JPS6350842Y2 - - Google Patents
Info
- Publication number
- JPS6350842Y2 JPS6350842Y2 JP10103982U JP10103982U JPS6350842Y2 JP S6350842 Y2 JPS6350842 Y2 JP S6350842Y2 JP 10103982 U JP10103982 U JP 10103982U JP 10103982 U JP10103982 U JP 10103982U JP S6350842 Y2 JPS6350842 Y2 JP S6350842Y2
- Authority
- JP
- Japan
- Prior art keywords
- anode
- lead wire
- capacitor element
- terminal
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 16
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【考案の詳細な説明】
本考案はチツプ状固体電解コンデンサに関す
る。[Detailed Description of the Invention] The present invention relates to a chip-shaped solid electrolytic capacitor.
チツプ状コンデンサはプリント基板取付けに適
するように小型でリードレス構造が要求されてい
る。 Chip capacitors are required to be small and have a leadless structure to be suitable for mounting on printed circuit boards.
小型であるためにコンデンサ素子やその端子は
非常に小さく製造工程中の取扱いがむつかしく、
特にコンデンサ素子からの陽極引出線への端子の
溶接が難作業である。 Due to their small size, capacitor elements and their terminals are extremely small and difficult to handle during the manufacturing process.
In particular, welding the terminal from the capacitor element to the anode lead wire is a difficult task.
従来品は端子の一部に舌片を設け、或いは孔を
あけて引出線を溶接していたが、溶接電極の配置
に手数を要し、溶接不良が多くまた工数も大とな
つていた。 In conventional products, a tongue piece is provided in a part of the terminal, or a hole is made, and a lead wire is welded to the terminal, but it takes time and effort to arrange the welding electrode, resulting in many welding defects and a large amount of man-hours.
本考案はこの欠点を除去し、改良したもので溶
接強度の大きいチツプ状固体電極コンデンサを提
供することを目的としている。 The object of the present invention is to eliminate this drawback and provide an improved chip-shaped solid electrode capacitor with high welding strength.
本考案を実施例にもとづいて説明する。第１図
は本考案を示すコンデンサの断面図、第２図はそ
れに用いる陽極端子の斜視図である。 The present invention will be explained based on examples. FIG. 1 is a sectional view of a capacitor according to the present invention, and FIG. 2 is a perspective view of an anode terminal used therein.
本考案コンデンサは第１図の如くコンデンサ素
子１の陰極層に陰極端子３をはんだ付けし、陽極
側の陽極引出線２に陽極端子４を溶接した構造で
ある。 As shown in FIG. 1, the capacitor of the present invention has a structure in which a cathode terminal 3 is soldered to the cathode layer of a capacitor element 1, and an anode terminal 4 is welded to an anode lead wire 2 on the anode side.
コンデンサ素子１は弁金属陽極体の表面に酸化
皮膜、半導体層、陰極層を順次積層形成したもの
で、一端から陽極引出線２が導出されている。 The capacitor element 1 has an oxide film, a semiconductor layer, and a cathode layer laminated in this order on the surface of a valve metal anode body, and an anode lead wire 2 is led out from one end.
陰極端子３は実施例ではＬ型金属板を用いハン
ダ付けとした。陽極端子４は断面Ｌ型の金属板の
折り目に垂直に二個所の切り込みを入れ、この間
の部分をＬ型の内方へ突出させて陽極接続部５を
設けたものを用いる。この陽極接続部５へコンデ
ンサ素子１の陽極引出線２を溶接する。 In the embodiment, the cathode terminal 3 is an L-shaped metal plate and is soldered. The anode terminal 4 is a metal plate having an L-shaped cross section, with two incisions made perpendicularly to the fold, and a portion between the two incisions protruding inward from the L-shape to provide an anode connection portion 5. The anode lead wire 2 of the capacitor element 1 is welded to this anode connection portion 5.
本考案においては陽極端子４に陽極接続部５を
設けたので陽極引出線２の溶接が容易となつた。
即ち下方溶接電極は突出させた空胴から挿入し接
続部５を下から支えまた上部電極は上方から陽極
引出線２をおさえる。溶接に際して障害がないの
で溶接が確実に行い得られ、ミスが少なくなり強
度が増した。 In the present invention, since the anode terminal 4 is provided with the anode connection portion 5, welding of the anode lead wire 2 is facilitated.
That is, the lower welding electrode is inserted from the protruding cavity and supports the connecting portion 5 from below, and the upper electrode holds down the anode lead wire 2 from above. Since there are no obstacles during welding, welding can be performed reliably, with fewer mistakes and increased strength.
また本実施例では陽極端子４と陰極端子３との
プリント基板ランドへの接続部となる各水平片は
同一平面内にあるように配置した。 Further, in this embodiment, each horizontal piece serving as a connection portion between the anode terminal 4 and the cathode terminal 3 to the printed circuit board land is arranged so as to be in the same plane.
そして陽陰端子４の垂直片は図示しなかつたが
樹脂を充填したときの流れどめとなつている。 Although the vertical pieces of the positive and negative terminals 4 are not shown, they serve as a flow stop when resin is filled.
本実施例に用いる金属端子３，４ははんだ付け
及び溶接可能な金属を用いるかはんだ付け可能な
メツキ例えばはんだ、錫、金メツキを施した金属
を加工したもので、銅、ニツケル、洋白などが最
適である。 The metal terminals 3 and 4 used in this embodiment are made of a metal that can be soldered and welded, or are made of solderable plating, such as solder, tin, or gold-plated metal, such as copper, nickel, or nickel silver. is optimal.
図面は本考案による実施例を示し、第１図は組
立てられたコンデンサの断面図、第２図は陽極端
子の斜視図である。
１……コンデンサ素子、２……陽極引出線、３
……陰極端子、４……陽極端子、５……陽極接続
部。
The drawings show an embodiment of the present invention, with FIG. 1 being a sectional view of an assembled capacitor, and FIG. 2 being a perspective view of an anode terminal. 1...Capacitor element, 2...Anode lead wire, 3
... cathode terminal, 4 ... anode terminal, 5 ... anode connection section.
Claims (1)
酸化皮膜、半導体層、陰極層を順次積層形成した
コンデンサ素子と、コンデンサ素子の陰極層に接
続された陰極端子と、断面Ｌ型の金属板の折り目
に垂直に設けた二個所の切り込みの間の部分をＬ
型金属板の内方へ突き出して陽極接続部としコン
デンサ素子の陽極引出線をこの陽極接続部で溶接
接続してなる陽極端子とからなる固体電解コンデ
ンサ。 A capacitor element in which an oxide film, a semiconductor layer, and a cathode layer are sequentially laminated on the surface of a valve metal anode body in which an anode lead wire is embedded, a cathode terminal connected to the cathode layer of the capacitor element, and a metal plate with an L-shaped cross section. The part between the two notches made perpendicular to the fold is L.
A solid electrolytic capacitor consisting of an anode terminal that protrudes inward from a molded metal plate and serves as an anode connection section, and the anode lead wire of the capacitor element is welded and connected to this anode connection section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10103982U JPS594630U (en) | 1982-07-02 | 1982-07-02 | solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10103982U JPS594630U (en) | 1982-07-02 | 1982-07-02 | solid electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS594630U JPS594630U (en) | 1984-01-12 |
| JPS6350842Y2 true JPS6350842Y2 (en) | 1988-12-27 |
Family
ID=30238765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10103982U Granted JPS594630U (en) | 1982-07-02 | 1982-07-02 | solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS594630U (en) |
-
1982
- 1982-07-02 JP JP10103982U patent/JPS594630U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS594630U (en) | 1984-01-12 |
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