JPS63269538A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS63269538A JPS63269538A JP10506487A JP10506487A JPS63269538A JP S63269538 A JPS63269538 A JP S63269538A JP 10506487 A JP10506487 A JP 10506487A JP 10506487 A JP10506487 A JP 10506487A JP S63269538 A JPS63269538 A JP S63269538A
- Authority
- JP
- Japan
- Prior art keywords
- film
- psg
- silicon nitride
- protective film
- bonding pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 14
- 230000001681 protective effect Effects 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 239000005368 silicate glass Substances 0.000 claims description 4
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 abstract description 14
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 12
- 229910052782 aluminium Inorganic materials 0.000 abstract description 12
- 238000005530 etching Methods 0.000 abstract description 3
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 1
- 230000035515 penetration Effects 0.000 abstract 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- 238000002161 passivation Methods 0.000 description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- -1 silicon nitrides Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Formation Of Insulating Films (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置に関し、特にボンディングバット部
のパッシベーション膜の構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, and particularly to the structure of a passivation film in a bonding butt portion.
半導体装置は特性安定化のため通常半導体素子表面にパ
ッシベーション膜を備えている0例えば、従来のパッシ
ベーション膜は、第2図に示すように、シリコン基板1
の上に半導体素子を形成した後、ボンディングパッド用
アルミ膜2を形成し、その上部に燐シリケートガラス膜
(以下PSG膜という)3を被着させる。このPSG膜
3が耐湿性の点で劣るのを補うために、このPSG膜3
の上を窒化シリコン(SiN4)膜4のような高耐湿性
保護膜で被覆し、これらをフォトレジストをマスクとし
て選択的にエツチングし、ボンディング用開口部を形成
している。Semiconductor devices usually include a passivation film on the surface of the semiconductor element in order to stabilize the characteristics.
After forming a semiconductor element thereon, an aluminum film 2 for a bonding pad is formed, and a phosphorus silicate glass film (hereinafter referred to as a PSG film) 3 is deposited on top of the aluminum film 2. In order to compensate for the inferiority of this PSG film 3 in terms of moisture resistance, this PSG film 3
A highly moisture-resistant protective film such as a silicon nitride (SiN4) film 4 is coated on top of the film, and this is selectively etched using a photoresist as a mask to form a bonding opening.
このボンディングパッド開口部のPSG膜3の側面は、
高耐湿性保護膜が被覆されておらずむき出しとなってい
た。The side surface of the PSG film 3 at this bonding pad opening is
The highly moisture-resistant protective film was not covered and was exposed.
上述した従来の構造では、パッシベーション膜の上面は
水分に対する充分な素子力を有するが、その側面はPS
G膜3の端面が露出しており、水分の素子力は必ずしも
完全とはいえかいため、水分がPSGSaO2まり、リ
ン酸(82PO4)が生成され、ボンディングパッド部
のアルミJfi 2を溶かしてしまうという欠点がある
。そのため半導体装置の信頼性を著しく低下させてしま
う大きな要因となっていた。In the conventional structure described above, the upper surface of the passivation film has sufficient element strength against moisture, but the side surface has sufficient resistance to moisture.
The end face of the G film 3 is exposed, and the elemental force of moisture is not necessarily perfect, so the moisture collects PSGSaO2, generates phosphoric acid (82PO4), and dissolves the aluminum Jfi 2 in the bonding pad area. There are drawbacks. This has been a major factor in significantly reducing the reliability of semiconductor devices.
本発明の目的は、このような欠点を除き、パッシベーシ
ョン膜側面からの水分の浸入を防止し、信頼性を高めた
半導体装置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to eliminate such drawbacks, prevent moisture from entering from the side surfaces of the passivation film, and provide a semiconductor device with improved reliability.
本発明の構成は、基板上に導電性膜のパターンを設け、
この導電性膜を含む基板上に燐シリケートガラス等の第
1の表面保護膜を設け、この第1の表面保護膜に開口さ
れたボンディングパッド部を設け、前記第1の表面保護
膜上に高耐湿性の第2の表面保護膜が前記第1の表面保
護膜の開口部側面を含むこの第1の表面保護膜全面に被
覆されたことを特徴とする。The structure of the present invention includes providing a pattern of a conductive film on a substrate,
A first surface protection film made of phosphorous silicate glass or the like is provided on the substrate including the conductive film, a bonding pad portion having an opening is provided in the first surface protection film, and a high The present invention is characterized in that a moisture-resistant second surface protection film is coated on the entire surface of the first surface protection film, including the side surfaces of the openings of the first surface protection film.
次に本発明を図面により詳細に説明する。 Next, the present invention will be explained in detail with reference to the drawings.
第1図は本発明の一実施例の半導体装置のボンディング
パッド部を示す縦断面図である0本実施例のボンディン
グパッド用アルミ膜2は、基板1上に形成され、PSG
SaO2なる第1の保護膜でボンディングパッド部を除
いて全面が被着されている。更に、窒化シリコン膜4の
第2の保護膜によりPSG膜3上にこのPSGSaO2
面をも包みこむ様に被覆し、PSGSaO2面からの水
分の浸入を防止している。FIG. 1 is a vertical cross-sectional view showing a bonding pad portion of a semiconductor device according to an embodiment of the present invention.A bonding pad aluminum film 2 of this embodiment is formed on a substrate 1, and a PSG
A first protective film made of SaO2 is coated over the entire surface except for the bonding pad portion. Furthermore, this PSGSaO2 is formed on the PSG film 3 by the second protective film of the silicon nitride film 4.
It covers the entire surface of the PSGSaO2 surface to prevent moisture from entering from the surface.
この構造は、まず基板1上に半導体素子を製作し、その
上に保護膜となるPSGSaO200〜10000人成
長させ、ボンディングワイヤをボンディングパッド用ア
ルミM2に圧着させる開口部を作る。そのためPSGS
aO2にレジストを塗布し露光・現像を加え、ボンディ
ングパッド用アルミM2上のレジストを除去する。その
後、弗酸系の薬液によりボンディングパッド用アルミ股
上のPSGSaO2ツチングし、更にレジストを全面剥
離した後に窒化シリコン4を500〜10000人成長
させる。この窒化シリコン膜4の上にレジストを塗布後
、PSG[4のエツチング開口部よりも小さい開口部の
マスクを使用し、露光・現像を加え、そのレジストをマ
スクとして窒化シリコン膜4をPSGSaO2より横方
向に窒化シリコン膜4の成長膜厚より1.5倍以上残る
様にエツチングし、その後レジストを全面剥離すること
により得られる。In this structure, a semiconductor element is first manufactured on a substrate 1, 200 to 10,000 PSGSaO layers are grown thereon to serve as a protective film, and an opening is created for bonding a bonding wire to an aluminum M2 for a bonding pad. Therefore, PSGS
A resist is applied to aO2, exposed and developed, and the resist on the bonding pad aluminum M2 is removed. Thereafter, PSGSaO2 is applied to the aluminum crotch for the bonding pad using a hydrofluoric acid-based chemical solution, and after the resist is removed from the entire surface, 500 to 10,000 silicon nitrides 4 are grown. After applying a resist on this silicon nitride film 4, exposure and development are performed using a mask with an opening smaller than the etching opening of PSG[4. This is obtained by etching the silicon nitride film 4 so that it remains 1.5 times or more thicker than the grown silicon nitride film 4, and then peeling off the resist on the entire surface.
以上説明したように本発明は、PSGSaO2面を高耐
湿性保護膜の窒化膜シリコン(Si3N4)4等により
覆うことにより、ボンディングパッド部のPSG膜側面
側面の水分の浸入を防止する効果がある。このためPS
GSaO2分が浸入してPSG膜内の化学反応でリン酸
等が生成されることがなく、ボンディングパッド部や内
部のアルミニウム等が溶かされてボンディングパッドの
アルミの消失及び内部配線の断面等が発生するのを防止
する効果がある。As described above, the present invention has the effect of preventing moisture from penetrating into the side surfaces of the PSG film in the bonding pad portion by covering the PSGSaO2 surface with a silicon nitride film (Si3N4)4 or the like as a highly moisture-resistant protective film. For this reason, P.S.
GSaO2 does not infiltrate and generate phosphoric acid, etc. due to chemical reactions within the PSG film, and the bonding pads and internal aluminum are melted, causing loss of aluminum from bonding pads and cross sections of internal wiring. It has the effect of preventing
例えば、従来では1〜3気圧、100〜150℃、相対
湿度100%下での保管状態で500時間経過後、パッ
ド周辺部からの水分の浸入によりPSG膜でリン酸が反
応生成されアルミニウムが溶かされ、内部配線が断線す
るという事例が、半導体装置保管数に対してlppm程
度発生していた。一方、本発明の構造では、同様の保管
状態において半導体装置には不良が発生することはなか
った。従って、本発明によれば高信頼性の半導体装置が
得られる。For example, conventionally, after 500 hours of storage at 1 to 3 atmospheres, 100 to 150 degrees Celsius, and 100% relative humidity, phosphoric acid is reacted and generated in the PSG film due to moisture intrusion from the periphery of the pad, and the aluminum is dissolved. As a result, the number of internal wiring breakages occurred approximately 1 ppm relative to the number of semiconductor devices stored. On the other hand, with the structure of the present invention, no defects occurred in the semiconductor device under similar storage conditions. Therefore, according to the present invention, a highly reliable semiconductor device can be obtained.
第1図は本発明の一実施例の縦断面図、第2図は従来の
半導体装置の一例の縦断面図である。
1・・・基板、2・・・ボンディングパッド用アルミ膜
、3・・・燐シリケートガラス膜、4・・・窒化シリコ
ン膜。FIG. 1 is a longitudinal sectional view of an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view of an example of a conventional semiconductor device. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Aluminum film for bonding pads, 3... Phosphorus silicate glass film, 4... Silicon nitride film.
Claims (1)
む基板上に燐シリケートガラス等の第1の表面保護膜を
設け、この第1の表面保護膜に開口されたボンディング
パッド部を設け、前記第1の表面保護膜上に高耐湿性の
第2の表面保護膜が前記第1の表面保護膜の開口部側面
を含むこの第1の表面保護膜全面に被覆されたことを特
徴とする半導体装置。A pattern of a conductive film is provided on a substrate, a first surface protection film such as phosphorous silicate glass is provided on the substrate including the conductive film, and a bonding pad portion having an opening is provided in the first surface protection film. , characterized in that a highly moisture-resistant second surface protective film is coated on the first surface protective film over the entire surface of the first surface protective film, including the side surfaces of the openings of the first surface protective film. semiconductor devices.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10506487A JPS63269538A (en) | 1987-04-27 | 1987-04-27 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10506487A JPS63269538A (en) | 1987-04-27 | 1987-04-27 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63269538A true JPS63269538A (en) | 1988-11-07 |
Family
ID=14397529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10506487A Pending JPS63269538A (en) | 1987-04-27 | 1987-04-27 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63269538A (en) |
-
1987
- 1987-04-27 JP JP10506487A patent/JPS63269538A/en active Pending
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