JPS5121192A - DODENSEISETSU CHAKUSHIITO - Google Patents
DODENSEISETSU CHAKUSHIITOInfo
- Publication number
- JPS5121192A JPS5121192A JP9308274A JP9308274A JPS5121192A JP S5121192 A JPS5121192 A JP S5121192A JP 9308274 A JP9308274 A JP 9308274A JP 9308274 A JP9308274 A JP 9308274A JP S5121192 A JPS5121192 A JP S5121192A
- Authority
- JP
- Japan
- Prior art keywords
- dodenseisetsu
- chakushiito
- dodenseisetsu chakushiito
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9308274A JPS5121192A (en) | 1974-08-14 | 1974-08-14 | DODENSEISETSU CHAKUSHIITO |
GB3190675A GB1477780A (en) | 1974-08-14 | 1975-07-30 | Assembly incorporating electrically conductive adhesive |
NLAANVRAGE7509591,A NL172104C (en) | 1974-08-14 | 1975-08-12 | ELECTRICAL CONNECTION BY CONDUCTIVE ADHESIVES. |
CH1053675A CH607666A5 (en) | 1974-08-14 | 1975-08-13 | Method for mechanically and electrically connecting two members each bearing a bundle of electrical conductors, and adhesive for implementing the method |
FR7525414A FR2282148A1 (en) | 1974-08-14 | 1975-08-14 | ELECTRICALLY CONDUCTIVE ADHESIVE |
DE19752536361 DE2536361A1 (en) | 1974-08-14 | 1975-08-14 | ELECTRICALLY CONDUCTIVE ADHESIVE |
US05/751,730 US4113981A (en) | 1974-08-14 | 1976-12-17 | Electrically conductive adhesive connecting arrays of conductors |
HK432/81A HK43281A (en) | 1974-08-14 | 1981-08-27 | Assembly incorporating electrically conductive adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9308274A JPS5121192A (en) | 1974-08-14 | 1974-08-14 | DODENSEISETSU CHAKUSHIITO |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5121192A true JPS5121192A (en) | 1976-02-20 |
Family
ID=14072589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9308274A Pending JPS5121192A (en) | 1974-08-14 | 1974-08-14 | DODENSEISETSU CHAKUSHIITO |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5121192A (en) |
Cited By (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5470364U (en) * | 1977-10-27 | 1979-05-18 | ||
JPS54144970A (en) * | 1978-05-01 | 1979-11-12 | Nitto Electric Ind Co | Adhesive tape for electric circuit components |
JPS55163897A (en) * | 1979-06-08 | 1980-12-20 | Hitachi Ltd | Logic element high density mounting structure |
JPS5823174A (en) * | 1981-07-31 | 1983-02-10 | 信越ポリマー株式会社 | Connector |
JPS5831679U (en) * | 1981-08-26 | 1983-03-01 | シャープ株式会社 | electrical connection device |
JPS58115779A (en) * | 1981-12-28 | 1983-07-09 | 信越ポリマー株式会社 | Electrically connecting structure and method of electrically connecting same |
JPS58133704A (en) * | 1982-12-27 | 1983-08-09 | ミネソタ・マイニング・アンド・マニユフアクチユアリング・コンパニ− | Sheet material adapted to form electric connection bonded to substrate |
JPS5989164A (en) * | 1982-11-10 | 1984-05-23 | Seiko Epson Corp | Multi-nozzle ink jet head unit |
JPS59119615A (en) * | 1982-12-27 | 1984-07-10 | 株式会社精工舎 | Thermal fusion-bonding connecting cable |
JPS59203378A (en) * | 1983-05-02 | 1984-11-17 | 株式会社精工舎 | Method of connecting connecting terminal |
JPS609009A (en) * | 1983-06-28 | 1985-01-18 | 松下電器産業株式会社 | Thermal press-bonding conductive film |
JPS60130004A (en) * | 1983-12-15 | 1985-07-11 | 日立化成工業株式会社 | Transparent conductive anisotropic adhesive sheet |
JPS60133677A (en) * | 1983-12-21 | 1985-07-16 | 株式会社精工舎 | Heat fusion-bonding connection cable |
JPS60172623U (en) * | 1984-04-19 | 1985-11-15 | 株式会社神戸製鋼所 | Multi-stage skipping blade broach |
JPS6120074U (en) * | 1984-07-09 | 1986-02-05 | アルプス電気株式会社 | heat seal connector |
JPS6164085A (en) * | 1984-09-04 | 1986-04-02 | ダイソー株式会社 | Electric member |
JPS61168996A (en) * | 1985-01-22 | 1986-07-30 | 松下電器産業株式会社 | Semiconductor device |
JPS61187393A (en) * | 1985-02-15 | 1986-08-21 | カシオ計算機株式会社 | Joint material for connection of electronic component |
JPS61194796A (en) * | 1985-02-22 | 1986-08-29 | カシオ計算機株式会社 | Junction structure of electronic component and method thereof |
JPS61228490A (en) * | 1985-04-02 | 1986-10-11 | 株式会社日立製作所 | Display unit connecting construction |
JPS627195A (en) * | 1985-07-03 | 1987-01-14 | サンアロ−株式会社 | Anisotropic conducting sticky adhesive layer |
JPS6277878U (en) * | 1985-11-06 | 1987-05-19 | ||
JPS62147675A (en) * | 1985-12-21 | 1987-07-01 | 日本メクトロン株式会社 | Flexible contact |
JPS6388714A (en) * | 1986-10-02 | 1988-04-19 | 信越ポリマ−株式会社 | Printed wiring board |
JPS63205074A (en) * | 1987-02-19 | 1988-08-24 | シャープ株式会社 | Tape carrier device mounting construction |
JPH01163904A (en) * | 1988-08-12 | 1989-06-28 | Seikosha Co Ltd | Heat-fusing type connection cable and its manufacture |
JPH01272010A (en) * | 1988-08-12 | 1989-10-31 | Seikosha Co Ltd | Thermal fusion type connecting cable and manufacture thereof |
JPH0236593A (en) * | 1988-06-10 | 1990-02-06 | Sheldahl Inc | Multilayer electronic circuit and its manufacture |
WO2000009623A1 (en) * | 1998-08-13 | 2000-02-24 | Hitachi Chemical Company, Ltd. | Adhesive for bonding circuit members, circuit board, and method of producing the same |
JP2001176895A (en) * | 1994-10-31 | 2001-06-29 | Hitachi Chem Co Ltd | Laminating method, die-bonding method, laminating device, and die-bonding device of film-shaped organic die-bonding material, and semiconductor device and manufacturing method thereof using the same |
JP2015502988A (en) * | 2011-10-25 | 2015-01-29 | スリーエム イノベイティブ プロパティズ カンパニー | Nonwoven adhesive tape and articles made therefrom |
-
1974
- 1974-08-14 JP JP9308274A patent/JPS5121192A/en active Pending
Cited By (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5711422Y2 (en) * | 1977-10-27 | 1982-03-05 | ||
JPS5470364U (en) * | 1977-10-27 | 1979-05-18 | ||
JPS54144970A (en) * | 1978-05-01 | 1979-11-12 | Nitto Electric Ind Co | Adhesive tape for electric circuit components |
JPS5517467B2 (en) * | 1978-05-01 | 1980-05-12 | ||
JPS55163897A (en) * | 1979-06-08 | 1980-12-20 | Hitachi Ltd | Logic element high density mounting structure |
JPS5823174A (en) * | 1981-07-31 | 1983-02-10 | 信越ポリマー株式会社 | Connector |
JPS6351354B2 (en) * | 1981-07-31 | 1988-10-13 | Shinetsu Polymer Co | |
JPS5831679U (en) * | 1981-08-26 | 1983-03-01 | シャープ株式会社 | electrical connection device |
JPH0226346B2 (en) * | 1981-12-28 | 1990-06-08 | Shinetsu Polymer Co | |
JPS58115779A (en) * | 1981-12-28 | 1983-07-09 | 信越ポリマー株式会社 | Electrically connecting structure and method of electrically connecting same |
JPS5989164A (en) * | 1982-11-10 | 1984-05-23 | Seiko Epson Corp | Multi-nozzle ink jet head unit |
JPS58133704A (en) * | 1982-12-27 | 1983-08-09 | ミネソタ・マイニング・アンド・マニユフアクチユアリング・コンパニ− | Sheet material adapted to form electric connection bonded to substrate |
JPH02803B2 (en) * | 1982-12-27 | 1990-01-09 | Seikosha Kk | |
JPS59119615A (en) * | 1982-12-27 | 1984-07-10 | 株式会社精工舎 | Thermal fusion-bonding connecting cable |
JPH0421966B2 (en) * | 1982-12-27 | 1992-04-14 | Minnesota Mining & Mfg | |
JPS59203378A (en) * | 1983-05-02 | 1984-11-17 | 株式会社精工舎 | Method of connecting connecting terminal |
JPS609009A (en) * | 1983-06-28 | 1985-01-18 | 松下電器産業株式会社 | Thermal press-bonding conductive film |
JPS60130004A (en) * | 1983-12-15 | 1985-07-11 | 日立化成工業株式会社 | Transparent conductive anisotropic adhesive sheet |
JPS60133677A (en) * | 1983-12-21 | 1985-07-16 | 株式会社精工舎 | Heat fusion-bonding connection cable |
JPH0112903Y2 (en) * | 1984-04-19 | 1989-04-14 | ||
JPS60172623U (en) * | 1984-04-19 | 1985-11-15 | 株式会社神戸製鋼所 | Multi-stage skipping blade broach |
JPS6120074U (en) * | 1984-07-09 | 1986-02-05 | アルプス電気株式会社 | heat seal connector |
JPS645351Y2 (en) * | 1984-07-09 | 1989-02-09 | ||
JPS6164085A (en) * | 1984-09-04 | 1986-04-02 | ダイソー株式会社 | Electric member |
JPH0348633B2 (en) * | 1984-09-04 | 1991-07-25 | Daisow Co Ltd | |
JPS61168996A (en) * | 1985-01-22 | 1986-07-30 | 松下電器産業株式会社 | Semiconductor device |
JPS61187393A (en) * | 1985-02-15 | 1986-08-21 | カシオ計算機株式会社 | Joint material for connection of electronic component |
JPS61194796A (en) * | 1985-02-22 | 1986-08-29 | カシオ計算機株式会社 | Junction structure of electronic component and method thereof |
JPS61228490A (en) * | 1985-04-02 | 1986-10-11 | 株式会社日立製作所 | Display unit connecting construction |
JPH0574826B2 (en) * | 1985-04-02 | 1993-10-19 | Hitachi Ltd | |
JPS627195A (en) * | 1985-07-03 | 1987-01-14 | サンアロ−株式会社 | Anisotropic conducting sticky adhesive layer |
JPH0351899Y2 (en) * | 1985-11-06 | 1991-11-08 | ||
JPS6277878U (en) * | 1985-11-06 | 1987-05-19 | ||
JPS62147675A (en) * | 1985-12-21 | 1987-07-01 | 日本メクトロン株式会社 | Flexible contact |
JPS6388714A (en) * | 1986-10-02 | 1988-04-19 | 信越ポリマ−株式会社 | Printed wiring board |
JPH054787B2 (en) * | 1987-02-19 | 1993-01-20 | Sharp Kk | |
JPS63205074A (en) * | 1987-02-19 | 1988-08-24 | シャープ株式会社 | Tape carrier device mounting construction |
JPH0236593A (en) * | 1988-06-10 | 1990-02-06 | Sheldahl Inc | Multilayer electronic circuit and its manufacture |
JPH0371727B2 (en) * | 1988-08-12 | 1991-11-14 | Seikosha Kk | |
JPH0371728B2 (en) * | 1988-08-12 | 1991-11-14 | Seikosha Kk | |
JPH01163904A (en) * | 1988-08-12 | 1989-06-28 | Seikosha Co Ltd | Heat-fusing type connection cable and its manufacture |
JPH01272010A (en) * | 1988-08-12 | 1989-10-31 | Seikosha Co Ltd | Thermal fusion type connecting cable and manufacture thereof |
JP2001176895A (en) * | 1994-10-31 | 2001-06-29 | Hitachi Chem Co Ltd | Laminating method, die-bonding method, laminating device, and die-bonding device of film-shaped organic die-bonding material, and semiconductor device and manufacturing method thereof using the same |
US8273458B2 (en) | 1997-02-14 | 2012-09-25 | Hitachi Chemical Company, Ltd. | Adhesive for bonding circuit members, circuit board and process for its production |
WO2000009623A1 (en) * | 1998-08-13 | 2000-02-24 | Hitachi Chemical Company, Ltd. | Adhesive for bonding circuit members, circuit board, and method of producing the same |
CN100379832C (en) * | 1998-08-13 | 2008-04-09 | 日立化成工业株式会社 | Adhesive for circuit components connection circuit board and producing method thereof |
US7879445B2 (en) | 1998-08-13 | 2011-02-01 | Hitachi Chemical Company, Ltd. | Adhesive for bonding circuit members, circuit board and process for its production |
US8252419B2 (en) | 1998-08-13 | 2012-08-28 | Hitachi Chemical Company, Ltd. | Adhesive for bonding circuit members, circuit board and process for its production |
US8273457B2 (en) | 1998-08-13 | 2012-09-25 | Hitachi Chemical Company, Ltd. | Adhesive for bonding circuit members, circuit board and process for its production |
US7247381B1 (en) | 1998-08-13 | 2007-07-24 | Hitachi Chemical Company, Ltd. | Adhesive for bonding circuit members, circuit board, and method of producing the same |
JP2015502988A (en) * | 2011-10-25 | 2015-01-29 | スリーエム イノベイティブ プロパティズ カンパニー | Nonwoven adhesive tape and articles made therefrom |
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