JPS6387832U - - Google Patents
Info
- Publication number
- JPS6387832U JPS6387832U JP18255586U JP18255586U JPS6387832U JP S6387832 U JPS6387832 U JP S6387832U JP 18255586 U JP18255586 U JP 18255586U JP 18255586 U JP18255586 U JP 18255586U JP S6387832 U JPS6387832 U JP S6387832U
- Authority
- JP
- Japan
- Prior art keywords
- pellets
- course
- movement
- calculates
- camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18255586U JPS6387832U (ko) | 1986-11-26 | 1986-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18255586U JPS6387832U (ko) | 1986-11-26 | 1986-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6387832U true JPS6387832U (ko) | 1988-06-08 |
Family
ID=31128462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18255586U Pending JPS6387832U (ko) | 1986-11-26 | 1986-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6387832U (ko) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02174132A (ja) * | 1988-12-26 | 1990-07-05 | Toshiba Corp | 半導体ペレットのダイボンディング方法 |
| KR100681772B1 (ko) * | 1998-12-01 | 2007-02-12 | 후지쯔 가부시끼가이샤 | 반도체 시험 방법 및 반도체 시험 장치 |
| JP2019145634A (ja) * | 2018-02-20 | 2019-08-29 | ワイエイシイガーター株式会社 | 剥離装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS575345A (en) * | 1980-06-13 | 1982-01-12 | Hitachi Ltd | Isolating and picking up method for pellet |
| JPS5954236A (ja) * | 1982-09-22 | 1984-03-29 | Toshiba Corp | ダイボンダ等におけるペレツト認識方法 |
-
1986
- 1986-11-26 JP JP18255586U patent/JPS6387832U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS575345A (en) * | 1980-06-13 | 1982-01-12 | Hitachi Ltd | Isolating and picking up method for pellet |
| JPS5954236A (ja) * | 1982-09-22 | 1984-03-29 | Toshiba Corp | ダイボンダ等におけるペレツト認識方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02174132A (ja) * | 1988-12-26 | 1990-07-05 | Toshiba Corp | 半導体ペレットのダイボンディング方法 |
| KR100681772B1 (ko) * | 1998-12-01 | 2007-02-12 | 후지쯔 가부시끼가이샤 | 반도체 시험 방법 및 반도체 시험 장치 |
| JP2019145634A (ja) * | 2018-02-20 | 2019-08-29 | ワイエイシイガーター株式会社 | 剥離装置 |
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