JPS6380595A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPS6380595A JPS6380595A JP22572286A JP22572286A JPS6380595A JP S6380595 A JPS6380595 A JP S6380595A JP 22572286 A JP22572286 A JP 22572286A JP 22572286 A JP22572286 A JP 22572286A JP S6380595 A JPS6380595 A JP S6380595A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- component
- solder
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 12
- 238000007689 inspection Methods 0.000 description 4
- 239000006071 cream Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はプリント配線板に関し、％に部品実装面上に表
面実装用パッドを有するプリント配線板に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a printed wiring board, and more particularly to a printed wiring board having surface mounting pads on a component mounting surface.
（従来技術）
通常、プリント配線板は、周知の如く、片面に部品を搭
載するための部品実装面（部品面）を有し、その裏面を
はんだ面として構成している。部品面には搭載部品の表
面実装用パッドやランド、配線パターンが形成されるが
、従来この種のプリント配線板の表面実装用パッドは、
部品面、はんだ面で独立している。(Prior Art) As is well known, a printed wiring board usually has a component mounting surface (component surface) on one side for mounting components, and the back surface thereof is configured as a solder surface. Surface mounting pads, lands, and wiring patterns for mounted components are formed on the component surface. Conventionally, surface mounting pads for this type of printed wiring board were
Independent on component side and solder side.
（発明が解決しようとする問題点）
上述した如〈従来のプリント配線板では、その表面実装
用パッドは部品面とはんだ面で独立しているため、少く
とも一面はクリームはんだ印刷が必要となり、部品実装
に際してはんだ付けは２回行わなければならない。また
プリント配線板単体での電気検査は、両面同時に、ある
いは片面づつ２回行う必要があり、検査の手間がかかる
。さらに、パッドはスルーホールと比べてプリント配線
板の基材との密着強度が低く、場合によっては剥れたり
する危険があった。(Problems to be Solved by the Invention) As mentioned above, in conventional printed wiring boards, the surface mounting pads are independent on the component side and the solder side, so cream solder printing is required on at least one side. When mounting components, soldering must be performed twice. Furthermore, electrical testing of a single printed wiring board requires testing on both sides simultaneously or twice on each side, which is time-consuming. Furthermore, pads have a lower adhesion strength to the base material of a printed wiring board than through holes, and there is a risk that they may peel off in some cases.
（問題点を解決するための手段）
本発明によるプリント配線板は、部品面の表面実装用パ
ッドの位置にスルーホールを形成し、このスルーホール
を通してはんだをパッド面へ流出、付着せしめるように
したものである。(Means for Solving the Problems) In the printed wiring board according to the present invention, a through hole is formed at the position of the surface mounting pad on the component surface, and solder flows out and adheres to the pad surface through the through hole. It is something.
（実施例） 次に、本発明を図面を参照して実施例につき説明する。(Example) Next, the present invention will be explained by way of example with reference to the drawings.
第１図は不発明の実施例に係るプリント配線板５０部品
面側からみた斜視図であり、第２図は電子部品を実装し
た状態圧おける本発明のプリント配線板の拡大縦断面図
である。これらの図に示す如くプリント配線板５０部品
面９上の表面実装用パッド２にはスルーホール１が設け
である。３はランド、１１は配線パターンである。第２
図の実施例のように表面実装用パッド２Ｖｃはフラット
パックＩＣ４の端子がはんだ接着される。この場合、部
品面９のパッド２へは、スルーホール１を通してはんだ
６が上がるなめ、従来の如く予めクリームはんだを印刷
する必要はない。その他プリント配線板５１Ｉｃはチッ
プ部品８．デュアルインパックＩＣ７等がはんだ接着さ
れるが、はんだ付けは１回でフラットパックＩＣ４，チ
ップ部品８．デュアルインパックＩＣ７へはんだが供給
されるので、２回行う必要はない。またプリント配線板
５単体でのｌＨ電気検査は、パッド上のスルーホール１
から検査用ピンを通じて導通をとれるので、はんだ面１
０側から検査することができ、これてよって検査は１回
で済むことになる。部品面９側のパッド２はスルーホー
ル１があるために配線板基材との密着強度が増加する。FIG. 1 is a perspective view of a printed wiring board 50 according to an embodiment of the invention as viewed from the component side, and FIG. 2 is an enlarged vertical cross-sectional view of the printed wiring board of the present invention with electronic components mounted thereon. . As shown in these figures, a through hole 1 is provided in a surface mounting pad 2 on a component surface 9 of a printed wiring board 50. 3 is a land, and 11 is a wiring pattern. Second
As in the illustrated embodiment, the terminals of the flat pack IC 4 are soldered to the surface mounting pad 2Vc. In this case, since the solder 6 rises to the pad 2 on the component surface 9 through the through hole 1, there is no need to print cream solder in advance as in the conventional method. Other printed wiring board 51Ic is chip component 8. Dual-in-pack IC7, etc. are soldered together, but flat-pack IC4, chip parts 8. Since the solder is supplied to the dual-in-pack IC 7, there is no need to perform it twice. In addition, for the IH electrical inspection of the printed wiring board 5 alone, the through hole 1 on the pad
Since continuity can be established through the test pin from the solder side 1
The inspection can be performed from the 0 side, which means that the inspection only needs to be done once. Since the pad 2 on the component surface 9 side has the through hole 1, the adhesion strength with the wiring board base material is increased.
（発明の効果）
以上説明したように本発明によれば、表面実装用プリン
ト配線板のパッドにスルーホールを設けることにより、
クリームはんだの印刷が不要で、しかも部品実装の際の
はんだ付けも１回で済む。(Effects of the Invention) As explained above, according to the present invention, by providing through holes in the pads of the surface mounting printed wiring board,
There is no need to print cream solder, and only one soldering is required when mounting components.
またスルーホールによってパッドの基材密着強度が増加
し、プリント配線板単体での電気検査はスルーホールを
介して行うことにより片面側から１回で行うことができ
るなどの効果がおる。Additionally, the through-holes increase the adhesion strength of the pads to the base material, and the electrical inspection of the printed wiring board itself can be performed in one go from one side by performing it through the through-holes.
第１図は本発明の実施例に係るプリント配線板の斜視図
、第２図は部品実装状態での本発明の実施例の拡大縦断
面図である。
１・・・スルーホール、 ２・・・表面実装用パッド、
３・・・ランド、 ４・・・フラットパックＩ
Ｃｌ３・・・プリント配線板、６・・・はんだ、９・・
・部品面、 １０・・・はんだ面。FIG. 1 is a perspective view of a printed wiring board according to an embodiment of the present invention, and FIG. 2 is an enlarged longitudinal sectional view of the embodiment of the present invention in a state where components are mounted. 1...Through hole, 2...Surface mounting pad,
3... Land, 4... Flat pack I
Cl3...Printed wiring board, 6...Solder, 9...
・Component side, 10...Solder side.
Claims (1)
ることを特徴とするプリント配線板。A printed wiring board characterized by having through holes in surface mounting pads on a component mounting surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22572286A JPS6380595A (en) | 1986-09-24 | 1986-09-24 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22572286A JPS6380595A (en) | 1986-09-24 | 1986-09-24 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6380595A true JPS6380595A (en) | 1988-04-11 |
Family
ID=16833789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22572286A Pending JPS6380595A (en) | 1986-09-24 | 1986-09-24 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6380595A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02125370U (en) * | 1989-03-23 | 1990-10-16 | ||
| JPH0582937A (en) * | 1991-04-23 | 1993-04-02 | Mitsubishi Electric Corp | Semiconductor device |
| JPH0538947U (en) * | 1991-10-23 | 1993-05-25 | 能美防災株式会社 | Printed circuit board mounting structure |
| JPH06237062A (en) * | 1993-02-10 | 1994-08-23 | Rohm Co Ltd | Structure for mounting electronic components on circuit board |
| JP2007205682A (en) * | 2006-02-06 | 2007-08-16 | Kazuhiko Iwasaki | Indoor decoration table of sacred arrow |
| JP2016046465A (en) * | 2014-08-26 | 2016-04-04 | Ｎｅｃエンジニアリング株式会社 | Printed board and circuit board |
-
1986
- 1986-09-24 JP JP22572286A patent/JPS6380595A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02125370U (en) * | 1989-03-23 | 1990-10-16 | ||
| JPH0582937A (en) * | 1991-04-23 | 1993-04-02 | Mitsubishi Electric Corp | Semiconductor device |
| JPH0538947U (en) * | 1991-10-23 | 1993-05-25 | 能美防災株式会社 | Printed circuit board mounting structure |
| JPH06237062A (en) * | 1993-02-10 | 1994-08-23 | Rohm Co Ltd | Structure for mounting electronic components on circuit board |
| JP2007205682A (en) * | 2006-02-06 | 2007-08-16 | Kazuhiko Iwasaki | Indoor decoration table of sacred arrow |
| JP2016046465A (en) * | 2014-08-26 | 2016-04-04 | Ｎｅｃエンジニアリング株式会社 | Printed board and circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH02100392A (en) | Circuit board and soldering method | |
| JPS6380595A (en) | Printed wiring board | |
| JPH0744043Y2 (en) | Printed wiring board | |
| JPH01255294A (en) | Printed wiring board | |
| JP2526205Y2 (en) | IC socket adapter | |
| JPS60201692A (en) | Wiring circuit device | |
| JPS59145592A (en) | Method of mounting electronic part on printed circuit board | |
| JPH0421257Y2 (en) | ||
| JPH0211032B2 (en) | ||
| JPS631093A (en) | Electronic parts mounting board device | |
| JPS61107791A (en) | Printed wiring board | |
| JPS5939964U (en) | wiring board | |
| JPH062276Y2 (en) | Electronic component mounting structure | |
| JPS6418775U (en) | ||
| JPH0710969U (en) | Printed board | |
| JPH11297754A (en) | Substrate | |
| JPS63168078A (en) | Printed wiring board | |
| JPS63253692A (en) | Through-hole substrate | |
| JPS63241983A (en) | Circuit wiring board | |
| JPH1041693A (en) | Mounting structure for semiconductor package | |
| JPH01297882A (en) | Printed board | |
| JPH04225545A (en) | Surface mounting type integrated circuit | |
| JPH0310175A (en) | Burn-in board for integrated circuit | |
| JPH0623274U (en) | Printed wiring board | |
| JPH0718472U (en) | Printed circuit board with check terminals |