JPS63296332A - Solid-state electrolytic capacitor - Google Patents
Solid-state electrolytic capacitorInfo
- Publication number
- JPS63296332A JPS63296332A JP13265687A JP13265687A JPS63296332A JP S63296332 A JPS63296332 A JP S63296332A JP 13265687 A JP13265687 A JP 13265687A JP 13265687 A JP13265687 A JP 13265687A JP S63296332 A JPS63296332 A JP S63296332A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- layer
- silver
- cathode layer
- electrolytic capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims description 11
- 229910000679 solder Inorganic materials 0.000 claims abstract description 26
- 229910052709 silver Inorganic materials 0.000 claims abstract description 13
- 239000004332 silver Substances 0.000 claims abstract description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 9
- 239000010949 copper Substances 0.000 claims abstract description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000004065 semiconductor Substances 0.000 claims abstract description 7
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 6
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 5
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 4
- 239000007787 solid Substances 0.000 claims description 9
- 230000005012 migration Effects 0.000 abstract description 5
- 238000013508 migration Methods 0.000 abstract description 5
- 230000002950 deficient Effects 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は陰極層を改良した固体電解コンデンサに関する
。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a solid electrolytic capacitor with an improved cathode layer.
（従来の技術）
タンタル固体電解コンデンサ等のコンデンサは、従来、
タンタル等の弁作用金属の焼結体に誘電体皮膜を形成し
、二酸化マンガン等の半導体層、陰極層を順次設けた構
造になっている。(Conventional technology) Capacitors such as tantalum solid electrolytic capacitors are conventionally
It has a structure in which a dielectric film is formed on a sintered body of a valve metal such as tantalum, and a semiconductor layer such as manganese dioxide and a cathode layer are sequentially provided.
陰極層は、カーボンにｍ層を積層したもので、銀層によ
り半田付けが可能になっている。The cathode layer is made by laminating m layers on carbon, and the silver layer allows soldering.
（発明が解決しようとする問題点）
しかし、従来の陰極層は１！層が半田に溶け込んでしま
い、下層のカーボンとの付きが悪くなる欠点があった。(Problem to be solved by the invention) However, the conventional cathode layer has only 1! The disadvantage was that the layer melted into the solder, resulting in poor adhesion to the underlying carbon layer.
また、湿度の高い雰囲気下では、マイグレーションによ
る短絡不良を生じ易い欠点があった。Furthermore, in a high humidity atmosphere, there is a drawback that short circuit failures due to migration are likely to occur.
本発明は、以上の欠点を改良し、陰極層と半田との付き
を向上し、マイグレーションによるＦｄＲ不良を防止し
つる固体電解コンデンサを提供するものである。The present invention provides a solid electrolytic capacitor that improves the above-mentioned drawbacks, improves the adhesion between the cathode layer and solder, and prevents FdR defects due to migration.
（問題点を解決するための手段）
本発明は、上記の目的を達成するために、弁作用金属の
ｌＩｌ極体表体表面電体皮膜、半導体層及び陰極層が設
けられている固体電解コンデンサにおいて、陰極層の表
面が半田付は可能でかつ半Ｉ′Ｉ］に溶け難い金属と節
の混合層からなることを特徴とする固体電解コンデンサ
を提供するものである。(Means for Solving the Problems) In order to achieve the above object, the present invention provides a solid electrolytic capacitor in which a valve metal lIl pole body surface electric conductor film, a semiconductor layer, and a cathode layer are provided. The present invention provides a solid electrolytic capacitor characterized in that the surface of the cathode layer is composed of a mixed layer of metal and knots which can be soldered and which is difficult to dissolve in semi-I'I.
（作用）
本発明によれば、銅やニッケル、パラジウム、白金等の
半田付は可能でかつ半田に溶け難い金属と銀の混合層を
陰極層の表面に形成しているため、表面に半田が塗布さ
れても銀が半田に溶け込むのが防げられ、半田とのつき
がよくなる。(Function) According to the present invention, a mixed layer of metals such as copper, nickel, palladium, platinum, etc., which can be soldered and which are difficult to dissolve in solder, and silver is formed on the surface of the cathode layer, so that solder does not form on the surface. Even when applied, it prevents the silver from melting into the solder and improves its adhesion to the solder.
（実施例） 以下、本発明を実施例に基づいて説明する。(Example) Hereinafter, the present invention will be explained based on examples.
第１図において、１はタンタルの焼結体であり、陽（４
端子２の接続されたＶＪＩＪ極リード線３が引き出され
ている。４はこの焼結体１を化成処理して形成された７
ａｚＯｓからなる誘電体皮膜である。In Figure 1, 1 is a tantalum sintered body, positive (4
The VJIJ pole lead wire 3 to which the terminal 2 is connected is drawn out. 4 is formed by chemical conversion treatment of this sintered body 1.
This is a dielectric film made of azOs.
５は誘電体皮膜４上に積層されたＭｎ０ｚからなる半導
体層である。６は半導体層５の表面に積層されたコロイ
ダルカーボン層である。７は、コロイダルカーボン層６
に積層された混合層であり、銅やニッケル、パラジウム
、銀等の半田付は可能でかつ半田に溶け舅い金属と銀と
をバインダーとともに溶剤に溶かし混合したものである
。８は、混合層７に塗布された半田層であり、陰極端子
７が取り付けられている。９はＵＡ脂外装である。Reference numeral 5 denotes a semiconductor layer made of Mn0z laminated on the dielectric film 4. 6 is a colloidal carbon layer laminated on the surface of the semiconductor layer 5. 7 is a colloidal carbon layer 6
It is a mixed layer laminated with copper, nickel, palladium, silver, etc., which can be soldered, and is a mixture of metals that can be dissolved in solder and silver dissolved in a solvent together with a binder. 8 is a solder layer applied to the mixed layer 7, and the cathode terminal 7 is attached thereto. 9 is the UA fat exterior.
混合層７中の銅と正の比率を変えた場合の半田漏れ性と
半田喰われ性について第２図のグラフに示した。半田漏
れ性とは、半田浸漬条件を温度２３０℃、時間５秒間と
しＪＩＳ Ｃ５１０２−８，４半田付は性に準じて行
ない、目視により半田で覆われた面積の比率である。半
田喰われ性とは半田浸漬条件を温度２６０℃、時１’１
Ｊ１０秒間とし、混合層の失った面積を目視により判定
した比率である。なお、混合層は銅粉と銀粉とが合わせ
て５５ｗｔ％、ニトロセルローズ（バインダー）が１０
ｗｔ％、ブチルアセテート（溶剤）が３５ｗｔ％からな
る。The graph in FIG. 2 shows the solder leakage and solder eating properties when the copper and positive ratios in the mixed layer 7 are changed. Solder leakage is the ratio of the area covered by solder as determined by visual observation, using solder immersion conditions of 230° C. and 5 seconds, and soldering according to JIS C5102-8, 4. Solder eatability refers to the solder immersion conditions at a temperature of 260°C and an hour of 1'1.
This is the ratio determined by visual observation of the area lost in the mixed layer for J10 seconds. The mixed layer contains a total of 55 wt% of copper powder and silver powder, and 10 wt% of nitrocellulose (binder).
wt%, butyl acetate (solvent) is 35 wt%.
低下する。従って、銅の場合には上記条件下において混
合量は８０％以下がよく、より好ましくは１ｏ〜３０％
の範囲がよい。descend. Therefore, in the case of copper, the mixing amount under the above conditions is preferably 80% or less, more preferably 10 to 30%.
A range of is good.
（発明の効果）
以下、本発明によれば、陰＃Ａ層の表面を銅やニッケル
、パラジウム、白金等の半田付は可能で半田に溶け難い
金属と銀との混合層としているため、銀が半田に溶け込
むのを防止でき、銅やニッケルを用いた場合にはより安
価になり、また、半田付着量が少なくでき小型化が可能
になる。ぞして銀のマイグレーションによる短絡不良を
減少しうる固体電解コンデンサが得られる。(Effects of the Invention) Hereinafter, according to the present invention, since the surface of the negative #A layer is made of a mixed layer of copper, nickel, palladium, platinum, etc., a metal that can be soldered but is difficult to dissolve in solder, and silver, If copper or nickel is used, it will be cheaper, and the amount of solder attached will be smaller, making it possible to downsize. As a result, a solid electrolytic capacitor capable of reducing short-circuit defects due to silver migration can be obtained.
第１図は本発明実施例の正面断面図、第２図は混合層の
銅と銀の比率を変えた場合の半田漏れ性と半田喰われ性
のグラフを示す。
１・・・焼結体、 ４・・・誘電体皮膜、５・・・半導
体層、 ６・・・コロイダルカーボン層、７・・・混合
層。
特許出願人 日立コンデンサ株式会社
升田等を藝ソヌ
井出爛番早ヌFIG. 1 is a front cross-sectional view of an example of the present invention, and FIG. 2 is a graph of solder leakage and solder eating when the ratio of copper and silver in the mixed layer is changed. DESCRIPTION OF SYMBOLS 1... Sintered compact, 4... Dielectric film, 5... Semiconductor layer, 6... Colloidal carbon layer, 7... Mixed layer. Patent applicant: Hitachi Capacitor Co., Ltd. Masuda et al.
Claims (2)
及び陰極層が設けられている固体電解コンデンサにおい
て、陰極層の表面が半田付け可能でかつ半田に溶け難い
金属と銀の混合層からなることを特徴とする固体電解コ
ンデンサ。(1) In a solid electrolytic capacitor in which a dielectric film, a semiconductor layer, and a cathode layer are provided on the surface of a valve metal anode body, the surface of the cathode layer is a mixed layer of metal and silver that is solderable and difficult to dissolve in solder. A solid electrolytic capacitor characterized by comprising:
ッケル、パラジウム、白金のうち少なくとも一種類であ
る特許請求の範囲第１項記載の固体電解コンデンサ。(2) The solid electrolytic capacitor according to claim 1, wherein the solderable metal that is difficult to dissolve in solder is at least one of copper, nickel, palladium, and platinum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13265687A JPS63296332A (en) | 1987-05-28 | 1987-05-28 | Solid-state electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13265687A JPS63296332A (en) | 1987-05-28 | 1987-05-28 | Solid-state electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63296332A true JPS63296332A (en) | 1988-12-02 |
Family
ID=15086422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13265687A Pending JPS63296332A (en) | 1987-05-28 | 1987-05-28 | Solid-state electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63296332A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0372519A2 (en) * | 1988-12-07 | 1990-06-13 | Matsushita Electric Industrial Co., Ltd. | A solid electrolytic capacitor |
| JP2013021223A (en) * | 2011-07-13 | 2013-01-31 | San Denshi Kogyo Kk | Solid electrolytic capacitor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5423425A (en) * | 1977-07-25 | 1979-02-22 | Toshiba Corp | Beam index color television picture receiver |
| JPS5783022A (en) * | 1980-11-11 | 1982-05-24 | Matsushita Electric Ind Co Ltd | Solid electrolytic condenser |
| JPS58158910A (en) * | 1982-03-16 | 1983-09-21 | 日本電気ホームエレクトロニクス株式会社 | Electronic part |
-
1987
- 1987-05-28 JP JP13265687A patent/JPS63296332A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5423425A (en) * | 1977-07-25 | 1979-02-22 | Toshiba Corp | Beam index color television picture receiver |
| JPS5783022A (en) * | 1980-11-11 | 1982-05-24 | Matsushita Electric Ind Co Ltd | Solid electrolytic condenser |
| JPS58158910A (en) * | 1982-03-16 | 1983-09-21 | 日本電気ホームエレクトロニクス株式会社 | Electronic part |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0372519A2 (en) * | 1988-12-07 | 1990-06-13 | Matsushita Electric Industrial Co., Ltd. | A solid electrolytic capacitor |
| US5005107A (en) * | 1988-12-07 | 1991-04-02 | Matsushita Electric Industrial Co., Ltd. | Solid electrolytic capacitor |
| JP2013021223A (en) * | 2011-07-13 | 2013-01-31 | San Denshi Kogyo Kk | Solid electrolytic capacitor |
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