JPS6332254B2 - - Google Patents

Info

Publication number
JPS6332254B2
JPS6332254B2 JP56076113A JP7611381A JPS6332254B2 JP S6332254 B2 JPS6332254 B2 JP S6332254B2 JP 56076113 A JP56076113 A JP 56076113A JP 7611381 A JP7611381 A JP 7611381A JP S6332254 B2 JPS6332254 B2 JP S6332254B2
Authority
JP
Japan
Prior art keywords
bonding
magazine
lead frame
lead frames
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56076113A
Other languages
Japanese (ja)
Other versions
JPS57192038A (en
Inventor
Yoshihiro Kazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56076113A priority Critical patent/JPS57192038A/en
Publication of JPS57192038A publication Critical patent/JPS57192038A/en
Publication of JPS6332254B2 publication Critical patent/JPS6332254B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32153—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/32175—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic
    • H01L2224/32188—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic the layer connector connecting to a bonding area protruding from the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Description

【発明の詳細な説明】 本発明はダイボンデイング又はワイヤボンデイ
ングするボンデイング装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a bonding apparatus for die bonding or wire bonding.

一般に、ダイボンデイング、ワイヤボンデイン
グ等のボンデイング作業は、リードフレームの平
面部に施される。しかるに最近、リードフレーム
の側面にボンデイングすることが行われつつあ
る。かかるリードフレームは一般に立型リードフ
レームとよばれており、この立型リードフレーム
のボンデイングにおいても、一般の平面にボンデ
イングする横型リードフレームの場合と同様に一
枚ずつボンデイング位置へ移送して位置決めし、
リードフレームの上面（側面）を検出位置によつ
て検出してダイボンデイング又はワイヤボンデイ
ングを行つている。 Generally, bonding operations such as die bonding and wire bonding are performed on a flat portion of a lead frame. However, recently, bonding to the side surface of a lead frame is being carried out. Such a lead frame is generally called a vertical lead frame, and when bonding this vertical lead frame, the lead frames are transferred one by one to the bonding position and positioned, just as in the case of horizontal lead frames that are bonded to a general flat surface. ,
Die bonding or wire bonding is performed by detecting the upper surface (side surface) of the lead frame using a detection position.

しかるに、立型リードフレームにおいては前記
の如くリードフレームの側面にボンデイングする
ので、ワイヤボンデイングはリードフレーム上の
１個のダイに対して１ワイヤ又は２ワイヤしか行
わない。またダイボンデイングはリードフレーム
上に等間隔にダイを貼付ける作業のみである。こ
のため、前記のようにリードフレームを一枚ずつ
ボンデイング位置に送つてボンデイングする方法
は、リードフレームの送り時間の占める割合が非
常に大きく生産性に劣る欠点を有する。また立型
リードフレームのボンデイングは、リードフレー
ムを縦型で位置決めして行うため、横型リードフ
レームに比べリードフレームの送りが困難である
と共に、リードフレーム自体のそり及びねじれ、
また位置決めによつて生ずるそり等の変形がボン
デイング作業上大きな問題点となつており、ボン
ダビリテイーが悪い。 However, in a vertical lead frame, since bonding is performed on the side surface of the lead frame as described above, wire bonding is performed only with one or two wires for one die on the lead frame. Furthermore, die bonding is simply a process of attaching dies at equal intervals on a lead frame. Therefore, the method of bonding by feeding the lead frames one by one to the bonding position as described above has the drawback that the time taken up by feeding the lead frames is very large and the productivity is poor. In addition, since bonding of vertical lead frames is performed by positioning the lead frame vertically, it is difficult to feed the lead frame compared to horizontal lead frames, and the lead frame itself may warp or twist.
Further, deformation such as warpage caused by positioning is a major problem in bonding work, and bondability is poor.

本発明は上記従来技術の欠点に鑑みなされたも
ので、ボンデイング時間を大幅に短縮させること
ができると共に、ボンダビリテイーを向上させる
ことができるボンデイング装置を提供することを
目的とする。 The present invention was made in view of the above-mentioned drawbacks of the prior art, and it is an object of the present invention to provide a bonding apparatus that can significantly shorten bonding time and improve bondability.

以下、本発明を図示の実施例により説明する。 Hereinafter, the present invention will be explained with reference to illustrated embodiments.

図は本発明になるボンデイング装置の一実施例
を示し、第１図は正面図、第２図は側面断面図、
第３図はワイヤボンデイング状態を示す説明図で
ある。１Ａ〜１Ｈはリードフレーム、２は複数の
リードフレーム１Ａ〜１Ｈを縦に収納するマガジ
ンで、リードフレーム１Ａ〜１Ｈをマガジン２の
収納部側壁にスプリング３で付勢するプツシヤー
４を備えている。またマガジン２には、側面にボ
ンデイング位置でマガジン２を位置決めするため
の位置決め孔２ａが設けられ、底面にマガジン２
を送るための送り孔２ｂが設けられている。５は
マガジン２を案内するマガジンガイド、６はマガ
ジン２をボンデイング位置で位置決めする位置決
めピンで、図示しない手段で駆動してマガジン２
の位置決め孔２ａに係合する。７はヒータ８を内
蔵したヒートブロツクで、リードフレーム１ａの
上端側面に当接するように図示しない手段で駆動
される。９はリードフレーム１Ａ〜１Ｈの上端部
分をヒートブロツク７に押付けるプツシヤーで、
図示しない手段で駆動される。１０はワイヤ１１
を挿通したキヤピラリ１２を先端に保持するボン
デイングアームで、図示しないXY駆動装置によ
つてXY方向に駆動される図示しないボンデイン
グヘツドに上下動可能に保持されている。１３は
リードフレーム１Ａ〜１Ｈの上端面のボンデイン
グ位置を検出する検出装置で、図示しない手段で
XY方向及び水平方向に移動させられるホルダー
１４に保持されている。 The figures show an embodiment of the bonding device according to the present invention, in which Fig. 1 is a front view, Fig. 2 is a side sectional view,
FIG. 3 is an explanatory diagram showing the wire bonding state. 1A to 1H are lead frames, and 2 is a magazine that vertically stores a plurality of lead frames 1A to 1H, and is provided with a pusher 4 that biases the lead frames 1A to 1H against the side wall of the storage section of the magazine 2 with a spring 3. Further, the magazine 2 is provided with a positioning hole 2a on the side surface for positioning the magazine 2 at the bonding position, and on the bottom surface of the magazine 2.
A feed hole 2b is provided for sending the water. 5 is a magazine guide that guides the magazine 2; 6 is a positioning pin that positions the magazine 2 at the bonding position;
It engages with the positioning hole 2a of. Reference numeral 7 denotes a heat block containing a heater 8, which is driven by means not shown so as to come into contact with the upper side surface of the lead frame 1a. 9 is a pusher that presses the upper end portions of lead frames 1A to 1H against heat block 7;
It is driven by means not shown. 10 is wire 11
This is a bonding arm that holds a capillary 12 inserted through the capillary 12 at its tip, and is held movably up and down by a bonding head (not shown) driven in the XY directions by an XY drive device (not shown). Reference numeral 13 denotes a detection device for detecting the bonding position on the upper end surface of the lead frames 1A to 1H by means not shown.
It is held in a holder 14 that can be moved in the XY direction and horizontal direction.

次にかかる構成よりなる本装置の動作について
説明する。複数枚のリードフレーム１Ａ〜１Ｈを
収納したマガジン２を送り孔２ｂに図示しない送
り爪が係合してマガジン２がマガジンガイド５に
案内されて矢印Ａ方向に送られ、第１番目のリー
ド１a1〜１h1がボンデイング位置に位置すると、
位置決めピン６が矢印Ｂ方向に移動して位置決め
孔２ａに挿入され、マガジン２は位置決めされ
る。次にヒートブロツク７が矢印Ｃ方向に移動し
てリードフレーム１Ａの側面に当接する。その
後、又はヒートブロツク７がリードフレーム１Ａ
に当接する直前にプツシヤー９が矢印Ｄ方向に移
動してリードフレーム１Ａ〜１Ｈをヒートブロツ
ク７に圧接させる。これによりボンデイングする
部分をボンデイング可能温度、例えば280〜350℃
に加熱する。 Next, the operation of this device having such a configuration will be explained. A feed pawl (not shown) engages the magazine 2 containing a plurality of lead frames 1A to 1H with the feed hole 2b, and the magazine 2 is guided by the magazine guide 5 and sent in the direction of arrow A, leading to the first lead 1a. 1 ~ 1h When 1 is located at the bonding position,
The positioning pin 6 moves in the direction of arrow B and is inserted into the positioning hole 2a, and the magazine 2 is positioned. Next, the heat block 7 moves in the direction of arrow C and comes into contact with the side surface of the lead frame 1A. After that, the heat block 7 is connected to the lead frame 1A.
Immediately before the pusher 9 comes into contact with the heat block 7, the pusher 9 moves in the direction of arrow D to press the lead frames 1A to 1H against the heat block 7. This allows the part to be bonded to reach the bonding temperature, e.g. 280 to 350℃.
Heat to.

続いて検出装置１３がXY方向に移動して位置
決めされているリードフレーム１Ａ〜１Ｈの上端
面の第１番目のリード１a1〜１h1から第６番目の
リード１a6〜１h6を走査してボンデイング位置を
検出する。この検出信号はボンデイングアーム１
０を駆動するXY駆動装置に送られ、これにより
キヤピラリ１２がXY方向及び上下方向に移動し
てボンデイングを行い、順次第１番目のリード１
a1〜１h1と第２番目のリード１a2〜１h2にワイヤ
１１a1〜１１h1を、第３番目のリード１a3〜１h3
と第４番目のリード１a4〜１h4にワイヤ１１a2〜
１１h2を、第５番目のリード１a5〜１h5と第６番
目のリード１a6〜１h6にワイヤ１１a3〜１１h3を
接続する。 Next, the detection device 13 moves in the XY direction and scans the first leads 1a 1 to 1h 1 to the sixth leads 1a 6 to 1h 6 on the upper end surfaces of the positioned lead frames 1A to 1H. Detect bonding position. This detection signal is the bonding arm 1
The capillary 12 moves in the XY direction and the vertical direction to perform bonding, and the first lead 1 is
Wires 11a 1 to 11h 1 are connected to a 1 to 1h 1 and the second leads 1a 2 to 1h 2 , and wires 11a 1 to 11h 1 are connected to the third leads 1a 3 to 1h 3.
and wires 11a 2 to 4th leads 1a 4 to 1h 4
Wires 11a 3 to 11h 3 are connected to the fifth leads 1a 5 to 1h 5 and the sixth leads 1a 6 to 1h 6 .

次に位置決めピン６、ヒートブロツク７、プツ
シヤー９が後退し、再び送り孔２ｂに送り爪が係
合してリードフレームの３ピツチ分（3P）マガ
ジン２を送り、第７番目のリード１a7〜１h7をボ
ンデイング位置に送る。そして、前記したように
位置決めピン６、ヒートブロツク７、プツシヤー
９が再び前進してマガジン２の位置決め及び次に
ボンデイングされる部分の加熱を行い、前記のよ
うにして第７番目から第12番目までのリードにボ
ンデイングされる。このようにして全てのリード
フレーム１Ａ〜１Ｈのボンデイングが終了する
と、マガジン２は矢印Ａ方向に送られてボンデイ
ング位置より排出される。 Next, the positioning pin 6, heat block 7, and pusher 9 move back, and the feed pawl engages with the feed hole 2b again to feed the magazine 2 by 3 pitches (3P) of the lead frame, and the seventh lead 1a 7 - Send 1h 7 to bonding position. Then, as described above, the positioning pin 6, heat block 7, and pusher 9 advance again to position the magazine 2 and heat the part to be bonded next. bonded to the lead. When bonding of all the lead frames 1A to 1H is completed in this manner, the magazine 2 is sent in the direction of arrow A and is ejected from the bonding position.

このように、複数枚のリードフレーム１Ａ〜１
Ｈはマガジン２に収納された状態でボンデイング
部に送られて一度にボンデイングされるので、従
来のようにリードフレームを１枚ずつ送つてボン
デイングするものに比べ、ボンデイング時間は著
しく短縮される。また複数枚束ねた状態でボンデ
イングするので、リードフレーム自体の変形は修
正され、ボンダビリテイーが向上する。 In this way, a plurality of lead frames 1A to 1
Since the leads stored in the magazine 2 are sent to the bonding section and bonded all at once, the bonding time is significantly shortened compared to the conventional method in which lead frames are sent one by one for bonding. Furthermore, since bonding is performed with a plurality of lead frames bundled together, deformation of the lead frame itself is corrected and bondability is improved.

なお、上記実施例においては、ワイヤボンデイ
ングの場合について説明したが、ダイボンデイン
グについても適用できる。この場合は、キヤピラ
リ２に代えてダイを吸着するコレツトを用いる。
また上記実施例においては、３ピツチ分を一度に
ボンデイングしたが、これに限られるものではな
く、例えば１ピツチ送る毎にボンデイングするよ
うにしてもよい。また作業能率上からは10ピツチ
程度を一度にボンデイングし、その後10ピツチ分
送つて次のボンデイングをするようにするのが好
ましい。またヒートブロツク７は移動させたが、
移動させなくてもよい。 In addition, although the case of wire bonding was explained in the said Example, it can also be applied to die bonding. In this case, instead of the capillary 2, a collet for adsorbing the die is used.
Further, in the above embodiment, three pitches are bonded at one time, but the present invention is not limited to this, and for example, bonding may be performed every time one pitch is fed. Also, from the viewpoint of work efficiency, it is preferable to bond about 10 pitches at a time, and then send 10 pitches before bonding the next one. Also, heat block 7 was moved,
There is no need to move it.

以上の説明から明らかな如く、本発明になるボ
ンデイング装置によれば、ボンデイング時間が著
しく短縮されると共に、ボンダビリテイーが向上
する。 As is clear from the above description, according to the bonding apparatus of the present invention, bonding time is significantly shortened and bondability is improved.

【図面の簡単な説明】[Brief explanation of the drawing]

図は本発明になるボンデイング装置の一実施例
を示し、第１図は正面図、第２図は側面断面図、
第３図はワイヤボンデイング状態を示す説明図で
ある。 １Ａ〜１Ｈ……リードフレーム、２……マガジ
ン、５……マガジンガイド、６……位置決めピ
ン、１２……キヤピラリ。 The figures show an embodiment of the bonding device according to the present invention, in which Fig. 1 is a front view, Fig. 2 is a side sectional view,
FIG. 3 is an explanatory diagram showing the wire bonding state. 1A to 1H...Lead frame, 2...Magazine, 5...Magazine guide, 6...Positioning pin, 12...Capillary.

Claims (1)

【特許請求の範囲】[Claims] １ ボンデイング面を上方にして複数枚の立型リ
ードフレームを束ねた状態で収納したマガジン
と、このマガジンをボンデイング位置へ案内する
マガジンガイドと、前記マガジンをボンデイング
位置で位置決めする位置決め手段と、前記マガジ
ンに収納された複数枚の立型リードフレームの上
面にボンデイングを施すボンデイング手段とから
なるボンデイング装置。1. A magazine in which a plurality of vertical lead frames are stored in a bundle with the bonding surface facing upward; a magazine guide for guiding the magazine to the bonding position; a positioning means for positioning the magazine at the bonding position; and the magazine. A bonding device comprising a bonding means for bonding the upper surfaces of a plurality of vertical lead frames housed in a.
JP56076113A 1981-05-20 1981-05-20 Bonding device Granted JPS57192038A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56076113A JPS57192038A (en) 1981-05-20 1981-05-20 Bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56076113A JPS57192038A (en) 1981-05-20 1981-05-20 Bonding device

Publications (2)

Publication Number Publication Date
JPS57192038A JPS57192038A (en) 1982-11-26
JPS6332254B2 true JPS6332254B2 (en) 1988-06-29

Family

ID=13595837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56076113A Granted JPS57192038A (en) 1981-05-20 1981-05-20 Bonding device

Country Status (1)

Country Link
JP (1) JPS57192038A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01148912U (en) * 1988-04-05 1989-10-16

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01148912U (en) * 1988-04-05 1989-10-16

Also Published As

Publication number Publication date
JPS57192038A (en) 1982-11-26

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