JPS63275152A - Socket for ic - Google Patents
Socket for icInfo
- Publication number
- JPS63275152A JPS63275152A JP11180587A JP11180587A JPS63275152A JP S63275152 A JPS63275152 A JP S63275152A JP 11180587 A JP11180587 A JP 11180587A JP 11180587 A JP11180587 A JP 11180587A JP S63275152 A JPS63275152 A JP S63275152A
- Authority
- JP
- Japan
- Prior art keywords
- lid
- main body
- failure analysis
- socket
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004458 analytical method Methods 0.000 abstract description 8
- 239000008188 pellet Substances 0.000 abstract description 6
- 239000000919 ceramic Substances 0.000 abstract description 2
- 230000002950 deficient Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Connecting Device With Holders (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はＩＣ用ソケットに関し、特にフラットパッケー
ジＩＣのＩＣ用ソケットに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC socket, and particularly to an IC socket for a flat package IC.
従来、この種のＩＣ用ソケットは、第２図に示すように
、ＩＣ４を動作させるためにＩＣ４を本体部２に載せＩ
Ｃピンと本体部２のリードとの接触を保つように、厚い
蓋６でＩＣ４をおさえていた。Conventionally, as shown in FIG. 2, in this type of IC socket, an IC 4 is placed on a main body 2 in order to operate the IC 4.
The IC 4 was held down with a thick lid 6 to maintain contact between the C pin and the lead of the main body 2.
近年、半導体集積回路は拡散プロセスの微細化、高集積
化にともなって、ＩＣの不良解析はきわめて困難さを深
めている。このための解析手法として、ＩＣを動作させ
て不良箇所（欠陥）を特定する手法が増加している。In recent years, with the miniaturization of diffusion processes and higher integration of semiconductor integrated circuits, failure analysis of ICs has become extremely difficult. As an analysis method for this purpose, a method of operating an IC to identify a defective location (defect) is increasing.
なお、ＩＣを動作させて解析する不良モードとしては、
ラッチアップ及びＥＳＤ破壊、リーク不良等があり、不
良箇所の特定はペレット表面を観察して行っている。The failure modes for operating and analyzing the IC are as follows:
There are latch-up, ESD damage, leakage defects, etc., and defective locations are identified by observing the pellet surface.
従来のＩＣ用ソケットでは、ソケットの蓋が厚いため動
作させた際にペレット上の観察を高倍率レンズを用いて
はレンズの焦点距離が確保できず観察できない。又、長
焦点レンズもあるが、標準レンズに比べて高価である。In conventional IC sockets, the lid of the socket is thick, so when the socket is operated, the pellet cannot be observed using a high-magnification lens because the focal length of the lens cannot be secured. There are also long focal length lenses, but they are more expensive than standard lenses.
このように、従来のＩＣ用ソケットでは不良解析がむつ
かしいという欠点がある。As described above, conventional IC sockets have the disadvantage that failure analysis is difficult.
本発明のＩＣ用ソケットは、ＩＣを搭載する本体部と、
該本体部の上面に設ける前記本体部を固定する蓋とを備
えるＩＣ用ソケットにおいて、前記蓋は前記ＩＣのリー
ド導出辺に対向する辺が前記ＩＣの搭載時の上面より低
くなる厚みを有している。The IC socket of the present invention includes a main body portion on which an IC is mounted;
In the IC socket, the IC socket includes a lid provided on the top surface of the main body for fixing the main body, the lid having a thickness such that a side facing a lead-out side of the IC is lower than the top surface when the IC is mounted. ing.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の分解斜視図である。FIG. 1 is an exploded perspective view of an embodiment of the present invention.
第１図に示すように、本体部１には不良解析を行うＩＣ
（ｉないのセラミックパッケージ又は開封されたモール
ドパッケージ）３が搭載される。As shown in Fig. 1, the main body 1 includes an IC for failure analysis.
(ceramic package or opened mold package) 3 is mounted.
蓋５は、本体部１の上面に設けた凸部１１及び凹部１２
と蓋５の下面側に設けた対応する凹部５２及び凸部５１
とが、互いにはめこまれて本体部１に固定される。The lid 5 includes a convex portion 11 and a concave portion 12 provided on the upper surface of the main body 1.
and a corresponding concave portion 52 and convex portion 51 provided on the lower surface side of the lid 5.
are fitted into each other and fixed to the main body part 1.
この場合、搭載されたＩＣ３の上面がＩＣ３のリード導
出辺に対向する蓋５の段部７の高さより高くなるように
段部７の厚さが設定されている。In this case, the thickness of the step 7 is set so that the top surface of the mounted IC 3 is higher than the step 7 of the lid 5 facing the lead-out side of the IC 3.
従って、前述したＩＣ動作時のＩＣペレット表面の状態
の観察を高倍率のレンズで行うことができる。Therefore, the condition of the surface of the IC pellet during the above-mentioned IC operation can be observed using a high-magnification lens.
なお、実施例では２辺からリードが導出されるＩＣにつ
いて説明したが、４辺からリードが導出されるＩＣに対
しても同様に本発明を適用できる。In the embodiment, an IC in which leads are derived from two sides has been described, but the present invention can be similarly applied to an IC in which leads are derived from four sides.
以上説明したように本発明は、ＩＣ（特にミニフラット
及びフラットパッケージＩＣ）の不良解析において、搭
載されたＩＣの表面より蓋のＩＣリード導出辺に対向す
る辺の高さを低くすることにより、ＩＣ動作時のペレッ
ト表面観察を通常の高倍率のレンズで行うことができる
ので、不良箇所の特定が容易になるという効果がある。As explained above, in failure analysis of ICs (particularly mini-flat and flat package ICs), the present invention is capable of improving Since the pellet surface can be observed using a normal high-magnification lens during IC operation, there is an effect that it becomes easier to identify defective locations.
第１図は本発明の第１の実施例の分解斜視図、第２図は
従来のＩＣ用ソケットの一例の断面図である。
１．２・・・本体部、３．４・・・ＩＣ２５，６・・・
蓋、７・・・段部、１１．５１・・・凸部、１２．５２
・・・凹部。FIG. 1 is an exploded perspective view of a first embodiment of the present invention, and FIG. 2 is a sectional view of an example of a conventional IC socket. 1.2... Main body, 3.4... IC25, 6...
Lid, 7... Step part, 11.51... Convex part, 12.52
...concavity.
Claims (1)
本体部を固定する蓋とを備えるＩＣ用ソケットにおいて
、前記蓋は前記ＩＣのリード導出辺に対向する辺が前記
ＩＣの搭載時の上面より低くなる厚みを有することを特
徴とするＩＣ用ソケット。In an IC socket comprising a main body for mounting an IC and a lid for fixing the main body provided on the upper surface of the main body, the lid has a side opposite to a lead lead-out side of the IC when the IC is mounted. An IC socket characterized by having a thickness lower than the top surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11180587A JPS63275152A (en) | 1987-05-07 | 1987-05-07 | Socket for ic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11180587A JPS63275152A (en) | 1987-05-07 | 1987-05-07 | Socket for ic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63275152A true JPS63275152A (en) | 1988-11-11 |
Family
ID=14570600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11180587A Pending JPS63275152A (en) | 1987-05-07 | 1987-05-07 | Socket for ic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63275152A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5646443A (en) * | 1993-10-15 | 1997-07-08 | Nec Corporation | Semiconductor package |
-
1987
- 1987-05-07 JP JP11180587A patent/JPS63275152A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5646443A (en) * | 1993-10-15 | 1997-07-08 | Nec Corporation | Semiconductor package |
| US5789812A (en) * | 1993-10-15 | 1998-08-04 | Nec Corporation | Semiconductor package |
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