JP2000216660A - Mount structure for element device and its manufacture - Google Patents
Mount structure for element device and its manufactureInfo
- Publication number
- JP2000216660A JP2000216660A JP11011892A JP1189299A JP2000216660A JP 2000216660 A JP2000216660 A JP 2000216660A JP 11011892 A JP11011892 A JP 11011892A JP 1189299 A JP1189299 A JP 1189299A JP 2000216660 A JP2000216660 A JP 2000216660A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- resin member
- electrode pad
- frame
- shaped resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、弾性表面波フィル
タなどとして用いる表面弾性波デバイスあるいは高周波
デバイスなどの素子デバイスに属し、特に、フェイスダ
ウンボンディングにより回路基板に実装される形式の素
子の実装構造、およびその製造方法に属する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an element device such as a surface acoustic wave device or a high-frequency device used as a surface acoustic wave filter or the like, and more particularly to an element mounting structure of a type mounted on a circuit board by face-down bonding. , And its manufacturing method.
【０００２】[0002]
【従来の技術】従来技術１として、表面弾性波デバイス
あるいは高周波デバイスは、図１１に示すように、表面
弾性波素子１０１が蓋１１１と回路基板１１５とで構成
された空間１１７に収容している。素子１０１の一面に
は、複数の電極１０２が形成されている。複数の電極１
０２のそれぞれには電極パッド１０３が設けられてい
る。回路基板１１５は凹形形状を呈している。回路基板
１１５の内底面には図示しない回路が形成されている。
この回路基板１１５の回路には複数の電極パッド１１６
が設けられている。2. Description of the Related Art As a prior art 1, a surface acoustic wave device or a high-frequency device has a surface acoustic wave element 101 housed in a space 117 formed by a lid 111 and a circuit board 115 as shown in FIG. . A plurality of electrodes 102 are formed on one surface of the element 101. Multiple electrodes 1
02 is provided with an electrode pad 103. The circuit board 115 has a concave shape. A circuit (not shown) is formed on the inner bottom surface of the circuit board 115.
The circuit on the circuit board 115 includes a plurality of electrode pads 116.
Is provided.
【０００３】素子１０１の電極パッド１０３と回路基板
１１５の電極パッド１１６とは、互いに金属バンプ１１
４によって接続されている。素子１１１と基板１１５は
金属バンプ１１４のみで接続している。The electrode pads 103 of the element 101 and the electrode pads 116 of the circuit board 115 are
4. The element 111 and the substrate 115 are connected only by the metal bump 114.
【０００４】凹形形状の回路基板１１５には、上面に蓋
１１１を被せることによって、空間１１７に素子１０１
を気密化した状態で収容している。気密構造は、蓋１１
１を実装後に個々に回路基板１１５に溶接することによ
ってなされている。The circuit board 115 having a concave shape is provided with a lid 111 on the upper surface thereof, so that the element 101 is placed in the space 117.
Is housed in an airtight state. The airtight structure is the lid 11
1 are individually welded to the circuit board 115 after mounting.
【０００５】図１２は、従来技術２としての表面弾性波
デバイスを示している。なお、図１１に示した従来技術
１の表面弾性波デバイスと、同じ要素部分については、
同じ符号を付して以下の説明をする。FIG. 12 shows a surface acoustic wave device as prior art 2. In addition, about the same element part as the surface acoustic wave device of the prior art 1 shown in FIG.
The following description is given with the same reference numerals.
【０００６】図１２を参照して、従来技術２における表
面弾性波デバイスは、素子１１１と板形状でなる回路基
板１１５との間に枠状樹脂部材１１８が介在されてい
る。素子１１１および回路基板１１５は枠状樹脂部材１
１８によって、空間１１７をもって、素子１０１の電極
パッド１０３と回路基板１１５の電極パッド１１６とが
互いに金属バンプ１１４によって接続されている。Referring to FIG. 12, in a surface acoustic wave device according to prior art 2, a frame-shaped resin member 118 is interposed between an element 111 and a plate-shaped circuit board 115. The element 111 and the circuit board 115 are
The electrode pad 103 of the element 101 and the electrode pad 116 of the circuit board 115 are connected to each other by a metal bump 114 with a space 117 by the space 18.
【０００７】この従来技術の表面弾性波デバイスにおい
ても、従来技術１と同様に、枠状樹脂１１８にて実装と
同時に気密構造を実現している（特開平８−３１６７７
８号公報を参照）。[0007] In this surface acoustic wave device of the prior art, similarly to the prior art 1, an airtight structure is realized at the same time as mounting with the frame-shaped resin 118 (Japanese Patent Laid-Open No. 8-31677).
No. 8).
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、従来技
術１における表面弾性波デバイスでは、回路基板１１５
が凹形状であることから、廉価に製作することができ
ず、また、凹形の回路阿基板１１５の中に素子１０１を
搭載するため、回路基板１１５の壁面および素子１０１
間に一定の距離が必要となり小形化することが制約され
てしまう。However, in the surface acoustic wave device according to the prior art 1, the circuit board 115 is not used.
Cannot be manufactured at low cost because of the concave shape, and since the element 101 is mounted in the concave circuit board 115, the wall surface of the circuit board 115 and the element 101
A certain distance is required between them, and miniaturization is restricted.
【０００９】また、従来技術２における表面弾性波デバ
イスでは、枠状樹脂部材８にて実装と同時に気密構造を
実現する構造であるが、枠状樹脂部材１１８のみでは密
着性が不足し、気密が確立されなく、熱圧着に時間がか
かるため生産性が悪いという問題があった。The surface acoustic wave device according to the prior art 2 has a structure that realizes an airtight structure simultaneously with mounting on the frame-shaped resin member 8, but the frame-shaped resin member 118 alone has insufficient adhesion and airtightness. There is a problem that productivity is poor because it is not established and it takes time for thermocompression bonding.
【００１０】それ故に、本発明の課題は、金属バンプの
応力緩和が可能であり、強度向上による性能安定が見込
まれ、さらに、樹脂材料の流れ込みを防止し、製造工法
上の安定度高い素子デバイスの実装構造、およびその製
造方法を提供することにある。[0010] Therefore, an object of the present invention is to reduce the stress of metal bumps, to improve the strength, and to expect the performance to be stable, to prevent the inflow of resin material, and to obtain an element device with high stability in the manufacturing method. And a method of manufacturing the same.
【００１１】[0011]
【課題を解決するための手段】本発明によれば、素子
と、該素子を搭載した回路基板と、前記素子および前記
回路基板間に空間を作るように介在した枠状樹脂部材
と、前記素子に設けた電極パッドと、前記回路基板に設
けた電極パッドと、前記素子の電極パッドおよび前記回
路基板の電極パッドとを相互に接続した金属バンプと、
前記素子に設けられかつ前記空間に位置した機能回路と
を含む素子デバイスの実装構造において、前記枠状樹脂
部材の外側に追加樹脂部材が設けられていることを特徴
とする素子デバイスの実装構造が得られる。According to the present invention, an element, a circuit board on which the element is mounted, a frame-shaped resin member interposed so as to form a space between the element and the circuit board, and And an electrode pad provided on the circuit board, a metal bump interconnecting the electrode pad of the element and the electrode pad of the circuit board,
In the mounting structure of an element device including the functional circuit provided in the element and located in the space, an additional resin member is provided outside the frame-shaped resin member. can get.
【００１２】また、本発明によれば、素子と、該素子を
搭載する回路基板と、前記素子および前記回路基板間に
空間を作るように介在される枠状樹脂部材と、前記素子
に設ける電極パッドと、前記回路基板に設ける電極パッ
ドと、前記素子の電極パッドおよび前記回路基板の電極
パッドとを相互に接続する金属バンプと、前記素子に設
けかつ前記空間に位置させる機能回路とを含み、前記回
路基板上に前記空間を保持するために前記枠状樹脂部材
を複数個設け、前記金属バンプを設けた前記素子を前記
回路基板の電極パッドへ搭載し、この際に、前記枠状樹
脂部材の接続及び前記金属バンプの接続を同時に行い、
一括して前記枠状樹脂部材の外側に前記追加樹脂部材を
設けた後、個々に分割して複数の前記素子を得ることを
特徴とする素子デバイスの製造方法が得られる。Further, according to the present invention, an element, a circuit board on which the element is mounted, a frame-shaped resin member interposed so as to form a space between the element and the circuit board, and an electrode provided on the element A pad, an electrode pad provided on the circuit board, a metal bump interconnecting the electrode pad of the element and the electrode pad of the circuit board, and a functional circuit provided on the element and located in the space, A plurality of the frame-shaped resin members are provided on the circuit board to hold the space, and the element provided with the metal bump is mounted on an electrode pad of the circuit board. And connection of the metal bumps simultaneously,
A method for manufacturing an element device is provided, wherein the additional resin member is provided outside the frame-shaped resin member at a time, and then the plurality of elements are obtained by dividing the additional resin member.
【００１３】[0013]
【作用】本発明では、回路基板と素子との接続、及び枠
状樹脂部材、追加樹脂部材の塗布を複数個一括して行
い、個片に切断する。また、金属バンプを外側に配置す
ることにより金属バンプの応力緩和が可能であり、強度
向上による性能の安定を図る。According to the present invention, the connection between the circuit board and the element and the application of the frame-shaped resin member and the additional resin member are collectively performed and cut into individual pieces. In addition, by arranging the metal bumps on the outside, the stress of the metal bumps can be relaxed, and the performance can be stabilized by improving the strength.
【００１４】さらに、枠状樹脂部材と追加樹脂部材にて
気密性を高め、頼性が高く、追加樹脂部材が枠状樹脂部
材の内側の空間への流れ込み防止する。Further, the airtightness is enhanced by the frame-shaped resin member and the additional resin member, the reliability is high, and the additional resin member is prevented from flowing into the space inside the frame-shaped resin member.
【００１５】[0015]
【発明の実施の形態】以下に、図面を参照して、本発明
の素子デバイスの実装構造における一実施の形態を説明
する。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a mounting structure of an element device according to the present invention.
【００１６】図１は，本発明のフェイスダウンボンディ
ングにより回路基板に実装される形式の素子デバイスの
実装構造における第１の実施の形態例を示している。な
お、素子デバイスは表面弾性波デバイスもしくは高周波
デバイスに採用されるものであるが、この実施の形態で
は、表面弾性波デバイスを代表例として以下に説明す
る。FIG. 1 shows a first embodiment of a mounting structure of an element device of the present invention which is mounted on a circuit board by face-down bonding. The element device is employed for a surface acoustic wave device or a high-frequency device. In this embodiment, a surface acoustic wave device will be described below as a representative example.
【００１７】図１を参照して、この実施の形態例におけ
る表面弾性波デバイスは、表面弾性波素子（以下、「素
子」と呼ぶ）１と、この素子１を搭載した回路基板５
と、素子１および回路基板５間に介在した枠状樹脂部材
８と、枠状樹脂部材８の回りに充填した追加樹脂部材９
とを備えている。Referring to FIG. 1, a surface acoustic wave device according to this embodiment includes a surface acoustic wave element (hereinafter, referred to as an “element”) 1 and a circuit board 5 on which the element 1 is mounted.
And a frame-shaped resin member 8 interposed between the element 1 and the circuit board 5, and an additional resin member 9 filled around the frame-shaped resin member 8.
And
【００１８】素子１の一面には複数の電極２が形成され
ている。複数の電極２のそれぞれには電極パッド３が設
けられている。電極パッド３の間には機能回路１１が設
けられている。機能回路１１は素子１の一面に形成され
ている。また、回路基板５の一面には図示しない回路が
形成されており、回路が電極パッド６に接続されてい
る。素子１の電極パッド３と回路基板５の電極パッド６
とは、互いに金属バンプ（金バンプ）４によって接続さ
れている。A plurality of electrodes 2 are formed on one surface of the element 1. Each of the plurality of electrodes 2 is provided with an electrode pad 3. A functional circuit 11 is provided between the electrode pads 3. The functional circuit 11 is formed on one surface of the element 1. A circuit (not shown) is formed on one surface of the circuit board 5, and the circuit is connected to the electrode pads 6. Electrode pad 3 of element 1 and electrode pad 6 of circuit board 5
Are connected to each other by a metal bump (gold bump) 4.
【００１９】次に、図２乃至図８を参照して第１の実施
の形態例によって説明した表面弾性波デバイスの製造方
法を説明する。Next, a method of manufacturing the surface acoustic wave device according to the first embodiment will be described with reference to FIGS.
【００２０】図２を参照して、まず、素子１の一面に機
能回路１１、電極２、電極パッド３、および金属バンプ
４を形成する。この際、電極２上にワイヤボンディング
法等にて金バンプ等の金属バンプ４を形成する。金属バ
ンプ４には先尖部分４ａを設けておく。回路基板５に
は、図３に示すように、複数の電極パッド６を形成し、
これらの電極パッド６を回路基板５の一面で囲み、回路
基板５上に複数の空間７を形成するために枠状樹脂部材
８を予め複数個分を形成しておく。枠状樹脂部材８は実
装加圧時の流動性が少ないこと、及び印刷、エッチング
等により選択的に高精度で形成される物が適する。例え
ば、複数個の素子１を切断して得るために、回路基板５
をガラスセラミック基板として、回路基板５上に熱硬化
型感光性樹脂をスピンコ−トで一様な厚さに塗布し、露
光現像にて所要箇所のみの枠状樹脂部材８を得る方法が
ある。感光性樹脂は実装時の加熱で接着性が増し硬化ま
で至る。Referring to FIG. 2, first, a functional circuit 11, an electrode 2, an electrode pad 3, and a metal bump 4 are formed on one surface of an element 1. At this time, a metal bump 4 such as a gold bump is formed on the electrode 2 by a wire bonding method or the like. The metal bump 4 has a pointed portion 4a. A plurality of electrode pads 6 are formed on the circuit board 5 as shown in FIG.
These electrode pads 6 are surrounded by one surface of the circuit board 5, and a plurality of frame-shaped resin members 8 are formed in advance in order to form a plurality of spaces 7 on the circuit board 5. As the frame-shaped resin member 8, a material having low fluidity at the time of mounting pressurization and selectively formed with high accuracy by printing, etching, or the like is suitable. For example, in order to obtain a plurality of elements 1 by cutting,
Is used as a glass ceramic substrate, a thermosetting photosensitive resin is applied on the circuit board 5 to a uniform thickness by spin coating, and a frame-shaped resin member 8 is formed only at a required portion by exposure and development. The photosensitive resin increases in adhesiveness by heating during mounting, and reaches curing.
【００２１】そして、図４に示すように、金属バンプ４
を設けた素子１を回路基板５の一面に対向させて搭載す
る。この際、金属バンプ４の先尖部分４ａは、回路基板
５上の電極パッド６に接触させる。そして、回路基板５
上には複数の素子１を順次搭載する。また、素子１は機
能回路１１を回路基板５側に対向させて搭載する。Then, as shown in FIG.
Is mounted on the circuit board 5 so as to face one surface thereof. At this time, the pointed portion 4a of the metal bump 4 is brought into contact with the electrode pad 6 on the circuit board 5. And the circuit board 5
A plurality of elements 1 are sequentially mounted thereon. The element 1 is mounted with the functional circuit 11 facing the circuit board 5 side.
【００２２】その後、図５に示すように、複数個の素子
１に加熱加圧装置１５を用いて加熱しながら加圧をかけ
て一括して実装する。この実装は複数の素子１に一括し
て加熱加圧をかけ、予め素子１上に形成された金属バン
プ４と回路基板５の電極パッド６の接続し、素子１の表
面と枠状樹脂部材８の接続を同時に行う。金属バンプ４
と枠状樹脂部材８は、ほぼ同じ高さまで押されることに
なる。この時、素子１が枠状樹脂部材８の熱硬化により
密着し、密閉された空間７となる。なお、加熱方式は必
要量のみ加熱するパルスヒ−ト方式が適する。Thereafter, as shown in FIG. 5, a plurality of elements 1 are pressurized while being heated by using a heating and pressurizing device 15, and are mounted collectively. In this mounting, a plurality of elements 1 are heated and pressurized at once, the metal bumps 4 formed on the elements 1 in advance and the electrode pads 6 of the circuit board 5 are connected, and the surface of the elements 1 and the frame-shaped resin member 8 are connected. Connection at the same time. Metal bump 4
And the frame-shaped resin member 8 are pushed to almost the same height. At this time, the element 1 is brought into close contact with the frame-shaped resin member 8 due to the thermosetting, thereby forming a closed space 7. A suitable heating method is a pulse heat method in which only a required amount is heated.
【００２３】次に、図６および図７に示すように、枠状
樹脂部材８の回りにかつ回路基板８上に一括して追加樹
脂部材９を充填する。さらに、追加樹脂部材９が硬化し
た後、図８に示す分割ライン１０に沿って個々の素子１
に分割する。追加樹脂部材９はディスペンス等の方法に
て供給し、枠状樹脂部材８の外側に追加樹脂部部材９を
全周充填する。素子１を複数個に分割して取る回路基板
５は，追加樹脂部部材９を一括して塗布する際に、枠状
樹脂部材８が空間７を保持する。すなわち、枠状樹脂部
材８は追加樹脂部部材９が枠状樹脂部材８の内側の空間
７へ流れ込むのを阻止する。Next, as shown in FIGS. 6 and 7, an additional resin member 9 is filled around the frame-shaped resin member 8 and on the circuit board 8 at a time. Further, after the additional resin member 9 is cured, the individual elements 1 are separated along the dividing line 10 shown in FIG.
Divided into The additional resin member 9 is supplied by a method such as dispensing, and the outside of the frame-shaped resin member 8 is filled with the additional resin member 9 all around. In the circuit board 5 where the element 1 is divided into a plurality of parts, the frame-shaped resin member 8 holds the space 7 when the additional resin member 9 is applied collectively. That is, the frame-shaped resin member 8 prevents the additional resin portion member 9 from flowing into the space 7 inside the frame-shaped resin member 8.
【００２４】追加樹脂部材９を硬化した後、分割ライン
１０にて個片に分割する分割方法としては、マルチダイ
サ−等により切断される。After the additional resin member 9 is cured, it is divided by a dividing line 10 into individual pieces.
【００２５】このような製造方法によって、図１に示し
た枠状樹脂部材８が素子１の機能回路３と金属バンプ４
の間に形成され、枠状樹脂部材８の外側に追加樹脂部材
９が充填される実装構造となる。According to such a manufacturing method, the frame-shaped resin member 8 shown in FIG.
And an additional resin member 9 is filled outside the frame-shaped resin member 8.
【００２６】上述した図２乃至図８の実装構造では、金
属バンプ４の配置が枠状樹脂部材８の内側に含む実施の
形態例を説明したが、金属バンプ４が枠状樹脂部材８の
外側に位置している場合もある。In the mounting structure of FIGS. 2 to 8 described above, the embodiment in which the arrangement of the metal bumps 4 is included inside the frame-shaped resin member 8 has been described. It may be located in.
【００２７】図９および図１０は、枠状樹脂部材８の外
側に金属バンプ４を配置した第２の実施の形態例を示し
ている。この実施の形態例における枠状樹脂部材８は、
素子１の機能回路１１と金属バンプ４との間に形成され
ている。金属バンプ４の周囲は追加樹脂部材９が充填さ
れており、その部分では素子１および回路基板５間の熱
応力等の応力は分散され、電気接続部分である金属バン
プ４にかかる負荷が減ることになる。FIGS. 9 and 10 show a second embodiment in which the metal bumps 4 are arranged outside the frame-shaped resin member 8. FIG. The frame-shaped resin member 8 in this embodiment is
It is formed between the functional circuit 11 of the element 1 and the metal bump 4. The periphery of the metal bumps 4 is filled with an additional resin member 9, in which stresses such as thermal stress between the element 1 and the circuit board 5 are dispersed, and the load applied to the metal bumps 4 as the electrical connection portions is reduced. become.
【００２８】なお、第２の実施の形態例における表面弾
性波デバイスの製造方法は、図２乃至図８により説明し
た第１の実施の形態例における表面弾性波デバイスの製
造方法と同様に行われることから説明を省略する。The method of manufacturing the surface acoustic wave device according to the second embodiment is performed in the same manner as the method of manufacturing the surface acoustic wave device according to the first embodiment described with reference to FIGS. Therefore, the description is omitted.
【００２９】さらに、上述した実施の形態例において
は、回路基板５上に枠状樹脂部材８を設けているが、こ
の枠状樹脂部材８をウエハ状態の素子１に設けても同様
の実装構造を得ることが可能である。Further, in the above-described embodiment, the frame-shaped resin member 8 is provided on the circuit board 5, but the same mounting structure can be obtained by providing the frame-shaped resin member 8 on the element 1 in a wafer state. It is possible to obtain
【００３０】また、上述した実施の形態例では、回路基
板５上に熱硬化型感光性樹脂を塗布し、露光現像にて所
要箇所のみの枠状樹脂部材８を得る方法を示したが、樹
脂材料によって形成した成形シートを所要の形状に製作
した枠状樹脂部材８を、回路基板５上に貼り付けること
によって、同様の実装構造をえることもできる。In the above-described embodiment, a method has been described in which a thermosetting photosensitive resin is applied onto the circuit board 5 and the frame-shaped resin member 8 is formed only at a required portion by exposure and development. A similar mounting structure can be obtained by attaching a frame-shaped resin member 8, which is a molded sheet made of a material into a required shape, on a circuit board 5.
【００３１】[0031]
【発明の効果】以上、実施の形態例によって説明したよ
うに、本発明の表面弾性波デバイスの実装構造によれ
ば、枠状樹脂部材と追加樹脂部材とによって気密を取っ
ているため信頼性が高く、枠状樹脂部材が追加樹脂部材
の空間へ流れ込むのを防止しているので、製造工法上の
安定度高くなる。As described above with reference to the embodiment, according to the mounting structure of the surface acoustic wave device of the present invention, since the frame-shaped resin member and the additional resin member are airtight, the reliability is improved. Since it is high and prevents the frame-shaped resin member from flowing into the space of the additional resin member, the stability in the manufacturing method is increased.
【００３２】また、本発明の表面弾性波デバイスの製造
方法では、接続及び樹脂塗布を複数個一括して行い、個
片に切断するため経済性に優れたものとなる。また、金
属バンプを枠状樹脂部材の外側に配置することにより、
金属バンプの応力緩和が可能であり、強度が向上し、性
能の安定化が見込まれる。In the method of manufacturing a surface acoustic wave device according to the present invention, a plurality of connections and application of a resin are collectively performed and cut into individual pieces. Also, by disposing the metal bumps outside the frame-shaped resin member,
The stress of the metal bump can be relaxed, the strength is improved, and the performance is expected to be stabilized.
【００３３】さらに、従来の構造と比較すると、使用す
る回路基板の形状の簡略化が可能なため、使用する部材
が廉価になる。Further, as compared with the conventional structure, since the shape of the circuit board to be used can be simplified, the members to be used are inexpensive.
【図１】本発明における表面弾性波デバイスの実装構造
における第１の実施の形態例を示す断面図である。FIG. 1 is a sectional view showing a first embodiment of a mounting structure of a surface acoustic wave device according to the present invention.
【図２】図１に示した表面弾性波デバイスにおいて、製
造方法の一実施の形態を説明するために、素子を示した
断面図である。FIG. 2 is a cross-sectional view showing an element in the surface acoustic wave device shown in FIG. 1 for describing an embodiment of a manufacturing method.
【図３】図１に示した表面弾性波デバイスにおいて、製
造方法の一実施の形態を説明するために、回路基板を示
した断面図である。FIG. 3 is a cross-sectional view showing a circuit board for describing one embodiment of a method of manufacturing the surface acoustic wave device shown in FIG. 1;
【図４】図１に示した表面弾性波デバイスにおける製造
方法において、図２に示した素子を回路基板に実装する
前の状態を示す断面図である。FIG. 4 is a cross-sectional view showing a state before mounting the element shown in FIG. 2 on a circuit board in the method of manufacturing the surface acoustic wave device shown in FIG.
【図５】図２に示した素子と回路基板とを加熱加圧する
状態を示した断面図である。FIG. 5 is a cross-sectional view showing a state in which the element and the circuit board shown in FIG. 2 are heated and pressed.
【図６】図５の状態から、素子と回路基板とを接続した
状態を示した断面図である。FIG. 6 is a cross-sectional view showing a state where the element and the circuit board are connected from the state of FIG. 5;
【図７】図６の平面図である。FIG. 7 is a plan view of FIG. 6;
【図８】図６に示した素子を複数に分割した状態を示す
断面図である。8 is a cross-sectional view showing a state where the element shown in FIG. 6 is divided into a plurality.
【図９】本発明における表面弾性波デバイスの実装構造
における第２の実施の形態例を示す断面図である。FIG. 9 is a sectional view showing a second embodiment of the mounting structure of the surface acoustic wave device according to the present invention.
【図１０】図９の平面図である。FIG. 10 is a plan view of FIG. 9;
【図１１】従来技術１の表面弾性波素子を示す断面図で
ある。FIG. 11 is a cross-sectional view illustrating a surface acoustic wave device according to the related art 1.
【図１２】従来技術２の表面弾性波素子を示す断面図で
ある。FIG. 12 is a cross-sectional view illustrating a surface acoustic wave device according to Conventional Technique 2.
１，１０１ 表面弾性波素子 ４ 金属バンプ ５，１１５ 回路基板 ６，１１６ 電極パッド ７，１１７ 空間 ８，１１８ 枠状樹脂部材 ９ 追加樹脂材 １０ 分割ライン １１ 機能回路 １１１ 蓋 DESCRIPTION OF SYMBOLS 1, 101 Surface acoustic wave element 4 Metal bump 5, 115 Circuit board 6, 116 Electrode pad 7, 117 Space 8, 118 Frame-shaped resin member 9 Additional resin material 10 Division line 11 Functional circuit 111 Lid
───────────────────────────────────────────────────── フロントページの続き (72)発明者 谷岡 道修 東京都港区芝五丁目７番１号 日本電気株 式会社内 (72)発明者 渡邉 典正 東京都港区芝五丁目７番１号 日本電気株 式会社内 Ｆターム(参考） 5J097 AA28 AA31 AA33 BB11 HA04 HA08 HA09 JJ03 JJ09 KK10 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Michio Tanioka 5-7-1 Shiba, Minato-ku, Tokyo Inside NEC Corporation (72) Inventor Norimasa Watanabe 5-7-1 Shiba, Minato-ku, Tokyo Japan F-term (reference) within Electric Company 5J097 AA28 AA31 AA33 BB11 HA04 HA08 HA09 JJ03 JJ09 KK10
Claims (8)
前記素子および前記回路基板間に空間を作るように介在
した枠状樹脂部材と、前記素子に設けた電極パッドと、
前記回路基板に設けた電極パッドと、前記素子の電極パ
ッドおよび前記回路基板の電極パッドとを相互に接続し
た金属バンプと、前記素子に設けられかつ前記空間に位
置した機能回路とを含む素子デバイスの実装構造におい
て、前記枠状樹脂部材の外側に追加樹脂部材が設けられ
ていることを特徴とする素子デバイスの実装構造。An element, a circuit board on which the element is mounted,
A frame-shaped resin member interposed to create a space between the element and the circuit board, and an electrode pad provided on the element,
An element device including an electrode pad provided on the circuit board, a metal bump interconnecting the electrode pad of the element and the electrode pad of the circuit board, and a functional circuit provided on the element and located in the space. The mounting structure for an element device according to claim 1, wherein an additional resin member is provided outside the frame-shaped resin member.
において、前記素子に設けた電極パッド、前記回路基板
に設けた電極パッド、前記金属バンプ、および前記機能
回路が前記枠状樹脂部材によって囲まれた前記空間に位
置していることを特徴とする素子デバイスの実装構造。2. The mounting structure of an element device according to claim 1, wherein the electrode pad provided on the element, the electrode pad provided on the circuit board, the metal bump, and the functional circuit are surrounded by the frame-shaped resin member. A mounting structure for an element device, wherein the mounting structure is located in the space defined above.
において、前記素子に設けた電極パッド、前記回路基板
に設けた電極パッド、および前記金属バンプが前記枠状
樹脂部材の外側に位置しており、前記機能回路が前記枠
状樹脂部材によって囲まれた前記空間に位置しており、
前記素子に設けた電極パッド、前記回路基板に設けた電
極パッド、および前記金属バンプが前記追加樹脂部材に
よって覆われていることを特徴とする素子デバイスの実
装構造。3. The mounting structure of an element device according to claim 1, wherein the electrode pad provided on the element, the electrode pad provided on the circuit board, and the metal bump are located outside the frame-shaped resin member. The functional circuit is located in the space surrounded by the frame-shaped resin member,
An electrode device mounting structure, wherein an electrode pad provided on the element, an electrode pad provided on the circuit board, and the metal bump are covered with the additional resin member.
前記素子および前記回路基板間に空間を作るように介在
される枠状樹脂部材と、前記素子に設ける電極パッド
と、前記回路基板に設ける電極パッドと、前記素子の電
極パッドおよび前記回路基板の電極パッドとを相互に接
続する金属バンプと、前記素子に設けかつ前記空間に位
置させる機能回路とを含み、前記回路基板上に前記空間
を保持するために前記枠状樹脂部材を複数個設け、前記
金属バンプを設けた前記素子を前記回路基板の電極パッ
ドへ搭載し、この際に、前記枠状樹脂部材の接続及び前
記金属バンプの接続を同時に行い、一括して前記枠状樹
脂部材の外側に前記追加樹脂部材を設けた後、個々に分
割して複数の前記素子を得ることを特徴とする素子デバ
イスの製造方法。4. An element, a circuit board on which the element is mounted,
A frame-shaped resin member interposed to create a space between the element and the circuit board, an electrode pad provided on the element, an electrode pad provided on the circuit board, an electrode pad of the element and an electrode of the circuit board A metal bump for interconnecting pads and a functional circuit provided on the element and positioned in the space, a plurality of the frame-shaped resin members are provided on the circuit board to hold the space, The element provided with the metal bumps is mounted on the electrode pads of the circuit board, and at this time, the connection of the frame-shaped resin member and the connection of the metal bumps are simultaneously performed, and collectively on the outside of the frame-shaped resin member. A method for manufacturing an element device, comprising: providing the additional resin member; and dividing the individual resin member to obtain a plurality of the elements.
において、前記素子に設けた電極パッド、前記回路基板
に設けた電極パッド、前記金属バンプ、および前記機能
回路を前記枠状樹脂部材によって囲まれた前記空間に位
置させることを特徴とする素子デバイスの製造方法。5. The element device mounting method according to claim 4, wherein the electrode pad provided on the element, the electrode pad provided on the circuit board, the metal bump, and the functional circuit are surrounded by the frame-shaped resin member. A method for manufacturing an element device, wherein the element device is located in the space defined above.
において、前記素子に設けた電極パッド、前記回路基板
に設けた電極パッド、および前記金属バンプを前記枠状
樹脂部材の外側に位置させ、前記機能回路を前記枠状樹
脂部材によって囲まれた前記空間に位置させ、前記素子
に設けた電極パッド、前記回路基板に設けた電極パッ
ド、および前記金属バンプを前記追加樹脂部材によって
覆うことを特徴とする素子デバイスの製造方法。6. The method for manufacturing an element device according to claim 4, wherein the electrode pad provided on the element, the electrode pad provided on the circuit board, and the metal bump are located outside the frame-shaped resin member. The functional circuit is located in the space surrounded by the frame-shaped resin member, and the electrode pad provided on the element, the electrode pad provided on the circuit board, and the metal bump are covered with the additional resin member. A method for manufacturing an element device.
において、前記素子に加熱加圧装置を用いて加熱しなが
ら加圧をかけて一括して前記素子の電極パッドと前記回
路基板の電極パッドとを前記金属バンプによって接続す
ることを特徴とする素子デバイスの製造方法。7. The method for manufacturing an element device according to claim 4, wherein the element is pressurized while being heated by using a heating and pressurizing device, and the electrode pad of the element and the electrode pad of the circuit board are collectively applied. Are connected by the metal bump.
において、前記枠状樹脂部材の外側に前記追加樹脂部材
を充填することを特徴とする素子デバイスの製造方法。8. The method for manufacturing an element device according to claim 4, wherein the additional resin member is filled outside the frame-shaped resin member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11011892A JP2000216660A (en) | 1999-01-20 | 1999-01-20 | Mount structure for element device and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11011892A JP2000216660A (en) | 1999-01-20 | 1999-01-20 | Mount structure for element device and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000216660A true JP2000216660A (en) | 2000-08-04 |
Family
ID=11790392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11011892A Pending JP2000216660A (en) | 1999-01-20 | 1999-01-20 | Mount structure for element device and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000216660A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100431182B1 (en) * | 2001-12-07 | 2004-05-12 | 삼성전기주식회사 | Surface acoustic wave device package and method |
| JP2007013017A (en) * | 2005-07-04 | 2007-01-18 | Sony Corp | Electronic device and its manufacturing method |
| US7248133B2 (en) | 2004-06-28 | 2007-07-24 | Kyocera Corporation | Method for manufacturing surface acoustic wave device |
| JP2008199664A (en) * | 2002-06-03 | 2008-08-28 | Murata Mfg Co Ltd | Surface acoustic wave device |
| JP2009010942A (en) * | 2007-05-29 | 2009-01-15 | Nippon Dempa Kogyo Co Ltd | Piezoelectric component and method of manufacturing the same |
-
1999
- 1999-01-20 JP JP11011892A patent/JP2000216660A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100431182B1 (en) * | 2001-12-07 | 2004-05-12 | 삼성전기주식회사 | Surface acoustic wave device package and method |
| JP2008199664A (en) * | 2002-06-03 | 2008-08-28 | Murata Mfg Co Ltd | Surface acoustic wave device |
| US7248133B2 (en) | 2004-06-28 | 2007-07-24 | Kyocera Corporation | Method for manufacturing surface acoustic wave device |
| JP2007013017A (en) * | 2005-07-04 | 2007-01-18 | Sony Corp | Electronic device and its manufacturing method |
| JP2009010942A (en) * | 2007-05-29 | 2009-01-15 | Nippon Dempa Kogyo Co Ltd | Piezoelectric component and method of manufacturing the same |
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