JPS63314908A - Surface acoustic wave device - Google Patents
Surface acoustic wave deviceInfo
- Publication number
- JPS63314908A JPS63314908A JP15187687A JP15187687A JPS63314908A JP S63314908 A JPS63314908 A JP S63314908A JP 15187687 A JP15187687 A JP 15187687A JP 15187687 A JP15187687 A JP 15187687A JP S63314908 A JPS63314908 A JP S63314908A
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- surface acoustic
- wave element
- plate piece
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 11
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 11
- 230000006641 stabilisation Effects 0.000 abstract description 2
- 238000011105 stabilization Methods 0.000 abstract description 2
- 239000007767 bonding agent Substances 0.000 abstract 2
- 238000007789 sealing Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 230000035882 stress Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電気回路においてフィルタや発振子として機
能する表面弾性波装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a surface acoustic wave device that functions as a filter or an oscillator in an electric circuit.
従来の技術
従来、この種の表面弾性波装置は、第３図に示すような
構成であった。第３図において、１は金属ベース、２は
接着剤、３は圧電基板３乙の一主面に所望の電極パター
ン（図示せず）を形成してなる表面弾性波素子、４はボ
ンディングワイヤ、５は外部リード端子、６はキャップ
である。そして、金属ベース１上に接着剤２を塗布し、
この上に弾性表面波素子３を接着固定し、ワイヤボンデ
ィング４により外部リード端子５と電気的に接続するも
のであった。また、接着剤２には通常、エポキシ系ある
いはシリコーン系等の樹脂が用いられ、加熱硬化するも
のであった。2. Description of the Related Art Conventionally, this type of surface acoustic wave device has had a configuration as shown in FIG. In FIG. 3, 1 is a metal base, 2 is an adhesive, 3 is a surface acoustic wave element formed by forming a desired electrode pattern (not shown) on one main surface of a piezoelectric substrate 3B, 4 is a bonding wire, 5 is an external lead terminal, and 6 is a cap. Then, apply adhesive 2 on metal base 1,
A surface acoustic wave element 3 was adhesively fixed thereon and electrically connected to an external lead terminal 5 by wire bonding 4. Further, the adhesive 2 is usually made of epoxy resin, silicone resin, or the like, and is cured by heating.
発明が解決しようとする問題点
このような従来の構成では、表面弾性波素子を金属ベー
ス上に接着剤を用いて加熱硬化させ、：接着固定する際
、金属ベース、接着剤用樹脂、圧’１’ＪＬ基板材料の
熱膨張係数の違いにより、圧′Ｅ基板が応力を受は変形
し、第４図のように反シかえったり、圧電基板に圧縮及
び引張り応力が残留するという問題があった。このよう
に圧電基板がひずみを受け、たとえば電極を設けた面側
か伸びるように反ると表面弾性波装置の中心周波数が低
下し、所望の特性が得られないという問題があった。ま
た、残留した応力が徐々に緩和されることによシ。Problems to be Solved by the Invention In such a conventional configuration, a surface acoustic wave element is heated and cured using an adhesive on a metal base. Due to the difference in thermal expansion coefficient of the 1'JL substrate materials, there are problems in that the piezoelectric substrate is deformed when subjected to stress, causing it to buckle as shown in Figure 4, and compressive and tensile stresses remain in the piezoelectric substrate. Ta. If the piezoelectric substrate is subjected to strain in this manner, for example, if the surface on which the electrodes are provided is warped, the center frequency of the surface acoustic wave device will be lowered, and there is a problem in that desired characteristics cannot be obtained. Also, the residual stress is gradually relieved.
表面弾性波装置の中心周波数が徐々に変化し、中心周波
数の長期安定化を妨げる要因になっていた。The center frequency of surface acoustic wave devices gradually changes, which is a factor that prevents long-term stabilization of the center frequency.
本発明はこのような問題を解決するもので、中心周波数
の経時変化が少ない、高精度の表面弾性波装置を提供す
ることを目的とするものである。The present invention solves these problems, and aims to provide a high-precision surface acoustic wave device in which the center frequency changes little over time.
問題点を解決するための手段
この問題点を解決するために本発明は、金属ペース上に
表面弾性波素子と同じかほぼ熱膨張率を有する板片を接
着固定し、さらに接着固定された前記板片上に前記表面
波素子を接着固定するようにしたものである。Means for Solving the Problem In order to solve this problem, the present invention adhesively fixes a plate piece having the same or almost the same coefficient of thermal expansion as the surface acoustic wave element on a metal paste, and furthermore, The surface wave element is adhesively fixed onto the plate piece.
作用
この構成によれば、金属ベースと表面弾性波素子の間に
、表面弾性波素子と同じかほぼ同じ熱膨張係数を有する
板片を介在させることにより、熱膨張係数の差により生
ずる弾性表面波素子のひずみが軽減されることになシ、
弾性表面波装置の高精度化及び長期安定化が図れること
となる。According to this configuration, by interposing a plate piece having the same or almost the same coefficient of thermal expansion as the surface acoustic wave element between the metal base and the surface acoustic wave element, the surface acoustic wave generated due to the difference in the coefficient of thermal expansion is This will reduce the strain on the element.
High precision and long-term stability of the surface acoustic wave device can be achieved.
実施例
本発明の一実施例を図面を用いて詳細に説明する。第１
図において、１１は金属ペース、１２は接着剤、１３は
圧電基板１３＆の一主面に所望の電極パターン（図示せ
ず）を形成してなる表面弾性波素子、１４は表面弾性波
素子１３を構成する圧電基板１３１Ｌと同一材料よりな
る板片、１５はボンディングワイヤ、１６は外部リード
端子、１７はキャップである。まず初めに、板片１４を
金属ベース１１上に接着剤１２によシ接着固定し、さら
にその上に表面弾性波素子１３を接着剤１２によシ接着
固定し、ボンディングワイヤ１５で外部リード端子１６
と電気的接続をとり、キャップ１７で気密封止をした構
成になっている。ここで、接着剤１２にはシリコーン系
樹脂を用い、できるだけ薄く塗布することによシ、表面
弾性波素子１３と樹脂との熱膨張係数の差の影響を小さ
くする。Embodiment An embodiment of the present invention will be described in detail with reference to the drawings. 1st
In the figure, 11 is a metal paste, 12 is an adhesive, 13 is a surface acoustic wave element formed by forming a desired electrode pattern (not shown) on one main surface of a piezoelectric substrate 13, and 14 is a surface acoustic wave element 13. A plate piece made of the same material as the piezoelectric substrate 131L, 15 is a bonding wire, 16 is an external lead terminal, and 17 is a cap. First, the plate piece 14 is adhesively fixed on the metal base 11 with the adhesive 12, and the surface acoustic wave element 13 is further adhesively fixed on the metal base 11 with the adhesive 12, and the external lead terminal is connected with the bonding wire 15. 16
The structure is such that an electrical connection is made with the cap 17 and hermetically sealed with a cap 17. Here, silicone resin is used as the adhesive 12, and by applying it as thinly as possible, the influence of the difference in thermal expansion coefficient between the surface acoustic wave element 13 and the resin is reduced.
また、板片１４は表面弾性波素子１３を構成する圧電基
板１３＆と同一材料でかつ同一板厚とし、熱膨張係数を
完全に一致させることによって、熱膨張係数の差による
影響を小さくしている。また、この場合は板片１４と圧
電基板１３＆を同一寸法形状で構成できることから、部
品の管理・調達が容易で自動組立上も有利である利点を
もっている。Further, the plate piece 14 is made of the same material and the same thickness as the piezoelectric substrate 13 & constituting the surface acoustic wave element 13, and by completely matching the coefficient of thermal expansion, the influence of the difference in the coefficient of thermal expansion is reduced. . Further, in this case, since the plate piece 14 and the piezoelectric substrate 13& can be constructed with the same size and shape, it has the advantage that management and procurement of parts is easy and automatic assembly is also advantageous.
第２図に、本実施例により作成した２ポ一ト型表面弾性
波発振子のエージング特性を、従来例と比較して示す。FIG. 2 shows the aging characteristics of the two-point surface acoustic wave oscillator produced according to this example in comparison with a conventional example.
第２図かられかるように本発明のものは中心周波数の低
下が従来例に比べて大幅に抑えられている。As can be seen from FIG. 2, in the case of the present invention, the decrease in the center frequency is significantly suppressed compared to the conventional example.
なお、前記一実施例においては、板片１４は表面弾性波
素子１３を構成する圧電基板１３ａと同一材料でかつ同
一板厚のものとしたが、これは同一材料でもって板厚は
少し異なるものとしてもよく、さらには圧電基板１３ａ
とほぼ同じ熱膨張率を有するものであれば、圧電基板１
３ａと同一材料でなくともよいものである。しかし、板
片１４を圧電基板１３λと同一材料でかつ同一板厚とす
る構成が最も好ましいのはもちろんである。In the above embodiment, the plate piece 14 is made of the same material and has the same thickness as the piezoelectric substrate 13a constituting the surface acoustic wave element 13, but this may be made of the same material but with a slightly different thickness. Furthermore, the piezoelectric substrate 13a
If the piezoelectric substrate 1 has approximately the same coefficient of thermal expansion as
It does not have to be made of the same material as 3a. However, it is of course most preferable that the plate piece 14 is made of the same material and has the same thickness as the piezoelectric substrate 13λ.
また、一実施例において、板片１４と表面弾性波素子１
３との接着にシリコーン系の樹脂を用いたが、これはエ
ポキシ系、さらにはポリイミド系、アクリル系の樹脂を
用いても同様な効果が得られる。さらに、接着の面積を
一実施例においては表面弾性波素子１３のチップ全面と
しているが、接着部分を表面弾性波素子１３のチップの
中央部のみとすれば、さらに熱膨張係数の差による影響
が抑えられることになる。Further, in one embodiment, the plate piece 14 and the surface acoustic wave element 1
Although a silicone-based resin was used for adhesion with No. 3, the same effect can be obtained by using an epoxy-based resin, polyimide-based resin, or acrylic-based resin. Furthermore, in one embodiment, the adhesive area covers the entire surface of the chip of the surface acoustic wave element 13, but if the adhesive area is only the central part of the chip of the surface acoustic wave element 13, the influence of the difference in thermal expansion coefficients can be further reduced. It will be suppressed.
発明の効果
以上のように本発明によれば、表面弾性波素子の変形が
抑えられ、中心周波数の変化が小さくな）、歩留シが向
上するという効果が得られる。また、中心周波数の経時
変化が非常に小さくなり、表面弾性波装置の長期安定性
が飛躍的に向上するという効果が得られる。Effects of the Invention As described above, according to the present invention, the deformation of the surface acoustic wave element is suppressed, the change in the center frequency is small), and the yield is improved. Further, the change in the center frequency over time becomes extremely small, and the long-term stability of the surface acoustic wave device is dramatically improved.
第１図は本発明の一実施例による表面弾性波装置を示す
構成図、第２図は本発明の一実施例により作成した２ポ
一ト型表面弾性波発振子の中心周波数のエージング特性
を従来例と比較して示す図。
第３図は従来の表面弾性波装置を示す構成図、第４図は
同従来例において応力を受けて表面弾性波素子が変形す
る様子を示した模式図である。
１１・・・・・・金属ベース、１２・・・・・・接着剤
、１３・・・・・・表面弾性波素子、１３１Ｌ・・・・
・・圧電基板、１４・・・・・・表面弾性波素子を構成
する圧電基板と同一材料よシなる板片、１６・・・・・
・ボンディングワイヤ、１６・・・・・・外部リード端
子、１７・・・・・・キャップ。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名１１
−一生属へ−ス
ｔＺ−４妾着を１
１３−−−ヨン；ヒニＩｉ［！醐ＩＬ ／ｌ’ｉ二：ｉ
素モヨチー１３Ｌ・−斥健基板Fig. 1 is a block diagram showing a surface acoustic wave device according to an embodiment of the present invention, and Fig. 2 shows the aging characteristics of the center frequency of a two-point surface acoustic wave oscillator produced according to an embodiment of the present invention. The figure shown in comparison with a conventional example. FIG. 3 is a configuration diagram showing a conventional surface acoustic wave device, and FIG. 4 is a schematic diagram showing how a surface acoustic wave element deforms under stress in the conventional example. 11...Metal base, 12...Adhesive, 13...Surface acoustic wave element, 131L...
...Piezoelectric substrate, 14...Plate piece made of the same material as the piezoelectric substrate constituting the surface acoustic wave element, 16...
・Bonding wire, 16... External lead terminal, 17... Cap. Name of agent: Patent attorney Toshio Nakao and 1 other person11
-To Issei Genus-stZ-4 Mistress 1 13--Yon; Hini Ii [!鐐IL /l'i２：i
Moyochi 13L - Hoken board
Claims (3)
た表面弾性波素子と、前記表面弾性波素子と同じかほぼ
同じ熱膨張率を有する板片と、金属ベースとからなり、
前記板片を前記金属ベース上に接着固定し、さらに接着
固定された前記板片上に前記表面弾性波素子をその裏面
の一部または全部に接着剤を塗布し接着固定してなる表
面弾性波装置。(1) Consisting of a surface acoustic wave element having a desired electrode pattern formed on one main surface of a piezoelectric substrate, a plate piece having the same or almost the same coefficient of thermal expansion as the surface acoustic wave element, and a metal base,
A surface acoustic wave device in which the plate piece is adhesively fixed on the metal base, and the surface acoustic wave element is adhesively fixed on the adhesively fixed plate piece by applying an adhesive to a part or all of the back surface thereof. .
第１項に記載の表面弾性波装置。(2) The surface acoustic wave device according to claim 1, wherein the plate piece is made of the same material as the piezoelectric substrate.
特許請求の範囲第１項に記載の表面弾性波装置。(3) The surface acoustic wave device according to claim 1, wherein the plate piece and the piezoelectric substrate are made of the same material and have the same plate thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15187687A JPS63314908A (en) | 1987-06-18 | 1987-06-18 | Surface acoustic wave device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15187687A JPS63314908A (en) | 1987-06-18 | 1987-06-18 | Surface acoustic wave device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63314908A true JPS63314908A (en) | 1988-12-22 |
Family
ID=15528137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15187687A Pending JPS63314908A (en) | 1987-06-18 | 1987-06-18 | Surface acoustic wave device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63314908A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6441515A (en) * | 1987-08-07 | 1989-02-13 | Nec Corp | Surface acoustic wave device |
| US5343175A (en) * | 1993-09-07 | 1994-08-30 | Motorola, Inc. | Mechanically tuned SAW device and method of tuning same |
-
1987
- 1987-06-18 JP JP15187687A patent/JPS63314908A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6441515A (en) * | 1987-08-07 | 1989-02-13 | Nec Corp | Surface acoustic wave device |
| US5343175A (en) * | 1993-09-07 | 1994-08-30 | Motorola, Inc. | Mechanically tuned SAW device and method of tuning same |
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