JPS63275205A - One body molded product of antenna substrate for high frequency - Google Patents
One body molded product of antenna substrate for high frequencyInfo
- Publication number
- JPS63275205A JPS63275205A JP62110348A JP11034887A JPS63275205A JP S63275205 A JPS63275205 A JP S63275205A JP 62110348 A JP62110348 A JP 62110348A JP 11034887 A JP11034887 A JP 11034887A JP S63275205 A JPS63275205 A JP S63275205A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- ground conductor
- dielectric
- metal plate
- high frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 28
- 239000004020 conductor Substances 0.000 claims abstract description 100
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 17
- 239000010949 copper Substances 0.000 claims abstract description 17
- 229910052709 silver Inorganic materials 0.000 claims abstract description 11
- 239000004332 silver Substances 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 36
- 239000003989 dielectric material Substances 0.000 claims description 16
- 229920000098 polyolefin Polymers 0.000 claims description 13
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 239000006260 foam Substances 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 abstract description 2
- 230000002787 reinforcement Effects 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 description 22
- 230000000052 comparative effect Effects 0.000 description 14
- 239000011889 copper foil Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- -1 polytetrafluoroethylene Polymers 0.000 description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- 239000003365 glass fiber Substances 0.000 description 9
- 239000002313 adhesive film Substances 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
- 230000003014 reinforcing effect Effects 0.000 description 6
- 239000004698 Polyethylene Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 229910000976 Electrical steel Inorganic materials 0.000 description 2
- 229910001335 Galvanized steel Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000008397 galvanized steel Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- 229910001208 Crucible steel Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229920003298 Nucrel® Polymers 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002990 reinforced plastic Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Landscapes
- Structure Of Printed Boards (AREA)
- Waveguides (AREA)
- Waveguide Aerials (AREA)
- Details Of Aerials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、衛星放送等の通信分野で使用される平面アン
テナ用基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a substrate for a flat antenna used in the communication field such as satellite broadcasting.
衛星放送等のアンテナとして使用されるマイクロ波用平
面アンテナは、誘電体の片面に導体としてｗ４箔等を用
い、これを回路加工し円形、方形、クランク形等の共振
器（放射器）やマイクロストリップラインを形成し、他
面に金属等の接地導体を配置した平板状の基板から構成
される。そして所望の利得や指向性を出すため共振器を
アレー化したりする。使用される誘電体は比誘電率（以
下ε、と略す）や誘電正接（以下ｔａｎδと略す）が小
さく高周波特性の良いことが要求される。Microwave flat antennas used as antennas for satellite broadcasting etc. use W4 foil etc. as a conductor on one side of a dielectric material, and the circuit is processed into a circular, rectangular, crank-shaped resonator (radiator) or micro It consists of a flat board on which a strip line is formed and a ground conductor made of metal or the like is placed on the other side. Then, in order to obtain desired gain and directivity, resonators are arranged into an array. The dielectric material used is required to have a small relative permittivity (hereinafter abbreviated as ε), a small dielectric loss tangent (hereinafter abbreviated as tanδ), and good high frequency characteristics.
そのため、従来、ε１の比較的小さいポリテトラフルオ
ロエチレン、ポリエチレン、ポリプロピレン、ポリスチ
レン、ポリイソブチレン、ポリメチルペンテン−１等の
樹脂を誘電体として使用したり、これらに熱的、機械的
な補強効果を発現させるためガラス繊維を埋設させ架橋
したり（例えは特開昭６０−２５３５２８号公報）、ガ
ラス繊維として石英ガラス繊維を使用したり （特開昭
５９−１０’９３４７号公報）、エポキシ樹脂等の誘電
体層にガラスバブル（微小中空球）を混入する方法（特
開昭６０−１６７３９４号公報）が提案されており、一
般にはポリエチレン、ポリテトラフルオロエチレンにガ
ラス繊維を複合し、両面に銅箔を積層した基板が高周波
用基板として汎用されている。しかしながら、これら従
来のものでは、伝送損失が大きいという問題点がある。Therefore, conventionally, resins such as polytetrafluoroethylene, polyethylene, polypropylene, polystyrene, polyisobutylene, and polymethylpentene-1, which have a relatively small ε1, have been used as dielectric materials, or they have been given thermal and mechanical reinforcement effects. To achieve this, glass fibers may be embedded and crosslinked (for example, JP-A-60-253528), quartz glass fibers may be used as glass fibers (JP-A-59-10'9347), epoxy resins, etc. A method of mixing glass bubbles (microscopic hollow spheres) into a dielectric layer has been proposed (Japanese Unexamined Patent Application Publication No. 167394/1983). Generally, glass fiber is composited with polyethylene or polytetrafluoroethylene, and copper is coated on both sides. A substrate made of laminated foil is commonly used as a high frequency substrate. However, these conventional devices have a problem in that transmission loss is large.
また日経エレクトロニクスＮ０．３４７号 １４５〜１
６０ページ（１９８４年、日経マグロウヒル社）に紹介
記載されているように衛星放送等のマイクロ波受信用平
面アンテナには、誘電体の片面の導体に共振器を多数個
配置し、電波電力を受信し、これらをマイクロストリッ
プラインで整合させ、１〜数箇所に集め同軸ケーブル等
でコンバーター、チューナー等へ導く方式が知られてい
る。しかし、この方法では、高周波電力が誘電体基板の
導体中を流れると表皮抵抗等のため減衰が大きく、共振
器の電波電力がストリップラインを伝搬する際の損失（
伝送損失）が大きくなってしまうという問題がある。こ
の問題点を解決する手段として、たとえば平面アンテナ
の開口部を数区画に分はストリップラインの長さを短く
して共振器からの電波電力をこれらの区画の中心に集め
、伝送損失の小さい導波管や同軸ケーブルによりこれら
の区画を結ぶ方法が考えられるが、この方法ではストリ
ップラインと導波管や同軸ケーブルの接続が複雑になり
、しかも工程数が多くなるという欠点がある。また別の
手段として、基板上に多数個の共振器を配し、これらを
マイクロストリ・ノブラインで結合し１箇所に集中させ
同軸ケーブルと結合する方法が望ましいと考えられるが
、この場合マイクロストリップラインの伝送損失の小さ
い基板としなければならない。Also Nikkei Electronics No. 0.347 145-1
As introduced on page 60 (1984, Nikkei McGraw-Hill Publishing), a flat antenna for receiving microwaves such as satellite broadcasting has a large number of resonators placed on a conductor on one side of a dielectric material to receive radio wave power. However, a method is known in which these signals are aligned using a microstrip line, collected at one or several locations, and guided to a converter, tuner, etc. using a coaxial cable or the like. However, with this method, when high-frequency power flows through the conductor of the dielectric substrate, there is large attenuation due to skin resistance, etc., and the loss (
There is a problem in that the transmission loss (transmission loss) becomes large. As a means to solve this problem, for example, the length of the stripline is shortened by dividing the aperture of the planar antenna into several sections, and the radio wave power from the resonator is concentrated in the center of these sections, thereby creating a conductor with low transmission loss. One possible method is to connect these sections using wave tubes or coaxial cables, but this method has the disadvantage that the connection between the strip line and the waveguide or coaxial cable becomes complicated and requires a large number of steps. As another method, it is considered desirable to arrange a large number of resonators on a board, connect them with a microstrip knob line, concentrate them in one place, and connect them to a coaxial cable, but in this case, the microstrip line The board must have low transmission loss.
すなわち、衛星放送の電波はＶＨＦ、ＵＨＦ帯の地上放
送の電波のように大電力化できず微弱であるため、アン
テナの利得を上げるうえでもさらに大幅に伝送損失の小
さい基板が要求されているのが現状である。In other words, since satellite broadcasting radio waves cannot be made to have as much power as terrestrial broadcasting radio waves in the VHF and UHF bands, and are weak, a board with significantly lower transmission loss is required to increase antenna gain. is the current situation.
また従来のアンテナ用基板においては、誘電体の一方の
側の導体面に共振器やストリップラインを形成すると、
形成した面の底に反りが発生するという問題点がある。In addition, in conventional antenna substrates, when a resonator or strip line is formed on the conductor surface on one side of the dielectric,
There is a problem that warpage occurs at the bottom of the formed surface.
この反りは受信電波に位相差を生じ好ましくない。この
アンテナ基板の反りは、誘電体中にガラス繊維を埋設し
ても発生する。This warpage causes a phase difference in the received radio waves, which is undesirable. This warping of the antenna substrate occurs even if glass fiber is embedded in the dielectric material.
そこで、この反りの防止および基板面の平行度を出すた
め、従来、導体、誘電体、接地導体を積層し、基板を作
製後、これに接地導体側から補強板を積層し、筐体にビ
スまたは嵌合せにより固定する方式が採用されている。Therefore, in order to prevent this warping and ensure parallelism of the board surface, conventionally, a conductor, dielectric, and ground conductor are laminated, and after the board is fabricated, a reinforcing plate is laminated from the ground conductor side, and the case is screwed. Alternatively, a method of fixing by fitting is adopted.
この補強板として、鉄、珪素鋼、アルミニウム、ステン
レス等汎用の金属板を使用したり、接地導体に補強板の
効果をもたせるために金属板を接地導体として使用する
方法があるが、この方法では金属の電気抵抗のため伝送
損失が大きくなったり、平面アンテナが重くなり、筐体
や取り付は治具を強固しなければならないという問題が
ある。また、補強板として、プラスチック等の絶縁体を
用いる方法もあるが、この場合には、アンテナの原理上
および使用するモードの固定のために用いられる導波管
や同軸ケーブルのシールド導体と接地導体との接続が困
難となるという問題点がある。さらに、この平面アンテ
ナの補強材として特開昭５９−６１２０３号公報、実開
昭５９−７６１１８号公報には、炭素繊維を樹脂に含浸
、硬化したハニカムサンドインチ構造体で作られる強化
プラスチック板を使用することが示されている。しかし
ながらこれらは高価な炭素繊維を使用するものであり、
多くの製造工程を要しコスト高となってしまうため、衛
星放送本体および中継用で大型アンテナ等の特殊なアン
テナとして有用であるが、衛星放送からの電波を受信す
る民生用、家庭用の受信アンテナとしてはあまりにも高
価なものとなり不向きであるなどの問題点があった。As this reinforcing plate, there is a method of using a general-purpose metal plate such as iron, silicon steel, aluminum, or stainless steel, or using a metal plate as a grounding conductor to give the grounding conductor the effect of a reinforcing plate. There are problems in that transmission loss increases due to the electrical resistance of the metal, the planar antenna becomes heavy, and the case and mounting jig must be made stronger. Another method is to use an insulator such as plastic as a reinforcing plate, but in this case, the shield conductor and ground conductor of the waveguide or coaxial cable used for the principle of the antenna and for fixing the mode to be used. There is a problem in that it is difficult to connect to the Furthermore, as a reinforcing material for this planar antenna, Japanese Unexamined Patent Application Publication No. 59-61203 and Japanese Utility Model Application No. 59-76118 disclose a reinforced plastic plate made of a honeycomb sandwich structure made by impregnating carbon fiber into resin and hardening it. indicated for use. However, these use expensive carbon fiber,
Since it requires many manufacturing processes and is expensive, it is useful as a special antenna such as a large antenna for satellite broadcasting itself and relay, but it is used for consumer and home reception to receive radio waves from satellite broadcasting. There were problems such as being too expensive and unsuitable as an antenna.
〔発明の目的〕
本発明は、前記事情に基づいてなされたものであり、そ
の目的は、基板の反りが実質的に生じず、導波管や同軸
ケーブルと接地導体との接続が容易であり、しかも、伝
送損失が大幅に低下しており、さらにコンパクトで収納
性が高く、軽量であるなどの特性上かつ実用上著しく優
れた高周波用アンテナ基板を提供することである。[Object of the Invention] The present invention has been made based on the above-mentioned circumstances, and its object is to provide a method that substantially prevents the substrate from warping and facilitates connection between a waveguide or coaxial cable and a ground conductor. Moreover, it is an object of the present invention to provide a high-frequency antenna substrate which has significantly reduced transmission loss, is compact, easy to store, and lightweight, and is extremely superior in terms of characteristics and practical use.
本発明者らは、前記問題点を解決すべく鋭意研究を重ね
た結果、導体、誘導体および接地導体から構成される高
周波用アンテナ基板において、接地導体として、直径３
ｆｉ以下の貫通孔を有する金属板の該貫通孔を含む表面
に接地導体が形成されている特定の構造を有する接地導
体を用いて構成されている高周波用アンテナ基板が、本
発明の目的達成に極めて有効であることを見出し、これ
らの知見に基づいて本発明を完成するに至った。As a result of extensive research to solve the above-mentioned problems, the present inventors have found that in a high-frequency antenna board composed of a conductor, an inductor, and a ground conductor, the ground conductor has a diameter of 3 mm.
To achieve the object of the present invention, a high frequency antenna board is constructed using a ground conductor having a specific structure in which a ground conductor is formed on the surface including the through hole of a metal plate having a through hole of less than or equal to fi. We have found that it is extremely effective, and have completed the present invention based on these findings.
すなわち本発明の高周波用アンテナ基板は、導体、誘電
体および接地導体から構成される高周波用アンテナ基板
において、接地導体として直径３鶴以下の貫通孔を有す
る金属板の貫通孔内表面を含む金属板表面に形成されて
いる銅または銀からなる接地導体を用い、導体、誘電体
および該接地導体を積層一体成形してなることを特徴と
する。That is, the high-frequency antenna board of the present invention is a high-frequency antenna board composed of a conductor, a dielectric material, and a ground conductor, and includes a metal plate having a through hole with a diameter of 3 cranes or less as the ground conductor. A ground conductor made of copper or silver is formed on the surface, and the conductor, dielectric, and the ground conductor are laminated and integrally molded.
次に、本発明の高周波用アンテナ基板を図に基づいて説
明する。第１図は、本発明の高周波用アンテナ基板の一
実施態様の主要部分の斜視図であり、１．２は導体に回
路を形成した後の共振器とストリップライン、３は誘電
体と導体または接地導体とを接着するための接着層であ
り、誘電体として作用する。４は誘電体、５は金属板、
６は金属板表面および貫通孔表面に形成した接地導体、
７は貫通孔を示す。第２図は第１図の高周波用アンテナ
基板の部分断面図を示したもので、符号は第１図と同じ
であり、８は銅箔等の導体を示す。Next, the high frequency antenna substrate of the present invention will be explained based on the drawings. FIG. 1 is a perspective view of the main parts of an embodiment of the high frequency antenna board of the present invention, 1.2 is a resonator and a strip line after forming a circuit on a conductor, 3 is a dielectric material and a conductor or This is an adhesive layer for bonding the ground conductor and acts as a dielectric. 4 is a dielectric, 5 is a metal plate,
6 is a ground conductor formed on the surface of the metal plate and the surface of the through hole;
7 indicates a through hole. FIG. 2 shows a partial cross-sectional view of the high-frequency antenna board of FIG. 1, where the reference numerals are the same as in FIG. 1, and 8 indicates a conductor such as copper foil.
金属板５には直径３寵以下の貫通孔７が設けられており
、この貫通孔７の表面と金属板５の両面には銅または銀
が施されて接地導体６が形成されており、導体８、誘電
体３．４、金属板表面に形成された接地導体６は積層一
体化されている。したかって、誘電体３側の接地導体６
は貫通孔５の表面に形成されている接地導体を通しても
う一方の基板外側表面の接地導体に導通するので同軸ケ
ーブルまたは導波管は、この外側表面の接地導体６の適
当な部位に接続すれば良く、したがってこれらは容易に
取付けることができるので作業性が著しく向上し、また
基板の伝送損失を低くすることができる。The metal plate 5 is provided with a through hole 7 having a diameter of 3 mm or less, and the surface of the through hole 7 and both surfaces of the metal plate 5 are coated with copper or silver to form a ground conductor 6. 8. The dielectric material 3.4 and the ground conductor 6 formed on the surface of the metal plate are laminated and integrated. Therefore, the ground conductor 6 on the dielectric 3 side
is connected to the ground conductor on the outer surface of the other board through the ground conductor formed on the surface of the through hole 5, so if the coaxial cable or waveguide is connected to an appropriate part of the ground conductor 6 on the outer surface. Therefore, since these can be easily installed, workability is significantly improved, and transmission loss of the board can be lowered.
本発明で用いられる金属板としては、炭素網、鋳鉄、鋳
鋼、ステンレス鋼、銅、銅合金（黄銅、リン青銅、洋白
、アルミニウム青銅）、亜鉛合金、珪素鋼、アルミニウ
ム、アルミニウム合金等の板を挙げることができる。こ
れらのうち、銅板への接地導体の形成は、通常必要ない
が銅板かりん脱酸銅の場合には銀で接地導体を形成する
方法が有効である。The metal plates used in the present invention include carbon mesh, cast iron, cast steel, stainless steel, copper, copper alloys (brass, phosphor bronze, nickel silver, aluminum bronze), zinc alloys, silicon steel, aluminum, aluminum alloy plates, etc. can be mentioned. Among these, forming a ground conductor on a copper plate is usually not necessary, but in the case of a copper plate or phosphor-deoxidized copper, it is effective to form a ground conductor with silver.
金属板の厚みは０．２〜３鶴のものが好適であり、基板
の反りを防止することができる。 金属板は一般に導体
であり、それ自身でも接地導体の役目を果たすが、これ
らは銅または銀より高い電気抵抗を示し、伝送損失に悪
影響を及ぼすため、金属板の表面に電気抵抗の低い銅ま
たは銀を形成する。The thickness of the metal plate is preferably 0.2 to 3 mm, and warpage of the substrate can be prevented. Metal plates are generally conductors and can serve as grounding conductors by themselves, but they have higher electrical resistance than copper or silver, which has a negative effect on transmission loss. form silver.
金属板に直径３鰭以下の貫通孔を設ける理由は、誘電体
、導体を積層し一体化して成形した基板の貫通孔部分に
対応した部位がへこむことを防止するためであり、直径
が３ｆｉより大きいと基板にへこみが発注する。貫通孔
はドリル、打抜き等によりあけることができ、貫通孔の
数は信頬性の面がら２個以上とすることが好ましい。金
属板はプレス等で絞り加工し、リブ等の加工を行い、補
強構造としてもよく、そうすることにより金属板の厚み
を薄くでき、軽量化が図れる。また穴加工、ネジ加工を
行い、筐体への取り付けを容易にしてもよい。また、立
体的に成形することによりコンバーター等の関連部品の
収納や取り付けが容易となり筐体の一部に使用できる。The reason why a through hole with a diameter of 3 fins or less is provided in a metal plate is to prevent the part corresponding to the through hole part of the board, which is formed by laminating and integrally forming a dielectric and a conductor, from being dented. If it is too large, it will cause a dent in the board. The through holes can be made by drilling, punching, etc., and the number of through holes is preferably two or more from the viewpoint of reliability. The metal plate may be drawn using a press or the like to form ribs or the like to form a reinforcing structure. By doing so, the thickness of the metal plate can be reduced and the weight can be reduced. Additionally, holes and screws may be processed to facilitate attachment to the housing. Furthermore, by forming the product three-dimensionally, it becomes easy to store and attach related parts such as a converter, and it can be used as part of a housing.
金属板への銅または銀からなる接地導体の形成は、通常
行われている方法で行えばよく、例えば、無電解メッキ
法、電気メツキ法、スパッタ法、電子ビーム蒸着法、抵
抗加熱蒸着法等が挙げられる。高周波電流は導体の表層
部を流れるので形成する接地導体の厚みは数μｍあれば
よく、金属板や形成する接地導体は平滑なことが望まし
い。A ground conductor made of copper or silver may be formed on a metal plate by a commonly used method, such as electroless plating, electroplating, sputtering, electron beam evaporation, resistance heating evaporation, etc. can be mentioned. Since the high frequency current flows through the surface layer of the conductor, the thickness of the ground conductor to be formed only needs to be several μm, and it is desirable that the metal plate and the ground conductor to be formed are smooth.
導体（１，２）としては電気抵抗の低い導体、たとえば
金、銀、銅、アルミニウム、ニッケル等が良好であり、
伝送損失を低下させる面から電気抵抗のより低い銀、銅
が好ましく、さらにコストの面から銅が特に好ましい。The conductors (1, 2) are preferably conductors with low electrical resistance, such as gold, silver, copper, aluminum, nickel, etc.
Silver and copper, which have lower electrical resistance, are preferred from the viewpoint of reducing transmission loss, and copper is particularly preferred from the viewpoint of cost.
導体は両面が平滑な１ 金属箔、特に両面が平
滑な銅箔が好ましく、中でも、たとえば圧延銅箔、無酸
素銅箔が好ましい。The conductor is preferably a metal foil with smooth surfaces on both sides, particularly a copper foil with smooth surfaces on both sides, and among them, for example, rolled copper foil or oxygen-free copper foil is preferable.
また高周波電流は導体の表層部を流れるので、接地導体
の厚みは数μｍあれば充分であり、厚すぎると反り易く
なるので適切な厚みに調整されていることが望ましい。Furthermore, since high-frequency current flows through the surface layer of the conductor, it is sufficient that the ground conductor has a thickness of several micrometers; if it is too thick, it will easily warp, so it is desirable to adjust the thickness to an appropriate value.
誘電体４としては、高周波用基板に多用されているポリ
テトラフルオロエチレンやポリエチレンにガラス繊維を
埋設させたものであっても良く、この他ポリオレフィン
、ポリスチレン等の樹脂なども好適に使用できる。中で
も伝送損失を低下させるためには、ε１やｔａｎδの値
ができるだけ小さい樹脂を使用することが望ましく、特
に好ましいものとして、たとえばε、やｔａｎδの小さ
い気体を含む発泡ポリオレフィンフオームまたはポリオ
レフィン粉末の焼結体などを挙げることができる。この
ような形態にすることによりε、やｔａｎδの値が小さ
くなって伝送損失が低下する効果が得られるばかりでな
く、他に誘電体の弾性率が低くなり、反りの防止効果が
著しく向上し、プラスチック成形品の肉厚を薄くできる
ので軽量化を図ることができ、またコスト的に有利にな
る。The dielectric 4 may be polytetrafluoroethylene, which is often used in high-frequency substrates, or polyethylene in which glass fibers are embedded, and other resins such as polyolefin and polystyrene can also be suitably used. Among these, in order to reduce transmission loss, it is desirable to use a resin with as small values of ε1 and tan δ as possible. Particularly preferable examples include sintering of foamed polyolefin foam or polyolefin powder containing gases with small ε and tan δ. Examples include the body. By adopting such a configuration, not only the values of ε and tan δ become smaller, thereby reducing the transmission loss, but also the elastic modulus of the dielectric material becomes lower, which significantly improves the warping prevention effect. Since the wall thickness of the plastic molded product can be reduced, the weight can be reduced, and it is also advantageous in terms of cost.
前記ポリオレフィンとしては、たとえばポリエチレン、
ポリプロピレン、ポリ−１−ブテン、ポ１ノー４−メチ
ルペンテン、ポリイソブチンなどのポリオレフィン単独
重合体、エチレン−プロピレン共重合体、エチレン−１
−ブテン共重合体、プロピレン−１−ブテン共重合体、
エチレン−酢酸ビニル共重合体、エチレン−スチレン共
重合体、のようなポリオレフィン共重合体およびこれら
の混合物よりなる樹脂組成物などを挙げることができる
。誘導体４と導体（１，２）および接地導体６は、接着
剤または接着フィルムなどの接着層を介して積層されて
いることが望ましい。これは導体のエツチングの際、エ
ツチング液が誘電体にしみ込むのを防止するのに有効な
ためである。接着層はその構造中に極性基を多数含むと
ε、、ｔａｎδが高くなることがある。そのような場合
、接着層の厚みは必要最小限にすることが望ましい。・
前記接着剤としては、たとえばアクリル樹脂、ポリエス
テル樹脂、ポリウレタン樹脂、フェノール樹脂、エポキ
シ樹脂、クロロブレンゴム、ニトリルゴム、エポキシフ
ェノール、ブチラールフェノール、ニトリルフェノール
等が挙げられる。また、接着フィルムとして（１）エチ
レン−酢酸ビニル共重合体、エチレン−アクリル酸エス
テル共重合体、エチレン−アクリル酸共重合体、エチレ
ン−７レイン酸共重合体、エチレン−無水マレイン酸グ
ラフト化重合体、エチレン−メタクリル酸グリシジル−
酢酸ビニル三元共重合体、アイオノマー重合体などのよ
うにポリオレフィンにα、β−不飽和カルボン酸、また
はそのエステル、その無水物もしくはその金属塩あるい
は飽和有機カルボン酸を通常の共重合またはグラフト共
重合させて得た共重合体、（ＩＦ）ポリオレフィンと前
記（Ｉ）の共重合体の混合物、（ＤＩ）ポリオレフィン
に粘着付与剤等を配合した接着性配合物を挙げることが
できる。Examples of the polyolefin include polyethylene,
Polyolefin homopolymers such as polypropylene, poly-1-butene, poly-1-4-methylpentene, polyisobutyne, ethylene-propylene copolymers, ethylene-1
-butene copolymer, propylene-1-butene copolymer,
Examples include resin compositions made of polyolefin copolymers such as ethylene-vinyl acetate copolymers, ethylene-styrene copolymers, and mixtures thereof. The dielectric 4, the conductors (1, 2), and the ground conductor 6 are preferably laminated with an adhesive layer such as an adhesive or an adhesive film interposed therebetween. This is because it is effective in preventing the etching solution from seeping into the dielectric material when etching the conductor. If the adhesive layer contains a large number of polar groups in its structure, ε and tan δ may become high. In such cases, it is desirable to minimize the thickness of the adhesive layer.・
Examples of the adhesive include acrylic resin, polyester resin, polyurethane resin, phenol resin, epoxy resin, chloroprene rubber, nitrile rubber, epoxy phenol, butyral phenol, nitrile phenol, and the like. In addition, as an adhesive film, (1) ethylene-vinyl acetate copolymer, ethylene-acrylic ester copolymer, ethylene-acrylic acid copolymer, ethylene-7leic acid copolymer, ethylene-maleic anhydride grafted polymer combination, ethylene-glycidyl methacrylate-
Conventional copolymerization or graft copolymerization of α, β-unsaturated carboxylic acids, their esters, their anhydrides, their metal salts, or saturated organic carboxylic acids to polyolefins such as vinyl acetate terpolymers and ionomer polymers. Examples include a copolymer obtained by polymerization, a mixture of (IF) polyolefin and the copolymer of (I), and an adhesive composition prepared by blending (DI) polyolefin with a tackifier or the like.
導体、誘電体、金属板表面に形成した接地導体の積層一
体化は、例えば金属板表面に形成した接地導体上に、接
着層、誘電体、接着層、導体の順序に積層し、加熱プレ
スすることにより容易に積層一体化することができる。To integrate the lamination of a conductor, a dielectric material, and a ground conductor formed on the surface of a metal plate, for example, the adhesive layer, dielectric material, adhesive layer, and conductor are laminated in this order on the ground conductor formed on the surface of the metal plate, and then heated and pressed. This allows for easy lamination and integration.
本発明の高周波用アンテナ基板は貫通孔を設けた金属板
を用いており、その貫通孔を含む金属板表面に銅または
銀の接地導体が形成されている特定の構造の接地導体付
金属板、誘電体、導体を積層一体化した構成となってい
るので、導体に回路パターンを形成した後の基板の反り
を金属板の補強により防止することができ、かつ同軸ケ
ーブルまたは導波管と接地導体の結合は、誘電体に隣接
する接地導体がプラスチック成形品に設けた貫通孔上に
形成された接地導体を通してもう一方の接地導体に導通
しているので、同軸ケーブルのシールド導体や導波管の
筐体導電部と接地導体を容易に結合させることができ、
作業性が著しく向上する。さらに接地導体に電気抵抗の
低い導体を使用しているので、伝送損失が低下し、また
、誘電体として、ε１やｔａｎδの小さい発泡ポリオレ
フィンフオーム、またはポリオレフィン粉末の焼結体を
使用すれば、さらに伝送損失を大幅に低下させることが
できる。The high frequency antenna board of the present invention uses a metal plate provided with a through hole, and a metal plate with a ground conductor having a specific structure in which a copper or silver ground conductor is formed on the surface of the metal plate including the through hole, Since the dielectric material and the conductor are integrated into a laminated structure, it is possible to prevent the board from warping after forming the circuit pattern on the conductor by reinforcing the metal plate. In this connection, the ground conductor adjacent to the dielectric is connected to the other ground conductor through the ground conductor formed on the through hole in the plastic molded product, so it is difficult to connect the shield conductor of the coaxial cable or the waveguide. The conductive part of the casing and the ground conductor can be easily connected.
Work efficiency is significantly improved. Furthermore, since a conductor with low electrical resistance is used for the grounding conductor, transmission loss is reduced, and if foamed polyolefin foam or sintered polyolefin powder with small ε1 and tanδ is used as the dielectric, it is even more effective. Transmission loss can be significantly reduced.
実施例１
厚さ０．６ ｔｍの溶融亜鉛メッキ鋼板にドリルで１１
Ｎφの貫通孔を４カ所設け、常法に従い電気銅メッキを
行い、厚さ約５μｍの銅メツキ接地導体を形成した。次
に、この上に接着フィルム〔ニュクレル０９０８Ｃ（２
５μｍ、三井デュポンポリケミカル株式会社商品名、エ
チレンメタアクリル酸共重合体）〕、誘電体〔１０倍発
発泡橋ポリエチレンフオーム、ハイエチレンＳ（Ｉｍ、
日立化成工業株式会社商品名）〕、接着フィルムにュク
レル０９０８Ｃ）、圧延銅箔（３５μｍ、日本鉱業株式
会社製）をこの順序に積層し、接着フィルムとフオーム
の誘電体厚みが０．７〜０．８ｗになるよう１２０℃で
１０分間プレスし、積層一体化した高周波用アンテナ基
板を得た。Example 1 Drill 11 on a 0.6 tm thick hot-dip galvanized steel plate.
Four Nφ through-holes were provided, and electrolytic copper plating was performed according to a conventional method to form a copper-plated ground conductor with a thickness of approximately 5 μm. Next, apply an adhesive film [Nucrel 0908C (2) on top of this.
5μm, Mitsui DuPont Polychemical Co., Ltd. trade name, ethylene methacrylic acid copolymer)], dielectric [10 times expanded bridge polyethylene foam, high ethylene S (Im,
Hitachi Chemical Co., Ltd. (product name)], Cuclell 0908C), and rolled copper foil (35 μm, manufactured by Nippon Mining Co., Ltd.) are laminated on the adhesive film in this order, and the dielectric thickness of the adhesive film and foam is 0.7 to 0. Pressing was carried out at 120° C. for 10 minutes to obtain a high frequency antenna substrate of .8W.
比較例１
厚さ０．６ ｔｍの溶融亜鉛メッキ鋼板にドリルで５１
１φの貫通孔を４カ所設け、これに実施例１と同じ接着
フィルム、フオーム、圧延銅箔を積層一体化して高周波
用アンテナ基板を得た。Comparative Example 1 51 mm with a drill on a hot-dip galvanized steel plate with a thickness of 0.6 tm
Four 1φ through holes were provided, and the same adhesive film, foam, and rolled copper foil as in Example 1 were laminated and integrated to obtain a high frequency antenna substrate.
Ｇ
比較例２
厚さ１ｆｉのアルミニウム板にドリルで３鶴φの穴を４
ケ所設けたこと以外は比較例１と同様にして高周波用ア
ンテナ基板を得た。G Comparative Example 2 Drill 4 holes of 3mm diameter in an aluminum plate with a thickness of 1fi.
A high-frequency antenna substrate was obtained in the same manner as in Comparative Example 1 except that the antenna substrate was provided in the following places.
比較例３
実施例１で使用した接着フィルム、フオーム、圧延銅箔
を用い、このフオームの両面に接着フィルムにュクレル
０９０８Ｃ，２５μｍ）を介して圧延銅箔（３５μｍ）
を積層し、１２０℃で５分間プレスし、積層一体化した
高周波用アンテナ基板を得た。Comparative Example 3 Using the adhesive film, foam, and rolled copper foil used in Example 1, a rolled copper foil (35 μm) was applied to both sides of the foam via an adhesive film of Cuclell 0908C (25 μm).
were laminated and pressed at 120° C. for 5 minutes to obtain an integrated laminated high-frequency antenna substrate.
比較例４
ガラス繊維を１０重量％含むガラス繊維強化ポリ−４−
メチルペンテン−１（ＦＲ−ＴＰＸ Ｔ１１０（三井
石油化学工業株式会社商品名）〕を用いプレスにより２
６０℃で成形を行い、厚さ０゜７Ｎのシートを得た。比
較例３のフオームをＦＲ−ＴＰＸ Ｔｌｌ０のシート
とした以外比較例３ Ｏ
と同様にして高周波用アンテナ基板を得た。Comparative Example 4 Glass fiber reinforced poly-4- containing 10% by weight of glass fibers
2 by pressing using methylpentene-1 (FR-TPX T110 (trade name of Mitsui Petrochemical Industries, Ltd.)).
Molding was carried out at 60°C to obtain a sheet with a thickness of 0°7N. A high frequency antenna substrate was obtained in the same manner as in Comparative Example 3 O except that the form of Comparative Example 3 was replaced with a sheet of FR-TPX Tll0.
実施例１、比較例１〜４で作製した基板のε。ε of the substrates produced in Example 1 and Comparative Examples 1 to 4.
、伝送損失、導体（銅箔）を全面エツチングした後の３
００ｆｉスパン間の反り量、金属板に設けた貫通孔によ
る基板のへこみの影響を第１表にまとめて示した。, transmission loss, after fully etching the conductor (copper foil) 3
Table 1 summarizes the amount of warpage between the 00fi spans and the influence of the dent in the substrate due to the through hole provided in the metal plate.
ε、はＡＳＴＭ Ｄ３３８０により測定した。ε was measured according to ASTM D3380.
伝送損失はマイクロストリップラインの特性インピーダ
ンスが５０±５Ωになるよう基板の導体（銅箔）をエツ
チングしストリップラインを形成し、スイープジェネレ
ータ、スカラーネットワークアナライザーにより常法で
測定した。測定周波数は１２ＧＨｚで行った。反りは基
板をつるし、直線定規を凹面にあて、定規と凹面との距
離の最大値を測定し、これを反り量とした。The transmission loss was measured by etching the conductor (copper foil) of the substrate to form a strip line so that the characteristic impedance of the microstrip line was 50±5Ω, and using a sweep generator and a scalar network analyzer in a conventional manner. The measurement frequency was 12 GHz. To determine the warpage, the board was suspended, a straight line ruler was placed on the concave surface, and the maximum distance between the ruler and the concave surface was measured, and this was taken as the amount of warp.
以下余白
第１表に示したように、金属板に貫通孔を設け、その表
面に接地導体を形成し、誘電体、導体を積層し一体成形
した実施例１では、比較例１および２と同様、金属板を
使用することでエツチング後の反りを防止できる。比較
例３および４はエツチング前はいずれも反り量は零であ
ったが、両面銅張り積層板の一方の銅箔を接地導体にし
、これにマスク用のフィルムを貼着し、もう一方の導体
に回路パターンを形成することを想定し全面をエツチン
グ除去すると、比較例４ではガラス繊維が１０％混入さ
れ強化されているにもかかわらず、反り量が８ｆｉと大
きな値を示した。比較例３では基板がカールし巻物状と
なり反り量が測定できなかったＯ
アンテナ基板の重要特性である伝送損失は導体（銅箔）
が同じであるにもかかわらず、接地導体の影響を受け、
本発明の金属板上に銅を形成して得られた接地導体を用
いたものは伝送損失が著しく低く、比較例１および２の
金属板のみの使用の場合、伝送損失は高くなった。また
、伝送損失はε１の低いフオームを使用することより、
著しく低下している。また、貫通孔による基板のへこみ
の影響は貫通孔の直径が３鶴以下（実施例１および比較
例２）ではへこみがなくその影響はないが、直径５ｍ（
比較例１）にするとへこみが生じた。As shown in Table 1 below, in Example 1, a through hole was provided in a metal plate, a ground conductor was formed on the surface of the metal plate, and a dielectric and a conductor were laminated and integrally molded. By using a metal plate, warping after etching can be prevented. In Comparative Examples 3 and 4, the amount of warpage was zero before etching, but one copper foil of the double-sided copper-clad laminate was used as a ground conductor, a masking film was attached to this, and the other conductor was When the entire surface was etched away with the assumption that a circuit pattern would be formed on it, the amount of warpage in Comparative Example 4 was as large as 8fi, even though 10% glass fiber was mixed in and reinforced. In Comparative Example 3, the board curled into a scroll shape and the amount of warpage could not be measured.O Transmission loss, which is an important characteristic of antenna boards, is caused by the conductor (copper foil).
Even though they are the same, they are affected by the ground conductor,
The transmission loss was extremely low when using the ground conductor obtained by forming copper on the metal plate of the present invention, and when only the metal plates of Comparative Examples 1 and 2 were used, the transmission loss was high. In addition, transmission loss can be reduced by using a form with low ε1.
It has decreased significantly. In addition, the influence of the dent in the substrate due to the through hole is that when the diameter of the through hole is 3 m or less (Example 1 and Comparative Example 2), there is no dent and there is no effect, but when the diameter of the through hole is 5 m (
Comparative Example 1) caused dents.
本発明によると、基板の反りが実質的に生ぜず、導波管
や同軸ケーブルと接地導体との接続が容易であり、しか
も、伝送損失が大幅に低下しており、さらにコンパクト
で収納性が高く、軽量であるなどの特性上かつ実用上著
しく優れた高周波用アンテナ基板を提供することができ
る。According to the present invention, there is virtually no warpage of the board, it is easy to connect the waveguide or coaxial cable to the ground conductor, transmission loss is significantly reduced, and it is compact and easy to store. It is possible to provide a high-frequency antenna substrate that is highly superior in terms of characteristics such as high price and light weight, and is excellent in practical use.
第１図は本発明の高周波用アンテナ基板の一実施態様の
主要部分の斜視図であり、第２図はその部分断面図であ
る。
符号の説明
１ 導体（共振器）
２ 導体（マイクロストリップライン）３ 接着層
４ 誘電体
５ 金属板 ６ 接地導体
７ 貫通孔 ８ 導体FIG. 1 is a perspective view of the main parts of an embodiment of the high frequency antenna board of the present invention, and FIG. 2 is a partial sectional view thereof. Explanation of symbols 1 Conductor (resonator) 2 Conductor (microstrip line) 3 Adhesive layer
4 Dielectric 5 Metal plate 6 Ground conductor 7 Through hole 8 Conductor
Claims (1)
用アンテナ基板において、接地導体として、直径３ｍｍ
以下の貫通孔を有する金属板の貫通孔内表面を含む金属
板表面に形成されている銅または銀からなる接地導体を
用い、導体、誘電体および該接地導体を積層一体化して
なることを特徴とする高周波用アンテナ基板。 ２、誘電体が発泡ポリオレフィンフォームまたはポリオ
レフィン粉末の焼結体である特許請求の範囲第１項また
は第２項記載の高周波用アンテナ基板。 ３、誘電体が、導体および接地導体に接着層を設けて接
着されている特許請求の範囲第１項または第２項記載の
高周波用アンテナ基板。[Claims] 1. In a high-frequency antenna board composed of a conductor, a dielectric material, and a ground conductor, the ground conductor has a diameter of 3 mm.
A ground conductor made of copper or silver is formed on the surface of a metal plate including the inner surface of the through hole of a metal plate having the following through holes, and the conductor, dielectric material, and the ground conductor are laminated and integrated. High frequency antenna board. 2. The high frequency antenna substrate according to claim 1 or 2, wherein the dielectric material is a sintered body of expanded polyolefin foam or polyolefin powder. 3. The high frequency antenna substrate according to claim 1 or 2, wherein the dielectric is bonded to the conductor and the ground conductor by providing an adhesive layer thereon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62110348A JPS63275205A (en) | 1987-05-06 | 1987-05-06 | One body molded product of antenna substrate for high frequency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62110348A JPS63275205A (en) | 1987-05-06 | 1987-05-06 | One body molded product of antenna substrate for high frequency |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63275205A true JPS63275205A (en) | 1988-11-11 |
Family
ID=14533480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62110348A Pending JPS63275205A (en) | 1987-05-06 | 1987-05-06 | One body molded product of antenna substrate for high frequency |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63275205A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0583024A (en) * | 1991-09-20 | 1993-04-02 | Matsushita Electric Ind Co Ltd | Microstrip antenna |
-
1987
- 1987-05-06 JP JP62110348A patent/JPS63275205A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0583024A (en) * | 1991-09-20 | 1993-04-02 | Matsushita Electric Ind Co Ltd | Microstrip antenna |
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