JPS6362659A - Precise finishing method with complex vibration grinding wheel - Google Patents
Precise finishing method with complex vibration grinding wheelInfo
- Publication number
- JPS6362659A JPS6362659A JP20851086A JP20851086A JPS6362659A JP S6362659 A JPS6362659 A JP S6362659A JP 20851086 A JP20851086 A JP 20851086A JP 20851086 A JP20851086 A JP 20851086A JP S6362659 A JPS6362659 A JP S6362659A
- Authority
- JP
- Japan
- Prior art keywords
- finishing
- vibration
- low frequency
- point
- grinding wheel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- 239000002131 composite material Substances 0.000 claims description 2
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- 238000013459 approach Methods 0.000 abstract description 2
- 239000006061 abrasive grain Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
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Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は研削砥石を回転させないで低い加工速度に於て
超音波振動と低周波振動を与え一定荷重を作用させて特
にゴム材のような軟質工作物の表面を能率よく精密仕上
加工する方法に関する。[Detailed Description of the Invention] (Field of Industrial Application) The present invention applies ultrasonic vibration and low-frequency vibration at a low processing speed without rotating the grinding wheel, and applies a constant load to the grinding wheel. This article relates to a method for efficiently precision finishing the surface of a soft workpiece.
（従来技術）
従来砥石を仕上方向と直角方向に低周波振動させて仕上
加工する仕上方法は公知である。又砥石にこの低周波振
動方向と同じ方向に超音波振動させて精密加工する方法
も公知である。(Prior Art) A finishing method in which a grindstone is vibrated at low frequency in a direction perpendicular to the finishing direction is known. There is also a known method for precision machining by subjecting a grindstone to ultrasonic vibration in the same direction as this low-frequency vibration.
（発明が解決しようとする問題点）
ところで上記従来技術のうち、低周波振動のみによる方
法は、金属材料の鏡面加工を対象としたもので金属材料
とその組成を異にする有機材であるゴム材のような軟質
工作物に対してその技術をそのまま適用してもその効果
は全く得られない。すなわち、砥石を金属材料加工面に
加圧してこれを低周波振動させ、各は粒の運動軌跡を交
錯させることによって各砥粒の切削長さを寸断して切削
抵抗を軽減させて切削性を向上させることがゴムのよう
な軟質材に比べて剛性の高い金属材料に対しては可能で
はあるが、ゴムのような軟質材のように弾性に富む材料
に対しては、この技術における程度の切削長さの寸断で
は切削抵抗が減少せず、工作物が弾性変形して逃げてし
まい精密切削１゛ることかできないＯ
この砥石を低周波振動の方向と同方向に超音波振動させ
る方法がある。この方法によって各砥粒の切削長さをよ
り細かく寸断することができ切削抵抗が激減してゴムの
ような軟質材の弾性変形を極微少化して精密切削を可能
とする。(Problems to be Solved by the Invention) Among the above-mentioned conventional techniques, the method using only low-frequency vibration is intended for mirror finishing of metal materials, and is intended for mirror finishing of metal materials and rubber, which is an organic material with a different composition. Even if the technique is applied directly to soft workpieces such as wood, no effect will be obtained at all. In other words, the grinding wheel is pressed against the metal surface to be machined, causing it to vibrate at a low frequency, and by intersecting the motion trajectories of each grain, the cutting length of each abrasive grain is cut into pieces, reducing cutting resistance and improving machinability. Although it is possible to improve the rigidity of metal materials compared to soft materials such as rubber, it is not possible to improve the degree of improvement with this technology for materials with high elasticity such as soft materials such as rubber. When the cutting length is cut short, the cutting resistance does not decrease, and the workpiece elastically deforms and escapes, making precision cutting impossible. be. By this method, the cutting length of each abrasive grain can be cut into finer pieces, cutting resistance is drastically reduced, and elastic deformation of a soft material such as rubber is minimized, making precision cutting possible.
しかし、この方法には加工できる工作物の形状に制限が
生ずる。すなわち、この方法は、一様な平面あるいは円
筒外周１人面の仕上加工には適用できるが、キー溝など
の溝加工や底のある穴の大面の仕上加工には使用できな
いという問題点がある。However, this method has limitations on the shape of the workpiece that can be machined. In other words, this method can be applied to finishing a uniform plane or a single surface on the outer circumference of a cylinder, but there is a problem that it cannot be used for finishing a groove such as a keyway or a large surface of a hole with a bottom. be.
すなわち、超音波振動よりも振幅の大きい低周波振動数
の振幅が砥石の作用面と直交する工作物の側面をたたい
たり、所定寸法以上に加工して寸法精度を狂わせる現象
が生ずる。例えば、キー溝加工ではキー溝側面をたたき
、大面加工では底面をたたく現象を生ずる。そして、加
工精度を低下させたり、砥石を破損させたりして発明の
効果を皆無とする。That is, a phenomenon occurs in which the amplitude of a low frequency vibration, which has a larger amplitude than the ultrasonic vibration, hits the side of the workpiece that is perpendicular to the working surface of the grindstone, or the workpiece is machined to a predetermined size or more, thereby disrupting dimensional accuracy. For example, when machining a keyway, the side surface of the keyway is struck, and when machining a large surface, the bottom surface is struck. This may reduce processing accuracy or damage the grindstone, rendering the invention ineffective.
（問題点を解決するための手段）
本発明は上記問題点に着目してなされたもので砥石に与
える振幅の大きい低周波振動の方向は切削仕上方向と同
方向として、切りくずを極微細化するための超音波振動
の方向を仕上方向と直角方向で、仕上加工面と平行方向
として砥石を重畳振動させ、この砥石に定荷重を与えて
加工形状精度に影響を与えることなく精密仕上加工する
ことを特徴とするものである。(Means for Solving the Problems) The present invention has been made by focusing on the above problems, and the direction of the low frequency vibration with large amplitude applied to the grinding wheel is the same as the finishing direction of cutting, thereby making the chips extremely fine. A grindstone is vibrated in a superimposed manner with the direction of ultrasonic vibration perpendicular to the finishing direction and parallel to the finished surface, and a constant load is applied to this grindstone to perform precision finishing without affecting the precision of the machined shape. It is characterized by this.
（実施例）
以下、図示した実施例に基づいて具体的に説明する。第
１図において、超音波振動砥石１を縦超音波振動子３の
振幅を拡大する振幅拡大用ホーン２の先端に取付けた曲
げ超音波振動砥石シャンク９０両端に接着し、工作物７
に対して、矢印８の仕上方向に対して直角方向で、仕上
表面とは平行をなす方向に超音波振動数ｆ、振幅ａ４で
超音波振動させる。超音波振動子３は電わい振動子、磁
わい振動子いずれでもその作用効果は同一である。この
超音波振動砥石を矢印８の仕上方向と同方向に低周波振
動数Ｆ、振幅Ａ５で低周波振動させる。このように仕上
方向と同方向に低周波振動し、仕上方向と直角方向に超
音波振動する砥石に荷重Ｐ６を与え仕上速度ｖ＜２πＡ
Ｆで平面仕上加工する。低周波振動駆動装置としては、
三相誘導電動機を利用した滑り子クランク機構、リンク
機構および空気圧、油圧を利用した装置あるいは電磁振
動、電気油圧振動駆動による装置などを用いることがで
きる。(Example) Hereinafter, a detailed explanation will be given based on the illustrated example. In FIG. 1, an ultrasonic vibrating grindstone 1 is glued to both ends of a bending ultrasonic vibrating grindstone shank 90 attached to the tip of an amplitude amplifying horn 2 for amplifying the amplitude of a vertical ultrasonic vibrator 3, and a workpiece 7
On the other hand, ultrasonic vibration is applied at an ultrasonic frequency f and an amplitude a4 in a direction perpendicular to the finishing direction as indicated by an arrow 8 and parallel to the finished surface. The action and effect of the ultrasonic vibrator 3 are the same whether it is an electric strain vibrator or a magnetic strain vibrator. This ultrasonic vibrating grindstone is caused to vibrate at a low frequency at a low frequency F and an amplitude A5 in the same direction as the finishing direction indicated by an arrow 8. In this way, load P6 is applied to the grindstone that vibrates at low frequency in the same direction as the finishing direction and ultrasonically vibrates in the direction perpendicular to the finishing direction, and the finishing speed v<2πA
Use F to finish the plane. As a low frequency vibration drive device,
A slider crank mechanism using a three-phase induction motor, a link mechanism, a device using pneumatic pressure or hydraulic pressure, or a device using electromagnetic vibration or electrohydraulic vibration drive can be used.
第２図は穴の本発明による精密仕上方法である。超音波
振動砥石１を縦超音波振動子３の振幅を拡大する振幅拡
大用ホーン２の先端に接着し穴７の軸方向に超音波振動
数ｆ、振幅ａで超音波振動させる。この縦超音波振動系
砥石を振動中心軸を回転中心軸Ｏと一致させて振動数Ｆ
。FIG. 2 is a method of precision finishing a hole according to the present invention. An ultrasonic vibrating grindstone 1 is bonded to the tip of an amplitude amplifying horn 2 for enlarging the amplitude of a vertical ultrasonic vibrator 3, and is ultrasonically vibrated in the axial direction of the hole 7 at an ultrasonic frequency f and an amplitude a. The vibration center axis of this vertical ultrasonic vibration system grindstone is aligned with the rotation center axis O, and the frequency of vibration is F.
.
振幅Ａで矢印５の仕上方向と同方向に低周波振動させ、
荷重Ｐ６を与え仕上速度Ｖ＜２πＡＦで穴仕上加工する
。Vibrate at low frequency in the same direction as the finishing direction of arrow 5 at amplitude A.
A load P6 is applied and the hole is finished at a finishing speed V<2πAF.
第３図、第４図、第５図、第６図、第７図。3, 4, 5, 6, and 7.
第８図によって本発明が能率的な精密仕上加工を可能と
する理由について説明する。The reason why the present invention enables efficient precision finishing will be explained with reference to FIG.
第３図において、仕上方向および低周波振動方向５をｙ
軸、荷重方向６をＺ軸、超音波振動方向をｙ軸とする。In Figure 3, the finishing direction and low frequency vibration direction 5 are y
The load direction 6 is the Z-axis, and the ultrasonic vibration direction is the y-axis.
砥石の変位と時間との関係はｙ ＝ Ａ ｓｉｎ ｗｔ
で表わされ、図示のような正弦波曲線１１で表わされる
。今この砥石１に対して工作物７を仕上方向８に一定速
度Ｖで送る。The relationship between the displacement of the grinding wheel and time is y = A sin wt
It is represented by a sine wave curve 11 as shown in the figure. Now, a workpiece 7 is sent to this grindstone 1 in a finishing direction 8 at a constant speed V.
点Ｏかも振動させたとする。曲線上の点Ｃで砥石の端面
が加工すべき工作物７の側面正１と接触し始め点ｄから
は砥石の振動の方向が仕上方向と同じ方向となり、点ｅ
は仕上速度と振動速度とが等しくなる点でこのｃｄｅＯ
間で砥石振動１サイクルで加工する長さ１Ｔ−Ｖｌｏを
仕上加工する。そしてここから砥石と工作物の側面ＣＥ
とは離れ始め点ｅ以後は振動速度が仕上速度よりも速く
なって最大速度２πＡＦに達する。Suppose that point O is also vibrated. At point C on the curve, the end face of the grinding wheel begins to come into contact with the side surface 1 of the workpiece 7 to be machined, and from point d onwards, the direction of vibration of the grinding wheel becomes the same as the finishing direction, and it reaches point e.
is this cdeO at the point where the finishing speed and vibration speed are equal.
In between, a length of 1T-Vlo is finished with one cycle of grindstone vibration. And from here, the side CE of the grindstone and workpiece
After the starting point e, the vibration speed becomes faster than the finishing speed and reaches the maximum speed 2πAF.
点ｉを通過し、点ｆの直前まで離れており、点ｆＶｃお
いて砥石側面と工作物側面Ｃｌ（とが接触し始め曲線上
のｆｇｂで１．ｒ＝７を仕上加工してＣＥに相当するＦ
Ｈまでを削除する。この砥石に荷重Ｐを与えれば抵抗
ｐ＃／ｃ等しい量だけの切込みＣＥで仕上方向に砥石の
振動−周期ごとにｌＴづつ小刻みに仕上加工していくこ
とができる。このとき、ゴムのような軟質材はわずかな
荷重でも弾性変形して加工すべき加工面が逃げてしまう
ので、この第３図の方法では金属は加工できてもゴムの
ような軟質材は砥石を切込ませて仕上加工することがで
きない。与える荷ｉＰをより軽荷重としても砥石をゴム
のような軟質材に切込ませることができる方法を必要と
する。It passes point i and is far away just before point f, and at point fVc, the side surface of the grinding wheel and the side surface of the workpiece Cl (start to come into contact with each other). F to do
Delete up to H. If a load P is applied to this grindstone, finishing can be performed in small increments of lT for each vibration period of the grindstone in the finishing direction with a depth of cut CE equal to the resistance p#/c. At this time, soft materials such as rubber deform elastically even with a slight load and the surface to be machined escapes, so although metal can be processed using the method shown in Figure 3, soft materials such as rubber cannot be processed easily with the grinding wheel. It is not possible to cut and finish. What is needed is a method that allows a grindstone to cut into a soft material such as rubber even if the applied load iP is a lighter load.
そこで、第３図で説明した砥石をさらに超音波振動数ｆ
、振幅ａをもって仕上方向８に対して直角方向で仕上面
と平行方向に超音波振動させる。このときの砥石内の１
つの砥粒点ｐの運動軌跡を実線の曲線１２と点線の曲線
１３で示す。Therefore, the grindstone explained in Fig. 3 is further adjusted to the ultrasonic frequency f.
, ultrasonic vibrations are made with an amplitude a in a direction perpendicular to the finishing direction 8 and parallel to the finished surface. 1 inside the whetstone at this time
The motion locus of one abrasive grain point p is shown by a solid curve 12 and a dotted curve 13.
点ｐは第３図の点０から第３図で説明したようにして振
動を開始する。一方、この点ｐは仕上方向と直角方向に
超音波域の早い周期で振動する。点ｐが超音波振動して
いなければこの点ｐの運動軌跡は直線となる。点Ｃ１点
ｄ１点ｅは第３図の曲線１１上の点Ｃ１点ｄ９点ｅに相
当する。実線１２の点ｅから１Ｔ−ｐ の砥石の低周
波振動１ザイクルで仕上方向に切削すべき長さの部分を
切削し始める。点ｅから点ｄに向うに従って低周波振動
の振動速度はゼロに近づく。そして、仕上速度Ｖと超音
波振動速度との関係になるので、点ｐの振動開始点付近
の運動軌跡の山と山との間隔に比べてその間隔が狭く密
となってくる。点ｄを通過して点ｅＶＣ向う過程ではそ
の位相が逆転する運動軌跡となる。これを点線１３で示
す。点ｅで低周波振動による振動１サイクルでの切削長
さを切削し終る。点線１３は実線１２を反転した形とな
る。この両曲線は激しく交叉してその軌跡は長さの短い
微小曲線に寸断される。低周波振動させないと、この超
音波振動軌跡の反転現象はなく寸断されることのない連
続した正弦波振動曲線を示す。この仕上方向の低周波振
動の伺加によって超音波振動軌跡を極微細に寸断するこ
とができる。すなわち、切削長さを極微細に寸断し、切
りくずを極微細にし、切削抵抗を軽減させることができ
る。説明を１つの砥粒によって行ったが実際の砥石作用
面には多数の砥粒が分布しているので、１Ｔｘｌ（砥石
の巾）の切削面積全面を微細な直線群によって細分割化
でき切削抵抗の軽減を実現させることができるようにな
る。これが本発明による仕上機構の特徴である。Point p begins to oscillate from point 0 in FIG. 3 in the manner described in FIG. On the other hand, this point p vibrates at a fast frequency in the ultrasonic range in a direction perpendicular to the finishing direction. If point p is not undergoing ultrasonic vibration, the motion trajectory of point p will be a straight line. The points C1, d1, and e correspond to the points C1, d9, and e on the curve 11 in FIG. From point e on the solid line 12, cutting of the length to be cut in the finishing direction is started with one cycle of low frequency vibration of the grindstone of 1T-p. The vibration speed of low frequency vibration approaches zero as it goes from point e to point d. Since there is a relationship between the finishing speed V and the ultrasonic vibration speed, the interval becomes narrower and denser than the interval between the peaks of the motion locus near the vibration start point of point p. In the process of passing through point d and heading towards point eVC, the trajectory becomes a motion trajectory in which the phase is reversed. This is shown by dotted line 13. At point e, the cutting length of one cycle of vibration due to low frequency vibration is finished. The dotted line 13 is the inverse of the solid line 12. These two curves intersect violently, and their loci are cut into short minute curves. If low frequency vibration is not applied, this reversal phenomenon of the ultrasonic vibration locus does not occur, and a continuous sinusoidal vibration curve is shown without interruption. By adding this low-frequency vibration in the finishing direction, the ultrasonic vibration locus can be cut into extremely fine pieces. That is, the cutting length can be cut into extremely fine pieces, the chips can be made extremely fine, and the cutting resistance can be reduced. The explanation was given using a single abrasive grain, but since many abrasive grains are actually distributed on the working surface of a whetstone, the entire cutting area of 1Txl (width of the whetstone) can be subdivided into fine straight lines, reducing the cutting resistance. It will be possible to realize the reduction of This is a feature of the finishing mechanism according to the invention.
砥石車は高速回転させて砥粒１刃あたりの切込みを小さ
くして抵抗を軽減させて精密研削を可能にしているが、
高速回転をさせることができない定荷重方式における砥
石によるゴムのような軟質材に対する能率的な精密研削
法は本発明の振動方向に超音波振動と低周波振動を重畳
複合させて切りくず長さを極微細に寸断して研削抵抗を
軽減させる方法以外にはない。Grinding wheels rotate at high speed to reduce the cutting depth per abrasive grain, reducing resistance and enabling precision grinding.
An efficient precision grinding method for soft materials such as rubber using a constant load method that cannot rotate at high speeds is based on the present invention, which combines ultrasonic vibration and low frequency vibration in the vibration direction to reduce the chip length. There is no other way than to reduce the grinding resistance by cutting it into extremely fine pieces.
第５図、第６図、第７図は、本発明の精密仕上機構をさ
らに詳しく説明し、仕上面あらさを平滑にする機構を説
明する図である。第５図は、本発明によって平均加工量
ｔをもってｌＴづつ小刻みに仕上加工している加工状態
を示し、第３図における点ｅ、あるいは点りの加工状態
を示す図である。第３図の点Ｃから加工し始めるに従い
、次第に増大していく加工抵抗の影響を受けて砥石はご
くわずかではあるが仕上面８から離れて加工抵抗と荷重
Ｐとのバランスが保たれる。そしてｌＴを砥石の低周波
振動１サイクルで切削した点ｅあるいは点りで平均加工
量ｔを加工し、第６図のようにして砥石側面は工作物か
ら離れ始める。この間に仕」二面８から突出した部分を
切削して第７図のように砥石作用面全面が仕上面８と接
触するようになる。そして単位面積あたりの法線方向加
圧力が減少し各砥粒は工作物への食込みによる切削作用
はなくなり、工作物表面の微細突起部を８のように平滑
に仕上げる。この仕上げ機構の場合も本発明の低周波振
動の重畳によって超音波振動による運動軌跡の反転機構
によって切削長さを寸断し、切削抵抗を軽減させてゴム
のような軟質材の微小突起部を弾性変形させて逃がすこ
となく均一に精密仕上するのが本発明の特徴である。FIG. 5, FIG. 6, and FIG. 7 are diagrams explaining the precision finishing mechanism of the present invention in more detail and explaining the mechanism for smoothing the roughness of the finished surface. FIG. 5 shows a machining state in which finishing is performed in small increments of 1T with an average machining amount t according to the present invention, and is a diagram showing a machining state at point e or dot in FIG. 3. As machining begins from point C in FIG. 3, the grinding wheel moves away from the finished surface 8, albeit very slightly, under the influence of the machining resistance, which gradually increases, and the balance between the machining resistance and the load P is maintained. Then, the average machining amount t is processed at point e or point where lT is cut by one cycle of low-frequency vibration of the grindstone, and the side surface of the grindstone begins to separate from the workpiece as shown in FIG. During this time, the part protruding from the finishing surface 8 is cut so that the entire working surface of the grindstone comes into contact with the finishing surface 8 as shown in FIG. Then, the normal pressing force per unit area is reduced, and each abrasive grain no longer has a cutting action by biting into the workpiece, and the fine protrusions on the workpiece surface are finished smooth as shown in 8. In the case of this finishing mechanism, the cutting length is cut into pieces by the ultrasonic vibration motion locus reversal mechanism by superimposing the low frequency vibration of the present invention, reducing the cutting resistance and making the micro protrusions of soft materials such as rubber elastic. A feature of the present invention is that it can be finished uniformly and precisely without deforming or escaping.
次に本発明の実施例について説明する。ゴムの平板にみ
ぞを精密仕上加工する場合を第８図。Next, examples of the present invention will be described. Figure 8 shows the case of precision finishing grooves on a flat rubber plate.
第９図によって説明する。This will be explained with reference to FIG.
１０ｍ角、厚さ５關のＷＡ≠６０の砥石１を２０１ＥＧ
（ｚ６００Ｗたて振動室わい振動子３の振幅拡大用ホー
ン２の先端にボルトで固定して取付けた曲げ振動砥石シ
ャンク１４０両端に接着する。ホーン２の振動節を取付
板１８で固定する。この取付板１５を加圧装置１６に固
定する。加圧装置は低周波振動駆動装置１７によって矢
印５の方向に低周波振動する振動軸１８に取付けろ。低
周波振動駆動装置は三相誘導電動機１９とベルト加によ
って一定方向に高速回転する振動駆動軸の回転運動を偏
心カムとすべり子クランク機構によって変換し、振動軸
１８を矢印５の方向に最大振動数１００Ｈｚ 、片振幅
０．２ｍｍ程度で振動させる。この装置１７を平削り盤
あるいは形削り盤刃物台２１に矢印８の仕上方向と矢印
５の低周波振動方向とが一致するようにして取付ける。201EG whetstone 1 of 10m square and 5mm thick with WA≠60
(Glue to both ends of the bending vibrating grindstone shank 140 attached with bolts to the tip of the amplitude expansion horn 2 of the z600W vertical vibration chamber oscillator 3. Fix the vibration node of the horn 2 with the mounting plate 18. Fix the mounting plate 15 to the pressure device 16.The pressure device should be attached to the vibration shaft 18 that vibrates at low frequency in the direction of the arrow 5 by the low frequency vibration drive device 17.The low frequency vibration drive device is a three-phase induction motor 19. The rotational motion of the vibration drive shaft, which rotates at high speed in a fixed direction by belt application, is converted by an eccentric cam and a slider crank mechanism, and the vibration shaft 18 is vibrated in the direction of arrow 5 at a maximum frequency of 100 Hz and a half amplitude of approximately 0.2 mm. This device 17 is attached to a planing machine or a shaping machine tool post 21 so that the finishing direction indicated by arrow 8 and the direction of low frequency vibration indicated by arrow 5 coincide with each other.
超音波発振機ｎによって超音波振動子３を励振すれば、
砥石は仕上方向と直角方向に超音波振動数ｆ −２０Ｋ
Ｈｚ 。If the ultrasonic vibrator 3 is excited by the ultrasonic oscillator n,
The grindstone has an ultrasonic frequency of f -20K in the direction perpendicular to the finishing direction.
Hz.
片振幅ａ ＝ ４〜１５μｍ程度で超音波振動する。Ultrasonic vibration occurs with half amplitude a = approximately 4 to 15 μm.
第９図のようにこの砥石１に加圧力Ｐを矢印６の方向に
工作物７に与え、振動数Ｆ ＝ １００Ｈｚ。As shown in FIG. 9, a pressing force P is applied to the workpiece 7 in the direction of the arrow 6 to the grindstone 1, and the frequency of vibration is F = 100 Hz.
片振幅＆＝０．２ｍｍ程度で低周波振動させ、仕上速度
ｖく２πＡＦの仕上速度Ｖ ＝ ０．５〜２Ｖ漬をもっ
て仕上加工することによって本発明による精密平面仕上
加工が実施されゴム材へのみその精密仕上加工が可能と
なる。Precision flat finishing according to the present invention is carried out by performing low frequency vibration with half amplitude &= about 0.2 mm and finishing at a finishing speed of V = 0.5 to 2V at a finishing speed of 2πAF. Precise finishing processing becomes possible.
本発明の実施において、仕上方向に対する超音波振動方
向および低周波振動方向との関係がそれぞれの振動方向
が多少づれた場合でも、それぞれの主成分が特許請求の
範囲で述べるように仕上方向に対して超音波振動方向に
ついては直角方向であり、低周波振動方向については同
方向となっている場合はすべて本発明に包含される。In the practice of the present invention, even if the relationship between the ultrasonic vibration direction and the low frequency vibration direction with respect to the finishing direction is slightly different from each other, the main components of each of them are relative to the finishing direction as stated in the claims. All cases where the ultrasonic vibration direction is perpendicular and the low frequency vibration direction is the same direction are included in the present invention.
（効果） 本発明の実施によって得られる効果について説明する。(effect) The effects obtained by implementing the present invention will be explained.
第１０図に示すように、−辺が１００ｍｍ の厚材状の
硬質ゴム材に幅１０ ｍｍの長１００ｍｒｒ＋の金属角
棒がはめこまれ、接着、固定されている。そして基板で
あるゴム材５表面が金属角棒別の表面から０．０３ｍｍ
以内で突出している。これを仕上げて金属角棒の表面よ
り０．０３ｍｍ以内に低く精密仕上加工するときに、本
発明を低周波振動数Ｆ ＝ １００ Ｈｚ 、振幅Ａ
＝ ０．２ ｍｍ 、超音波振動数ｆ −２０ＫＨｚ
、 振幅ａ ＝ １６．７１ｍ 、 １０ ｍｍ角厚
さ５ｍｍの＝＃＝ ６００電着ダイヤモンド砥石、仕上
速度２”Ａ。As shown in FIG. 10, a square metal bar with a width of 10 mm and a length of 100 mrr+ is fitted into a thick hard rubber material with a negative side of 100 mm, and is bonded and fixed. And the surface of the rubber material 5 that is the substrate is 0.03 mm from the surface of another square metal bar.
Outstanding within. When this is finished and precisely finished to a level lower than the surface of the square metal bar by 0.03 mm, the present invention is applied to a low frequency vibration frequency F = 100 Hz and an amplitude A.
= 0.2 mm, ultrasonic frequency f -20KHz
, amplitude a = 16.71 m, 10 mm square 5 mm thick = # = 600 electroplated diamond grinding wheel, finishing speed 2”A.
２ ｇ／ｍｉの極部荷重で実施することによって、４往
復させるだけで各みそを一様に表面粗さ３ ｆｉｍ Ｒ
ｍａｘ 、平面度３ｆｉｍ７１００ｍｍの加工面精度と
し、端面のだれや変形盛り上りをなくして一様な仕上面
に能率よく精密仕上することに成功した。By carrying out the process with an extreme load of 2 g/mi, each miso can be uniformly coated with a surface roughness of 3 fim R by just 4 reciprocations.
The machined surface accuracy was max. 3fim7100mm, and we were able to efficiently and accurately finish the finished surface to a uniform finish by eliminating droop and deformed bulges on the end face.
本発明を実施することによって仕上速度を遅くして精密
仕上できるので加工面表面および砥石作用面の発熱を皆
無にすることができる。また、加圧力を極小にしてゴム
の精密仕上ができる。加圧するとゴムに吸収させている
油かにじみ出て潤滑作用をして砥粒の切削作用を阻害し
て滑らせて仕上作業が困雛であったような場合などに本
発明は画期的効果を発揮する。By carrying out the present invention, precision finishing can be achieved by slowing down the finishing speed, so that heat generation on the machined surface and the grinding wheel action surface can be completely eliminated. In addition, precision finishing of rubber can be achieved by minimizing the pressing force. When pressurized, the oil absorbed by the rubber oozes out and acts as a lubricant, inhibiting the cutting action of the abrasive grains and causing them to slip, making finishing work difficult. demonstrate.
第１図は本発明による平面の仕上加工方法とその特徴を
簡明に示す説明図。FIG. 1 is an explanatory diagram briefly showing the flat surface finishing method and its characteristics according to the present invention.
第２図は、本発明による穴の仕上加工方法とその特徴を
簡明に示す説明図。FIG. 2 is an explanatory diagram briefly showing the hole finishing method and its characteristics according to the present invention.
第３図は、砥石を仕上方向に低周波振動させたときの砥
石の運動軌跡と砥石の振動１サイクルでの仕上加工長さ
ｌＴを示す説明図。FIG. 3 is an explanatory diagram showing the locus of motion of the grindstone when the grindstone is vibrated at low frequency in the finishing direction and the finishing length lT in one cycle of vibration of the grindstone.
第４図は、砥石を仕上方向と直角方向に超音波振動させ
、仕上方向に低周波振動させたときの砥石のなかの１つ
の砥粒ｐの超音波振動の運動軌跡が反転交錯して切削長
さが寸断され切削抵抗が軽減することを示す説明図。Figure 4 shows that when the grinding wheel is vibrated ultrasonically in a direction perpendicular to the finishing direction and vibrated at low frequency in the finishing direction, the locus of motion of the ultrasonic vibration of one abrasive grain P in the grinding wheel is reversed and crossed, resulting in cutting. An explanatory diagram showing that cutting resistance is reduced by cutting the length.
第５図は、砥石の低周波振動１ザイクルでｌＴの長さを
切削したときの砥石と工作物との位置関係を示す説明図
。FIG. 5 is an explanatory diagram showing the positional relationship between the grindstone and the workpiece when cutting a length of 1T with one cycle of low-frequency vibration of the grindstone.
第６図は、砥石の低周波振動１サイクルでＶ＝２πＡＦ
”となってそれ以後、砥石の側面が工作物から離れ始め
、加工面を平滑にしていく過程を示す説明図。Figure 6 shows V=2πAF in one cycle of low-frequency vibration of the grindstone.
This is an explanatory diagram showing the process in which the side of the grindstone begins to move away from the workpiece and the machined surface becomes smooth.
第７図は、第６図につづき、砥石の低周波振動１サイク
ルの時間の経過とともに、砥石作用面全面が工作物の加
工面全面と接触して加工面を平滑に精密仕上することを
示す説明図。Fig. 7 continues from Fig. 6 and shows that as time passes for one cycle of low-frequency vibration of the grinding wheel, the entire working surface of the grinding wheel comes into contact with the entire processing surface of the workpiece, resulting in a smooth and precise finish on the processing surface. Explanatory diagram.
第８図は、本発明を実施する平削り盤を仕上方向と直角
方向から見た側面図。FIG. 8 is a side view of a planing machine embodying the present invention, viewed from a direction perpendicular to the finishing direction.
第９図は本発明に用いるみぞ加工用超音波振動砥石の側
面図。FIG. 9 is a side view of the ultrasonic vibration grindstone for groove machining used in the present invention.
第１０図は、本発明の実施効果を説明するための本発明
実施前の工作物の上面図と正面図。FIG. 10 is a top view and a front view of a workpiece before implementing the present invention for explaining the effects of implementing the present invention.
第１１図は、本発明の実施後の工作物の正面図である。FIG. 11 is a front view of the workpiece after implementing the present invention.
１・・・・・・超音波振動ダイヤモンド砥石２・・・・
・・振幅拡大用ホーン
３・・・・・・超音波振動子
４・・・・・・超音波振動
５・・・・・・低周波振動
６・・・・・・加圧力
ｎ・・・・・・超音波発振機
器・・・・・・ゴム素材
第１図
図面の７１・占（内容に変更なし）
第３図
第４図
図面の浄書（内容に変更なし）
第９図
第１０図
一目一
第１１図
手続補正書
昭和６１年１２月８ 日
特許庁長官 黒 １）明 雄 殿
１、事件の表示
昭和６１年特許願第２０８５１０号
２、発明の名称
複合振動砥石による精密仕上加工方法
３、補正をする者
事件との関係 特許出願人
住所 栃木県宇都宮市南大通り１−４−２０チサンマ
ンション７０１号室
氏名 隈 部 淳一部
４、代理人
住所 東京都港区新橋２丁目２番５号５、補正指令の
日付
昭和６１年１１月２５日
６、補正の対象
委任状及び図面
７、補正の内容1... Ultrasonic vibration diamond grinding wheel 2...
... Horn for amplitude expansion 3 ... Ultrasonic vibrator 4 ... Ultrasonic vibration 5 ... Low frequency vibration 6 ... Pressure force n ... ...Ultrasonic oscillation equipment...Rubber material Figure 1 71 of the drawing (no change in content) Figure 3 Engraving of the drawing in Figure 4 (no change in content) Figure 9 Figure 10 Ichimoku 1 Figure 11 Procedural Amendment December 8, 1985 Commissioner of the Patent Office Black 1) Mr. Yu Aki 1, Indication of the case 1985 Patent Application No. 208510 2, Name of the invention Precision finishing method using composite vibrating grindstone 3. Relationship with the case of the person making the amendment Patent Applicant Address: Room 701, Chisun Mansion, 1-4-20 Minami Odori, Utsunomiya City, Tochigi Prefecture Name: Jun Kumabe Part 4 Agent address: 2-2-5-5 Shinbashi, Minato-ku, Tokyo , Date of amendment order November 25, 1986 6, Power of attorney subject to amendment and drawings 7, Contents of amendment
Claims (1)
超音波動させ、該仕上用砥石を仕上方向と同方向に低周
波振動数Ｆ、振巾Ａで低周波振動させ、仕上速度Ｖ＜２
πＡＦとして該仕上用砥石を加工面に加圧して仕上加工
する複合振動砥石による精密仕上加工方法。A finishing whetstone is ultrasonically moved in a direction perpendicular to the finishing surface and parallel to the finishing surface, and the finishing whetstone is vibrated at a low frequency frequency F and an amplitude A in the same direction as the finishing direction, and the finishing speed is V. <2
A precision finishing method using a composite vibrating grindstone in which the finishing grindstone is pressurized to the processing surface as πAF.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20851086A JPH0624692B2 (en) | 1986-09-04 | 1986-09-04 | Precision groove grinding method by compound vibration of grindstone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20851086A JPH0624692B2 (en) | 1986-09-04 | 1986-09-04 | Precision groove grinding method by compound vibration of grindstone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6362659A true JPS6362659A (en) | 1988-03-18 |
| JPH0624692B2 JPH0624692B2 (en) | 1994-04-06 |
Family
ID=16557356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20851086A Expired - Lifetime JPH0624692B2 (en) | 1986-09-04 | 1986-09-04 | Precision groove grinding method by compound vibration of grindstone |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0624692B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5562530A (en) * | 1994-08-02 | 1996-10-08 | Sematech, Inc. | Pulsed-force chemical mechanical polishing |
| JP2001315213A (en) * | 2000-05-12 | 2001-11-13 | Teijin Seiki Co Ltd | Method and apparatus for optical solid molding |
| JP5049402B1 (en) * | 2011-12-20 | 2012-10-17 | 有限会社アリューズ | Mirror surface processing method, mirror surface processing machine, mirror surface processing tool |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102211296B (en) * | 2011-05-31 | 2013-12-25 | 北京航空航天大学 | Composite ultrasonic vibration grinding device based on high and low frequencies |
| CN102211297B (en) * | 2011-05-31 | 2013-12-25 | 北京航空航天大学 | Method and device for composite vibration grinding based on ultrasonic high frequency and pneumatic low frequency |
-
1986
- 1986-09-04 JP JP20851086A patent/JPH0624692B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5562530A (en) * | 1994-08-02 | 1996-10-08 | Sematech, Inc. | Pulsed-force chemical mechanical polishing |
| JP2001315213A (en) * | 2000-05-12 | 2001-11-13 | Teijin Seiki Co Ltd | Method and apparatus for optical solid molding |
| JP5049402B1 (en) * | 2011-12-20 | 2012-10-17 | 有限会社アリューズ | Mirror surface processing method, mirror surface processing machine, mirror surface processing tool |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0624692B2 (en) | 1994-04-06 |
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