JPS6336598A - Manufacture of wiring board - Google Patents
Manufacture of wiring boardInfo
- Publication number
- JPS6336598A JPS6336598A JP17947386A JP17947386A JPS6336598A JP S6336598 A JPS6336598 A JP S6336598A JP 17947386 A JP17947386 A JP 17947386A JP 17947386 A JP17947386 A JP 17947386A JP S6336598 A JPS6336598 A JP S6336598A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- conductor
- thickness
- protection plate
- electroless plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000004020 conductor Substances 0.000 claims description 21
- 238000007772 electroless plating Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000003054 catalyst Substances 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 description 6
- 238000007654 immersion Methods 0.000 description 4
- 239000011888 foil Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は厚さの異なる４電体を形成した配線板の製造方
法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing a wiring board in which four electric bodies having different thicknesses are formed.
従来の技術
従来、アディティブ法により製作する配線板は、設計上
要求される導電体の厚さに対応し、基板を無電解めっき
槽に浸漬する時間をｆｔｉ制御することにより行ってい
る。浸漬時間に比例して導電体が基板上に析出されるの
で所望厚さの導電体を得ることができた。BACKGROUND OF THE INVENTION Conventionally, wiring boards have been manufactured by the additive method by controlling fti the time during which the board is immersed in an electroless plating bath in accordance with the thickness of the conductor required in the design. Since the conductor was deposited on the substrate in proportion to the immersion time, it was possible to obtain the conductor with the desired thickness.
発明が解決しようとする問題点
従来のアディティブ法による配線板は、基板上に同一厚
さの導電箔を得ることを目的とする場合には適当である
が、同一基板上に厚さの異なる導電体層を形成すること
ができなかった。Problems to be Solved by the Invention The wiring board produced using the conventional additive method is suitable when the purpose is to obtain a conductive foil of the same thickness on a substrate, but it is suitable for producing conductive foils of different thicknesses on the same substrate. It was not possible to form a body layer.
問題点を解決するための手段
本発明は同一基板上のＳ電体の異った厚さの配線板の製
造方法を提供する。本発明の配線板は触媒入り接着剤を
塗布した絶縁基板を用い、この基板にスルーホール用の
孔明けを行い、基板表面にめっきレジスト層を印刷形成
し、無電解めっき液に浸漬して所定厚の４電体を形成し
た配線板を製造する。ここで一旦配線板を取出して取付
は孔を貫設する。この後さらに導電体箔厚を厚くしよう
とする箇所を除く箇所の導電体上に絶縁保護板をａ置し
、ボルトで配線板に対し絶縁保護板を固着し、再度無電
解めっき液に配線板を浸漬し、絶縁保護板で保護されな
い箇所の４電体の厚さをさらに厚くすることによって一
枚の印刷配線板で厚さの異なる導電体層を形成すること
ができる配線板の製造方法を提供する。Means for Solving the Problems The present invention provides a method for manufacturing wiring boards with different thicknesses of S electrical bodies on the same substrate. The wiring board of the present invention uses an insulating substrate coated with a catalyst-containing adhesive, holes for through holes are formed in this substrate, a plating resist layer is printed on the surface of the substrate, and it is immersed in an electroless plating solution to form a predetermined shape. A wiring board on which four thick electric bodies are formed is manufactured. At this point, take out the wiring board and install it through the holes. After this, place the insulation protection plate a on the conductor except for the area where the conductor foil thickness is to be made thicker, fix the insulation protection plate to the wiring board with bolts, and coat the wiring board in the electroless plating solution again. A method for producing a wiring board that can form conductive layers of different thicknesses on a single printed wiring board by dipping the printed wiring board into a printed wiring board and increasing the thickness of the four conductive bodies in the areas not protected by the insulation protection plate. provide.
実施例
本発明の実施例を図面に基づき説明すると、触媒入り接
着剤２が塗布された絶縁板１にスルーホールの孔明け３
を行い、めっきレジスト層４を形成し、無電解めっき液
に浸漬して、導電体５を形成して配線板１０を製造する
。導電体５層の厚さは浸漬時間に比例して形成されるの
で、絶縁板１上に設けられた導電体５は均一な厚さに形
成されている。Embodiment An embodiment of the present invention will be explained based on the drawings.Through holes 3 are formed in an insulating plate 1 coated with a catalyst-containing adhesive 2.
A plating resist layer 4 is formed, and a conductor 5 is formed by immersion in an electroless plating solution, thereby manufacturing a wiring board 10. Since the thickness of the conductor 5 layer is formed in proportion to the immersion time, the conductor 5 provided on the insulating plate 1 is formed to have a uniform thickness.
この配線板１０を用い、一枚の配線板上にあって、導電
体の厚さに大小を設けようとするとき、さらに導電体の
厚さを大きくしようとする箇所を除き、換言すれば、す
でに所望する厚さに形成されている導電体５Ａの表面に
、無電解めっき液に浸漬してもめっき析出が生じないベ
ーク板の絶縁保護板１２をｔｌｌ、置し、プラスチック
製ボルト１４で配線板１０に対し絶縁保護板１２を固着
する。When using this wiring board 10 and trying to set the thickness of the conductor on a single wiring board, except for the part where the thickness of the conductor is to be increased, in other words, On the surface of the conductor 5A, which has already been formed to a desired thickness, an insulating protection plate 12 made of a bake plate that does not cause plating precipitation even when immersed in an electroless plating solution is placed, and wiring is completed using plastic bolts 14. An insulating protection plate 12 is fixed to the plate 10.
この後、再び無電解めっき液に浸漬すると、浸漬時間に
比例して導電体５の上にさらにめっきが析出されて、露
出されている導電体５Ｂは所望厚さに形成できる。絶縁
保護板１２を取ることにより厚さの異なる導電体５Ａ、
５Ｂを有した配線板２０を製造することができる。Thereafter, when the conductor 5 is immersed in the electroless plating solution again, more plating is deposited on the conductor 5 in proportion to the immersion time, and the exposed conductor 5B can be formed to a desired thickness. Conductor 5A with different thickness by removing insulation protection plate 12,
A wiring board 20 having 5B can be manufactured.
発明の効果
本発明は以上に説明した如き工程に基づいて製造する配
線板の製造方法であり、一枚の配線板上に異なった厚さ
の導電体層が形成できるので高電流を流すパターンや放
熱性が特に要求されるパターンに容易に対応できるよう
になり、スルーホールの信頼性向上にも効果のある発明
である。Effects of the Invention The present invention is a method of manufacturing a wiring board based on the process as explained above, and since conductor layers of different thicknesses can be formed on one wiring board, it is possible to form a pattern that allows high current to flow. This invention can easily be applied to patterns that particularly require heat dissipation, and is also effective in improving the reliability of through holes.
第１図は本発明の断面図、第２図は従来の断面図、第３
図は絶縁保護板を載置した断面図。
図面において、 ５：、０電体、 １０：配線板、１２
：絶縁保護板、 ２０：配線板。Fig. 1 is a sectional view of the present invention, Fig. 2 is a sectional view of the conventional method, and Fig. 3 is a sectional view of the conventional method.
The figure is a cross-sectional view with an insulation protection plate placed on it. In the drawings, 5:, 0 electric body, 10: wiring board, 12
: Insulation protection board, 20: Wiring board.
Claims (1)
ルーホール用の孔明けを行い、めつきレジスト層を設け
、無電解めっき液に浸漬して所定厚の導電体を形成する
配線板を製作した後、さらに導電体の厚さを厚くしよう
とする箇所を除く導電体を覆って絶縁保護板を載置し、
配線板にこの絶縁保護板を固着した後、再度無電解めっ
き液に配線板を浸漬し、絶縁保護板で保護されない箇所
の導電体の厚さをさらに厚くすることを特徴とする配線
板の製造方法。(1) A wiring board using an insulating substrate coated with a catalyst-containing adhesive, drilling holes for through holes, providing a plating resist layer, and immersing it in an electroless plating solution to form a conductor of a predetermined thickness. After manufacturing the conductor, place an insulating protection plate over the conductor except for the areas where the thickness of the conductor is to be increased.
After fixing this insulating protection plate to the wiring board, the wiring board is immersed in an electroless plating solution again to further increase the thickness of the conductor in areas not protected by the insulating protection plate. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17947386A JPS6336598A (en) | 1986-07-30 | 1986-07-30 | Manufacture of wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17947386A JPS6336598A (en) | 1986-07-30 | 1986-07-30 | Manufacture of wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6336598A true JPS6336598A (en) | 1988-02-17 |
Family
ID=16066458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17947386A Pending JPS6336598A (en) | 1986-07-30 | 1986-07-30 | Manufacture of wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6336598A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0366194A (en) * | 1989-08-04 | 1991-03-20 | Ibiden Co Ltd | Manufacture of printed board |
| JP2011082250A (en) * | 2009-10-05 | 2011-04-21 | Denso Corp | Wiring board and method for manufacturing the same |
| JP2013243293A (en) * | 2012-05-22 | 2013-12-05 | Shimada Phys & Chem Ind Co Ltd | Printed wiring board and manufacturing method of the same |
| JP2014099647A (en) * | 2014-01-28 | 2014-05-29 | Denso Corp | Wiring board and method of manufacturing the same |
| JP2014216567A (en) * | 2013-04-26 | 2014-11-17 | 株式会社デンソー | Multilayer substrate and electronic apparatus using the same |
-
1986
- 1986-07-30 JP JP17947386A patent/JPS6336598A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0366194A (en) * | 1989-08-04 | 1991-03-20 | Ibiden Co Ltd | Manufacture of printed board |
| JP2011082250A (en) * | 2009-10-05 | 2011-04-21 | Denso Corp | Wiring board and method for manufacturing the same |
| JP2013243293A (en) * | 2012-05-22 | 2013-12-05 | Shimada Phys & Chem Ind Co Ltd | Printed wiring board and manufacturing method of the same |
| JP2014216567A (en) * | 2013-04-26 | 2014-11-17 | 株式会社デンソー | Multilayer substrate and electronic apparatus using the same |
| JP2014099647A (en) * | 2014-01-28 | 2014-05-29 | Denso Corp | Wiring board and method of manufacturing the same |
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