JPS6360186A - Metallizing composition and metallization for aluminum nitride base ceramic surface - Google Patents
Metallizing composition and metallization for aluminum nitride base ceramic surfaceInfo
- Publication number
- JPS6360186A JPS6360186A JP20403586A JP20403586A JPS6360186A JP S6360186 A JPS6360186 A JP S6360186A JP 20403586 A JP20403586 A JP 20403586A JP 20403586 A JP20403586 A JP 20403586A JP S6360186 A JPS6360186 A JP S6360186A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- metallization
- aluminum nitride
- composition
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 22
- 239000000203 mixture Substances 0.000 title claims description 21
- 238000001465 metallisation Methods 0.000 title claims description 11
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 title claims description 7
- 238000000034 method Methods 0.000 claims description 12
- 238000002844 melting Methods 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- 239000011812 mixed powder Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 3
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000001272 pressureless sintering Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Ceramic Products (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は窒化アルミ系セラミックスの表面を金属化する
ための新規な組成物とそれを用いた金属化方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a novel composition for metallizing the surface of aluminum nitride ceramics and a metallization method using the same.
従来よりｇ化アルミ系セラミックスを主成分とするセラ
ミックス同志あるいはこのような窒化アルミ系セラミッ
クスと金属とを、金属ろう材料を用いて接合することな
どを目的として、ｈ（ｏ −Ｍｎ系やＣｕ−人ｇ−Ｔｉ
系の組成物及びこれらを用いる金属化方法が提案され
て来た。しかしながら窒化アルミ系セフミックスをＭｏ
−Ｍｎ 系組成物を用いて金属化する場合には期待
するほどＫは接合強度が得られず剪断強度で数ＫＦ／關
２と低く、 又Ｃｕ−ムｇ−Ｔｉ系組成物を用いる場合
には１０数％以上のＴｉを含むため後のろう付工程で酸
化され易く、ろうが廻シにくいなどの問題があった。Conventionally, h(o-Mn-based and Cu- Human g-Ti
Compositions of systems and metallization methods using them have been proposed. However, aluminum nitride-based Cefmix is
-When metallizing using a Mn-based composition, the bonding strength of K is not as high as expected, and the shear strength is as low as several KF/2, and when using a Cu-Mg-Ti-based composition, Because it contains more than 10% Ti, it is easily oxidized in the subsequent brazing process and has problems such as difficulty in soldering.
本発明は、窒化アルミニウム系セラミックスと適度に反
応性を有し、かつ、濡れ性を有する金属化組成物の構成
元素の種類と含有量や、金属化するための加熱処理の方
法に関して研究を重ねて完成されたものであシ、−段と
強度の優れたかつ比較的酸化しに＜＜、信頼性の大きな
ろう材処理を施すことができる窒化アルミ系セラミック
ス（以下ＡＪＮ系セラミックスとする）の表面金属化技
術を提供することを目的としている。The present invention has been made through repeated research on the types and contents of constituent elements of a metallization composition that has appropriate reactivity and wettability with aluminum nitride ceramics, and the method of heat treatment for metallization. It is a product of aluminum nitride ceramics (hereinafter referred to as AJN ceramics), which has excellent strength, is relatively resistant to oxidation, and can be subjected to highly reliable brazing treatment. It aims to provide surface metallization technology.
本発明のＡｔＮ系セラミックス焼結体表面の金属化組成
物は、Ｐｄは１０〜８０重量％（以下重量％の重Ｊを省
略）、Ｔａを５〜８５％、Ｚｒを１．０〜１２．０％、
Ｍｎを０．５〜１０．０％、Ｎｉを１１．０％以下、Ｗ
を２０％以下含み、残部実質的にＣｕ及び不可避的不純
物からなることを特徴としている。The metallization composition on the surface of the AtN-based ceramic sintered body of the present invention contains 10 to 80% by weight of Pd (hereinafter, weight % is omitted), 5 to 85% of Ta, and 1.0 to 12% of Zr. 0%,
Mn 0.5 to 10.0%, Ni 11.0% or less, W
It is characterized in that it contains 20% or less of Cu, and the remainder substantially consists of Cu and unavoidable impurities.
又、本発明の金属化方法はこの金属化組成物よυなる合
金の粉末あるいは混合した各元素の粉末をｌ’Ｎ系セヲ
ミックスの表面に塗布し非酸化性ｌ囲気中で１ＪＦＩ３
あるいは半溶融させて俤付けることを特徴とする。In addition, the metallization method of the present invention involves applying powder of the alloy υ or mixed powder of each element of the metallization composition to the surface of the l'N-based sewomix, and heating it in a non-oxidizing atmosphere at 1JFI3.
Alternatively, it is characterized by being applied in a semi-molten state.
本発明におけるＡＩ！Ｎ系セフミックスとは、Ａ、ＪＮ
。AI in the present invention! What is N-type Cefmix? A, JN
.
人ＩＮ −ＢＮ 、 ＡｌＮ−８ｉＢＮ４など、あるい
は各種の焼結助剤を含むムｉ！Ｎが６０体積％以上を占
めるセフミックス焼結体である。Mui containing IN-BN, AlN-8iBN4, etc., or various sintering aids! This is a Cefmix sintered body in which N accounts for 60% by volume or more.
これらのＡ／Ｎ系セフミックスに対して、Ｚｒは少量で
も謡れ性を著しく同上させるので、溶融初期の段階で金
属化組成物が表面張力によって、塗布パターンよυも縮
少してしまうのを妨げ、正確なパターンを焼付けるのに
有効でらシ、さらに金属化組成物が溶融状態に保持され
ている間Ｋ Ａ！！Ｎ系セラミックスの表面層に拡散侵
入して、 Ｚｒ の酸化物を形成させて金属化層をセ
ラミックス表面に強固に結合させるのに有効である。但
し過１ζ」な反応を生じる場合には、セラミックスの表
面層を変質させてかえって脆化させた９１金属化層自体
が酸化し易くなるので、あまシ多量に含有させることは
かえって不利となるので、１．０〜１２，０％の範囲内
で配合する必要がある。For these A/N-based cefmixes, even a small amount of Zr significantly improves the singing performance, so it is necessary to prevent the metallized composition from shrinking by υ due to surface tension in the early melting stage. K A! ! It is effective to diffuse into the surface layer of N-based ceramics, form Zr oxide, and firmly bond the metallized layer to the ceramic surface. However, if a reaction of 1ζ occurs, the 91 metallized layer itself, which alters the quality of the surface layer of the ceramic and makes it brittle, becomes more likely to oxidize, so it is rather disadvantageous to contain a large amount of 91. , it is necessary to blend within the range of 1.0 to 12.0%.
溶融状態あるいは半溶融状態の金属化組成物中のＭｕは
Ｚｒはどではないが、ＡＩＮ系セラミックスと者干反応
性を有し、さらに金属化組成物の溶融開始温度を下げる
ので金属化層の表面を平滑にするうえで有効な元素であ
る。しかし、あまｒ多量に含有させると金属化層の耐酸
化性、耐蝕性を劣化させるので、わまシ多量に配合させ
ることは好ましくなく、０．５〜１０．０％の範囲内で
配合する必要がある。Although Mu in the metallized composition in a molten or semi-molten state is not as strong as Zr, it has a high reactivity with AIN ceramics, and also lowers the melting start temperature of the metallized composition, so that the metallized layer becomes It is an effective element in smoothing the surface. However, if it is contained in a large amount, it will deteriorate the oxidation resistance and corrosion resistance of the metallized layer, so it is not preferable to contain it in a large amount. There is a need.
Ｔａは高融点金属元素であり、金属化組成物中で他の成
分に比較して溶解しにくい元素であるが、−度溶解して
しまえば金属化層の融点を上げるので、後のろう付工程
などの高温にさらされる状態でも形状を保ち、又高温強
度を高めるうえで有効な元素である。又ＴａはムＪＮと
親和力があ）、濡れ性を向上させるうえで必須の元素で
ある。但しあまり多量に含有させると、金属化層に未溶
解残渣が多くなるため表面状況を劣化させるので、不利
となるので５〜８５％が適正な成分範囲でちる。Ta is a high melting point metal element, and is an element that is difficult to dissolve compared to other components in the metallized composition, but once it is dissolved, it will raise the melting point of the metallized layer, so it will be difficult to solder it later. It is an effective element in maintaining its shape even when exposed to high temperatures during processes and increasing high-temperature strength. Furthermore, Ta has an affinity with MuJN) and is an essential element for improving wettability. However, if it is contained in too large a quantity, undissolved residues will be present in the metallized layer, degrading the surface condition, which is disadvantageous, so the appropriate component range is 5 to 85%.
ＮｊはＡ７Ｎとの反応性が殆んどなく、濡れ性を劣化さ
せるが、ＰｄやＣｕと共に金属化組成物成分の融点の３
整上必要に応じて配合する元素であり、Ｔａと互いに溶
解度を有するので不利とはならないので１１．０％以下
の成分範囲とする。Nj has almost no reactivity with A7N and deteriorates its wettability, but it has a melting point of 3% of the melting point of the metallized composition components, along with Pd and Cu.
It is an element that is added as necessary for cleaning, and since it has mutual solubility with Ta, it is not disadvantageous, so the content range is set to 11.0% or less.
Ｐｄは女金属元素の一種であｌ）、ＣｕやＮｉと全率固
溶体を形成して金属化層を均質かつ柔軟性に富む層とす
るうえで必要な元素である。又前記高融点金属元素のＴ
ａを溶解し切るためにはＣｕだけでは不充分であ、９、
Ｐｄも必要不可欠である。Pd is a type of female metal element l) and is an element necessary to form a solid solution with Cu and Ni to make the metallized layer homogeneous and highly flexible. Further, T of the high melting point metal element
Cu alone is insufficient to completely dissolve a, 9,
Pd is also essential.
あまシ多量に配合すると金属化層に局所的に濡れ性の悪
い部分を形成し、表面を粗雑にし、コブ状突起物を形成
させやすくして、好ましくないので１０〜８０％の成分
範囲とする。If a large amount of amariness is added, it will locally form areas with poor wettability in the metallized layer, making the surface rough and making it easy to form lump-like protrusions, which is not preferable, so the content should be in the range of 10 to 80%. .
主成分元素であるＣｕはＡＩＮとの親和力は全く無いが
、金属化層の融点を適度に調整するうえで有効であシ、
あわせて、導電性、柔軟性に冨む金属である。又、他の
Ｐｄ、Ｎｉ、Ｍｎとほぼ広い範囲にわたりて固溶し、金
属化層を均質にするために必要な元素である。したがっ
て不可避的不純物として各種のガス成分例えば０ 、
Ｎ 、 Ｈｌあるいは８．０４８ｉなどの成分を除く残
部をＣｕの成分範囲とする。Although Cu, the main component element, has no affinity with AIN, it is effective in appropriately adjusting the melting point of the metallized layer.
Additionally, it is a highly conductive and flexible metal. Further, it forms a solid solution with other Pd, Ni, and Mn over a substantially wide range, and is an element necessary to make the metallized layer homogeneous. Therefore, various gas components such as 0,
The remainder excluding components such as N, Hl, or 8.048i is taken as the Cu component range.
さらに本発明の金属化組成物にはＴａよりもさらに融点
の高いＷを含才せてもｆＢ ４”ａの溶解成分に溶融し
にくいので、一部そのままのＷの粒子の形状として金属
化層に存在させることも出来るので、熱膨張を調整して
金属化層がセラミックス表面に残留応力を残存させない
ようにしたシ、金属化層の耐熱性を上げるのに有効であ
る。しかじあまシ多量に含有させるとかえって金属化層
の接合力や形状を劣化させるので２０％以下の成分範囲
とするＯ
本発明の金属化組成物をＡＪＮ系セラミックスに溶着さ
せる本発明方法は前記組成の１５０メツシユ以下、好ま
しくは８２５メツシ二以下の、合金あるいは混合した元
素金属の微粉末に適度な流動性とセラミックス表面への
付着力とを付与するために、粘結剤として、エチルセル
ロース系、アクリル系などのビークルを混合してペース
ト状とし、スクリーン印刷、刷毛、へらなどによる＝ｂ
方によって、セラミックスの所定の面に塗布し、乾燥後
、ムｒ ｒ Ｎ２ ｅ Ｎ２ ｔ 真空などの非酸化
性雰囲気中で、１０００〜１８００℃の温度範囲で５〜
８０分間保持して、溶融あるいは半溶融状態にして、金
属化層を形成させる方法である。Furthermore, even if the metallized composition of the present invention contains W, which has a higher melting point than Ta, it is difficult to melt into the dissolved component of fB 4''a, so the metallized layer may be formed in the form of particles of W with some of it intact. It is effective to adjust the thermal expansion so that the metallized layer does not leave any residual stress on the ceramic surface, and to increase the heat resistance of the metallized layer. If the metallized composition is contained in AJN ceramics, the bonding strength and shape of the metallized layer will deteriorate, so the content should be set at 20% or less. In order to impart appropriate fluidity and adhesion to the ceramic surface to the fine powder of alloyed or mixed elemental metals, preferably 825 mesh or less, a vehicle such as ethyl cellulose or acrylic is used as a binder. Mix to make a paste and print by screen printing, brush, spatula, etc.=b
Depending on the method, it is applied to a predetermined surface of the ceramic, and after drying, it is heated in a non-oxidizing atmosphere such as a vacuum in a temperature range of 1000 to 1800°C for 5 to 50 minutes.
This is a method of holding it for 80 minutes to bring it into a molten or semi-molten state to form a metallized layer.
前記の本発明方法によって、表面を金属化させたム７Ｎ
系セラミックスはさらに金属化した表面の上に、Ｃｏ
、 Ｒｈ 、ムｇ、ムｕ、Ｒｕ、Ｐｔ＋Ｎｉなどのよう
に耐蝕性に優れ、又ろう付温度で金属化層中の活性な元
素のＺｒ 、 Ｔａ 、 Ｍｕが酸化されるのを妨げ、
ろうの流れが疎外されるのを防ぐような耐酸化性に富ん
だ金属のメッキを施こして実用に供することが出来る。Mu7N whose surface was metallized by the method of the present invention described above.
Co-based ceramics are further coated with Co on the metallized surface.
, Rh, Mug, Mu, Ru, Pt+Ni, etc., it has excellent corrosion resistance, and also prevents the active elements Zr, Ta, and Mu in the metallized layer from being oxidized at the brazing temperature,
It can be put into practical use by plating with a highly oxidation-resistant metal that prevents the flow of wax from being blocked.
又、ムｌ！Ｎ の電子回路基板上に本発明組成物を精緻
なスクリーン印刷手法によって印刷し、かつ本発明方法
によって溶融や半溶融させて焼付け、さらにＣｕ、Ｎｉ
、 あるいはＡｕなどをメッキして高熱伝導性基板と
して用いることも出来る。Also, mul! The composition of the present invention is printed on a Cu, Ni electronic circuit board by a precise screen printing method, melted or semi-molten and baked by the method of the present invention, and then Cu, Ni
Alternatively, it can be plated with Au or the like and used as a highly thermally conductive substrate.
本発明によって、従来製造の困難であった結合力が充分
強く、ろう付などのし易い金属化面を有するＡＩＮ系セ
ラミックス製品を製造出来るようになった。したがって
ムｌ！Ｎ系セフミックスの用途である各種の用途、例え
ば、放熱板１ｗＬ子回路基板、電波吸収体、熱交換器部
品、測温用部品。The present invention has made it possible to manufacture AIN-based ceramic products that have sufficiently strong bonding strength and have metallized surfaces that are easy to braze, etc., which has been difficult to manufacture in the past. Therefore, it's too much! N-based Cefmix is used for various purposes, such as heat sinks, 1wL child circuit boards, radio wave absorbers, heat exchanger parts, and temperature measurement parts.
エンジン部品、高温治具などのいろいろな用途に本発明
を適用して効果を上げることが出来る。The present invention can be applied to various uses such as engine parts and high-temperature jigs to improve its effects.
次に、本発明の詳細な説明する。Next, the present invention will be explained in detail.
実施例１
第１表に記載の如き各種本発明の金属化組成物を８２５
メツシユ以下の微粉末の金属粉として混合して配合し、
エチルセルロース系のビークルを混入してペースト状と
し、厚み０．６４ｓ＋ｍ １２．ＯＵ角の常圧焼結Ａ
７Ｎ セラミックスの表面に、幅６朋、長さ１０ｇｇの
角のパターンを印刷し、乾燥後、１０００〜１２４０℃
の温度範囲で２０分間■２気流中で金属化層を溶着して
セラミックス表面上に形成させた。その後Ｎｉメッキを
厚み０．００５朋程度施こした後、Ｎｉ２９％、０ｏ１
７％、残部Ｆｅ、Ｊ：、’）なるコバール合金の直径番
頭、長さ１０Ｈの個片を共晶銀ろうを用いて８８０〜８
４０℃Ｎ２気流中で数分間保持してろう付した。炉中冷
却後、ＩＮセラミックスの裏面にエポキシ系接着材で１
０．Ｏｓｎ角 厚さ１０ｍｍの鋼材を接着し、剪断用試
験片を作シ、コバールとＡＩＮ間で剪断力が働らくよう
に試験を行ったところ、同表記載の測定結果を得、実用
性のある高い接合強度を得た。又、それに先立って、メ
タツイズ面を４０倍の実体顕微鏡で観察したところ、穴
などの欠陥が殆んど無く、表面も平滑で、パターンより
のはみ出し、縮みなども無く、印口ｊｌ焼付溶着性の極
めて優れた金属化組成物であることの確証を得た。Example 1 Various metallizing compositions of the present invention, such as those listed in Table 1, were
Mixed and formulated as a fine metal powder of less than mesh size,
Mix ethyl cellulose vehicle to make paste, thickness 0.64s+m 12. OU angle pressureless sintering A
A corner pattern with a width of 6mm and a length of 10gg is printed on the surface of 7N ceramics, and after drying, it is heated at 1000-1240℃.
The metallized layer was formed on the ceramic surface by welding in two air streams for 20 minutes at a temperature range of . After that, after applying Ni plating to a thickness of about 0.005mm, Ni29%, 0o1
Using eutectic silver solder, pieces of Kovar alloy with a diameter number of 7% and a balance of Fe, J:, ') and a length of 880~8
Brazing was carried out by holding it for several minutes at 40°C in a N2 stream. After cooling in the furnace, glue the back side of the IN ceramics with epoxy adhesive.
0. Osn angle 10mm thick steel materials were glued together to make a shearing test piece, and a test was conducted to apply shearing force between Kovar and AIN, and the measurement results shown in the table were obtained, indicating that it is practical. High bonding strength was obtained. In addition, prior to that, when the Meta Twis surface was observed using a stereomicroscope with a magnification of 40 times, it was found that there were almost no defects such as holes, the surface was smooth, there was no protrusion beyond the pattern, no shrinkage, etc. It was confirmed that this is an extremely excellent metallized composition.
第１表
以上のように、本発明によ九ばＡＪＮ系セラミックスを
対象として表面が平滑で、強い結合力を有し、耐酸化性
に侵れた金Ｕ化Ｕを形成することが出来る。As shown in Table 1, the present invention makes it possible to form a gold-plated U with a smooth surface, strong bonding strength, and improved oxidation resistance for AJN ceramics.
Claims (2)
、Ｚｒを１．０〜１２．０重量％、Ｍｎを０．５〜１０
．０重量％、Ｎｉを１１．０重量％以下、Ｗを２０重量
％以下含み、残部実質的にＣｕ及び不可避的不純物から
なることを特徴とする窒化アルミ系セラミックスの表面
金属化組成物。(1) 10-80% by weight of Pd, 5-85% by weight of Ta
, Zr 1.0-12.0% by weight, Mn 0.5-10
．． A surface metallization composition for aluminum nitride ceramics, characterized in that it contains 0% by weight or less of Ni, 11.0% or less of Ni, 20% or less of W, and the remainder substantially consists of Cu and unavoidable impurities.
、Ｚｒを１．０〜１２．０重量％、Ｍｎを０．６〜１０
．０重量％、Ｎｉを１１．０重量％以下、Ｗを２０重量
％以下含み、残部実質的にＣｕ及び不可避的不純物から
なる合金の粉末あるいは混合した粉末を窒化アルミ系セ
ラミックスの表面に塗布し、非酸化性雰囲気中で溶融あ
るいは半溶融させて焼付けることを特徴とする金属化方
法。(2) 10-80% by weight of Pd, 5-85% by weight of Ta
, Zr 1.0-12.0% by weight, Mn 0.6-10
．． Coating an alloy powder or mixed powder containing 0% by weight, 11.0% by weight or less of Ni, 20% by weight or less of W, and the remainder substantially consisting of Cu and inevitable impurities on the surface of the aluminum nitride ceramic, A metallization method characterized by melting or semi-melting and baking in a non-oxidizing atmosphere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20403586A JPH0822793B2 (en) | 1986-08-30 | 1986-08-30 | Aluminum nitride ceramic surface metallization composition and metallization method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20403586A JPH0822793B2 (en) | 1986-08-30 | 1986-08-30 | Aluminum nitride ceramic surface metallization composition and metallization method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6360186A true JPS6360186A (en) | 1988-03-16 |
| JPH0822793B2 JPH0822793B2 (en) | 1996-03-06 |
Family
ID=16483672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20403586A Expired - Lifetime JPH0822793B2 (en) | 1986-08-30 | 1986-08-30 | Aluminum nitride ceramic surface metallization composition and metallization method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0822793B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5045400A (en) * | 1989-02-06 | 1991-09-03 | Nippon Hybrid Technologies Co., Ltd. | Composition for and method of metallizing ceramic surface, and surface-metallized ceramic article |
-
1986
- 1986-08-30 JP JP20403586A patent/JPH0822793B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5045400A (en) * | 1989-02-06 | 1991-09-03 | Nippon Hybrid Technologies Co., Ltd. | Composition for and method of metallizing ceramic surface, and surface-metallized ceramic article |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0822793B2 (en) | 1996-03-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3834351B2 (en) | Ceramic circuit board | |
| JPH02208274A (en) | Composition for metallizing ceramic surface, surface-metallizing method and surface-metallized product | |
| JPS62270483A (en) | Ceramic metallizing composition, metallization and metallized product | |
| JP4081865B2 (en) | Method for producing conductor composition | |
| JPS6360186A (en) | Metallizing composition and metallization for aluminum nitride base ceramic surface | |
| JPH0524943A (en) | Active metallic brazing filler metal and method for joining metallic member and ceramic member by using this active metallic brazing filler metal | |
| JP3896432B2 (en) | Method for producing metal-ceramic composite substrate and brazing material used therefor | |
| JPH05170552A (en) | Aluminum nitride substrate having metallized layer and metallization of the substrate | |
| JP3161815B2 (en) | Brazing material for joining ceramics and metal and joining method therefor | |
| JPS63169348A (en) | Amorphous alloy foil for jointing ceramics | |
| JPS59217680A (en) | Metallizing paste and ceramic product | |
| JPH0574552B2 (en) | ||
| JPS6228067A (en) | Joining method for ceramics | |
| JPS63134576A (en) | Method of soldering ceramic component | |
| JP3155044B2 (en) | Brazing material for joining ceramics and metal and joining method therefor | |
| JP3493586B2 (en) | Ceramic metallization composition | |
| JPS61236661A (en) | Method of joining ceramic and metal, same kind of ceramics or different kind of ceramics | |
| JPS61281078A (en) | Method of joining ceramics to metal, same ceramics each other or different ceramics | |
| JPH04235246A (en) | Alloy for metalizing for ceramics and metalizing method | |
| JPS62167274A (en) | Metallizing composition for silicon carbide type ceramics surface, metallization and same product with metallized surface | |
| JPH02101131A (en) | Metallizing composition on the surface of ceramics and metallizing method | |
| JPH0597532A (en) | Bonding composition | |
| JP3409062B2 (en) | Joining method of ceramics and metal | |
| JP2020157326A (en) | Joining method of lead free solder material | |
| JPH0570260A (en) | Brazing filler metal paste for joining ceramic to metal |