JPS6336042U - - Google Patents
Info
- Publication number
- JPS6336042U JPS6336042U JP12714586U JP12714586U JPS6336042U JP S6336042 U JPS6336042 U JP S6336042U JP 12714586 U JP12714586 U JP 12714586U JP 12714586 U JP12714586 U JP 12714586U JP S6336042 U JPS6336042 U JP S6336042U
- Authority
- JP
- Japan
- Prior art keywords
- mounting table
- wafer mounting
- supporting substrate
- opening
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 239000000523 sample Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims 3
Landscapes
- Measuring Leads Or Probes (AREA)
Description
第１図ａ，ｂ，ｃはこの考案のプローブカード
にかかり、ａは上面図、ｂは断面図、ｃはリング
の断面図、第２図ないし第４図はいずれも夫々が
従来例のプローブカードにかかり、各図のａは上
面図、ｂは断面図を夫々示す。
１０１……ウエーハ載置台、１０２……支持基
板、１０２ａ……支持基板の開孔、１１……リン
グ、１１ａ……リングの最大径部、１１ｂ……リ
ングの開口端縁、１１ｃ……リングのテーパ面。
Figures 1a, b, and c show the probe card of this invention; a is a top view, b is a cross-sectional view, and c is a cross-sectional view of the ring; Figures 2 to 4 are respectively probes of conventional examples. In each figure, a shows a top view, and b shows a cross-sectional view of the card. 101...Wafer mounting table, 102...Support substrate, 102a...Opening hole in support substrate, 11...Ring, 11a...Maximum diameter part of ring, 11b...Opening edge of ring, 11c... Tapered surface.
Claims (1)
を載置するウエーハ載置台、上記ウエーハ載置台
の上方にこれと平行に配置され開孔を有する支持
基板、上記支持基板のウエーハ載置台との対向面
側の上記開孔周縁にこれと同心に最大径部で取着
されウエーハ載置台の方向に突出した截頭円錐型
で開口端縁は先端が小径なテーパに形成され、か
つ電気絶縁材でなるリング、上記支持基板のウエ
ーハ載置台との対向面側にこの支持基板からなる
リングの外側面に沿い、かつ開孔の中心から支持
基板に垂直の軸上にウエーハ載置台側を指向して
設けられたプローブ針、および、上記プローブ針
に接続し半導体素子の電気的特性測定を行なう素
子特性測定装置を具備したプローブカード。 A wafer mounting table on which a semiconductor wafer on which a semiconductor element to be measured is formed is placed, a support substrate arranged above and parallel to the wafer mounting table and having an opening, a side of the support substrate facing the wafer mounting table. a truncated conical ring that is attached concentrically to the periphery of the above-mentioned hole at its maximum diameter and protrudes toward the wafer mounting table; the opening edge is tapered to a small diameter at the tip; , provided on the side of the supporting substrate facing the wafer mounting table, along the outer surface of the ring made of the supporting substrate, and oriented toward the wafer mounting table side on an axis perpendicular to the supporting substrate from the center of the opening. A probe card comprising: a probe needle; and an element characteristic measuring device connected to the probe needle to measure the electrical characteristics of a semiconductor element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12714586U JPS6336042U (en) | 1986-08-22 | 1986-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12714586U JPS6336042U (en) | 1986-08-22 | 1986-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6336042U true JPS6336042U (en) | 1988-03-08 |
Family
ID=31021616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12714586U Pending JPS6336042U (en) | 1986-08-22 | 1986-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6336042U (en) |
-
1986
- 1986-08-22 JP JP12714586U patent/JPS6336042U/ja active Pending