JPS63307748A - Resin material - Google Patents
Resin materialInfo
- Publication number
- JPS63307748A JPS63307748A JP14322887A JP14322887A JPS63307748A JP S63307748 A JPS63307748 A JP S63307748A JP 14322887 A JP14322887 A JP 14322887A JP 14322887 A JP14322887 A JP 14322887A JP S63307748 A JPS63307748 A JP S63307748A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- heat transfer
- electrical insulation
- resin material
- thermal conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 51
- 239000011347 resin Substances 0.000 title claims abstract description 51
- 239000000463 material Substances 0.000 title claims abstract description 22
- 239000000919 ceramic Substances 0.000 claims abstract description 23
- 238000010292 electrical insulation Methods 0.000 claims abstract description 16
- 239000000843 powder Substances 0.000 claims abstract description 15
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 abstract description 3
- 229920002050 silicone resin Polymers 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920001342 Bakelite® Polymers 0.000 description 3
- 239000004637 bakelite Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
Abstract
Description
【発明の詳細な説明】 ［発明の目的コ （産業上の利用分野） 本発明はセラミックスを添加した樹脂材料に関する。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a resin material added with ceramics.
（従来の技術）
回路基板に搭載される電子部品においては、部品の外側
全体を樹脂で囲んでモールドして絶縁構造としだものか
める。(Prior Art) In electronic components mounted on circuit boards, the entire outside of the component is surrounded by resin and molded to provide an insulating structure.
また、電子部品を搭載したセラミックス基板をノ！ツケ
ーノを構成する金属ケースに取付けるために、樹脂を接
着剤として用い基板を接着固定したものがある。In addition, ceramic substrates equipped with electronic components! In order to attach it to the metal case that makes up the Tsukeno, there is one in which the board is fixed using resin as an adhesive.
従来、このような樹脂モールド電子部品や回路基板を絶
縁構造にして取付ける場合に用いる合成樹脂としては、
絶縁性を念頭において選択したベークライトまたはシリ
コーングルを使用している。Conventionally, the synthetic resins used to attach such resin-molded electronic components and circuit boards to insulated structures include:
Bakelite or silicone glue, selected with insulation in mind, is used.
（発明が解決しようとする問題点）
しかして、前記のように樹脂モールド電子部品や回路基
板を絶縁構造にして取付けるために用いる合成樹脂にお
いては、電気絶縁性が要求されるのは勿論であるが、こ
れに加えて電子部品の熱による誤動作や破損を防止する
ために、電子部品で発生する熱を良好に伝達して外部へ
放出できる良好な熱伝導性を有することが要求される。(Problems to be Solved by the Invention) However, as mentioned above, the synthetic resin used to attach resin-molded electronic components and circuit boards in an insulating structure is of course required to have electrical insulation properties. However, in addition to this, in order to prevent electronic components from malfunctioning or being damaged due to heat, they are required to have good thermal conductivity so that the heat generated in the electronic components can be well transferred and released to the outside.
特に樹脂モールド電子部品では、電子部品で発生した熱
が部品を囲む樹脂の内部にこもるために、合成樹脂に良
好な熱伝導性が要求される。Particularly in resin-molded electronic components, the synthetic resin is required to have good thermal conductivity because the heat generated by the electronic component is trapped inside the resin surrounding the component.
しかしながら、従来使用されているベークライトやシリ
コーン・ｒルは電気絶縁性に優れているが、前記の用途
において電子部品の熱を良好に外部へ放出するには熱伝
導性が不充分である。このため、前記用途では熱によシ
ミ子部品が誤動作または破損するおそれがある。However, although Bakelite and silicone rubber conventionally used have excellent electrical insulation properties, they do not have sufficient thermal conductivity to effectively release heat from electronic components to the outside in the above-mentioned applications. For this reason, in the above-mentioned applications, there is a risk that the smitter component may malfunction or be damaged due to heat.
本発明は前記事情に基づいてなされたもので、電気絶縁
性に加えて良好な熱伝導性を有する樹脂材料を提供する
ことを目的とする。The present invention was made based on the above circumstances, and an object of the present invention is to provide a resin material that has good thermal conductivity in addition to electrical insulation.
［発明の構成］
（問題点を解決するだめの手段と作用）前記目的を達成
するために本発明の樹脂材料は、電気絶縁性を有する樹
脂に熱伝導性に優れたセラミックスの粉末を分散混入し
てなることを特徴とするものである。[Structure of the Invention] (Means and Effects for Solving the Problems) In order to achieve the above object, the resin material of the present invention is produced by dispersing and mixing ceramic powder with excellent thermal conductivity into a resin having electrical insulation properties. It is characterized by:
本発明の発明者は樹脂の熱伝導性を高める点について研
究を重ねてきた。この過程で発明者は樹脂自身で熱伝導
性を向上させることは困難であり、樹脂に熱伝導性に優
れた他の物質を添加することに着目した。そして、樹脂
に添加する材料として回路基板において基板を形成する
材料として用いられているセラミックス材料に着目した
。セラミックスを樹脂に添加する材料として用いる理由
は次の通りである。セラミックスは基板として用いてい
るように電気絶縁性が優れておシ、樹脂に添加しても樹
脂の電気絶縁性を高めこそすれ、樹脂の電気絶縁性を低
下させることがない。そして、セラミックスには熱伝導
性が優れているものがち）、窒化アルミニウムはなかで
も優れた熱伝導性（熱伝導率７０〜２６０ Ｗ／ｍＫ
）を有している。The inventor of the present invention has conducted repeated research on improving the thermal conductivity of resin. In this process, the inventor found it difficult to improve the thermal conductivity of the resin itself, and focused on adding another substance with excellent thermal conductivity to the resin. As a material added to resin, we focused on ceramic materials that are used as materials for forming circuit boards. The reason for using ceramics as a material added to resin is as follows. Ceramics have excellent electrical insulation properties as they are used as substrates, and even when added to resins, they only increase the electrical insulation properties of the resin without reducing the electrical insulation properties of the resin. Ceramics tend to have excellent thermal conductivity), and aluminum nitride has particularly excellent thermal conductivity (thermal conductivity of 70 to 260 W/mK).
)have.
さらに、セラミックスは粉末状にして樹脂のなかに容易
且つ均一に分散して混入することができるからである。Furthermore, ceramics can be easily and uniformly dispersed and mixed into the resin in the form of powder.
本発明はこの知見にニジなされたものである。The present invention is based on this knowledge.
本発明の樹脂材料について説明する。The resin material of the present invention will be explained.
本発明の樹脂材料は、電気絶縁性を有する樹脂を広く対
象にすることができるが、樹脂のなかでは熱伝導性が良
好なシリコーン樹脂が特に好ましい。The resin material of the present invention can be applied to a wide variety of resins having electrical insulation properties, but among resins, silicone resins having good thermal conductivity are particularly preferred.
樹脂に混入するセラミックスは電気絶縁性と熱伝導性を
有しているものが広く対象にできるが、特に熱伝導性に
優れた窒化アルミニウム（ＡｔＮ ）が適している。A wide variety of ceramics can be used to mix in the resin, but aluminum nitride (AtN), which has excellent thermal conductivity, is particularly suitable.
セラミックスが樹脂に混入する形態は次の通シである。Ceramics are mixed into resin in the following manner.
セラミックスの焼結体を粉砕してミクロンオーダの粉末
を形成し、この粉末ｔ−溶融している樹脂のなかに入れ
て両者を良く混練する。これによシセラミックスが樹脂
のなかに容易且つ均一に分散させて混入できる。A sintered ceramic body is pulverized to form a powder on the order of microns, and this powder is placed in a molten resin and the two are thoroughly kneaded. This allows the ceramics to be easily and uniformly dispersed and mixed into the resin.
セラミックス粉末を樹脂に混入する割合は、樹脂に充分
な熱伝導性を与えることができる大きさであシ１例えば
樹脂２；セラミックス粉末１である。The ratio of the ceramic powder mixed into the resin is such that the resin has sufficient thermal conductivity, for example, 1 part: 2 parts resin: 1 part ceramic powder.
従って、本発明の樹脂材料は第１図で示すように樹脂１
の内部にセラミックスの粉末２が混入分散しているので
、電気絶縁性とともに優れた熱伝導性を有している。Therefore, the resin material of the present invention is as shown in FIG.
Since the ceramic powder 2 is mixed and dispersed inside, it has excellent thermal conductivity as well as electrical insulation.
本発明の樹脂材料は、１１ｃ気絶縁性と熱伝導性の両方
を要求される用途に広く使用できるが、特に電子部品の
モールド用や接着剤としての使用に適している。The resin material of the present invention can be widely used in applications requiring both 11c insulation and thermal conductivity, and is particularly suitable for use in molding electronic components and as an adhesive.
例えば第２図で示すように電子部品３をモールドする樹
脂１として使用する。この場合、樹脂１は電子部品３全
体を囲むが、電子部品３から発住−する熱を良好に伝導
して外部へ放出でき電子部品３の破損を防止できる。For example, as shown in FIG. 2, it is used as a resin 1 for molding an electronic component 3. In this case, the resin 1 surrounds the entire electronic component 3, but can effectively conduct heat generated from the electronic component 3 and release it to the outside, thereby preventing damage to the electronic component 3.
また、第３図で示すように電子部品４を搭載したセラミ
ックス基板５を金属ケース６に接着固定するための樹脂
接着剤１として使用できる。この好に伝導することがで
きる。特に樹脂接着剤１はセラミックスの粉末が混入し
ているため、セラミックス基板５と金属ケース６の熱膨
張係数に近い大きさの熱膨張係数を有し、セラミックス
基板５と金属ケース６との間■熱膨張差によるル６力発
生を緩和でき樹脂接着剤１の破損全防止できる。Further, as shown in FIG. 3, it can be used as a resin adhesive 1 for adhesively fixing a ceramic substrate 5 on which an electronic component 4 is mounted to a metal case 6. This allows good conduction. In particular, since the resin adhesive 1 contains ceramic powder, it has a coefficient of thermal expansion close to that of the ceramic substrate 5 and the metal case 6, and the gap between the ceramic substrate 5 and the metal case 6 is The generation of force caused by the difference in thermal expansion can be alleviated, and damage to the resin adhesive 1 can be completely prevented.
（実施例）
本発明例として、窒化アルミニウム焼結棒金粉砕して粒
径５μｍ程度の粉末とし、この粉末を軟化したシリコー
ン樹脂のなかに粉末ｌ：樹脂２の割合で混入して混練し
樹脂材料全裏作した。(Example) As an example of the present invention, a sintered aluminum nitride bar is ground into a powder with a particle size of approximately 5 μm, and this powder is mixed into softened silicone resin at a ratio of 1 part powder to 2 parts resin and kneaded. I made all the materials backwards.
そして、この樹脂材料の熱伝導率を測定した結果１００
Ｗ／ｍＫであった。The thermal conductivity of this resin material was measured and the result was 100
It was W/mK.
また、従来例としてベークライト樹脂を用意し、その熱
伝導率を測定した結果、１〜５ｗ７’ｍＫであった０
［発明の効果コ
以上説明したように本発明の樹脂材料によれば、電気絶
縁性とともに熱伝導性に優れているので、電気絶縁性と
熱伝導性が要求される用途に効果的に使用できる。In addition, as a conventional example, Bakelite resin was prepared and its thermal conductivity was measured, and the result was 1 to 5w7'mK. Because it has excellent thermal conductivity as well as thermal conductivity, it can be effectively used in applications that require electrical insulation and thermal conductivity.
第１図は本発明の樹脂材料を示す説明図、第２図および
第３図は本発明の樹脂材料の用途例を示す説明図である
。
１・・・樹脂、２−・・セラミックス粉末。
員願人代理人 弁理士 卸 江 武 彦第１図
第２図
■
第３図FIG. 1 is an explanatory diagram showing the resin material of the present invention, and FIGS. 2 and 3 are explanatory diagrams showing application examples of the resin material of the present invention. 1...Resin, 2-...Ceramics powder. Patent Attorney Takehiko E Figure 1 Figure 2 ■ Figure 3
Claims (2)
ミックスの粉末を混入分散してなる樹脂材料。(1) A resin material made by mixing and dispersing ceramic powder with excellent thermal conductivity into a resin with electrical insulation properties.
の範囲第１項に記載の樹脂材料。(2) The resin material according to claim 1, wherein the ceramic is aluminum nitride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14322887A JPS63307748A (en) | 1987-06-10 | 1987-06-10 | Resin material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14322887A JPS63307748A (en) | 1987-06-10 | 1987-06-10 | Resin material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63307748A true JPS63307748A (en) | 1988-12-15 |
Family
ID=15333881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14322887A Pending JPS63307748A (en) | 1987-06-10 | 1987-06-10 | Resin material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63307748A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5011870A (en) * | 1989-02-08 | 1991-04-30 | Dow Corning Corporation | Thermally conductive organosiloxane compositions |
| JPH03126765A (en) * | 1989-10-02 | 1991-05-29 | Siemens Ag | Composite material resistant to high temperature |
| US5194480A (en) * | 1991-05-24 | 1993-03-16 | W. R. Grace & Co.-Conn. | Thermally conductive elastomer |
| WO2011046036A1 (en) * | 2009-10-14 | 2011-04-21 | 株式会社小糸製作所 | Circuit device and production method therefor |
| CN109929249A (en) * | 2017-12-15 | 2019-06-25 | 南京机器人研究院有限公司 | A kind of insulation thermal conductivity new material |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63305521A (en) * | 1987-06-05 | 1988-12-13 | Mitsubishi Electric Corp | Semiconductor device |
-
1987
- 1987-06-10 JP JP14322887A patent/JPS63307748A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63305521A (en) * | 1987-06-05 | 1988-12-13 | Mitsubishi Electric Corp | Semiconductor device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5011870A (en) * | 1989-02-08 | 1991-04-30 | Dow Corning Corporation | Thermally conductive organosiloxane compositions |
| JPH03126765A (en) * | 1989-10-02 | 1991-05-29 | Siemens Ag | Composite material resistant to high temperature |
| US5194480A (en) * | 1991-05-24 | 1993-03-16 | W. R. Grace & Co.-Conn. | Thermally conductive elastomer |
| WO2011046036A1 (en) * | 2009-10-14 | 2011-04-21 | 株式会社小糸製作所 | Circuit device and production method therefor |
| CN109929249A (en) * | 2017-12-15 | 2019-06-25 | 南京机器人研究院有限公司 | A kind of insulation thermal conductivity new material |
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