JPS6366525A - Electronic endoscope - Google Patents
Electronic endoscopeInfo
- Publication number
- JPS6366525A JPS6366525A JP61213499A JP21349986A JPS6366525A JP S6366525 A JPS6366525 A JP S6366525A JP 61213499 A JP61213499 A JP 61213499A JP 21349986 A JP21349986 A JP 21349986A JP S6366525 A JPS6366525 A JP S6366525A
- Authority
- JP
- Japan
- Prior art keywords
- solid
- state image
- image pickup
- attached
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 238000003780 insertion Methods 0.000 claims abstract description 13
- 230000037431 insertion Effects 0.000 claims abstract description 13
- 238000003384 imaging method Methods 0.000 claims description 21
- 230000005540 biological transmission Effects 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000007787 solid Substances 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 206010018388 glossodynia Diseases 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
Landscapes
- Endoscopes (AREA)
- Instruments For Viewing The Inside Of Hollow Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は固体撮像素子、又はこの固体撮像素子が取ｆＮ
Ｊけられる基板の隅部に切欠ぎを形成した電子内視鏡に
関する。[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a solid-state image sensor, or to
The present invention relates to an electronic endoscope in which a notch is formed in the corner of a board that can be cut.
［従来の技術］
近年、電荷結合素子（ＣＯＤ）等の固体撮像素子をＶａ
ｆ’＆手段に用いた電子内８２ｖ１が種々提案されて
いる。[Prior Art] In recent years, solid-state imaging devices such as charge-coupled devices (COD) have been
Various electronic internal 82v1 used for f'& means have been proposed.
上記固体撮像素子は一般に長方形状ないし正方形状であ
るため、挿入部の先端部に収容した場合、該先端部の中
央に取付けると、他の照明手段とか処置具用チャンネル
等のスペースを十分とれないといった問題があった。Since the solid-state imaging device described above is generally rectangular or square in shape, when it is housed in the tip of the insertion tube, if it is installed in the center of the tip, there will not be enough space for other illumination means, channels for treatment tools, etc. There was such a problem.
このため、特開昭５８−４６９２２号公報に開示されて
いるように、ミラー等で反射さけて挿入部あるいは先端
部の軸と平行に配置した固体撮像素子の娼像面に尋くよ
うにした従来例がある。For this reason, as disclosed in Japanese Unexamined Patent Application Publication No. 58-46922, the imaging surface of a solid-state image sensor is placed parallel to the axis of the insertion section or the distal end, avoiding reflection by a mirror or the like. There is a conventional example.
［発明が解決しようとづる問題点］
しかしながら、この従来例では硬性の先端部の長さが長
くなり、挿入の際に患者に大きな舌痛を強いるという欠
点がある。又、！１手段を形成する固体Ｒ像索子が先端
部の中央に配設されるため、ライトガイドとか鉗子チｔ
１ンネルを設けるスペースが小さくなってしまうという
欠点があった。[Problems to be Solved by the Invention] However, in this conventional example, the length of the hard tip is long, and the patient is forced to experience severe tongue pain during insertion. or,! Since the solid R imager, which forms one means, is placed in the center of the tip, it is difficult to use light guides or forceps.
There was a drawback that the space for providing one channel was small.
本発明は上述した点にかんがみてなされたもので、先端
部を短く、小型化でさると共に、ライトガイドとか鉗子
チャンネルを設けるスペースも確保できる電子内？ＪＡ
ｖｔを提供することを目的とげる。The present invention has been made in view of the above-mentioned points, and it is possible to reduce the size of the tip by shortening the tip, and to secure a space for installing a light guide or a forceps channel. JA
The aim is to provide VT.
［問題点を解決づる手段及び作用］
本発明では先端部内に収納される固体’ｋｘ’ｌｌ素子
を斜めに配設すると共に、固体撮像素子のパッケージ又
は固体Ｖｉｉ像素子が取付けられるり板の隅部の面取り
を行うことにより角ばった隅部が邪魔になることを防い
で円筒状の外形を右する先端部内に無駄となるスペース
部分を少なくしてコンパクトに収納しライトガイド等の
収納スペースを確保している。[Means and effects for solving the problems] In the present invention, the solid-state 'kx'll element housed in the tip part is arranged diagonally, and the package of the solid-state image sensor or the corner of the plate to which the solid-state VII image element is attached is arranged diagonally. By chamfering the edges, the square corners are prevented from getting in the way, reducing wasted space within the tip of the cylindrical outer shape, allowing for compact storage and securing storage space for light guides, etc. are doing.
［実施例１ 以下、図面を参照して本発明を具体的に説明する。[Example 1 Hereinafter, the present invention will be specifically explained with reference to the drawings.
第１図ないし第４図は本発明の第１実施例に係り、第１
図は４隅が面取りされた固体日像素子を承り正面図、第
２図は第１実論例の先端部の構造を示づ断面図、第３図
は第２図の正面図、第４図は第１実施例の全体を承り側
面図である。FIGS. 1 to 4 relate to a first embodiment of the present invention.
The figure is a front view of a solid-state image element with chamfered four corners, Figure 2 is a sectional view showing the structure of the tip of the first practical example, Figure 3 is a front view of Figure 2, and The figure is a side view of the entire first embodiment.
第４図に示すように、第１実施例の電子内視鏡１は、細
長で例えば可撓性の挿入部２の後端に大径の操作部３が
連設されている。前記操作部３の後端にはコネクタ受け
４が設けられ、このコネクタ受け４に装着されるコネク
タ５を有するケーブル６を介して、前記操作部３と、光
源装置及び映像信号処理回路が内蔵されたルリ御装置７
とが接続されるようになっている。ざらに、前記制御装
置７には、表示手段としてのカラーモニタ８が接続され
るようになっている。As shown in FIG. 4, the electronic endoscope 1 of the first embodiment has a large-diameter operating section 3 connected to the rear end of an elongated, for example, flexible insertion section 2. As shown in FIG. A connector receiver 4 is provided at the rear end of the operating section 3, and the operating section 3, a light source device, and a video signal processing circuit are connected via a cable 6 having a connector 5 attached to the connector receiver 4. Taruri control device 7
are now connected. Generally speaking, a color monitor 8 as a display means is connected to the control device 7.
前記挿入部２の先端側には、硬性の先端部９及びこの先
端部９に隣接Ｊる後方側に湾曲可能な湾曲部１１が順次
設けられている。また、前記操作部３に設けられた湾曲
操作ノブ１２を回動操作することによって、前記湾曲部
１１を左右方向あるいは上下方向に湾曲できるようにな
っている。また、前記操作部３には、前記挿入部２内に
設けられた鉗子チャンネルに連通ずる挿入口１３が設け
られている。On the distal end side of the insertion portion 2, a rigid distal end portion 9 and a bendable portion 11 adjacent to the distal end portion 9 and capable of bending toward the rear side are sequentially provided. Furthermore, by rotating a bending operation knob 12 provided on the operating section 3, the bending section 11 can be bent in the left-right direction or the up-down direction. Further, the operation section 3 is provided with an insertion port 13 that communicates with a forceps channel provided in the insertion section 2.
前記先端部９は、第２図に示ずように梠成されている。The tip portion 9 is layered as shown in FIG.
すなわち、先端部９は、全屈等の硬性の部月からなる円
柱状の先端部本体１５を協え、この先端部本体１５の上
部側に偏心して形成した透孔には対物レンズ系１６が取
付番）られたレンズ枠１７が嵌装されでいる。対物レン
ズ系１６の奥には、赤外カッミーフィルり１８、プリズ
ム１９Δ、１９Ｂ及び固体陽像素子２１が配設しである
。That is, the tip 9 has a cylindrical tip main body 15 made of a hard part such as a fully bent member, and an objective lens system 16 is installed in a through hole eccentrically formed in the upper side of the tip main body 15. The lens frame 17 with the specified mounting number has been fitted. At the back of the objective lens system 16, an infrared cammie filter 18, prisms 19Δ, 19B, and a solid positive image element 21 are arranged.
上記固体撮像素子２１は斜めに配設した基板２２に取付
けられている。The solid-state image sensor 21 is attached to a diagonally arranged substrate 22.
上記り］物レンズ系１６を取イ」げた透孔と平行な透孔
が下部側に偏心して設けられ、この透孔には挿入部２内
を挿通したライトガイド２３の前端側が固着されている
。このライトガイド２３の前端から出射される照明光は
、その直前に配設した配光レンズ２４によって拡間され
、対物レンズ系１６で結像される対象物を照明できるよ
うにしている。A through hole parallel to the through hole through which the object lens system 16 is removed is eccentrically provided on the lower side, and the front end side of the light guide 23 inserted through the insertion portion 2 is fixed to this through hole. . The illumination light emitted from the front end of the light guide 23 is expanded by a light distribution lens 24 disposed immediately in front of it, so that it can illuminate the object imaged by the objective lens system 16.
上記先端部本体１５はその外周が途中から後部側にかけ
て段；６状に細径にされ、”Ｔ ＩＱ性内カバー２５取
付けである。The outer periphery of the tip main body 15 is tapered into a six-step shape from the middle to the rear, and an inner cover 25 is attached to the tip.
又、先端部本体１５には、ライトガイド２３のｉＶｊ
娼：側が口金を介して固定される透孔に隣接して、第３
図に示すように鉗子チャンネル用透孔２６が設けである
。In addition, the tip main body 15 has iVj of the light guide 23.
Prong: The third side is adjacent to the through hole to which the side is fixed via the cap.
As shown in the figure, a through hole 26 for the forceps channel is provided.
上記レンズ枠１７に取付けられる対物レンズ系１６はス
ペーサ２６によって、それぞれ所定間隔に保持される。The objective lens systems 16 attached to the lens frame 17 are held at predetermined intervals by spacers 26, respectively.
上記対物レンズ系１６の光軸に治って入射される光線は
一点鎖線で承り”ようにプリズム１９△。The light rays that enter the optical axis of the objective lens system 16 are shown by the dashed dotted line and pass through the prism 19△.
１９Ｂの接合面で反射され、さらにプリズム１９Ａの上
面で反射された後、プリズム１９Ｂを通つ゛Ｃ固体撮像
素子２１のイメージエリアの中心に像を結ぶ撮像光学系
が形成しである。つまりこの固体撮像素子２１のイメー
ジエリア（撮像面）は対物レンズ系１６の焦点面に配設
しである。After being reflected by the cemented surface of the prism 19B and further reflected by the upper surface of the prism 19A, an imaging optical system is formed which focuses the image on the center of the image area of the solid-state image sensor 21 passing through the prism 19B. In other words, the image area (imaging surface) of this solid-state image sensor 21 is arranged at the focal plane of the objective lens system 16.
上記プリズム１９Ａ、１９Ｂを用いることによって、固
体撮像索子２１の板面又はイメージエリア面が対物レン
ズ系１６の光軸と平行な方向よりも傾斜した方向を向い
た固体回像、七子２１に対象物の像を結ぶようにしてい
る。By using the prisms 19A and 19B, a solid-state rotation image, in which the plate surface or the image area surface of the solid-state imaging probe 21 is oriented in a direction tilted with respect to the direction parallel to the optical axis of the objective lens system 16, is obtained. I try to form images of things.
上記固体服像素子２１が取付けられた基板２２は、基板
固定板２８を介して先端部本体１５に固定される。又、
この基板２２には、固体撮像素子２１を斜めに取付けた
部分の裏側の空間部分に集積回路とかコンデンサ等の電
気回路部品２９８を取付けると共に固体撮像素子２１の
前部の空間部分にも電気回路部品２９ｂを取付けて、先
端部９内の空間の使用密度を上げて先端部９を小型化し
ている。The substrate 22 to which the solid image element 21 is attached is fixed to the tip main body 15 via a substrate fixing plate 28. or,
On this board 22, an electric circuit component 298 such as an integrated circuit or a capacitor is mounted in the space on the back side of the part where the solid-state image sensor 21 is mounted diagonally, and electrical circuit parts 298 are also installed in the space in front of the solid-state image sensor 21. 29b is attached to increase the usage density of the space within the tip portion 9, thereby reducing the size of the tip portion 9.
又、上記基板２２は、固体Ｉｉ像素子２１を取付けた部
分の後部側が折り曲げられ、信号ね３０が半田イ」け等
で接続される接続部３１が形成される。Further, the rear portion of the substrate 22 where the solid-state II image element 21 is attached is bent to form a connecting portion 31 to which the signal line 30 is connected by soldering or the like.
上記基板２２に取付けられる固体！ｌ１３像索子２１は
第１図に示すように中央部に長方形又は正方形状の踊像
部３２が形成され、固体撮像索子２１パッケージの外形
の４隅は切り欠かれて、面取り（切欠き）３３．３３．
３３．３３がしである。A solid body attached to the above board 22! As shown in FIG. 1, the 113 image sensor 21 has a rectangular or square dancing image part 32 formed in the center, and the four corners of the outer shape of the solid-state image sensor 21 package are cut out and chamfered (notched). )33.33.
33.33 is here.
これら面取り３３．・・・、３３を形成することによっ
て、部面取り３３．・・・、３３を形成しない場合より
も固体撮像索子２１を先端部９内に無駄となる空間を少
なくして収納できるようにしである。These chamfers33. ..., 33, the partial chamfering 33. . . , the solid-state imaging probe 21 can be stored in the distal end portion 9 with less wasted space than in the case where the probe 33 is not formed.
尚、ライトガイド２２はその前端が口金に固着されたチ
ューブ３４で被覆されている。Note that the front end of the light guide 22 is covered with a tube 34 fixed to the base.
このように構成された第１実施例の電子内視鏡１によれ
ば、先端部９内に収納される固体撮像索子２１の４隅に
面取り３３．３３，３３．３３を施しであるので、無駄
となる空間を少なくして先端部９内に収納できる。従っ
て、先端部９の外径を小さくできる。According to the electronic endoscope 1 of the first embodiment configured as described above, the four corners of the solid-state imaging cord 21 housed in the distal end portion 9 are chamfered 33.33, 33.33. , it can be stored within the tip portion 9 with less wasted space. Therefore, the outer diameter of the tip portion 9 can be reduced.
又、固体ｋｍ像素子２１を先端部９の中心位置より例え
ば上部側に偏心して配設しているので、先端部９を細径
にしてもライトガイド２３を挿通するスペースと、鉗子
チャンネルとなる透孔２６のスペースを確保できる。Furthermore, since the solid-state km image element 21 is eccentrically arranged, for example, above the center position of the distal end 9, even if the distal end 9 is made small in diameter, there is still space for the light guide 23 to be inserted and a forceps channel. A space for the through hole 26 can be secured.
又、上記固体撮像索子２１を斜めに配設しであるので、
撮像面を挿入部を平行となるように配設した従来例より
も、先端部９の艮ざを短くできる。Furthermore, since the solid-state imaging cable 21 is arranged diagonally,
The length of the distal end 9 can be made shorter than in the conventional example in which the imaging surface is arranged parallel to the insertion section.
従って、体腔内に挿入する際に患者に与える苦痛を小さ
くできる。Therefore, the pain caused to the patient when inserted into the body cavity can be reduced.
固体［１素子２１パツケージの面取りの形状は第１図に
示すものに限らず、第５図のように曲面状の面取り４１
，４１．４１．４１でも良いし、第６図に示すように角
を切り取った面取り４２゜４２．４２．４２でも良いし
、第７図に示すように適宜角度で斜めに切り取った面取
り４３，４３゜４３．４３でも良い。又、上述したもの
は矩形状のパッケージであったが、第８図に示すように
円形の上下部分を切欠いた形状のパッケージにおいて、
例えば第６図に示すもののように、その４隅を切り取っ
た面取り４４，４４．４４．４４のものでも良い。The shape of the chamfer of the solid body [1 element 21 package is not limited to that shown in FIG. 1, but may also be curved as shown in FIG.
, 41.41.41, a chamfered corner 42.42.42.42 as shown in FIG. 43°43.43 is also fine. Furthermore, although the above-mentioned package was a rectangular package, as shown in FIG.
For example, as shown in FIG. 6, the four corners may be chamfered 44, 44, 44, 44.
第９図は本発明の第２実施例の電子内視鏡５１の先端側
を示す。FIG. 9 shows the distal end side of an electronic endoscope 51 according to a second embodiment of the present invention.
この実施例においても先端部５２を形成する先端部本体
５３に透孔を設け、対物レンズ系５４を取付け、この対
物レンズ系５４の奥にプリズム５５Ａ、５５Ｂを配設し
である。このプリズム５５Ｂの出射面側にカバーガラス
５６を介して固体撮像素子デツプ５７が第１実施例と同
様に斜めに配設される。この固体撮像索子ブツプ５７は
、ベースを兼ねる基板５８に取イ」けられている。In this embodiment as well, a through hole is provided in the tip main body 53 forming the tip 52, an objective lens system 54 is attached, and prisms 55A and 55B are disposed at the back of the objective lens system 54. A solid-state imaging device deep 57 is obliquely disposed on the exit surface side of the prism 55B with a cover glass 56 in between, as in the first embodiment. This solid-state imaging probe bump 57 is mounted on a substrate 58 which also serves as a base.
又、上記対物レンズ系５４の下側には鉗子チャンネル５
９を形成する透孔６１が設けである。しかして、第１０
図及び第１１図に示すように、この透孔６１に隣接して
ライトガイド６２が配設され、このライトガイド６２と
反対側に送気・送水チャンネル６３が形成される。Further, a forceps channel 5 is provided below the objective lens system 54.
A through hole 61 forming a hole 9 is provided. However, the 10th
As shown in the drawings and FIG. 11, a light guide 62 is disposed adjacent to the through hole 61, and an air/water supply channel 63 is formed on the opposite side of the light guide 62.
上記送気・進水チャンネル６３の前端には、第１１図に
示すように対物レンズ系に向けて送気又は送水できるよ
うにしたノズル部６４が形成しである。A nozzle portion 64 is formed at the front end of the air/launch channel 63, as shown in FIG. 11, for supplying air or water toward the objective lens system.
上記鉗子チャンネル５９は、透孔６１の後端側に可撓性
チューブ６５を取付けて形成される。The forceps channel 59 is formed by attaching a flexible tube 65 to the rear end side of the through hole 61.
又、先端部本体５３の後部外周には、外套カバー６６が
取付けられている。Further, a mantle cover 66 is attached to the rear outer periphery of the tip main body 53.
ところで、上記固体Ｖｌｉ＆素子チップ５７が取イ・Ｊ
けられる基板５８は、第１１図に示Ｊように先端部５２
の内側形状に合わせて上部側の両側に切欠き５８ａ、５
８ｂが設けであると共に、下部の左側の部分もライトガ
イド６２を挿通ずるための切欠き５８ｃが形成され、又
右側部分にら切欠き５８ｄが形成しである。By the way, the above-mentioned solid Vli & element chip 57 is
The substrate 58 to be removed is disposed at the tip 52 as shown in FIG.
Notches 58a, 5 are provided on both sides of the upper side to match the inner shape of the
8b, a notch 58c for inserting the light guide 62 is also formed in the left side of the lower part, and a notch 58d is formed in the right side.
上記固体撮像素子チップ５７は、その裏面側が基板５８
に固着され、第１２図に示Ｊように！ｌｉｊ像部６８の
周囲の２辺に沿って形成した各チップ側ポンディングパ
ッド６９は、ボンディングワイヤ７１によって、基板５
８に設けた基板側（ベース側）ポンディングパッド７２
に電気的に０通されている。The solid-state image sensor chip 57 has a substrate 58 on its back side.
It is fixed to J as shown in Figure 12! Each chip-side bonding pad 69 formed along two sides around the lij image portion 68 is connected to the substrate 5 by a bonding wire 71.
Board side (base side) bonding pad 72 provided at 8
is electrically connected to 0.
上記ベース側ポンディングパッド７２は、プリントパタ
ーン７３を介してトランジスタ７４ａ；］ンデンナ７４
ｂ等とかランドレススルー小−ル７５等に導通される。The base side bonding pad 72 is connected to the transistor 74a through the printed pattern 73.
It is electrically connected to the small landless through hole 75 or the like.
このランドレススルーホール７５は基板５８の裏面のパ
ターンを経て電気回路素子と１＆続されたり、基板５８
の裏面側のＩＣ７６（第９図参照）の端子取付は用スル
ーホールランド７７とかコネクタ受け７８の各ビン足を
取イ・］けるコネクタ受は用スルーホールランド７９等
と接続される。This landless through hole 75 is connected to an electric circuit element through the pattern on the back side of the substrate 58, or
The terminals of the IC 76 (see FIG. 9) on the back side of the connector are connected to the through-hole lands 77 and the pin legs of the connector receivers 78. The connector receivers are connected to the through-hole lands 79 and the like.
尚、上記ボンディングワイヤ７２で両ポンディングパッ
ド６９．７２が接続された固体Ｈａ 像素子チップ５７
は樹脂８０で封止されている。Note that the solid Ha image element chip 57 has both bonding pads 69 and 72 connected by the bonding wire 72.
is sealed with resin 80.
尚、第９図に示すようにコネクタ受け７８には信号線８
１の先端に取付けたコネクタ８２が接続される。Incidentally, as shown in FIG. 9, the signal line 8 is connected to the connector receiver 78.
A connector 82 attached to the tip of 1 is connected.
この第２実施例では固体撮像素子チップ５７が取付けら
れる基板５８に切欠き５８ａ、５８ｂ。In this second embodiment, notches 58a and 58b are provided in a substrate 58 to which a solid-state image sensor chip 57 is attached.
５８Ｃ，５８ｄを形成したほぼ楕円形ないし台形状にし
て先端部５２内に無駄な空間を少なくして収納している
。58C and 58d are formed into a substantially elliptical or trapezoidal shape and are housed within the distal end portion 52 with less wasted space.
上記第２実施例では基板５８は、固体撮像素子チップ５
７の１ｍ面６８と平行、つまり先端部５２の軸方向から
傾いた方向に配設しであるが、この軸方向と平行となる
ように配設しても良い。In the second embodiment, the substrate 58 is the solid-state image sensor chip 5.
7, that is, in a direction inclined from the axial direction of the tip portion 52, but it may be arranged parallel to this axial direction.
第１３図は本発明の第３実施例の電子内？ＩＡ鏡９１の
先端側を示づ。FIG. 13 shows the electron inside of the third embodiment of the present invention? The tip side of the IA mirror 91 is shown.
この電子内視＆１９１の先端側の断面形状は第２図に示
す電子内視鏡１の先端側と殆んど同様であり、対応する
同一部材には同符号を付けて示す。The cross-sectional shape of the distal end side of this electronic endoscope &191 is almost the same as that of the distal end side of the electronic endoscope 1 shown in FIG. 2, and corresponding identical members are designated by the same reference numerals.
対物レンズ系１６の奥に配設され、陽像光学系を形成づ
るプリズム１９Ａ、１９Ｂは、上記第１３図のＢ−［３
Ｆ２断面で示づ第１４図に示づように、上部側の左右の
隅部２箇所に切欠き９２．９２を形成して先端部９内に
収納されている。尚、この実施例では対物レンズ系１６
の下側には２本のライトガイド２３．２３が配設しであ
る。The prisms 19A and 19B, which are arranged at the back of the objective lens system 16 and form a positive image optical system, are arranged at
As shown in FIG. 14 showing the F2 cross section, notches 92 and 92 are formed at two left and right corners of the upper portion, and the tip is housed in the tip portion 9. In this embodiment, the objective lens system 16
Two light guides 23, 23 are arranged below.
上記先端部９に収納された内視鏡先端構成物の外周は、
先端部９の内径に殆んど接するように収納り°ることに
よって、実装密度を向上し、先端部９を細径、小型化し
ている。The outer periphery of the endoscope tip structure housed in the tip portion 9 is as follows:
By housing it so as to be almost in contact with the inner diameter of the tip 9, the packaging density is improved and the tip 9 is made smaller in diameter and smaller.
尚、第１４図において、固体撮像素子２１のパッケージ
も一点鎖線で示すように上部側の両隅に切欠き（符号９
４．９４で示す）を形成したものにして、より大きな撮
像面を有Ｊる固体撮像素子を収納するようにしても良い
。In FIG. 14, the package of the solid-state image sensor 21 also has notches (symbol 9) at both corners of the upper side as shown by the dashed line.
4.94) may be used to accommodate a solid-state image sensor having a larger imaging surface.
［発明の効果］
以上述べたように本発明によれば固体撮像素子又は固体
撮像素子が取付りられる基鈑に切欠きを設け、撮像面が
挿入部の軸と平行となる方向からずれた斜め方向を向く
ように配設しであるので、先端部の長さを短く、且つ細
径化でさる。[Effects of the Invention] As described above, according to the present invention, a notch is provided in the solid-state imaging device or the base plate to which the solid-state imaging device is attached, and the imaging surface is tilted away from the direction parallel to the axis of the insertion portion. Since it is arranged so as to face the direction, the length of the tip part can be shortened and the diameter can be reduced.
第１図ないし第４図は本発明の第１実施例に係り、第１
図は４隅が面取りされた固体撮像素子を示す正面図、第
２図は第１実施例の電子内視鏡の先端側の構造を示す断
面図、第３図は第２図の正面図、第４図は第１実施例の
全体を示り゛側面図、第５図は固体囮＠糸子の第２実施
例を示す正面図、第６図は固体撮像素子の第３実施例を
示す正面図、第７図は固体撮像素子の第４実施例を示す
正面図、第８図は固体撮像素子の第５実施例を示Ｊ正面
図、第９図は本発明の第２実滴例の電子内視鏡の先端側
を示す断面図、第１０図は第９図のＡ−Ａ線の概略断面
図、第１１図は第９図の正面図、第１２図は第２実施例
における固体撮像素子チップがＬｔ板に取付けられた様
子を示す説明図、第１３図は本発明の第３実施例の電子
内？１！鏡の先端側を示Ｊ“断面図、第１４図（よ第１
３図のＢ−Ｂ線概略断面図である。
１・・・電子内祝ｖＬ ９・・・先端部１５・・
・先端部本体 １６・・・対物レンズ系２１・・・
固体撮像素子 ２２・・・基板２３・・・ライトガイ
ド ３２・・・Ｉｌａｍ部３３・・・面取り
代理人 弁理士 伊 藤 進
第２図
第４図
第５図 第６図
第７図 第８図
第９図
第１０図 第１１図
第１２図
第１３図 ユ
第１４図
手続ネ甫正習Ｉ（自発）
昭和６２年６月２６ 日
特許庁長官 黒 １）明ｋｎ 殿
１、事件の表示 昭和６１年特許願第２１３４９９
号事件との関係 特許出願人
代表者 下 山 敏 部
５、補正命令の口付 く自 発）
６９、補正の対象 明細書の「発明の詳細な説明」
の欄１、明細書の第５ページの第１７行目に「・・・可
撓性カバー２」とあるのを「・・・カバー２」に訂正し
ます。FIGS. 1 to 4 relate to a first embodiment of the present invention.
The figure is a front view showing a solid-state image sensor with chamfered four corners, FIG. 2 is a sectional view showing the structure on the distal end side of the electronic endoscope of the first embodiment, and FIG. 3 is a front view of FIG. Fig. 4 shows the whole of the first embodiment, a side view, Fig. 5 is a front view showing the second embodiment of the solid-state decoy @Itoko, and Fig. 6 is a front view showing the third embodiment of the solid-state image sensor. 7 is a front view showing the fourth embodiment of the solid-state image sensor, FIG. 8 is a front view showing the fifth embodiment of the solid-state image sensor, and FIG. 9 is a front view of the second embodiment of the solid-state image sensor of the present invention. 10 is a schematic sectional view taken along line A-A in FIG. 9, FIG. 11 is a front view of FIG. 9, and FIG. 12 is a solid state diagram in the second embodiment. FIG. 13 is an explanatory diagram showing how the image sensor chip is attached to the Lt board. 1! Figure 14 is a sectional view showing the tip side of the mirror.
FIG. 4 is a schematic cross-sectional view taken along line BB in FIG. 3; 1...Electronic congratulation vL 9...Tip 15...
・Tip body 16...Objective lens system 21...
Solid-state image sensor 22... Substrate 23... Light guide 32... Ilam section 33... Chamfering agent Patent attorney Susumu Ito Figure 2 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Fig. 9 Fig. 10 Fig. 11 Fig. 12 Fig. 13 Fig. Yu Fig. 14 Procedure Nefu Zhengshu I (spontaneous) June 26, 1985 Commissioner of the Patent Office Black 1) Ming kn Dong 1, Indication of the case Showa 1961 Patent Application No. 213499
Relationship with Case No. 5 Satoshi Shimoyama, representative of the patent applicant, voluntarily issued an order for amendment) 69. Subject of amendment ``Detailed description of the invention'' in the specification
In Column 1, line 17 of page 5 of the statement, "...Flexible Cover 2" should be corrected to "...Cover 2."
Claims (1)
において、 前記固体撮像素子又は該固体撮像素子が取付けられる基
板の隅部等を切欠き、前記固体撮像素子の撮像面が挿入
部の軸方向と平行な方向と傾斜した方向を向くように先
端部内に収納したことを特徴とする電子内視鏡。[Scope of Claims] An electronic endoscope in which a solid-state imaging device is disposed within the distal end of an insertion section, wherein a corner or the like of the solid-state imaging device or a substrate to which the solid-state imaging device is attached is cut out, and the solid-state imaging device is inserted into the endoscope. 1. An electronic endoscope, wherein the electronic endoscope is housed in a distal end portion so that an imaging surface thereof faces in a direction parallel to an axial direction of an insertion section and in a direction inclined.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61213499A JPS6366525A (en) | 1986-09-09 | 1986-09-09 | Electronic endoscope |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61213499A JPS6366525A (en) | 1986-09-09 | 1986-09-09 | Electronic endoscope |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6366525A true JPS6366525A (en) | 1988-03-25 |
Family
ID=16640207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61213499A Pending JPS6366525A (en) | 1986-09-09 | 1986-09-09 | Electronic endoscope |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6366525A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02104334A (en) * | 1988-07-12 | 1990-04-17 | Roehm Properties Bv | Monitor for heart disease |
| US5040069A (en) * | 1989-06-16 | 1991-08-13 | Fuji Photo Optical Co., Ltd. | Electronic endoscope with a mask bump bonded to an image pick-up device |
| JPH05123291A (en) * | 1991-11-08 | 1993-05-21 | Fuji Photo Optical Co Ltd | Tip part structure of electronic endoscope |
| JP2005525896A (en) * | 2002-05-16 | 2005-09-02 | シー２キュア インコーポレイティド | Small camera head |
| JP2020537178A (en) * | 2017-10-13 | 2020-12-17 | オリンパス ビンテル ウント イーベーエー ゲーエムベーハーＯｌｙｍｐｕｓ Ｗｉｎｔｅｒ ＆ Ｉｂｅ Ｇｅｓｅｌｌｓｃｈａｆｔ Ｍｉｔ Ｂｅｓｃｈｒａｎｋｔｅｒ Ｈａｆｔｕｎｇ | Optical system of stereo video endoscope |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6068823A (en) * | 1983-09-26 | 1985-04-19 | オリンパス光学工業株式会社 | Endoscope |
| JPS6088923A (en) * | 1983-10-21 | 1985-05-18 | Olympus Optical Co Ltd | Endoscope |
| JPS61124918A (en) * | 1984-11-22 | 1986-06-12 | Olympus Optical Co Ltd | Endoscope |
| JPS6156623B2 (en) * | 1983-08-31 | 1986-12-03 | Hitachi Ltd |
-
1986
- 1986-09-09 JP JP61213499A patent/JPS6366525A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6156623B2 (en) * | 1983-08-31 | 1986-12-03 | Hitachi Ltd | |
| JPS6068823A (en) * | 1983-09-26 | 1985-04-19 | オリンパス光学工業株式会社 | Endoscope |
| JPS6088923A (en) * | 1983-10-21 | 1985-05-18 | Olympus Optical Co Ltd | Endoscope |
| JPS61124918A (en) * | 1984-11-22 | 1986-06-12 | Olympus Optical Co Ltd | Endoscope |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02104334A (en) * | 1988-07-12 | 1990-04-17 | Roehm Properties Bv | Monitor for heart disease |
| US5040069A (en) * | 1989-06-16 | 1991-08-13 | Fuji Photo Optical Co., Ltd. | Electronic endoscope with a mask bump bonded to an image pick-up device |
| JPH05123291A (en) * | 1991-11-08 | 1993-05-21 | Fuji Photo Optical Co Ltd | Tip part structure of electronic endoscope |
| JP2005525896A (en) * | 2002-05-16 | 2005-09-02 | シー２キュア インコーポレイティド | Small camera head |
| JP2020537178A (en) * | 2017-10-13 | 2020-12-17 | オリンパス ビンテル ウント イーベーエー ゲーエムベーハーＯｌｙｍｐｕｓ Ｗｉｎｔｅｒ ＆ Ｉｂｅ Ｇｅｓｅｌｌｓｃｈａｆｔ Ｍｉｔ Ｂｅｓｃｈｒａｎｋｔｅｒ Ｈａｆｔｕｎｇ | Optical system of stereo video endoscope |
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