JPH0449795B2 - - Google Patents
Info
- Publication number
- JPH0449795B2 JPH0449795B2 JP60191201A JP19120185A JPH0449795B2 JP H0449795 B2 JPH0449795 B2 JP H0449795B2 JP 60191201 A JP60191201 A JP 60191201A JP 19120185 A JP19120185 A JP 19120185A JP H0449795 B2 JPH0449795 B2 JP H0449795B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating sheet
- plating
- printed wiring
- wiring board
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 25
- 239000010410 layer Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000007772 electroless plating Methods 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- JHWIEAWILPSRMU-UHFFFAOYSA-N 2-methyl-3-pyrimidin-4-ylpropanoic acid Chemical compound OC(=O)C(C)CC1=CC=NC=N1 JHWIEAWILPSRMU-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000002941 palladium compounds Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はフレキシブルなプリント配線板の製造
方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of manufacturing a flexible printed wiring board.
（従来の技術）
従来のフレキシブルなプリント配線板は、薄い
プラスチツクフイルムを絶縁性シートとして用
い、この絶縁性シートの両面に接着剤で銅箔を貼
り合わせ、銅箔を貼り合わせた後に孔を明け、孔
内壁にめつき触媒を付着し、無電解めつき或いは
無電解めつきと電気めつきの併用による孔内壁に
めつき層を形成し、その後、銅箔をエツチング処
理して回路を形成して製造されている。(Conventional technology) Conventional flexible printed wiring boards use a thin plastic film as an insulating sheet, bond copper foil to both sides of the insulating sheet with adhesive, and punch holes after bonding the copper foil. A plating catalyst is attached to the inner wall of the hole, a plating layer is formed on the inner wall of the hole by electroless plating or a combination of electroless plating and electroplating, and then a circuit is formed by etching the copper foil. Manufactured.
（発明が解決しようとする問題点）
しかし、従来の方法では、孔内壁のめつき層を
形成するためにめつき触媒を付与しなければなら
ず、また、表面の回路形成とは別工程となつてい
るために製造工程が複雑になり信頼性が低くなり
易い欠点があつた。(Problems to be Solved by the Invention) However, in the conventional method, a plating catalyst must be applied to form a plating layer on the inner wall of the hole, and a process separate from the circuit formation on the surface is required. Because of this, the manufacturing process was complicated and reliability tended to be low.
本発明は、製造工程が簡単で信頼性の高いプリ
ント配線板の製造方法の提供を目的とするもので
ある。 An object of the present invention is to provide a method for manufacturing a printed wiring board with a simple manufacturing process and high reliability.
（問題点を解決するための手段）
本発明は、以上の目的を達成するために、絶縁
性シートに無電解めつきによる回路を形成しうる
プリント配線板の製造方法において、厚さ25μｍ
〜70μｍ範囲の絶縁性シートを用いこの絶縁性シ
ートにめつき触媒入り接着剤を塗布する工程と、
該絶縁性シートに孔を設ける工程と、該工程後に
前記絶縁性シートにめつきレジストを設ける工程
と、該工程後に無電解めつきにより前記絶縁性シ
ートの表面及び内壁に同時にめつき層を形成する
ことを特徴とするプリント配線板の製造方法を提
供するものである。(Means for Solving the Problems) In order to achieve the above objects, the present invention provides a method for manufacturing a printed wiring board in which a circuit can be formed on an insulating sheet by electroless plating.
a step of using an insulating sheet in the range of ~70 μm and applying a plating catalyst-containing adhesive to the insulating sheet;
A step of providing holes in the insulating sheet, a step of providing a plating resist on the insulating sheet after this step, and simultaneously forming a plating layer on the surface and inner wall of the insulating sheet by electroless plating after this step. The present invention provides a method for manufacturing a printed wiring board characterized by:
（作用）
本発明によれば、厚さ25μｍ〜70μｍの範囲の
絶縁性シートを用い、この絶縁性シートにめつき
触媒入り接着剤層を設けているために、シート表
面と孔内壁とに無電解めつきにより同時にめつき
層を形成でき、工程が簡単になる。(Function) According to the present invention, since an insulating sheet having a thickness in the range of 25 μm to 70 μm is used and a plating catalyst-containing adhesive layer is provided on this insulating sheet, there is no interference between the sheet surface and the inner wall of the hole. Electrolytic plating allows the formation of a plating layer at the same time, simplifying the process.
（実施例）
以下、本発明の実施例を図面に基づいて説明す
る。(Example) Hereinafter, an example of the present invention will be described based on the drawings.
先ず、絶縁性シートとして厚さ25μｍ〜70μｍ
の範囲ポリイミドフイルムやエポキシフイルム、
ポリエステルフイルム等の絶縁フイルムを用い、
この絶縁性シート１に、第１図に示す通り、パラ
ジウム化合物をめつき触媒としこれをアクリロニ
トリルブタジエンゴム、フエノール樹脂系組成物
中に含有した接着剤２を塗布する。 First, as an insulating sheet, the thickness is 25 μm to 70 μm.
A range of polyimide films and epoxy films,
Using an insulating film such as polyester film,
As shown in FIG. 1, this insulating sheet 1 is coated with an adhesive 2 containing a palladium compound as a plating catalyst in an acrylonitrile butadiene rubber and phenolic resin composition.
次に、この絶縁性シート１に、第２図に示す通
り孔３パンチやドリル等により設け、洗浄する。
洗浄後、第３図に示す通り、接着剤２表面の任意
の箇所にめつきレジスト層４をスクリーン印刷す
る。 Next, holes 3 are formed in the insulating sheet 1 by punching, drilling, etc. as shown in FIG. 2, and the holes are cleaned.
After cleaning, as shown in FIG. 3, a plating resist layer 4 is screen printed on an arbitrary location on the surface of the adhesive 2.
めつきレジスト層４印刷後、硼弗化水素酸、重
クロム酸ソーダ等からなる粗化液により、第４図
に示す通り、接着剤２表面を化学粗化する。 After printing the plating resist layer 4, the surface of the adhesive 2 is chemically roughened using a roughening liquid made of borofluoric acid, sodium dichromate, etc., as shown in FIG.
化学粗化後、硫酸銅、ホルムアルデヒド、錯化
剤、苛性ソーダ、シアン化ソーダ等からなる無電
解めつき液中に、絶縁性シート１を浸漬し、無電
解めつきにより、第５図に示す通り、表面及び孔
３内壁に同時にめつき層５を形成する。 After chemical roughening, the insulating sheet 1 is immersed in an electroless plating solution containing copper sulfate, formaldehyde, a complexing agent, caustic soda, soda cyanide, etc., and electroless plating is performed to form the sheet as shown in FIG. , a plating layer 5 is formed on the surface and the inner wall of the hole 3 at the same time.
例えば、実施例１として、
絶縁性シート：厚さ25μｍのポリイミドフイル
ム、
接着剤：めつき触媒入り接着剤（日立化成工業社
製HA−21）を厚さ20μｍに塗布
めつきレジスト層：めつきレジストインク（日立
化成工業社製HGM−02BK）を印刷、
無電解めつき：ホルムアルデヒド、錯化剤、苛性
ソーダ及びシアン化ソーダ等からなる無電解め
つき液中に35Hr浸漬し、めつき処理、絶縁性
シート及び孔内壁に厚さ35μｍのめつき層を形
成し、
プリント配線板とする。For example, as Example 1, insulating sheet: polyimide film with a thickness of 25 μm, adhesive: plating catalyst-containing adhesive (HA-21 manufactured by Hitachi Chemical Co., Ltd.) applied to a thickness of 20 μm, plating, resist layer: plating. Printed with resist ink (HGM-02BK manufactured by Hitachi Chemical Co., Ltd.), electroless plating: immersed for 35 hours in an electroless plating solution consisting of formaldehyde, complexing agent, caustic soda, soda cyanide, etc., plating processing, and insulation. A 35 μm thick plating layer is formed on the adhesive sheet and the inner walls of the holes to form a printed wiring board.
また、実施例２は、絶縁板フイルムとして厚さ
70μｍのポリイミドフイルムを用いた以外は実施
例１と同じ条件で処理し、プリント配線板を製造
する。 In addition, in Example 2, the thickness of the insulating plate film was
A printed wiring board was manufactured under the same conditions as in Example 1 except that a 70 μm polyimide film was used.
そして、これらの実施例１と２について、
MIL−1070の規定に従い衝撃テストを75回繰返
し行つたが問題はなかつた。 Regarding these Examples 1 and 2,
The impact test was repeated 75 times in accordance with the MIL-1070 regulations, but no problems were found.
なお、比較例として、厚さ100μｍのポリイミ
ドフイルムを用いた以外は実施例１と同じ条件で
処理し、プリント配線板を製造したが、孔内のめ
つき層が均一に形成されず、両面のめつき層が導
通しなかつた。 As a comparative example, a printed wiring board was manufactured under the same conditions as in Example 1 except that a polyimide film with a thickness of 100 μm was used, but the plating layer inside the holes was not formed uniformly and the The plating layer was not conductive.
（発明の効果）
以上の通り、本発明によれば、めつき触媒入り
接着剤を塗布した厚さ25μｍ〜70μｍの範囲の絶
縁性シートをフレキシブルな基板として用いるた
めに、製造工程が簡単で信頼性の高いプリント配
線板の製造方法が得られる。(Effects of the Invention) As described above, according to the present invention, since an insulating sheet coated with a plating catalyst-containing adhesive and having a thickness in the range of 25 μm to 70 μm is used as a flexible substrate, the manufacturing process is simple and reliable. A method for manufacturing a printed wiring board with high performance can be obtained.
第１図〜第５図は本発明の実施例の各製造段階
を示し、第１図は接着剤層を設けた絶縁性シート
の正面断面図、第２図は孔を明けた絶縁性シート
の正面断面図、第３図はめつきレジスト層形成後
の絶縁性シートの正面断面図、第４図は接着剤を
粗化した絶縁性シートの正面断面図、第５図は本
発明の実施例によるプリント配線板の正面断面図
を示す。
１……絶縁性シート、２……接着剤、３……
孔、４……めつきレジスト層、５……めつき層。
Figures 1 to 5 show each manufacturing stage of an embodiment of the present invention. Figure 1 is a front sectional view of an insulating sheet provided with an adhesive layer, and Figure 2 is a cross-sectional view of an insulating sheet with holes. Fig. 3 is a front sectional view of the insulating sheet after forming a plating resist layer, Fig. 4 is a front sectional view of the insulating sheet with roughened adhesive, and Fig. 5 is according to an embodiment of the present invention. A front sectional view of the printed wiring board is shown. 1... Insulating sheet, 2... Adhesive, 3...
Hole, 4...Plated resist layer, 5...Plated layer.
Claims (1)
成しうるプリント配線板の製造方法において、厚
さ25μｍ〜70μｍの範囲の絶縁性シートを用いこ
の絶縁性シートにめつき触媒入り接着剤層を設け
る工程と、該絶縁性シートに孔を設ける工程と、
該工程後に前記絶縁性シートにめつきレジストを
設ける工程と、該工程後に無電解めつきにより前
記絶縁性シートの表面及び孔内壁に同時にめつき
層を形成することを特徴とするプリント配線板の
製造方法。1. In a method for manufacturing a printed wiring board in which a circuit can be formed by electroless plating on an insulating sheet, an insulating sheet with a thickness in the range of 25 μm to 70 μm is used, and a plating catalyst-containing adhesive layer is provided on this insulating sheet. a step of providing holes in the insulating sheet;
A printed wiring board comprising a step of providing a plating resist on the insulating sheet after the step, and simultaneously forming a plating layer on the surface of the insulating sheet and the inner wall of the hole by electroless plating after the step. Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19120185A JPS6251288A (en) | 1985-08-30 | 1985-08-30 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19120185A JPS6251288A (en) | 1985-08-30 | 1985-08-30 | Manufacture of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6251288A JPS6251288A (en) | 1987-03-05 |
| JPH0449795B2 true JPH0449795B2 (en) | 1992-08-12 |
Family
ID=16270587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19120185A Granted JPS6251288A (en) | 1985-08-30 | 1985-08-30 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6251288A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009057446A1 (en) | 2007-10-30 | 2009-05-07 | Tokai Riken Co., Ltd. | Electronic key |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0760922B2 (en) * | 1988-07-15 | 1995-06-28 | 横浜ゴム株式会社 | Multi-layer film for additive method wiring board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51149564A (en) * | 1975-06-17 | 1976-12-22 | Tokyo Shibaura Electric Co | Method of manufacturing circuit substrate |
| JPS5943594A (en) * | 1982-09-03 | 1984-03-10 | 大日本印刷株式会社 | Conductive circuit sheet |
-
1985
- 1985-08-30 JP JP19120185A patent/JPS6251288A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51149564A (en) * | 1975-06-17 | 1976-12-22 | Tokyo Shibaura Electric Co | Method of manufacturing circuit substrate |
| JPS5943594A (en) * | 1982-09-03 | 1984-03-10 | 大日本印刷株式会社 | Conductive circuit sheet |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009057446A1 (en) | 2007-10-30 | 2009-05-07 | Tokai Riken Co., Ltd. | Electronic key |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6251288A (en) | 1987-03-05 |
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