斜部に対応する傾斜部を有することを特徴とす
る実用新案登録請求の範囲第１項記載の半導体製
造装置における搬送機構。[Claims for Utility Model Registration] (1) In a transport mechanism in a semiconductor manufacturing device that transports a transported object using a transport arm, the transported object has an engagement groove into which the transport arm is inserted; The coupling groove is provided with an inclined portion on which the conveyance arm slides, and means for preventing movement of the conveyed object in the moving direction of the conveyance arm, so that the conveyance arm and the conveyed object are A transport mechanism for a semiconductor manufacturing apparatus, characterized in that the object to be transported is automatically moved a predetermined distance in a direction perpendicular to the movement direction of the arm by sliding an inclined portion of the arm. . (2) The transport mechanism in a semiconductor manufacturing apparatus according to claim 1, wherein the object to be transported is a wafer carrier. (3) The transport mechanism in a semiconductor manufacturing apparatus according to claim 1, wherein the transport arm has an inclined part corresponding to the inclined part of the engagement groove at the distal end thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18376086U JPH0528770Y2 (en) | 1986-12-01 | 1986-12-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18376086U JPH0528770Y2 (en) | 1986-12-01 | 1986-12-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6389242U true JPS6389242U (en) | 1988-06-10 |
| JPH0528770Y2 JPH0528770Y2 (en) | 1993-07-23 |
Family
ID=31130797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18376086U Expired - Lifetime JPH0528770Y2 (en) | 1986-12-01 | 1986-12-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0528770Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007040062A1 (en) * | 2005-10-04 | 2007-04-12 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and method for manufacturing semiconductor device |
-
1986
- 1986-12-01 JP JP18376086U patent/JPH0528770Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007040062A1 (en) * | 2005-10-04 | 2007-04-12 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and method for manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0528770Y2 (en) | 1993-07-23 |
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