JPS6367360B2 - - Google Patents
Info
- Publication number
- JPS6367360B2 JPS6367360B2 JP56027435A JP2743581A JPS6367360B2 JP S6367360 B2 JPS6367360 B2 JP S6367360B2 JP 56027435 A JP56027435 A JP 56027435A JP 2743581 A JP2743581 A JP 2743581A JP S6367360 B2 JPS6367360 B2 JP S6367360B2
- Authority
- JP
- Japan
- Prior art keywords
- holes
- hole
- base film
- copper foil
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 29
- 238000007639 printing Methods 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000011888 foil Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000005553 drilling Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 19
- 239000011889 copper foil Substances 0.000 description 19
- 238000005530 etching Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000004080 punching Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】
この発明は、プラスチツクフイルムをベースと
したフレキシブル印刷回路板とリード端子との接
続方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of connecting lead terminals to a flexible printed circuit board based on plastic film.
この種のフレキシブル印刷回路板には、印刷用
ガイドホール、外形打ち抜き用ガイドホールある
いは素子取り付け穴などの製品の基準となる穴が
あけられている。 This type of flexible printed circuit board has holes that serve as product standards, such as printing guide holes, outline punching guide holes, and device mounting holes.
これらの穴はフレキシブル印刷回路板に必須で
あり、それら穴あけをいかになすかは製品の性能
に直接影響を及ぼす。ここにおける発明は、
ICなどの素子の取り付けの信頼性を高めること、
および工程の調整を容易に行なえるようにする
こと、に特に着目してなされたものである。 These holes are essential to flexible printed circuit boards, and how they are made has a direct impact on the performance of the product. The invention here is
Improving the reliability of mounting elements such as ICs,
This was done with a particular focus on making process adjustments easier.
まず、の着目点について述べると、従来一般
に穴は打ち抜きによつてあけられているので、た
とえば素子取り付け穴を考えた場合、ベースフイ
ルム側の穴と回路パターン側の穴とはほぼ同じ大
きさである。このため、ICなどの素子のリード
端子を取り付けた場合、半田は回路パターンの表
側にまわるだけであり、接続部の信頼性の面で充
分とはいえない。 First, regarding the point to note, conventionally holes are generally made by punching, so when considering an element mounting hole, for example, the hole on the base film side and the hole on the circuit pattern side are approximately the same size. be. For this reason, when lead terminals of elements such as ICs are attached, the solder only spreads to the front side of the circuit pattern, which is not sufficient in terms of the reliability of the connection.
つぎに、の着目点については以下に述べるよ
うなことが問題となる。 Next, regarding the focus point, the following issues arise.
前記各種の穴のうち、印刷用ガイドホールはエ
ツチング用レジストパターンの印刷時の位置合わ
せに用いるものであるため、他の穴とは異なり少
なくともエツチング用レジストパターンの印刷工
程以前にあけておかなければならない。そこでフ
レキシブル印刷回路板を製造する場合、従来一般
には第１図に示すように、素子取り付け穴などは
銅箔のエツチング後に穴あけするのに対し、印刷
用ガイドホールだけは銅箔の張り付けを終えた後
で予めあけておく方法が採られている。 Among the various holes mentioned above, the printing guide hole is used for positioning when printing the etching resist pattern, so unlike the other holes, it must be made at least before the printing process of the etching resist pattern. No. Therefore, when manufacturing flexible printed circuit boards, conventionally, as shown in Figure 1, element mounting holes were drilled after etching the copper foil, whereas printing guide holes were made after the copper foil had been pasted. A method is adopted in which it is opened in advance later.
ところが、そのように印刷用ガイドホールを他
の穴と別個にあける場合、工程の調整が面倒にな
るという問題のほか、エツチングの前後において
穴あけするのでエツチングによる材料の伸縮を考
慮しなければならず、一般に余り広い面積にわた
つてパターンと穴とを一致させることが困難にな
るという問題が否めない。位置合わせ精度に関す
る後者の問題は、(a)エツチングによる銅箔の部分
的除去によつて、ベースフイルムと銅箔との熱膨
張差に基づく銅箔張り付け時の内部応力が開放さ
れること、および(b)エツチング工程その他湿式プ
ロセスでの吸湿、環境の相対湿度の影響によつ
て、ベースフイルムが伸縮すること、などに起因
して生じるものである。 However, when printing guide holes are drilled separately from other holes, there is a problem that adjustment of the process becomes troublesome, and since the holes are drilled before and after etching, expansion and contraction of the material due to etching must be taken into account. However, there is an undeniable problem that it is generally difficult to match the pattern and the hole over a too large area. The latter problem regarding alignment accuracy is caused by (a) partial removal of the copper foil by etching, which releases internal stress during attachment of the copper foil due to the difference in thermal expansion between the base film and the copper foil; (b) This is caused by expansion and contraction of the base film due to moisture absorption during etching and other wet processes and the influence of the relative humidity of the environment.
ここで、これらの問題を解決する方法として、
銅箔のエツチング後において行なつていた素子取
り付け穴などの打ち抜きを、印刷用ガイドホール
のパンチ工程において同時に行なう方法が考えら
れる。しかしこの方法によると、前述した二点の
問題は解決できるものの、その反面フイルム材料
の広い面積にわたつて穴あけされることになるの
で、レジストパターンの印刷を行なう際に材料を
真空テーブル上に固定することが困難となるのみ
ならず、穴のエツジ部によつて印刷用スクリーン
にキズを生じやすくなり、実用上の難点という新
たな問題が生じる。 Here, as a way to solve these problems,
A method may be considered in which the punching of element mounting holes, etc., which was performed after etching the copper foil, is performed simultaneously in the punching process of the printing guide holes. However, although this method solves the two problems mentioned above, it also requires drilling holes over a wide area of the film material, so the material must be fixed on a vacuum table when printing the resist pattern. Not only is it difficult to do so, but the edges of the holes tend to cause scratches on the printing screen, creating a new problem of practical difficulty.
この発明は以上の各点を考慮してなされたもの
で、フレキシブル印刷回路板とリード端子との間
を高信頼性の接続を行なう方法を提供するもので
ある。 The present invention has been made in consideration of the above points, and provides a method for highly reliable connection between a flexible printed circuit board and a lead terminal.
この発明のフレキシブル印刷回路板とリード端
子との接続方法では、前記各種の穴のうち、素子
取り付け穴について、回路パターン側の穴をベー
スフイルム側の穴よりも小さく、かつ、リード線
の径よりも大きくあけ、間〓に半田を流し込むよ
うにした点に基本的な特徴がある。そして、この
基本的な特徴があるが故に、素子接続のための半
田を回路パターンの表裏両面にまわすことがで
き、信頼性の高い接続構造を得ることができる。 In the method for connecting a flexible printed circuit board and a lead terminal of the present invention, among the various holes, the hole on the circuit pattern side is smaller than the hole on the base film side and is smaller than the diameter of the lead wire. The basic feature is that the solder is poured into the gap with a large gap. Because of this basic feature, solder for connecting elements can be applied to both the front and back sides of the circuit pattern, making it possible to obtain a highly reliable connection structure.
また、こうしたフレキシブル印刷回路板を得る
には、少なくとも素子取り付け穴について、ベー
スフイルム側の穴と回路パターン側の穴とを別個
にあける方法を採る。この別個にあけること、お
よび前述した工程調整の問題を考えた場合、製法
としては次のようなものが好適である。すなわ
ち、その製法は、印刷用ガイドホール、素子取り
付け穴などの製品の基準となる穴を予めあけたベ
ースフイルムに対し、回路パターン形成用の金属
箔（以下、銅箔を中心に述べる。）を張り付ける
ようにした点に特徴をもつものである。したがつ
て、それらの穴あけについては少なくとも銅箔の
張り付け前に行なわなければならないが、各穴に
ついてはパンチングによつてすべてを同時にあけ
ることもできるし、複数回にわたるパンチングあ
るいはドリル加工などによつて穴の種類毎に別個
にあけることもできる。穴あけの作業性などから
すると、すべての穴を同時にあけることが最適で
ある。 Furthermore, in order to obtain such a flexible printed circuit board, a method is adopted in which at least the element mounting holes are separately drilled on the base film side and on the circuit pattern side. Considering this separate opening and the above-mentioned problem of process adjustment, the following manufacturing method is suitable. In other words, the manufacturing method involves inserting metal foil (hereinafter mainly copper foil) for forming a circuit pattern onto a base film in which standard holes for the product, such as guide holes for printing and holes for mounting elements, are pre-drilled. It is characterized by the fact that it can be pasted. Therefore, these holes must be drilled at least before pasting the copper foil, but each hole can be punched all at the same time, or multiple holes can be punched or drilled multiple times. It is also possible to drill separate holes for each type of hole. From the viewpoint of workability of drilling, it is optimal to drill all the holes at the same time.
これらの特徴を工程に沿つて明らかにすると、
印刷用ガイドホール、素子取り付け穴などの穴あ
け工程は、第２図および第３図に示すように、ベ
ースフイルム１に対する接着剤２の塗布工程、お
よびその接着剤２の乾燥工程の後に位置する。こ
の場合、すべての穴３を一時にあけるようにすれ
ば、各穴間の位置精度がパンチング用の型の精度
によつて定まるので、そこに新たな誤差が生じる
ことはない。 When these characteristics are clarified along the process,
As shown in FIGS. 2 and 3, the process of making holes such as printing guide holes and element mounting holes is performed after the process of applying the adhesive 2 to the base film 1 and the process of drying the adhesive 2. In this case, if all the holes 3 are punched at once, the positional accuracy between the holes is determined by the accuracy of the punching die, and no new errors will occur there.
ついで、ベースフイルム１上の銅箔４の張り付
け工程および銅箔４表面の整面工程を経た後、通
常のパターン形成の工程、つまりエツチング用レ
ジストパターン５の印刷および銅箔４のエツチン
グ工程によつて銅箔４に所定の回路パターン４ａ
を形成すことになる。これらの個々の工程におけ
る各処理内容自体は従来と同様であるので、その
詳細については述べないが、たとえばエツチング
用レジストパターン５をスクリーン印刷で形成す
る場合、印刷版は平坦な銅箔４と密着するので、
版にキズを生じるなどの障害を生じることもな
く、また各穴３部分とレジストパターン５とは印
刷版自体の精度によつてきわめて正確に位置出し
することができる。 Next, after passing through the process of pasting the copper foil 4 on the base film 1 and the process of leveling the surface of the copper foil 4, a normal pattern forming process, that is, a process of printing a resist pattern 5 for etching and etching the copper foil 4, is performed. A predetermined circuit pattern 4a is formed on the copper foil 4.
will be formed. The details of each process in each of these steps are the same as in the past, so we will not discuss the details, but for example, when forming the etching resist pattern 5 by screen printing, the printing plate is in close contact with the flat copper foil 4. So,
There is no problem such as scratches on the plate, and each hole 3 and resist pattern 5 can be positioned extremely accurately due to the accuracy of the printing plate itself.
ところで、回路パターン４ａを形成する際に
は、前記ベースフイルム１側の穴３に対応した穴
６を銅箔４側にもあけることになるが、前述した
とおりこの発明ではそれらの穴３と６とを別個
に、かつ穴３を穴６よりも大き目にあけるので、
次のような優れた効果を得ることができる。すな
わち、ベースフイルム１側の穴３を銅箔４側の実
際の穴３よりも少し大き目にあけることにより、
レジストパターン５の印刷時の位置合わせ精度を
多少甘くしても正確な穴６を明けることができ
る。また、フレキシブル印刷回路板に対して、第
４図に示すように、ICなどの素子の半田づけ部
分であるリード端子７などを取り付ける場合にお
いて、回路パターン４ａの穴６が、ベースフイル
ム１の穴３よりも小さくなる設定を行なうことは
勿論であるが、リード端子（素子の半田づけ部
分）７が挿入される大きさで、かつ、溶融状態の
半田８が穴とリード端子７との間〓を通つて、回
路パターン４ａの表裏両面に回り得る程度に設定
する。つまり、第４図に示すように、穴６の中に
半田８が満たされるとともに、穴６からはみ出し
た半田８が回路パターン４ａの両面に付着するよ
うにして、信頼性の高い接続構造を得るものであ
る。 By the way, when forming the circuit pattern 4a, holes 6 corresponding to the holes 3 on the base film 1 side are also made on the copper foil 4 side, but as described above, in this invention, those holes 3 and 6 are made. and separately, and hole 3 is made larger than hole 6, so
The following excellent effects can be obtained. That is, by making the hole 3 on the base film 1 side a little larger than the actual hole 3 on the copper foil 4 side,
Accurate holes 6 can be made even if the positioning accuracy during printing of the resist pattern 5 is somewhat relaxed. Furthermore, when attaching lead terminals 7, which are soldered parts of elements such as ICs, to a flexible printed circuit board, as shown in FIG. Of course, it is necessary to set the size smaller than 3, but the size is such that the lead terminal (soldered part of the element) 7 can be inserted, and the molten solder 8 is between the hole and the lead terminal 7. It is set to such an extent that it can pass through the circuit pattern 4a and go around both the front and back sides of the circuit pattern 4a. That is, as shown in FIG. 4, the holes 6 are filled with solder 8, and the solder 8 protruding from the holes 6 adheres to both sides of the circuit pattern 4a, thereby obtaining a highly reliable connection structure. It is something.
以上のように、この発明に係るフレキシブル印
刷回路板とリード端子との接続方法にあつては、
回路パターンの穴が、ベースフイルムの穴よりも
小さく、素子の固定部分が挿入される大きさであ
り、溶融状態の半田が穴とリード端子との間〓を
通つて、回路パターンの表裏両面に回つて素子を
固定するから、取り付け部分の信頼性を高めるこ
とができ、また製法として、素子取り付け穴など
の製品の基準となる穴を予めあけたベースフイル
ム１に対し、回路パターン４ａ形成用の金属箔４
を張り付けるようにする方法を採る場合には、工
程の調整をも容易に行なうことができるという別
の効果をも得ることができる。 As described above, in the method of connecting a flexible printed circuit board and lead terminals according to the present invention,
The hole in the circuit pattern is smaller than the hole in the base film and is large enough to allow the fixed part of the element to be inserted, and the molten solder passes between the hole and the lead terminal and is applied to both the front and back sides of the circuit pattern. Since the device is fixed by turning, the reliability of the mounting part can be increased.In addition, as for the manufacturing method, the base film 1 is pre-drilled with holes that serve as product standards such as device mounting holes. metal foil 4
If a method is adopted in which the material is pasted, another effect can be obtained in that the process can be easily adjusted.
なお、一般にベースフイルム１は銅箔４よりも
広くなされ、しかも前記した製品の基準となる穴
のうち印刷用ガイドホールは銅箔４のないベース
フイルム１の外側周辺部に配置されているので、
印刷用ガイドホールだけは他の穴とは別に銅箔４
の張り付け後に行なうようにすることもできる。 Note that the base film 1 is generally wider than the copper foil 4, and among the holes that serve as the reference for the above-mentioned product, the printing guide holes are arranged on the outer periphery of the base film 1 where the copper foil 4 is not provided.
Copper foil 4 is used for the printing guide hole separately from other holes.
It is also possible to perform this after pasting.
第１図は従来のフレキシブル印刷回路板の製法
を示す工程図、第２図はこの発明に適用するフレ
キシブル印刷回路板の製法の一実施例を示す工程
図、第３図Ａ〜Ｄはその工程途中における製品の
状態を示す断面図、第４図はこの発明による接続
後の状態を示す断面図である。
１……ベースフイルム、３……穴、４……銅
箔、４ａ……回路パターン、６……穴、７……リ
ード端子（素子の半田づけ部分）、８……半田。
Fig. 1 is a process diagram showing a conventional method for manufacturing a flexible printed circuit board, Fig. 2 is a process diagram showing an example of a method for manufacturing a flexible printed circuit board applied to the present invention, and Figs. 3 A to D are the steps. FIG. 4 is a cross-sectional view showing the state of the product in the middle, and FIG. 4 is a cross-sectional view showing the state after connection according to the present invention. 1... Base film, 3... Hole, 4... Copper foil, 4a... Circuit pattern, 6... Hole, 7... Lead terminal (soldering part of the element), 8... Solder.
Claims (1)
素子取り付け穴など製品の基準となる穴を明ける
第１工程と、その第１工程の後に穴あけしたベー
スフイルムの一面に金属箔を張り付ける第２工程
と、第１および第２工程後に、金属箔に、ベース
フイルム側の素子取り付け穴よりも小さく、素子
の半田づけ部分よりも大きな半田づけ用の穴を有
する回路パターンを形成する第３工程と、半田づ
け用の穴に素子のリード線を挿入してその間〓に
溶融半田を流し込んで一体化する工程とを備えて
いることを特徴とするフレキシブル印刷回路板と
リード端子との接続方法。1. A first step of drilling holes that serve as product standards such as printing guide holes and element mounting holes in the base film, a second step of pasting metal foil on one side of the base film that has been drilled after the first step, and After the first and second steps, a third step is to form a circuit pattern on the metal foil that has a soldering hole that is smaller than the element mounting hole on the base film side and larger than the soldered part of the element, and a soldering step. A method for connecting a flexible printed circuit board and a lead terminal, comprising the steps of inserting the lead wire of an element into the hole and pouring molten solder between the holes to integrate the lead terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2743581A JPS57141989A (en) | 1981-02-26 | 1981-02-26 | Flexible printed circuit board and method of producing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2743581A JPS57141989A (en) | 1981-02-26 | 1981-02-26 | Flexible printed circuit board and method of producing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57141989A JPS57141989A (en) | 1982-09-02 |
| JPS6367360B2 true JPS6367360B2 (en) | 1988-12-26 |
Family
ID=12221025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2743581A Granted JPS57141989A (en) | 1981-02-26 | 1981-02-26 | Flexible printed circuit board and method of producing same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57141989A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03126739U (en) * | 1990-04-06 | 1991-12-20 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5528238A (en) * | 1978-08-17 | 1980-02-28 | Matsushita Electric Ind Co Ltd | Flat battery |
| JPS55138864A (en) * | 1979-04-16 | 1980-10-30 | Sharp Corp | Method of fabricating semiconductor assembling substrate |
| JPS5670693A (en) * | 1979-11-14 | 1981-06-12 | Matsushita Electric Ind Co Ltd | Method of manufacturing printed circuit board |
-
1981
- 1981-02-26 JP JP2743581A patent/JPS57141989A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5528238A (en) * | 1978-08-17 | 1980-02-28 | Matsushita Electric Ind Co Ltd | Flat battery |
| JPS55138864A (en) * | 1979-04-16 | 1980-10-30 | Sharp Corp | Method of fabricating semiconductor assembling substrate |
| JPS5670693A (en) * | 1979-11-14 | 1981-06-12 | Matsushita Electric Ind Co Ltd | Method of manufacturing printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03126739U (en) * | 1990-04-06 | 1991-12-20 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57141989A (en) | 1982-09-02 |
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