JPS6362678A - Rotary grinding wheel - Google Patents
Rotary grinding wheelInfo
- Publication number
- JPS6362678A JPS6362678A JP20514886A JP20514886A JPS6362678A JP S6362678 A JPS6362678 A JP S6362678A JP 20514886 A JP20514886 A JP 20514886A JP 20514886 A JP20514886 A JP 20514886A JP S6362678 A JPS6362678 A JP S6362678A
- Authority
- JP
- Japan
- Prior art keywords
- disc
- rotary
- aromatic
- abrasive grains
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000227 grinding Methods 0.000 title abstract description 9
- 239000006061 abrasive grain Substances 0.000 claims abstract description 70
- 229920001721 polyimide Polymers 0.000 claims abstract description 26
- 239000002245 particle Substances 0.000 claims abstract description 8
- 238000002156 mixing Methods 0.000 claims abstract description 5
- 239000004642 Polyimide Substances 0.000 claims description 22
- 125000003118 aryl group Chemical group 0.000 abstract description 49
- 238000005498 polishing Methods 0.000 abstract description 22
- 238000005520 cutting process Methods 0.000 abstract description 10
- 239000000463 material Substances 0.000 abstract description 8
- 239000007788 liquid Substances 0.000 abstract description 7
- 230000007774 longterm Effects 0.000 abstract description 3
- DFSAHTMGGGMUFZ-UHFFFAOYSA-N C1(=CC=CC=C1)C1=CC=CC=C1.[C].[C].[C].[C] Chemical compound C1(=CC=CC=C1)C1=CC=CC=C1.[C].[C].[C].[C] DFSAHTMGGGMUFZ-UHFFFAOYSA-N 0.000 abstract 2
- 239000003814 drug Substances 0.000 abstract 2
- 229920005575 poly(amic acid) Polymers 0.000 description 25
- 239000002253 acid Substances 0.000 description 18
- 239000010408 film Substances 0.000 description 18
- 239000002904 solvent Substances 0.000 description 18
- 239000006185 dispersion Substances 0.000 description 11
- 238000003756 stirring Methods 0.000 description 11
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- -1 aromatic tetracarboxylic acid Chemical class 0.000 description 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 150000004984 aromatic diamines Chemical class 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 5
- 239000010432 diamond Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- 230000014759 maintenance of location Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 3
- 239000003082 abrasive agent Substances 0.000 description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 3
- ATHHXGZTWNVVOU-UHFFFAOYSA-N N-methylformamide Chemical compound CNC=O ATHHXGZTWNVVOU-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- ZHDTXTDHBRADLM-UHFFFAOYSA-N hydron;2,3,4,5-tetrahydropyridin-6-amine;chloride Chemical compound Cl.NC1=NCCCC1 ZHDTXTDHBRADLM-UHFFFAOYSA-N 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- DIUALWFQMYOAFP-UHFFFAOYSA-N 1,3,6,8-tetraoxofuro[3,4-e][2]benzofuran-4,5-dicarboxylic acid Chemical compound O=C1OC(=O)C2=C1C(C(=O)O)=C(C(O)=O)C1=C2C(=O)OC1=O DIUALWFQMYOAFP-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
- CQMIJLIXKMKFQW-UHFFFAOYSA-N 4-phenylbenzene-1,2,3,5-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C(O)=O)=C1C1=CC=CC=C1 CQMIJLIXKMKFQW-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- PMDCZENCAXMSOU-UHFFFAOYSA-N N-Ethylacetamide Natural products CCNC(C)=O PMDCZENCAXMSOU-UHFFFAOYSA-N 0.000 description 1
- OHLUUHNLEMFGTQ-UHFFFAOYSA-N N-methylacetamide Chemical compound CNC(C)=O OHLUUHNLEMFGTQ-UHFFFAOYSA-N 0.000 description 1
- 101100491995 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) aro-1 gene Proteins 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 101150099564 amiF gene Proteins 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 125000006159 dianhydride group Chemical group 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 230000035558 fertility Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- XWRMTHIKSJKELT-UHFFFAOYSA-N n-ethylacetamide Chemical compound [CH2]CNC(C)=O XWRMTHIKSJKELT-UHFFFAOYSA-N 0.000 description 1
- KERBAAIBDHEFDD-UHFFFAOYSA-N n-ethylformamide Chemical compound CCNC=O KERBAAIBDHEFDD-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229940090668 parachlorophenol Drugs 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業−にの利用分野〕
この発明は、砥粒がビフェニルテトラカルボン酸系の芳
香族ポリイミドの均質層内に均一に分散して内蔵されて
いる適度の剛性と共に柔軟性も有する特定の砥粒含有シ
ート体が、円盤状に切り抜かれている円盤状ディスク体
からなる回転砥石（ダイジングソーも含む）、さらに、
その円盤状ディスク体が回転支持台座に固着（固定）さ
れているディスク型の回転砥石に関するものである。[Detailed description of the invention] [Industrial field of application] This invention is characterized by the fact that abrasive grains are uniformly dispersed and incorporated within a homogeneous layer of biphenyltetracarboxylic acid-based aromatic polyimide, which has moderate rigidity and flexibility. A rotary grindstone (including a dicing saw) consisting of a disc-shaped disc body in which a specific abrasive grain-containing sheet body that also has abrasive properties is cut out in a disc-shape;
This invention relates to a disc-shaped rotating grindstone whose disc-shaped disc body is fixed (fixed) to a rotation support base.
この発明の回転砥石は、種々の研磨または研削機械に取
り付けて、回転させて、被研磨材の表面と回転している
前記回転砥石の平面または周縁部とを接触させて研磨し
たり、あるいは、回転している回転砥石の周縁部で、種
々の無機材料（シリコンウェハーなど）または金属材料
などに、細密な研削や溝入れしたり、あるいは、無機材
料を精密に切断したりするために使用することかできる
ものである。The rotary whetstone of the present invention can be attached to various polishing or grinding machines and rotated to bring the surface of a material to be polished into contact with the plane or peripheral portion of the rotating whetstone for polishing, or The peripheral edge of a rotating whetstone is used for finely grinding or grooving various inorganic materials (silicon wafers, etc.) or metal materials, or for precisely cutting inorganic materials. It is something that can be done.
ｒ従来技術の説明〕
紙製の基材などの表面に、研磨用の砥粒を接着剤などと
共に塗布しイ」着さ・０−た紙ヤスリなどの柔軟な研磨
シートが知られていたか、このよ・うな研磨シートは、
その紙などの基材の材質および接着剤などのために、機
械的強度、耐熱性および研磨性能を充分に有するもので
はなく、工業的な回転砥石として、硬質であって研磨ま
たは切断の困芹な被研磨材なとの研磨または切断に使用
することができなかったのである。Description of Prior Art] Are there any known flexible abrasive sheets, such as sandpaper, which are coated with abrasive grains together with an adhesive or the like on the surface of a paper base material? This kind of polishing sheet is
Due to the material of the base material such as paper and the adhesive, it does not have sufficient mechanical strength, heat resistance, and abrasive performance, and as an industrial rotary whetstone, it is hard and difficult to grind or cut. Therefore, it could not be used for polishing or cutting the materials to be polished.
また、超硬合金用の耐熱性の研削材村上しては、ピロメ
リット酸二無水物と芳香族ジアミンとからｉｑられた芳
香族ポリイミド粉体（砥粒結合剤）と、ダイヤモンドな
どの砥粒とを混合した粉体混合物を、金型内に充填し、
その充填物を高温および高圧で成形して厚手の環状の砥
粒成形体を製造し、この砥粒成形体をホイール状の砥石
基盤に砥粒層として接合して製作した「回転研削させる
ことができる研削工具ｊが、アメリカ特許第３３８５６
８４号明細書、アメリカ特許第３６５０７１５号明細書
などによって、知られている。In addition, Murakami's heat-resistant abrasive material for cemented carbide uses aromatic polyimide powder (abrasive grain binder) made from pyromellitic dianhydride and aromatic diamine, and abrasive grains such as diamond. Fill the mold with a powder mixture of
The filling is molded at high temperature and pressure to produce a thick annular abrasive grain molded body, and this abrasive grain molded body is bonded to a wheel-shaped grindstone base as an abrasive grain layer. The grinding tool j that can be used is U.S. Patent No. 33856.
It is known from US Pat. No. 84, US Pat. No. 3,650,715, and the like.
しかし、前記の耐熱性の研削材料の製法における粉末成
形法では、厚さが薄く、剛性を有すると共に柔軟である
耐熱性の研磨シー１を工業的Ｑこ容易に製造することか
できなかったのである。However, with the powder molding method used in the production of heat-resistant abrasive materials, it was not possible to easily produce a heat-resistant abrasive sheet 1 that was thin, rigid, and flexible on an industrial scale. be.
さらに、種々の基材の精密な切断などの用途に使用され
る回転砥石としては、ダイ４・モント、フランダムなど
の粒状又は粉末状の研磨剤（以下、砥粒ともいう）を、
メタルポンド、レシンポンドなどの結合剤を用いて薄板
状またはシート状に固着成形した後、その成形体をラッ
ピング加工して所定の厚さまで薄＜ Ｌ、で、製造した
ものなどか、知られていた。Furthermore, as rotary whetstones used for purposes such as precision cutting of various base materials, granular or powdery abrasives (hereinafter also referred to as abrasive grains) such as Dai 4 Mont and Flundum are used.
It is known that the product is manufactured by firmly molding it into a thin plate or sheet using a binder such as metal pound or resin pound, and then lapping the molded body to a predetermined thickness. .
しかしながら、この公知の方法で製作された回転砥石は
、ラソビンク加圧というｕ４１Ｌ、い加圧が必要であり
、生産性が低いと共に、得られた回転砥石が砥粒の分散
状態のバラツキおよび仕上がり厚みのバラツキを有して
おり、精密な切断、溝入れなどに使用できないという欠
点かあり、さらに、前述の回転砥石の製作費が多くなり
、製造コストが高くなるという問題点があった。However, the rotary whetstone manufactured by this known method requires high pressure called lasovink pressurization, resulting in low productivity and the resulting whetstone has uneven dispersion of abrasive grains and uneven finish thickness. This has the disadvantage that it cannot be used for precision cutting, grooving, etc. Furthermore, there is a problem that the production cost of the above-mentioned rotary grindstone increases, which increases the manufacturing cost.
この発明者らは、前述の公知の回転砥石の有していた種
々の問題へか解決されている回転砥石を提供することを
目的として鋭意ω［究した結果、砥粒が均一・に分散し
ている有機溶媒（分散液）内で、ビフ丁、ニルテトラカ
ルボン酸類の芳香族テトラカルボン酸成分と芳香族シア
ミン成分とを重合して調製したポリマーの溶液（芳香族
ポリアミック酸の溶液など）から溶液流延法で製膜・成
形したｒ砥粒を均一・に分散して含有する芳香族ポリイ
ミドの均一層と、そのポリイミドの均一層内に均一に分
散している砥粒とからなる砥粒含有薄膜またはシート体
（以下、砥粒含有シート体とも言う）」を、円盤状に裁
断して製造された円盤状ディスク体からなる回転砥石、
必要であれば、その円盤状ディスク体が回転支持台座に
固定されている回転砥石が、前述の種々の問題点を解消
することができることを見い出し、この発明を完成した
。The inventors have conducted extensive research on ω [with the aim of providing a rotary whetstone that solves the various problems of the known rotary whetstones mentioned above, and have found that the abrasive grains are uniformly and From a polymer solution (such as a solution of an aromatic polyamic acid) prepared by polymerizing an aromatic tetracarboxylic acid component and an aromatic cyamine component of biftine and niltetracarboxylic acids in an organic solvent (dispersion liquid) containing Abrasive grains consisting of a uniform layer of aromatic polyimide containing uniformly dispersed R-abrasive grains formed and molded by a solution casting method, and abrasive grains uniformly dispersed within the uniform layer of polyimide. A rotary grindstone made of a disc-shaped disc body manufactured by cutting a thin film or sheet containing abrasive grains (hereinafter also referred to as an abrasive-containing sheet body) into a disc shape,
The present invention has been completed based on the discovery that, if necessary, a rotary grindstone whose disc-shaped disc body is fixed to a rotary support base can solve the various problems described above.
すなわち、この発明は、平均粒子径０．１〜６０μｍで
ある砥粒が５〜８０容量％の配合割合でビフェニルテト
ラカルボン系の芳香族ポリイミドの均質層内に均一に分
散している、厚さ１０〜５００μｍの砥粒含有シート体
が、円盤状に切り抜かれている円盤状ディスク体からな
る回転砥石、特に、前記の円盤状ディスク体が回転支持
台座に固定されているディスク型の回転砥石に関する。In other words, the present invention provides a method for producing a thick layer in which abrasive grains having an average particle diameter of 0.1 to 60 μm are uniformly dispersed in a homogeneous layer of biphenyltetracarboxylic aromatic polyimide at a blending ratio of 5 to 80% by volume. The present invention relates to a rotary whetstone consisting of a disc-shaped disc body in which an abrasive grain-containing sheet body of 10 to 500 μm is cut out in a disc-shape, and particularly to a disc-shaped rotary whetstone in which the disc-shaped disc body is fixed to a rotation support pedestal. .
この発明の回転砥石は、内部に均一に分散している砥粒
を内蔵しているビフ、ア、ニルテトラカルボン酸系の芳
香族ポリイミドが、優れた砥粒の保持性を有しており、
また機械的強度（特に、引張弾性率、Ｍ Ｉ Ｔ耐折強
度など）、耐熱性（５００′ｃに加熱した際の熱減量率
）、耐Ｍ性（湿度５０％での２５°Ｃの平衡吸湿率）、
耐薬品性などについても優れているので、高温下での耐
熱研磨性、長時間の耐久性、種々の研磨液に対する耐薬
品性などについて優れた回転研磨性能、回転切断性など
を示すことができる、適当な剛性を有すると共に柔軟性
も有する新規な砥石含有シート体が円盤状に切り抜かれ
ている円盤状ディスク体からなる回転砥石、特に、その
円盤状ディスク体と回転支持台座とからなる回転砥石で
ある。The rotary whetstone of the present invention has excellent abrasive grain retention due to the aromatic polyimide of bif, a, nyltetracarboxylic acid containing abrasive grains uniformly dispersed inside.
In addition, mechanical strength (especially tensile modulus, MIT folding strength, etc.), heat resistance (heat loss rate when heated to 500'C), M resistance (25°C equilibrium at 50% humidity), moisture absorption rate),
It also has excellent chemical resistance, so it can exhibit excellent rotary polishing performance, rotary cutting performance, etc. in terms of heat polishing resistance at high temperatures, long-term durability, and chemical resistance to various polishing liquids. , a rotary whetstone consisting of a disc-shaped disc body in which a novel whetstone-containing sheet body having appropriate rigidity and flexibility is cut out in a disc-shape, particularly a rotary whetstone composed of the disc-shaped disc body and a rotation support base. It is.
この発明の回転砥石は、概略、砥粒を均一・に分散して
含有するヒフｌニルテトラカルボン酸系のポリアミック
酸（ポリイミド前駆体）溶液から、溶液流延法などで製
膜して、芳香族ポリイミドと砥粒とからなる砥粒含有シ
ート体を製造した後、その砥粒含有シート体を円盤状に
裁断して円盤状ディスク体を形成するといる平易なＪ［
程、あるいは、その円盤状ディスク体を回転支持台座に
固着するという平易な工程で、均一・な擾れた性能のデ
ィスク型の回転砥石を製造する、二とができるのである
。The rotary whetstone of the present invention is generally produced by forming a film using a solution casting method or the like from a solution of a polyamic acid (polyimide precursor) based on hifuryltetracarboxylic acid containing uniformly dispersed abrasive grains. A simple J[
It is possible to manufacture a disc-shaped rotating grindstone with uniform grinding performance through the simple process of fixing the disc-shaped disc body to a rotating support base.
以下、この発明について、図面も参考にしながらさらに
詳しく説明する。Hereinafter, this invention will be explained in more detail with reference to the drawings.
第１図は、この発明の回転砥石の斜視図であり、さらに
、第２図および第３図は、前記１転紙石の平面図および
１折面図である。FIG. 1 is a perspective view of the rotary grindstone of the present invention, and FIGS. 2 and 3 are a plan view and a folded view of the above-mentioned rolling stone.
この発明は、砥粒が特定の配合割合でヒフヱニルテトラ
カルボン系の芳香族ポリイミドの均ｒｆ層内に均一に分
散して内蔵されている、厚さ１０〜５００μｍ稈度の砥
粒含有シー１一体１が、円盤状、特にドーナツ盤状に切
り抜かれている（裁断されている）円盤状ディスク体か
らなる回転砥石であり、特に、第３図に示すように、前
記円盤状ディスク体ｌが回転支持台ＩＩ ２に、適当な
手段（例えば、接着剤、ビスなど）で固定または固着さ
れている回転砥石であって、高速の回転によって被研磨
また（：ｌ′研削物を研磨、研削、切断することができ
る薄手の回転砥石３である。This invention provides an abrasive grain-containing sheet with a thickness of 10 to 500 μm and a culmability in which abrasive grains are uniformly dispersed and incorporated in a homogeneous RF layer of aromatic polyimide based on hyphenyltetracarboxylic at a specific blending ratio. 1 1 is a rotary grindstone consisting of a disc-shaped disc body cut out (cut) into a disc shape, particularly a donut disc shape, and in particular, as shown in FIG. is a rotary grindstone which is fixed or fixed to the rotary support base II 2 by suitable means (e.g., adhesive, screws, etc.), and is capable of polishing or grinding the object to be polished or (:l') by rotating at high speed. This is a thin rotary grindstone 3 that can be cut.
この発明における円盤状ディスク体１を形成している砥
粒含有シー１〜体は、平均Ｗｔ、 ７’ ｆ条０．１〜
６０μｍの砥粒が５〜８０容早％１、好まり、 ＜は１
０〜７０容丑％、さらに好ましくは１５〜６０容量％の
配合割合でヒフェニルテＩ・ラカルボン系の芳香族ボリ
イミ１゛の均質系内Ｑこ均 乙に分散している、ｊ￥さ
１０〜５００μｍ、好まし７くは３０〜４００μｍ、さ
らに好ゴロ、くば５０〜３００１ｊｍの砥粒含有シー１
〜体であれはよい。The abrasive grain-containing sheets 1 to 1 forming the disc-shaped disk body 1 in this invention have an average Wt, 7' f 0.1 to 0.1.
60μm abrasive grains are 5-80% 1, preferred, <1
0 to 70% by volume, more preferably 15 to 60% by volume, aromatic polyimide of Hyphenylte I/Lacarvone is dispersed in a homogeneous system with a thickness of 10 to 500 μm. , preferably 7 to 30 to 400 μm, and more preferably abrasive grains with a diameter of 50 to 3001 μm
~Whatever your body is is fine.
前記の円盤状ディスク体１は、特に］”−ナナラ状であ
ることが好ましく、また、その外径が約５〜２５ｃｍ、
特に６〜２０ｃｍ程度であることが好ましい。It is particularly preferable that the disc-shaped disc body 1 has a]-row shape, and has an outer diameter of about 5 to 25 cm,
In particular, it is preferably about 6 to 20 cm.
＋ｉｉｆ記の円盤状う−イスク体１において芳香族ポリ
・イミ］・の均質層内乙こ均一・に分１１りしている砥
粒としてしｌ、平均粒子径か０．１〜６０μｍ、好まし
くは０．５〜５０７１ｍ稈度である研磨にたば研削用の
砥粒であればよく、また、その砥オ→の最大径か１７０
μｍ程度以下、特に１５０μｍ以下であることが々ｒま
しく、例えば、天然または人造ダイヤモンド、炭化ケイ
素、立方晶ボロンナイト（窒化ホウ素）、溶融アルミナ
、スピンネル、ザクロ石、ケイ砂などからなる前記平均
粒子径の砥粒を挙げることができる。In the disc-shaped disk body 1 described in 3.3.1, the abrasive grains are uniformly divided into 11 parts in the homogeneous layer of aromatic polyimide, and the average particle diameter is preferably 0.1 to 60 μm. may be abrasive grains for polishing with a culm of 0.5 to 5071 m, and the maximum diameter of the abrasive o→170
It is often about μm or less, especially 150 μm or less, and is made of, for example, natural or artificial diamond, silicon carbide, cubic boronite (boron nitride), fused alumina, spinel, garnet, silica sand, etc. Examples include abrasive grains of particle size.
前記砥粒は、無機質または金属質の物質が、前記砥粒の
各表面に被覆されている砥粒であってもよい。The abrasive grains may be abrasive grains in which each surface of the abrasive grains is coated with an inorganic or metallic substance.
前記円盤状シート体１において使用されている芳香ｈ′
ｉ＋：ボリイミトは、２．３．３”、、ｌ’ ビラｌ
ニルテトラカルボン酸、３．３’、４．４’−ヒフェニ
ルテ１〜ラヵルボン酸、およびそれらの酸ニ無水物から
なる群から選ばれたｒビフェニルテトラカルボン酸また
はその酸二無水物」４ニドとして（特に好ましくは約６
０Ｔ−ル％ツ上）含有するｒ芳香族テｌ” ：’ｙカル
ボンｍ成分Ｊと、４，４゛ ジアミノシフ丁、ニルエ
ーテル、３．４’−ジアミノジフェニルエーテル、４．
４リジアミノジフｌニルナオコニーう−ル、４．４’−
ジアミノシフｌニルソ、ルボン、４，４°−ジアミノヘ
ンシソエノン、４，４゛−ジアミノジフェニルメタン、
２，２−ヒス（４−アミノファニル）プロパン、０−１
ｍ又はｐ−フェニレンジアミンなとからなる群から遼は
れた芳香族シアミン化合物を約５０モル％ｊ以上含有す
る「芳香族ジアミン成分」とから、両成分の等モルを重
合およびイミド化して得δ、れた、ビフェニルテトラカ
ルボン酸系の耐；（ｉｔ ｆ’ｔの芳香族ボリイミ１で
ある。Fragrance h' used in the disk-shaped sheet body 1
i+: Boliimito is 2.3.3", l' Billa l
r-biphenyltetracarboxylic acid or its acid dianhydride selected from the group consisting of biphenyltetracarboxylic acid, 3.3', 4.4'-hyphenyltetracarboxylic acid, and their acid dianhydrides. (Particularly preferably about 6
0T-R%T) Containing aromatic compound: 'yCarbonm component J, 4,4'-diaminosphenyl ether, 3.4'-diaminodiphenyl ether, 4.
4 lydiaminodifur, 4.4'-
Diaminophenylsoenone, 4,4°-diaminodiphenylmethane, 4,4°-diaminodiphenylmethane,
2,2-his(4-aminophanyl)propane, 0-1
obtained by polymerizing and imidizing equal moles of both components from an "aromatic diamine component" containing about 50 mol% or more of an aromatic cyamine compound that is far from the group consisting of m- or p-phenylenediamine. δ, resistance of biphenyltetracarboxylic acid system; (it f't aromatic polyimide 1.
前記の芳香族ボリイミ１ば、対数粘度（５０’Ｃで測定
、濃度；０．５ｇ／］００ｍｐ溶媒、溶媒；パラクロル
フェノール）か、約０． ］〜７、特に０゜３ｍ５程度
であることが好ましい。The aromatic polyimide 1 has a logarithmic viscosity (measured at 50'C, concentration: 0.5 g/]00 mp solvent, solvent: parachlorophenol) or about 0. ]~7, particularly preferably about 0°3m5.
この発明において、前記の芳香族ボリイ及１・は、試料
を１ （１’Ｃ： ／分て胃温した場合に試料の５車量
％が加熱減量ずろまでの温度で示される’ −ｉｔ鳩性
Ｊか４５０″Ｃ以上、特に５０ （１’Ｃ以上である４
）のが好まし２く、また、平衡吸湿率（湿度５０％およ
び温度５０℃の環境状態Ｑに保持し７て到達する吸／！
Ｉｉ！率である）が１．２％以下、特に１．０％以ド（
あろ４）のが、回転砥石ζに成形され人：後の酌久牲（
耐熱性、機械的物性の保持性なと）において、好ましい
。In this invention, the aromatic compound and 1. are expressed by the temperature at which 5% of the sample loses weight on heating when the sample is heated at 1 (1'C: /min). J or higher than 450"C, especially 50 (1'C or higher)
) is preferable, and the equilibrium moisture absorption rate (absorption/! which is reached by maintaining the environmental condition Q of 50% humidity and 50° C.) is preferable.
Ii! rate) is 1.2% or less, especially 1.0% or less (
Aro 4) was formed into a rotating whetstone
It is preferable in terms of heat resistance and retention of mechanical properties.
この発明においては、特に、３．３’ 、４．４’−ビ
フェニルテＩ・ラカルポン酸またはその酸二無水物を約
７０モル％以上、特に好ましくは８０モル％以上、さら
に好ましくは９０〜１００モル％含有する「芳香族テト
ラカルボン酸成分」と、４．４’−ジアミノジフェニル
エーテルを約６０モル％以上、特に好ましくは７０モル
％以−１−１さらに好ましくは８０〜１００モル％含有
する「芳香族シアミン成分」とを、大略等モル、重合し
、さらにイミド化して得られた高分子量の芳香族ポリイ
ミドが、前述の耐熱性、耐久性、機械的物１７１などの
ほかに、砥粒の保持性において、すなわ゛ら回転砥石の
研磨性の長期保持性乙こおいて、好適である。In this invention, in particular, 3.3',4.4'-biphenylteI-lacarponic acid or its acid dianhydride is contained in an amount of about 70 mol% or more, particularly preferably 80 mol% or more, and even more preferably 90 to 100 mol%. ``Aromatic tetracarboxylic acid component'' containing mol% and ``aromatic tetracarboxylic acid component'' containing 4,4'-diaminodiphenyl ether at about 60 mol% or more, particularly preferably 70 mol% or more, and more preferably 80 to 100 mol%. The high molecular weight aromatic polyimide obtained by polymerizing and imidizing approximately equimolar amount of "aromatic cyamine component" has the above-mentioned properties such as heat resistance, durability, mechanical properties 171, etc. In terms of retention, it is particularly suitable for long-term retention of polishing properties of rotary whetstones.
また、特に、３，３“、４．４’−ビフェニルテトラカ
ルボン酸またはその酸二無水物を約６０モル％以−１＝
、峙に好ましくは７０モル％以上、さらに好ましくは８
０〜１００モル％含有する芳香族テトラカルボン酸成分
と、０−ｌｍ−又はｐ−フェニｉ／ンシアミンを約４０
モル％以上、特に好まし７くは５０モル％以−ヒ、さら
に好ましくは６０〜１００モル％含有する芳香族ジアミ
ン成分とを、大略等モル、重合Ｊ写よびイミド化して（
Ｍられた高分子量の芳香族ボリイミ＋が、前述の耐久性
、機械的物性などと共に、特に耐熱性が高く、弾性率が
高く、さらに熱的な寸法安定性がよい（常温から３００
℃までの熱膨張係数が約４．５ Ｘ ＋−０−５ｃｍ／
ｃｍ／℃ｋｊ下、特に１．２〜４．ＯＸ １０−”ｃｍ
／ｃｍ／’Ｃ程度である）ので、好）角である。In particular, about 60 mol% or more of 3,3",4,4'-biphenyltetracarboxylic acid or its acid dianhydride-1=
, preferably 70 mol% or more, more preferably 8
An aromatic tetracarboxylic acid component containing 0 to 100 mol% and about 40% of 0-lm- or p-phenylene/cyamine.
The aromatic diamine component containing mol% or more, particularly preferably 7 or 50 mol% or more, more preferably 60 to 100 mol%, is polymerized and imidized (
The high molecular weight aromatic polyimide + has particularly high heat resistance, high elastic modulus, and good thermal dimensional stability (from room temperature to 300 m
Thermal expansion coefficient up to ℃ is approximately 4.5 x +-0-5cm/
cm/℃kj, especially 1.2 to 4. OX 10-”cm
/cm/'C), so it is a good) angle.
前記の芳香族テトラカルボン酸成分としては、前述のビ
フ、ニルテトラカルボン酸またはその酸−ユ無水物と、
ビロメリｙ Ｉ・酸また！３１その酸−無水物との混合
物であってもよい。As the aromatic tetracarboxylic acid component, the above-mentioned bif, niltetracarboxylic acid or its acid anhydride,
Biromeliy I・Acid again! 31 may be a mixture with its acid-anhydride.
この発明においては、前記の砥粒および芳香族ポリイミ
ドの他に、例えば、グラファ・イト、ＳｉＯ２、ｓｉｃ
、、Ａ７＋２０３、Ｆｅ２Ｏ３、ＣｕＸＳｎ、またはそ
れらの混合物からなる充ｔ−Ｈ＋Ａが配合されていても
よく、その充填材の平均粒子径が約０．１〜１１００ｔ
Ｉ、特Ｑこ０．５〜５０μｍ程度の粉体であることが望
ましい。In this invention, in addition to the abrasive grains and aromatic polyimide, for example, graphite, SiO2, sic
,, A7+203, Fe2O3, CuXSn, or a filler t-H+A consisting of a mixture thereof may be blended, and the average particle size of the filler is about 0.1 to 1100t.
It is desirable that the powder be about 0.5 to 50 μm in size.
この発明における砥粒含有シート体は、例えば、Ｎ−メ
チル−２−ピＩ７リドン、Ｎ、 Ｎ−メチルホルムア
ミド、Ｎ、 Ｎ−エチルホルムアミド、Ｎ、Ｎ−メチ
ルアセトアミド、Ｎ、Ｎ−エチルアセトアミドなどのア
ミＦ系溶媒、フェノール、クレゾール、ハロゲン化フェ
ノールなどのフェノール系溶媒などの有機極性溶媒中に
、前述の砥粒を均一・に分散させ、
その分散液に、前述の芳香族シアミン成分および芳香族
テトラカルボン酸成分を添加し溶解させつつ、０〜８０
°Ｃ１好ましくは０〜６０℃の反応温度で、０．５〜５
０時間、好ましくは１〜３０時間、両成分を反応（重合
）させて、高分子量の芳香族ポリアミック酸（芳香族ボ
リイミ］Ｓ前駆体）を生成さゼで、前記砥粒が均一・に
分散している芳香族ポリアミック酸の溶液を調製し、そ
して、前記砥粒が分散しているポリアミック酸溶液を使
用して溶液流延法で適当な平滑な支持体−ヒで液状薄膜
を形成し、そして、
その液状薄膜を乾燥し溶媒を除去して固化させて固化膜
を形成すると共に、芳香族ポリアミック酸をイミド化し
、さらに必要であれは３００℃以−ヒの高温で加熱処理
することによって、芳香族ボリイミ）゛の均質系内に砥
粒が均一・分散して内臓されている芳香族ポリイミドと
砥粒とからなる厚さ１０〜５００μｍの薄膜またはシー
ト体（砥粒含有シート体）を成形することができる。The abrasive grain-containing sheet body in this invention includes, for example, N-methyl-2-piI7ridone, N,N-methylformamide, N,N-ethylformamide, N,N-methylacetamide, N,N-ethylacetamide, etc. The above-mentioned abrasive grains are uniformly dispersed in an organic polar solvent such as AmiF-based solvent, phenol-based solvent such as phenol, cresol, and halogenated phenol, and the above-mentioned aromatic cyamine component and aroma are added to the dispersion. 0 to 80 while adding and dissolving the group tetracarboxylic acid component.
°C1 preferably 0.5 to 5 at a reaction temperature of 0 to 60 °C
Both components are reacted (polymerized) for 0 hours, preferably 1 to 30 hours to produce a high molecular weight aromatic polyamic acid (aromatic polyamic acid (aromatic polyimide) S precursor), and the abrasive grains are uniformly dispersed. preparing a solution of aromatic polyamic acid having the abrasive grains dispersed therein, and using the polyamic acid solution in which the abrasive grains are dispersed, forming a liquid thin film on a suitable smooth support by a solution casting method; Then, by drying the liquid thin film, removing the solvent, and solidifying it to form a solidified film, the aromatic polyamic acid is imidized, and if necessary, heat treatment is performed at a high temperature of 300°C or higher. Forming a thin film or sheet body (abrasive grain-containing sheet body) with a thickness of 10 to 500 μm consisting of aromatic polyimide and abrasive grains, in which abrasive grains are uniformly and dispersed in a homogeneous system of aromatic polyimide (aromatic polyimide). can do.
その砥粒含有シート体を、公知の裁断方法で、円盤状に
裁断して円盤状ディスク体を製造するのである。The abrasive grain-containing sheet body is cut into disk shapes by a known cutting method to produce a disk-shaped disk body.
前記の砥粒の分散液は、例えば重合用の有機極性溶媒を
攪拌しながら、約６０°Ｃ以下の温度、前記溶媒内に砥
粒を、約１〜３０市量％稈度の、割合となるように、添
加しζ、その砥粒添加液を約５〜６０分間攪拌して砥粒
を均一に分散して調製することができる。The dispersion of the abrasive grains is prepared by, for example, stirring an organic polar solvent for polymerization at a temperature of about 60° C. or less, and adding the abrasive grains to the solvent in a proportion of about 1 to 30% fertility by market weight. The abrasive grains can be prepared by adding ζ and stirring the abrasive grain addition solution for about 5 to 60 minutes to uniformly disperse the abrasive grains.
なお、この分散液の調製の際乙こ、必要であれば適当な
カメブリング剤〔例えば、α−間 フェニルアミノプロ
ピル−トリメトキシシラン−（アミノエチル）−γ−ア
ミツブし１ピル−トリメトキシシラン、γ アミノプロ
ピル−トリメトキシシラン、ビニル−トリエトキシシラ
ン、ヒニルートリス（２−メトキシエトキシ
−＜３．４−エポキシシクロヘキシル）エチル−トリメ
トキシシラン
−メトキシシラン、Ｔ−メルカプトプロピル− トリメ
トキシシランなどのトリアルコキシシラン系化合物など
〕を、この分散液に添加される予定の全モノマー成分の
全９に対して０．０１〜５重♀％、特に０．０５〜３重
量％程度の配合割合で、砥粒と共に溶媒に添加して、攪
拌することが好ましく、このカップリング剤を添加した
砥粒の分散液を使用して調製された芳香族ポリアミック
酸溶液から製造された砥粒含有シー！・体からｊｑられ
た回転砥石は、特に研磨性能がイ憂れているので適当で
ある。In addition, when preparing this dispersion, if necessary, a suitable camera-bringing agent [for example, α-phenylaminopropyl-trimethoxysilane-(aminoethyl)-γ-aminopropyl-trimethoxysilane, γ Trialkoxy such as aminopropyl-trimethoxysilane, vinyl-triethoxysilane, hinyltris(2-methoxyethoxy-<3.4-epoxycyclohexyl)ethyl-trimethoxysilane-methoxysilane, T-mercaptopropyl-trimethoxysilane A silane compound, etc.] is added to the abrasive grains at a blending ratio of 0.01 to 5% by weight, particularly 0.05 to 3% by weight, based on all 9 of the total monomer components to be added to this dispersion. The abrasive-containing sheath prepared from the aromatic polyamic acid solution prepared using the abrasive dispersion to which the coupling agent is added is preferably added to the solvent and stirred together with the coupling agent.・A rotary whetstone that is removed from the body is particularly suitable because its polishing performance is poor.
前記のポリアミック酸溶液の調製において生成した芳香
族ポリアミック酸は、その対数粘度（測定温度；３０℃
、濃度；Ｏ−５ ｇ／ １ ０ ０ｍｆｆ溶媒、溶媒；
Ｎ，Ｎージメチルアセトアミ］−）が約０． １〜７、
特に０．３〜５程度であること、その溶液中のポリアミ
ック酸の濃度が約３〜５０重量％、特に５〜３０重量％
稈度であること、さらにその溶液の回転粘度（２５°（
：）が、約１〜５００００ボイズ、特に５〜３００００
ボイズ稈度であることが、好まし２い。The aromatic polyamic acid produced in the preparation of the polyamic acid solution has a logarithmic viscosity (measurement temperature: 30°C
, concentration; O-5 g/100 mff solvent, solvent;
N,N-dimethylacetami]-) is about 0. 1 to 7,
In particular, the concentration of polyamic acid in the solution is about 3 to 50% by weight, especially about 5 to 30% by weight.
The rotational viscosity of the solution (25° (
:) but about 1 to 50,000 voices, especially 5 to 30,000
Boies culmness is preferred.
さらに、前述の支持体上の液状薄膜は、常圧下または減
圧下、あるいは不活性ガスの流通下に、約５０〜１５０
℃に加熱して溶媒を除去し、乾燥及び固化（凝固）させ
、続いて、前記支持体から固化膜をζＴｈ１１離した後
、その固化膜を加熱炉などの中で約２００〜５５０℃の
温度に加熱し°乙固化膜中の溶媒の残８１；を充分に除
去すると共に、芳香族ポリアミック酸をほぼ完全にイミ
ド化し、さら乙こ固化膜を熱処理することによー，て、
砥粒が芳香族ポリイミド中に均一・に分散して内臓され
ている「適当な剛性を有すると共に柔軟性を有する耐熱
性の砥粒含有シート体」を、断続的又ａＣｔ連続的に製
造することができる。Furthermore, the liquid thin film on the above-mentioned support can be formed under normal pressure or reduced pressure, or under the flow of an inert gas.
℃ to remove the solvent, dry and solidify (coagulate), then separate the solidified film from the support by ζTh11, and then heat the solidified film in a heating furnace or the like at a temperature of about 200 to 550°C. By heating to sufficiently remove the solvent residue 81 in the solidified film and almost completely imidizing the aromatic polyamic acid, the solidified film is further heat-treated.
To produce intermittently or continuously at aCt "a heat-resistant abrasive grain-containing sheet body having appropriate rigidity and flexibility" in which abrasive grains are uniformly and evenly dispersed and incorporated in aromatic polyimide. Can be done.
この発明において使用されることがある回転支持台座２
ば、回転駆動装置と連結している回転軸に、回転砥石を
取りつけることができる機能、円盤状ディスク体ｌを回
転時に偏心しないように同心状に保持・固定する機能を
有するものであれば、どのような形式、サイズ、または
、どのような材質（例えば、熱硬化性樹脂、アルミニウ
ム、鋼鉄、ステンレスなどの金属など）のものであって
もよい。Rotation support pedestal 2 that may be used in this invention
For example, if it has the function of attaching a rotating grindstone to the rotating shaft connected to the rotational drive device, and the function of holding and fixing the disc-shaped disc l concentrically so that it does not become eccentric during rotation, It may be of any type, size, or made of any material (for example, thermosetting resin, aluminum, steel, metal such as stainless steel, etc.).
前記の回転支持台座２としては、第３図に示すように、
円盤状ディスク体の両側から挟持して、接着剤、ビスな
どで固定する形式の軽量ものが好ましい。As the rotation support base 2, as shown in FIG.
It is preferable to use a lightweight type that is clamped from both sides of a disc-shaped disc body and fixed with adhesive, screws, or the like.
また、前記の回転支持台座２は、円盤状ディスク体１の
外径によって、適宜その外径を換えることが好ましく、
例えば、円盤状ディスク体１の外径の約０．１〜０．８
倍、特に０． ２〜０．７倍程度の外径を有するものが
好まし２い。また、この発明の回転砥石は、その円盤状
ディスク体が摩耗して、その外径が小ざくなった場合に
は、外径の小さな回転支持台座に取り替えてさらに使用
することかできる。Further, it is preferable that the outer diameter of the rotation support pedestal 2 is changed as appropriate depending on the outer diameter of the disc-shaped disc body 1.
For example, about 0.1 to 0.8 of the outer diameter of the disc-shaped disc body 1
times, especially 0. It is preferable to have an outer diameter of about 2 to 0.7 times. Furthermore, in the case where the disc-shaped disc body of the rotary grindstone of the present invention becomes worn and its outer diameter becomes small, it can be replaced with a rotary support pedestal having a smaller outer diameter for further use.
以下、この発明の実施例を示して、さらに詳しくこの発
明を説明する。Hereinafter, the present invention will be explained in more detail by showing examples of the present invention.
実施例１
（芳香族ポリアミ、り酸溶液の調製）
内容積２１である円筒型重合槽に、Ｎ， Ｎ−ジメチル
アセトアミド８００ｇを入れて、攪拌しながら、ダイヤ
モンド粉末（平均粒子径５μ）７０。Example 1 (Preparation of aromatic polyamide, phosphoric acid solution) 800 g of N,N-dimethylacetamide was placed in a cylindrical polymerization tank with an internal volume of 21, and while stirring, 70 g of diamond powder (average particle size 5 μm) was added.
６４ｇを添加し、そのまま、約３０分間攪拌を続けて、
砥粒の分）Ｉｋ液をｍ製し、
続いて、その分散液に、４，４−ジアミノジフェニルエ
ーテル８ ０． ９ ９ ｇを約２分間で添加し、３０
°Ｃで３０分間攪拌して前記の芳香族ジアミン成分を熔
解させ、
そして、得られた溶液に、３．３’，４．４’−ビフェ
ニルテトラカルボン酸二無水物１０７、１７ｇを５分間
で徐々に添加Ｌ７、その溶液を３０℃で２時間攪拌して
、前記酸二無水物からなる芳香族テＩ・ラカルポン酸成
分を溶解させろと共に、前記の両成分を重合反応させ、
最後に、その重合液に、３．３’、４．、ｉ’−ヒフェ
ーニルテＩ・ラカルボン酸二無水物１］、８４．ｇを徐
々に添加し、３０℃で３時間攪拌して反応ざセで、芳香
族ポリアミック酸を構成１−７、砥粒が均一に分散して
いる芳香族ポリアミック酸／８／＆、をｆｉｌｉｌ製し
た。Add 64g and continue stirring for about 30 minutes.
4,4-diaminodiphenyl ether was added to the dispersion. Add 9 9 g in about 2 minutes, add 30 g
The aromatic diamine component was dissolved by stirring at °C for 30 minutes, and 107.17 g of 3.3',4.4'-biphenyltetracarboxylic dianhydride was added to the resulting solution over a period of 5 minutes. Gradually add L7, stir the solution at 30 ° C. for 2 hours to dissolve the aromatic teI-lacarboxylic acid component consisting of the acid dianhydride, and polymerize both components. 3.3', 4. , i'-Hyphenyltane I. lacarboxylic dianhydride 1], 84. Gradually add the aromatic polyamic acid 1-7, aromatic polyamic acid /8/& in which the abrasive grains are uniformly dispersed. Manufactured.
前記芳香族ポリアミック酸溶液は、ポリマー濃度が２０
重磨％であり、その溶液の回転粘度（３０°Ｃ）が１０
００ボイズでＪ〕す、また、その溶液中の芳香族ボ’）
−Ｊ”ｉ・、り酸の対数粘度（測定温度；３０℃、４度
：０．５ ｇ／１００ｍ１ｉ’５媒、溶媒；Ｎ。The aromatic polyamic acid solution has a polymer concentration of 20
%, and the rotational viscosity (30°C) of the solution is 10
J] with 00 bois, and aromatic bois') in the solution.
-J"i., Logarithmic viscosity of phosphoric acid (measurement temperature: 30°C, 4°C: 0.5 g/100m1i'5 medium, solvent: N.
Ｎ−ジメチルアセＩ・アミＦ）が、１．５６であった。N-dimethylace I/amiF) was 1.56.
（η（す膜）
前記の芳香族ポリアミック酸溶液を型膜用のドープ液点
して使用し７て、カーノス扱ににアプリケーターを用い
てハフ１コート法（溶液流延法）により、均一な厚さの
溶液薄Ｍ’２を形成し２、次いで、約１２０℃の熱風を
供給して前記溶液薄模を乾燥し２て溶媒を一部除去して
、約３０重丑％の溶媒が残存している固化膜を形成し、
そして、この固化膜をガラス板から剥離して、ピンテン
ターで把持して、約３００−４５０°Ｃの熱風を吹き込
むことができる加熱炉内に配置し、この加熱炉内で、前
記固化膜を前記熱風で乾燥すると共Ｑこ熱処理１ノて、
固化膜か含有する溶媒の除去を行うと共に固化膜を構成
Ｌ７ているポリマーのイミド化を完全に行って、厚さ６
０ ｔｔ ｍの「砥粒が１２４３容量％の割合で均・に
分１１々して内臓されている芳香族ポリイミドフィルム
からなる砥粒含有シー１体Ｊを製造した。(η (film)) The aromatic polyamic acid solution described above was used as a dope for the mold film, and a homogeneous coating was applied by the Huff 1 coat method (solution casting method) using an applicator to treat the mold. Form a thin solution M'2 with a thickness of 2, then dry the thin solution by supplying hot air at about 120° C. 2 to remove a portion of the solvent, leaving about 30% by weight of the solvent. Forms a solidified film that is
Then, this solidified film is peeled off from the glass plate, held with a pin tenter, and placed in a heating furnace into which hot air of about 300-450°C can be blown. After drying with hot air, heat treatment 1 is carried out.
The solvent contained in the solidified film is removed and the polymer constituting the solidified film is completely imidized to a thickness of 6.
An abrasive grain-containing sheet J was produced, which was made of an aromatic polyimide film in which abrasive grains of 0 ttm were incorporated evenly in 11 equal parts at a ratio of 1243% by volume.
前記砥粒含有シート体について、打抜き装置を使用して
、内径３ ｃｍおよび外径１５ｃｍの１−ナラ状の円盤
状ディスク体を形成し、その円盤状ディスク体をステン
Ｉ／ス製薄板（円盤状、厚さ１１ｍ、。For the abrasive grain-containing sheet body, a punching machine was used to form a single-necked disc-shaped disc with an inner diameter of 3 cm and an outer diameter of 15 cm, and the disc-shaped disc was cut into a thin plate made of stainless steel (disc shape, thickness 11m.
外径８ｃｍ）２枚の間に同心固状に挾持１．て固定し、
第１〜３図に示すような回転砥石を製造した。(outer diameter 8cm)) is held concentrically between two pieces 1. and fix it.
A rotary grindstone as shown in FIGS. 1 to 3 was manufactured.
この回転砥石の研磨性能を試験した結果、１５０ ’Ｃ
ｆ′７） １ｒｌｉ ？ｎ下、５０時間以十ノ長時間の
連続ｒｔｌＦ ｒ％において優れたωＦｌ！性能を有し
ていた。As a result of testing the polishing performance of this rotating whetstone, it was found that 150'C
f'7) 1rli? Excellent ωFl in continuous rtlF r% for a long time of 50 hours or more under n! It had good performance.
また、前記砥粒含有シート体について種々の物性を測定
しまたが、それらの諸物性を第１表に示す。In addition, various physical properties were measured for the abrasive grain-containing sheet body, and the various physical properties are shown in Table 1.
実施例２
（芳香族ポリアミック酸溶液の調製）
内容積１７！である円筒型重合槽に、Ｎ、 Ｎ ジメ
チルアセトアミド２４０ｇを入れて、攪拌しながら、ダ
イヤモンド粉末（平均！、を子径５μ）２０ｇおよびγ
−Ｎ−フェニルアミノプロピル−１−リメトキシシラン
（カップリング剤）０．３０７ｇを添加し、そのまま、
約６０分間攪拌を続けて、砥粒の分散液を調製し、
続いて、その分散液に、バラフェニレンジアミン１６．
１．３ ｇを約２分間で添加し、３０℃で３０分間攪拌
し７て前記の芳香族ジアミン成分を溶解さ・Ｕ、
そして、（尊られた／客演に、３．３’、４．４’ ｌ
ニフェニルテ１−ラカルボン酸二無水物３９．４９ｇを
５分間で徐々に添加し７、その溶液を３０℃で２時間攪
拌して、前記酸二無水物からなる芳香族テトラカルボン
酸成分を溶解さ・け゛るき共Ｃ，′Ｘ、前記の両成分を
重合反応さ−Ｕ、
最後に、その重合液に、３，３”、イ、４゛−ビフェニ
ルテトラカルボン酸二無水物４．３９ｇを徐々に添加し
、３０℃で３時間攪拌して反応さ−（４で、芳香族ポリ
アミック酸を生成し、砥粒が均一に分散し７ている芳香
族ポリアミック酸溶液を調製Ｌ７た。Example 2 (Preparation of aromatic polyamic acid solution) Internal volume 17! Put 240 g of N, N dimethylacetamide into a cylindrical polymerization tank, and while stirring, add 20 g of diamond powder (average!, diameter 5 μ) and γ
0.307 g of -N-phenylaminopropyl-1-rimethoxysilane (coupling agent) was added, and as it was,
Stirring was continued for about 60 minutes to prepare a dispersion of abrasive particles, and then 16.
Add 1.3 g over about 2 minutes and stir for 30 minutes at 30°C to dissolve the aromatic diamine component. 4'l
39.49 g of niphenylte-1-lacarboxylic dianhydride was gradually added over 5 minutes, and the solution was stirred at 30°C for 2 hours to dissolve the aromatic tetracarboxylic acid component consisting of the acid dianhydride. The above-mentioned two components were polymerized.Finally, 4.39 g of 3,3'', i,4''-biphenyltetracarboxylic dianhydride was gradually added to the polymerization solution. and stirred at 30° C. for 3 hours to react (Step 4 produced aromatic polyamic acid and prepared an aromatic polyamic acid solution in which abrasive grains were uniformly dispersed).
前記芳香族ポリアミック酸溶液は、ポリマー濃度が２０
重量％であり、その溶液の回転粘度（３０℃）が１３０
０ボイズであり、また、その重合液中の芳香族ポリアミ
、り酸の対数粘度（測定温度；３０℃、濃度； ０．５
ｇ／ｌｏｏｍ ｐ溶媒、溶媒；Ｎ。The aromatic polyamic acid solution has a polymer concentration of 20
% by weight, and the rotational viscosity (30°C) of the solution is 130
0 voids, and the logarithmic viscosity of the aromatic polyamide and phosphoric acid in the polymerization solution (measurement temperature: 30°C, concentration: 0.5
g/room p solvent, solvent; N.
Ｎ−ジメチルアセトアミド）か、１．７２であった。N-dimethylacetamide) or 1.72.
（＠膜）
前記の芳香族ポリアミック酸溶液を製膜用の１・−プ液
として使用したし、１かは実施例１と同様にして製膜を
行い、「砥粒が１２．２容量％の割合で均に分散１．て
内臓され゛（いる芳香族ボリイミ［フィルムからなる厚
さ８０μｍの砥粒含有シート体」を製造し７た。(@Membrane) The aromatic polyamic acid solution described above was used as the 1st liquid for film formation, and 1 was formed into a film in the same manner as in Example 1. An 80 μm thick abrasive grain-containing sheet body consisting of an aromatic polyimide [film] containing 1.
ｉｉＪ記砥粒含杓ンー１〜体について、↑［抜き装置を
使用Ｕ２て、内径３ｃｍよりよひ外径１，５ｃｎ＋のド
ーナツ状の円盤状ディスク体を形成し、その円盤状ディ
スク体をステンレス製薄板（円盤状、厚さ１ｍ１１、外
径８ｃｍ）２枚の間に同心円状に挟持して固定し、第１
〜３図に示すような回転砥石を製造した。ii Regarding the abrasive grain-containing ladle 1 ~ body described in J, ↑ [Use a punching device U2 to form a donut-shaped disk body with an inner diameter of 3 cm and an outer diameter of 1.5 cm +, and then make the disk-shaped disk body into stainless steel. The first
A rotary grindstone as shown in Figure 3 was manufactured.
この回転砥石の研磨性０ヒを試験した結県、１５０℃の
高温下、５０時間以−にの長時間の連続研磨において優
れた研磨性能を有していた。This rotary whetstone was tested for 0-hi polishing performance, and was found to have excellent polishing performance in continuous polishing for over 50 hours at a high temperature of 150°C.
また、前記砥粒含有ソート体について種々の物性を測定
したが、それらの諸物性を第１表に示す。In addition, various physical properties were measured for the abrasive grain-containing sorted bodies, and the various physical properties are shown in Table 1.
比較例１
カップリング剤を全く使用しなかったほかは、実施例２
と同様にしてダイヤモンド砥粒の分散液を調製した。Comparative Example 1 Example 2 except that no coupling agent was used
A dispersion of diamond abrasive grains was prepared in the same manner as described above.
前記の分散液に、４，４−ジアミノジフェニルエーテル
２８．７２ ｇを約２分間で添加し、３０°Ｃで３０分
間攪拌して前記の芳香族シアミン成分を溶解させ、
続いて、その溶液に、ピじ１メリット酸二無水物２８．
１５ｇを５分間で徐々に添加し、その溶液を３０℃で２
時間攪拌して、前記酸二無水物からなる芳香族−”フー
トラカルホン酸成分を／８解さセると共に、前記の両成
分を重合反応さ・け、
最後Ｑこ、その重合液に、ビロメリソＩ〜酸二無水物３
．１３ ｇを徐々に添加し、３０℃で３時間攪拌して反
応させて、芳香族ポリアミック酸を生成し、砥粒が均・
に分散している芳香族ポリアミ’）り酸溶液を調製した
。To the above dispersion, 28.72 g of 4,4-diaminodiphenyl ether was added over about 2 minutes and stirred at 30°C for 30 minutes to dissolve the aromatic cyamine component, and then to the solution, Piji 1 Mellitic dianhydride 28.
15g was gradually added over 5 minutes, and the solution was incubated at 30°C for 2 hours.
While stirring for a period of time, the aromatic-phutoracarphonic acid component consisting of the acid dianhydride is dissolved by 1/8, and both of the above components are subjected to a polymerization reaction. Acid dianhydride 3
．． 13 g was gradually added and reacted by stirring at 30°C for 3 hours to produce aromatic polyamic acid and make the abrasive grains uniform.
An aromatic polyamic acid solution was prepared.
０１■記芳香族ポリアミツク酸溶液は、ポリマー濃度が
２０重量％であり、その溶液の回転粘度（３０°Ｃ）力
＜２８００ボイス”であり、また、そのｌ容ン夜中の芳
香族ポリアミック酸の対数粘度（測定温度；３０℃、温
度； ０．５ ｇ ／］００ｍｆｆ ｉ媒、溶媒；Ｎ。The aromatic polyamic acid solution described in 01. has a polymer concentration of 20% by weight, a rotational viscosity (30°C) of <2800 voices, and a Logarithmic viscosity (measurement temperature: 30°C, temperature: 0.5 g/]00 mff i medium, solvent: N.
Ｎ−ジメ千ルアセトアミ１へ）が、１．８６であった。N-dimethylacetamide 1) was 1.86.
（製膜）
前記の芳香族ポリアミック酸溶液を製膜用のドープ液と
して使用したほかは実施例１と同様にして製膜を行い、
「砥粒が１２．５容量％の割合で均一に分散して内臓さ
れている芳−Ｓ族ポリイミドフィルムからなる厚さ９０
μｍの砥粒含有シート体」を製造した。(Film Formation) Film formation was performed in the same manner as in Example 1, except that the aromatic polyamic acid solution was used as a dope solution for film formation.
90 mm thick made of an aromatic-S polyimide film in which abrasive grains are uniformly dispersed at a ratio of 12.5% by volume.
A sheet containing μm abrasive grains was manufactured.
前記砥粒含有シート体について、打抜き装置を使用して
、内径３ｃｍおよび外径１．５ ｃｍのドーナツ状の円
盤状ディスク体を形成し、その円盤状ディスク体をステ
ンレス製薄板（円盤状、厚さ１曽ｌ、外径８ｃｍ）２枚
の間に同心円状に挟持して固定し、第１〜３図に示すよ
うな回転砥石をＭ造した。For the abrasive grain-containing sheet body, a donut-shaped disc body with an inner diameter of 3 cm and an outer diameter of 1.5 cm was formed using a punching device, and the disc-shaped disc body was cut into a stainless steel thin plate (disc-shaped, thick A rotating grindstone as shown in Figs. 1 to 3 was manufactured by sandwiching and fixing the grindstone concentrically between two pieces (1 size, outer diameter 8 cm).
前記の回転砥石について、研磨試験を行ったが、その研
磨性能は、１５０℃の高温下において、次第に低下し、
必ずしも満足すべきものではなかった。A polishing test was conducted on the above-mentioned rotating whetstone, but its polishing performance gradually decreased at a high temperature of 150°C.
It wasn't necessarily satisfying.
前記砥粒含有シート体について、種々の物性の測定を行
った。それらの諸物性を第１表に示す。Various physical properties were measured for the abrasive grain-containing sheet body. Their physical properties are shown in Table 1.
第１表
実施例１ 実施例２ 比較例１
引張強度ｋｇ／ｍｕ ｌ １．０ １９．０
］ ０．０伸び率 ％ １８ ５ ３８
弾性率 ｋｇ／ｍｕ ５８０ ９６０ ３８０耐
折強度 回 ２６４００ １０００ ５３５
０熱減量 ％ １．１ ０．５ ］、
３（０〜５００℃）
平衡吸湿率 ％ ０．８ ０．６ １．３（
湿度５０％ ５０°Ｃ）Table 1 Example 1 Example 2 Comparative Example 1 Tensile strength kg/mul 1.0 19.0
] 0.0 Elongation rate % 18 5 38
Elastic modulus kg/mu 580 960 380 Folding strength times 26400 1000 535
0 heat loss % 1.1 0.5 ],
3 (0 to 500℃) Equilibrium moisture absorption rate % 0.8 0.6 1.3 (
Humidity 50% 50°C)
第１図は、この発明の回転砥石の斜視図であり、さらに
、第２図および第３図は、前記回転砥石の平面図および
断面図である。
１；円盤状ディスク体、
２；回転支持台座、
３；回転砥石。FIG. 1 is a perspective view of a rotating grindstone of the present invention, and FIGS. 2 and 3 are a plan view and a sectional view of the rotating grindstone. 1; Disc-shaped disc body; 2; Rotating support pedestal; 3; Rotating grindstone.
Claims (2)
０容量％の配合割合でビフェニルテトラカルボン系の芳
香族ポリイミドの均質層内に均一に分散している、厚さ
１０〜５００μｍの砥粒含有シート体が、円盤状に切り
抜かれている円盤状ディスク体からなる回転砥石。(1) 5 to 8 abrasive grains with an average particle diameter of 0.1 to 60 μm
A disc-shaped disc in which an abrasive grain-containing sheet body with a thickness of 10 to 500 μm is cut out, and the abrasive grain-containing sheet body is uniformly dispersed in a homogeneous layer of biphenyltetracarboxylic aromatic polyimide at a blending ratio of 0% by volume. A rotating whetstone consisting of a body.
る特許請求の範囲第１項記載の回転砥石。(2) The rotary grindstone according to claim 1, wherein the disc-shaped disc body is fixed to a rotation support base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20514886A JPH0624701B2 (en) | 1986-09-02 | 1986-09-02 | Rotary whetstone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20514886A JPH0624701B2 (en) | 1986-09-02 | 1986-09-02 | Rotary whetstone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6362678A true JPS6362678A (en) | 1988-03-18 |
| JPH0624701B2 JPH0624701B2 (en) | 1994-04-06 |
Family
ID=16502214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20514886A Expired - Lifetime JPH0624701B2 (en) | 1986-09-02 | 1986-09-02 | Rotary whetstone |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0624701B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006026868A (en) * | 2004-07-21 | 2006-02-02 | Disco Abrasive Syst Ltd | Abrasive cutting wheel, cutting tool and method for manufacturing abrasive cutting wheel |
| JP2007283418A (en) * | 2006-04-14 | 2007-11-01 | Disco Abrasive Syst Ltd | Cutting tool |
| JP2008190546A (en) * | 2007-01-31 | 2008-08-21 | Iwai Kikai Kogyo Co Ltd | Diaphragm fixing structure of diaphragm valve |
| JP2011506114A (en) * | 2007-12-12 | 2011-03-03 | サンーゴバン アブレイシブズ，インコーポレイティド | Multifunctional polishing tool with hybrid binder |
| JP2011235438A (en) * | 1998-01-30 | 2011-11-24 | Saint-Gobain Abrasives Inc | High speed grinding wheel |
| JP2013223902A (en) * | 2012-04-20 | 2013-10-31 | Tokyo Seimitsu Co Ltd | Cutting blade and its manufacturing method |
| JP2015163432A (en) * | 2015-06-04 | 2015-09-10 | 株式会社東京精密 | Manufacturing method of blade for cutting |
| CN114905420A (en) * | 2022-04-18 | 2022-08-16 | 郑州磨料磨具磨削研究所有限公司 | Multi-element cross-scale laminated composite diamond grinding wheel and forming method |
-
1986
- 1986-09-02 JP JP20514886A patent/JPH0624701B2/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011235438A (en) * | 1998-01-30 | 2011-11-24 | Saint-Gobain Abrasives Inc | High speed grinding wheel |
| JP2006026868A (en) * | 2004-07-21 | 2006-02-02 | Disco Abrasive Syst Ltd | Abrasive cutting wheel, cutting tool and method for manufacturing abrasive cutting wheel |
| JP4541791B2 (en) * | 2004-07-21 | 2010-09-08 | 株式会社ディスコ | Manufacturing method of cutting wheel |
| JP2007283418A (en) * | 2006-04-14 | 2007-11-01 | Disco Abrasive Syst Ltd | Cutting tool |
| JP2008190546A (en) * | 2007-01-31 | 2008-08-21 | Iwai Kikai Kogyo Co Ltd | Diaphragm fixing structure of diaphragm valve |
| JP2011506114A (en) * | 2007-12-12 | 2011-03-03 | サンーゴバン アブレイシブズ，インコーポレイティド | Multifunctional polishing tool with hybrid binder |
| JP2013223902A (en) * | 2012-04-20 | 2013-10-31 | Tokyo Seimitsu Co Ltd | Cutting blade and its manufacturing method |
| JP2015163432A (en) * | 2015-06-04 | 2015-09-10 | 株式会社東京精密 | Manufacturing method of blade for cutting |
| CN114905420A (en) * | 2022-04-18 | 2022-08-16 | 郑州磨料磨具磨削研究所有限公司 | Multi-element cross-scale laminated composite diamond grinding wheel and forming method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0624701B2 (en) | 1994-04-06 |
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| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |