JPS6333577A - Electroless plating solution - Google Patents
Electroless plating solutionInfo
- Publication number
- JPS6333577A JPS6333577A JP17737686A JP17737686A JPS6333577A JP S6333577 A JPS6333577 A JP S6333577A JP 17737686 A JP17737686 A JP 17737686A JP 17737686 A JP17737686 A JP 17737686A JP S6333577 A JPS6333577 A JP S6333577A
- Authority
- JP
- Japan
- Prior art keywords
- electroless plating
- plating solution
- copper
- niobium pentoxide
- physical properties
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007772 electroless plating Methods 0.000 title claims abstract description 11
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Inorganic materials O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 claims abstract description 9
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 4
- 239000008139 complexing agent Substances 0.000 claims abstract description 4
- 239000003381 stabilizer Substances 0.000 claims abstract description 4
- 239000004094 surface-active agent Substances 0.000 claims abstract description 4
- 239000005749 Copper compound Substances 0.000 claims abstract 3
- 150000001880 copper compounds Chemical class 0.000 claims abstract 3
- 239000004020 conductor Substances 0.000 claims abstract 2
- 239000003513 alkali Substances 0.000 claims description 2
- 239000003518 caustics Substances 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims 1
- 238000007747 plating Methods 0.000 abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 13
- 239000011889 copper foil Substances 0.000 abstract description 7
- 230000000704 physical effect Effects 0.000 abstract description 7
- 229910052802 copper Inorganic materials 0.000 abstract description 6
- 239000010949 copper Substances 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 4
- 229910000365 copper sulfate Inorganic materials 0.000 abstract description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract description 3
- 230000008021 deposition Effects 0.000 abstract description 3
- 229910001854 alkali hydroxide Inorganic materials 0.000 abstract 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 abstract 2
- -1 copper sulfate Chemical class 0.000 abstract 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 241000218645 Cedrus Species 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 本発明は配線板に用いる無電解めっき液に関する。[Detailed description of the invention] Industrial applications The present invention relates to an electroless plating solution used for wiring boards.
従来の技術
印刷配線板は機器の小型化に従って、高密度化が進み、
回路幅の狭いものが必要になっている。Conventional technologyPrinted wiring boards have become denser as devices become smaller.
A narrow circuit width is required.
フルアデイティブ方式の印刷配線板はめつき触媒入り接
着剤を塗布した基板に、めっきレジスト印刷を行い、硬
化、化学粗化、洗浄し、無電解めっき液に浸漬して導電
回路を形成し、その後半田レジストインク印刷処理を順
次行って製造している。Fully additive printed wiring boards are plated.Plating resist is printed on a substrate coated with catalyst-containing adhesive, hardened, chemically roughened, cleaned, and immersed in electroless plating solution to form a conductive circuit. Manufactured by sequential solder resist ink printing process.
発明が解決しようとする問題点
従来フルアデイティブ配線板の問題点は（１）銅ぶりの
低減
本来めっきの付着があってはならないめっきレジスト層
の表面に、めっきの際、銅粒子が析出する現象をいうも
ので、絶縁性を低下しショート発生の要因になる。Problems to be Solved by the Invention The problems with conventional fully additive wiring boards are (1) Reduction of copper tint During plating, copper particles are deposited on the surface of the plating resist layer, where no plating should originally be attached. This is a phenomenon that reduces insulation and causes short circuits.
（２）銅箔物性の向上
配線板の大型化と、搭載部品数が大幅に増加したため、
半田付は作業時に曲げ歪が生じ、導電回路が断線事故が
発生する要因になる。特に紙基材は曲り易い。(2) Improved copper foil physical properties Due to larger wiring boards and a significant increase in the number of mounted components,
Bending distortion occurs during soldering, which can lead to disconnection of conductive circuits. In particular, paper base materials are easy to bend.
、（３）接続信頼性の向上 がある。, (3) Improving connection reliability There is.
無電解めっき液としては、硫酸鋼、ホルムアルデヒド、
ＥＤＴＡ、苛性ソーダ、シアン化ソーダ等からなる液組
成が、銅ふり発生が少く、比較的安定しているが、基板
の大型化、搭載部品の増加で高い物性の銅箔が形成され
た配線板が要求されるようになった。Electroless plating solutions include sulfuric acid steel, formaldehyde,
The liquid composition consisting of EDTA, caustic soda, soda cyanide, etc. is relatively stable with little copper splatter, but as boards become larger and the number of mounted components increases, wiring boards with copper foil with high physical properties are becoming less effective. It has become required.
問題点を解決するための手段
本発明の無電解めっき液は、硫酸銅、還元剤、錯化剤、
安定剤、界面活性剤及び苛性アルカリ等からなるめっき
液に０．５〜３０ｐｐｌの五酸化ニオブを添加するもの
である。五酸化ニオブの添加０が０．５ｐｐｉ以下だと
銅物性向上に寄与せず、また３ ０ ＤＩ）１１以上だ
とめっき速度が小さくなり過ぎ高価な五酸化ニオブを添
加する価値がない。Means for Solving the Problems The electroless plating solution of the present invention contains copper sulfate, a reducing agent, a complexing agent,
0.5 to 30 ppl of niobium pentoxide is added to a plating solution consisting of a stabilizer, a surfactant, a caustic alkali, etc. If the amount of niobium pentoxide added is less than 0.5 ppi, it will not contribute to improving the physical properties of copper, and if it is more than 30 DI)11, the plating rate will be too low and it is not worth adding expensive niobium pentoxide.
実施例
（１）めっき触媒入り接着剤が表面に塗布されためつき
触媒入り紙基材フェノール樹脂積層板（日立化成工業株
式会社製ＡＣＬ−１４１）を用い、この基材にスルーボ
ール用の孔明けを行い、この孔の中にシーダー（日立化
成工業株式会社製ｌ−１８−１０１Ｂ＞を塗布し、その
後めっきレジストインク（日立化成工業株式会社製ＨＣ
ＴＭ−０１８Ｋ）をスクリーン印刷し、硬化後、クロム
硼弗化水素酸系粗化液で接着剤の表面を化学■化し、洗
浄する。Example (1) A plating catalyst-containing paper base phenolic resin laminate (ACL-141 manufactured by Hitachi Chemical Co., Ltd.) whose surface was coated with a plating catalyst-containing adhesive was used, and holes for through balls were drilled in this base material. Then, apply cedar (l-18-101B manufactured by Hitachi Chemical Co., Ltd.) into the holes, and then apply plating resist ink (HC manufactured by Hitachi Chemical Co., Ltd.).
TM-018K) is screen printed, and after curing, the surface of the adhesive is chemically roughened with a chromium borohydrofluoride roughening solution and washed.
この後、硫酸銅、ホルムアルデヒド、エチレンジアミン
四酢酸、苛性ソーダ、及びシアン化ソーダ等からなる無
電解めっき液に五酸化ニオブを２ ｐｐｍ添加し、約７
５℃で銅箔厚ざ２５μｍのスルーホール配線板を製作し
た。Thereafter, 2 ppm of niobium pentoxide was added to an electroless plating solution consisting of copper sulfate, formaldehyde, ethylenediaminetetraacetic acid, caustic soda, soda cyanide, etc.
A through-hole wiring board with a copper foil thickness of 25 μm was manufactured at 5°C.
めっき液としてはめっきの析出速度が１±０．２μｍ／
Ｈｒになるように調整した。また、ステンレス板上にめ
っきを析出させ、析出した銅箔の物性を測定した。The plating solution has a deposition rate of 1±0.2μm/
I adjusted it so that it was Hr. In addition, plating was deposited on a stainless steel plate, and the physical properties of the deposited copper foil were measured.
（２）実施例１においてめっき液に添加する五酸化ニオ
ブのωを７ ｏ＋ｏｇにし、他は同じ条件で配線板を製
作した。(2) A wiring board was manufactured under the same conditions as in Example 1 except that the ω of niobium pentoxide added to the plating solution was set to 7 o+og.
（３）比較例１として、実施例１においてめっき液に五
酸化ニオブの添加を行わず配線板を製作した。(3) As Comparative Example 1, a wiring board was manufactured in Example 1 without adding niobium pentoxide to the plating solution.
以上に記載したものの特性を表に示す。The characteristics of those described above are shown in the table.
以下余白 ※２６０℃１０秒のはんだ処理後に測定した。Margin below *Measured after soldering at 260°C for 10 seconds.
発明の効果
本発明は表から明らかなように、銅箔の物性が向上して
いるため高密度細線化配線板に部品を数多く搭載しても
はんだ処理したときゃ曲げ力が与えられても断線事故が
生じない紙基材配線板が製作できる。また、ブローホー
ルが少くなり接続信頼ヰも大幅に向トした。Effects of the Invention As is clear from the table, the present invention has improved physical properties of copper foil, so even if a large number of components are mounted on a high-density thin wiring board, there will be no disconnection accidents even when bending force is applied during soldering. It is possible to produce a paper-based wiring board that does not cause In addition, there are fewer blowholes and connection reliability has been significantly improved.
Claims (2)
及び苛性アルカリを含んだ配線板に導体回路を形成する
ための電解めつき液であって、このめっき液に五酸化ニ
オブを添加したことを特徴とする無電解めつき液。(1) An electrolytic plating solution for forming a conductor circuit on a wiring board containing a copper compound, a reducing agent, a complexing agent, a stabilizer, a surfactant, and a caustic alkali. An electroless plating solution characterized by the addition of.
請求の範囲第１項記載の無電解めつき液。(2) The electroless plating solution according to claim 1, in which 0.5 to 30 ppm of niobium pentoxide is added.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17737686A JPS6333577A (en) | 1986-07-28 | 1986-07-28 | Electroless plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17737686A JPS6333577A (en) | 1986-07-28 | 1986-07-28 | Electroless plating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6333577A true JPS6333577A (en) | 1988-02-13 |
Family
ID=16029860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17737686A Pending JPS6333577A (en) | 1986-07-28 | 1986-07-28 | Electroless plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6333577A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0293076A (en) * | 1988-09-29 | 1990-04-03 | Sanko Tokushu Kinzoku Kogyo Kk | Production of fine metal body utilized for electroless plating |
| US6299977B1 (en) | 1997-08-29 | 2001-10-09 | Teijin Limited | Non-Woven fabric and artificial leather |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60218479A (en) * | 1984-04-13 | 1985-11-01 | Hitachi Ltd | Chemical copper plating solution |
-
1986
- 1986-07-28 JP JP17737686A patent/JPS6333577A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60218479A (en) * | 1984-04-13 | 1985-11-01 | Hitachi Ltd | Chemical copper plating solution |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0293076A (en) * | 1988-09-29 | 1990-04-03 | Sanko Tokushu Kinzoku Kogyo Kk | Production of fine metal body utilized for electroless plating |
| US6299977B1 (en) | 1997-08-29 | 2001-10-09 | Teijin Limited | Non-Woven fabric and artificial leather |
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