JPS63264642A - Molding of five-membered cyclic compound polymer - Google Patents
Molding of five-membered cyclic compound polymerInfo
- Publication number
- JPS63264642A JPS63264642A JP9727287A JP9727287A JPS63264642A JP S63264642 A JPS63264642 A JP S63264642A JP 9727287 A JP9727287 A JP 9727287A JP 9727287 A JP9727287 A JP 9727287A JP S63264642 A JPS63264642 A JP S63264642A
- Authority
- JP
- Japan
- Prior art keywords
- polymer
- molding
- membered heterocyclic
- dopant
- heterocyclic compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920000642 polymer Polymers 0.000 title claims abstract description 64
- 238000000465 moulding Methods 0.000 title claims abstract description 24
- 150000001923 cyclic compounds Chemical class 0.000 title claims description 4
- 239000002019 doping agent Substances 0.000 claims abstract description 23
- 150000002391 heterocyclic compounds Chemical class 0.000 claims abstract description 18
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 14
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 5
- 125000003118 aryl group Chemical group 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 4
- 229910052711 selenium Inorganic materials 0.000 claims abstract description 3
- 229910052714 tellurium Inorganic materials 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 27
- 150000000565 5-membered heterocyclic compounds Chemical class 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 3
- 239000011593 sulfur Substances 0.000 claims description 3
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 2
- 125000003277 amino group Chemical group 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 239000011669 selenium Substances 0.000 claims description 2
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 2
- 239000000178 monomer Substances 0.000 abstract description 3
- 238000005691 oxidative coupling reaction Methods 0.000 abstract description 3
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 7
- 239000011630 iodine Substances 0.000 description 7
- 229910052740 iodine Inorganic materials 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- WQYWXQCOYRZFAV-UHFFFAOYSA-N 3-octylthiophene Chemical compound CCCCCCCCC=1C=CSC=1 WQYWXQCOYRZFAV-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- -1 nitrosyl hexafluoroantimonate Chemical compound 0.000 description 5
- 239000007800 oxidant agent Substances 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229920006395 saturated elastomer Polymers 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- RFKWIEFTBMACPZ-UHFFFAOYSA-N 3-dodecylthiophene Chemical compound CCCCCCCCCCCCC=1C=CSC=1 RFKWIEFTBMACPZ-UHFFFAOYSA-N 0.000 description 3
- FRVZSODZVJPMKO-UHFFFAOYSA-N 3-hexadecylthiophene Chemical compound CCCCCCCCCCCCCCCCC=1C=CSC=1 FRVZSODZVJPMKO-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- YBGKQGSCGDNZIB-UHFFFAOYSA-N arsenic pentafluoride Chemical compound F[As](F)(F)(F)F YBGKQGSCGDNZIB-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical group 0.000 description 3
- 229920000123 polythiophene Polymers 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000002841 Lewis acid Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- FAPDDOBMIUGHIN-UHFFFAOYSA-K antimony trichloride Chemical compound Cl[Sb](Cl)Cl FAPDDOBMIUGHIN-UHFFFAOYSA-K 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 150000007517 lewis acids Chemical class 0.000 description 2
- MHCFAGZWMAWTNR-UHFFFAOYSA-M lithium perchlorate Chemical compound [Li+].[O-]Cl(=O)(=O)=O MHCFAGZWMAWTNR-UHFFFAOYSA-M 0.000 description 2
- 229910001486 lithium perchlorate Inorganic materials 0.000 description 2
- 229910001496 lithium tetrafluoroborate Inorganic materials 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- PDKHNCYLMVRIFV-UHFFFAOYSA-H molybdenum;hexachloride Chemical compound [Cl-].[Cl-].[Cl-].[Cl-].[Cl-].[Cl-].[Mo] PDKHNCYLMVRIFV-UHFFFAOYSA-H 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 2
- 229920000414 polyfuran Polymers 0.000 description 2
- 229920000128 polypyrrole Polymers 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- AKEJUJNQAAGONA-UHFFFAOYSA-N sulfur trioxide Chemical compound O=S(=O)=O AKEJUJNQAAGONA-UHFFFAOYSA-N 0.000 description 2
- YOUIDGQAIILFBW-UHFFFAOYSA-J tetrachlorotungsten Chemical compound Cl[W](Cl)(Cl)Cl YOUIDGQAIILFBW-UHFFFAOYSA-J 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- DSPXASHHKFVPCL-UHFFFAOYSA-N 1-isocyanocyclohexene Chemical compound [C-]#[N+]C1=CCCCC1 DSPXASHHKFVPCL-UHFFFAOYSA-N 0.000 description 1
- TUCRZHGAIRVWTI-UHFFFAOYSA-N 2-bromothiophene Chemical compound BrC1=CC=CS1 TUCRZHGAIRVWTI-UHFFFAOYSA-N 0.000 description 1
- GIFWAJGKWIDXMY-UHFFFAOYSA-N 2-octylthiophene Chemical compound CCCCCCCCC1=CC=CS1 GIFWAJGKWIDXMY-UHFFFAOYSA-N 0.000 description 1
- BZORYGRKQHUBCY-UHFFFAOYSA-N 3-butylthiophene Chemical compound [CH2]CCCC=1C=CSC=1 BZORYGRKQHUBCY-UHFFFAOYSA-N 0.000 description 1
- 125000002373 5 membered heterocyclic group Chemical group 0.000 description 1
- FWLUTJHBRZTAMP-UHFFFAOYSA-N B([O-])([O-])F.B([O-])([O-])F.B([O-])([O-])F.B([O-])([O-])F.B([O-])([O-])F.B([O-])([O-])F.[Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[Li+] Chemical compound B([O-])([O-])F.B([O-])([O-])F.B([O-])([O-])F.B([O-])([O-])F.B([O-])([O-])F.B([O-])([O-])F.[Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[Li+] FWLUTJHBRZTAMP-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229910015040 LiAsFe Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- 241000209140 Triticum Species 0.000 description 1
- 235000021307 Triticum Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000005210 alkyl ammonium group Chemical group 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- 125000000640 cyclooctyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 150000004795 grignard reagents Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 150000002367 halogens Chemical group 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910001500 lithium hexafluoroborate Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- IOOQQIVFCFWSIU-UHFFFAOYSA-M magnesium;octane;bromide Chemical compound [Mg+2].[Br-].CCCCCCC[CH2-] IOOQQIVFCFWSIU-UHFFFAOYSA-M 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- ZNDBDFUPDXEZFL-UHFFFAOYSA-N nitroso trifluoromethanesulfonate Chemical compound FC(F)(F)S(=O)(=O)ON=O ZNDBDFUPDXEZFL-UHFFFAOYSA-N 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 231100000572 poisoning Toxicity 0.000 description 1
- 230000000607 poisoning effect Effects 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- KBLZDCFTQSIIOH-UHFFFAOYSA-M tetrabutylazanium;perchlorate Chemical compound [O-]Cl(=O)(=O)=O.CCCC[N+](CCCC)(CCCC)CCCC KBLZDCFTQSIIOH-UHFFFAOYSA-M 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は複素5員環式化合物重合体の成形方法に関する
ものであり、さらには導電性樹脂の成形方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for molding a five-membered heterocyclic compound polymer, and further relates to a method for molding a conductive resin.
主鎖に複素5員環式化合物が連なった構造を有するポリ
ピロール、ポリフラン、ポリチオフェン、ポリセレノフ
ェン等の重合体は耐熱性が良好で、かつ化学的安定性に
優れ、エンジニアリングプラスチックとして有用である
と考えられている。また、最近の研究によれば、これら
の重合体にヨウ素や五フフ化ヒ素等のドーパントをドー
プすることにより、絶縁体から導電体に変化するなど、
優れた性質を有することが知られており、導電性材料と
してだけではなくセンサー材料、オプトエレクトロニク
ス、エレクトロニクスデバイスなどの機能性材料として
も使用されている。Polymers such as polypyrrole, polyfuran, polythiophene, and polyselenophene, which have a structure in which five-membered heterocyclic compounds are linked in the main chain, have good heat resistance and excellent chemical stability, and are useful as engineering plastics. It is considered. Also, according to recent research, by doping these polymers with dopants such as iodine and arsenic pentafluoride, they can change from insulators to conductors.
It is known to have excellent properties and is used not only as a conductive material but also as a functional material for sensor materials, optoelectronics, electronic devices, etc.
例えば、ポリチオフェンは化学的酸化重合方法によりチ
オフェンを重合して得られるポリマーであるが、不活性
ガス中で、500℃迄は安定な粉末として知られている
。For example, polythiophene is a polymer obtained by polymerizing thiophene using a chemical oxidative polymerization method, and is known as a powder that is stable up to 500° C. in an inert gas.
また、電気化学的酸化重合方法によりフィルム状の重合
体が得られ、ヨウ素をドーピングしたものは高い導電性
を有することが知られている。さらにポリピロール、ポ
リフラン、ポリセレノフェン、ポリテルロフェン等の複
素5員環式化合物重合体についても同様の性質が知られ
ている。Furthermore, it is known that film-like polymers can be obtained by electrochemical oxidative polymerization, and those doped with iodine have high electrical conductivity. Furthermore, similar properties are known for five-membered heterocyclic compound polymers such as polypyrrole, polyfuran, polyselenophene, and polytellurophene.
しかしながら、これらの重合体は架橋構造を生成したり
して不溶性であり、加熱しても軟化することなく分解し
てしまい、熔融するような重合体は知られていなかった
。蓋なわち不融性、不溶性の重合体であるため、成形加
工が困難であり、実用の上から大きな問題点となってい
た。However, these polymers are insoluble because they form a crosslinked structure, and they decompose without softening even when heated, and no polymers that melt are known. Since the lid is an infusible and insoluble polymer, it is difficult to mold and process, which has been a major problem from a practical standpoint.
一方、特開昭61−278526号には特定の構造を有
する複素5員環式化合物重合体と有機溶剤からなる導電
性溶液および導電性製品の成形方法が提案されている。On the other hand, JP-A No. 61-278526 proposes a method for molding a conductive solution and a conductive product comprising a five-membered heterocyclic compound polymer having a specific structure and an organic solvent.
すなわち、この溶液から容易にキャスティングによりフ
ィルムを製造でき、また塗布物などの形にも容易に加工
できる事が示されている。That is, it has been shown that a film can be easily produced from this solution by casting, and that it can also be easily processed into the form of a coated product.
しかしながら、溶液では成形方法が限られてしまい、フ
ィルムや繊維、塗布物などの形でしか利用できない上、
溶剤を除去した後の歪み、ずれ、縮みなどが起こり易い
等の問題がある。However, the molding methods for solutions are limited, and they can only be used in the form of films, fibers, coatings, etc.
There are problems such as distortion, displacement, and shrinkage after the solvent is removed.
また、溶剤を使用するため、取り扱いが難しく、運搬や
保管に問題があり、さらに溶剤による中毒や火災の危険
性等、安全性や環境に与える問題があるので、溶剤を使
用しないで成形する方法が望まれていた。In addition, since it uses a solvent, it is difficult to handle, has problems with transportation and storage, and also poses safety and environmental problems such as poisoning and fire hazards due to the solvent, so there are molding methods that do not use solvents. was desired.
本発明の目的は、従来の複素5員環式化合物重合体や複
素5員環式化合物重合体の溶液に比べ、これらの複素5
員環式化合物重合体の成形加工が容易に安全に行え、し
かも導電性成形物を容易に安価に製造できるなどの優れ
た成形加工方法を提供する事にある。The purpose of the present invention is to improve
It is an object of the present invention to provide an excellent molding method that can easily and safely mold a membered cyclic compound polymer, and can also easily and inexpensively produce conductive molded products.
本発明者らは、上記目的を達成するために鋭意検討した
結果、特定の構造単位を有する複素5員環式化合物重合
体が軟化点を有するため、これらの複素5員環式化合物
重合体を軟化点以上の温度で成形加工することが可能で
ある事を見い出して本発明を完成させた。As a result of intensive studies to achieve the above object, the present inventors found that since the hetero5-membered cyclic compound polymers having a specific structural unit have a softening point, these 5-membered heterocyclic compound polymers The present invention was completed by discovering that molding can be performed at temperatures above the softening point.
すなわち、本発明は一般式(I)
〔式(I)中、Rは炭素数8個以上のアルキル基、Xは
酸素、硫黄、セレン、テルル又は−NR’で表わされる
アミノ基、但し、ここでR/は水素、アルキル基又はア
リール基を示す〕で表わされる単量体単位を繰り返し単
位とする複素5員環式化合物重合体、或いはドーパント
で予めドープ処理された該重合体をドーパントと併用或
いは併用することなく、該複素5員環式化合物重合体或
いはドープ処理された該重合体の軟化点以上の温度に加
熱し、所望の形状に成形する方法であって、更に必要に
応じ、これら成形物をドーパントでドープ処理すること
を特徴とする複素5員環式化合物重合体の成形方法であ
る。That is, the present invention relates to general formula (I) [In formula (I), R is an alkyl group having 8 or more carbon atoms, X is an amino group represented by oxygen, sulfur, selenium, tellurium or -NR', provided that A 5-membered heterocyclic compound polymer whose repeating unit is a monomer unit represented by R/ represents hydrogen, an alkyl group or an aryl group, or a polymer pre-doped with a dopant, used in combination with a dopant. Alternatively, a method in which the five-membered heterocyclic compound polymer or the doped polymer is heated to a temperature equal to or higher than the softening point of the polymer and molded into a desired shape, if necessary. This is a method for molding a five-membered heterocyclic compound polymer, which is characterized by doping a molded product with a dopant.
上記した本発明で使用される複素5員環式化合物重合体
は高分子鎖の複素5員環核上にアルキル基を有しおり、
上式のうち、Rで示される炭素数8(Ili1以上のア
ルキル基としては、オクチル、ノニル、デシル、ウンデ
シル、ドデシル等の直鎖アルキル基のほかに、シクロオ
クチル基のような環状アルキル基、或いは分枝構造を有
するアルキル基などが挙げられる。これらのアルキル基
はハロゲン、ニトロ、シアノ、アルコキシ、アリール、
アルケニルなどの基を有していてもよい。また、窒素、
酸素、硫黄などのへテロ原子を含んでいてもよい。The 5-membered heterocyclic compound polymer used in the present invention described above has an alkyl group on the 5-membered heterocyclic nucleus of the polymer chain,
In the above formula, the alkyl group having 8 carbon atoms (Ili1 or more) represented by R includes linear alkyl groups such as octyl, nonyl, decyl, undecyl, and dodecyl, as well as cyclic alkyl groups such as cyclooctyl group, Alternatively, examples include alkyl groups having a branched structure.These alkyl groups include halogen, nitro, cyano, alkoxy, aryl,
It may have a group such as alkenyl. Also, nitrogen,
It may also contain heteroatoms such as oxygen and sulfur.
一般的に重合体の置換基のアルキル鎖が長いほど重合体
の軟化点は低くなる傾向にあり、逆にアルキル鎖が短か
ければ重合体の軟化点は高くなる傾向にある。例えば炭
素数8個のオクチル基がっいている場合には重合体の軟
化点は156°Cであったがそれ以下の長さの置換基の
場合には重合体は軟化点を有せず不融性であった。Generally, the longer the alkyl chain of the substituent of a polymer, the lower the softening point of the polymer, and conversely, the shorter the alkyl chain, the higher the softening point of the polymer. For example, when an octyl group with 8 carbon atoms is present, the softening point of the polymer is 156°C, but when the length of the substituent is shorter than that, the polymer does not have a softening point. It was fusible.
本発明で使用される複素5員環式化合物重合体は、通常
、前記の一般式(I)で表わされる複素5員環式化合物
の酸化的カップリング反応によって製造される。The 5-membered heterocyclic compound polymer used in the present invention is usually produced by an oxidative coupling reaction of the 5-membered heterocyclic compound represented by the general formula (I).
また2、5−ジハロゲン化した複素5員環式化合物をマ
グネシウムと反応させてジグリニャー塩化した後、ニッ
ケル触媒によりカップリングして重合体を製造する方法
によって合成することができる。Alternatively, it can be synthesized by a method in which a 2,5-dihalogenated five-membered heterocyclic compound is reacted with magnesium to form a Digrinya salt, and then coupled with a nickel catalyst to produce a polymer.
本発明で使用される複素5員環式化合物重合体は、一般
式(I)の化合物単位が2.5位または2.4位で繰り
返し結合している重合体であり、或いは一部架橋構造を
有した重合体であっても構わない。複素5員環式化合物
の酸化的カップリング反応による具体的な重合方法とし
ては、酸化剤触媒を用いて重合する方法、電気化学的に
重合する方法等が挙げられ、中でも酸化剤触媒を用いて
重合する方法が重合体を安価に容易に得る手段として好
ましい。The 5-membered heterocyclic compound polymer used in the present invention is a polymer in which compound units of general formula (I) are repeatedly bonded at the 2.5-position or 2.4-position, or a polymer having a partially crosslinked structure. It may be a polymer having the following. Specific polymerization methods using oxidative coupling reactions of five-membered heterocyclic compounds include polymerization methods using oxidizing agent catalysts, electrochemical polymerization methods, etc. Among them, polymerization methods using oxidizing agent catalysts, etc. A method of polymerization is preferable as it is a means to easily obtain a polymer at low cost.
これらの重合用触媒としては塩化アルミニウム、塩化鉄
、塩化モリブデン、塩化タングステン、塩化錫、塩化ア
ンチモン、五フッ化ヒ素等のルイス酸として知られてい
る化合物が挙げられる。これらのうち、塩化アルミニウ
ムのように酸化力を持たないものや酸化力の弱いものは
、塩化第二銅や二酸化マンガン、酸素などのような酸化
剤を併用することも好ましい。Examples of these polymerization catalysts include compounds known as Lewis acids such as aluminum chloride, iron chloride, molybdenum chloride, tungsten chloride, tin chloride, antimony chloride, and arsenic pentafluoride. Among these, those having no oxidizing power or having weak oxidizing power, such as aluminum chloride, are preferably used in combination with an oxidizing agent such as cupric chloride, manganese dioxide, or oxygen.
これらの酸化剤触媒を、上記アルキル置換複素5員環式
化合物中に添加することにより室温下で容易に本発明で
使用される複素5員環式化合物重合体を製造することが
できる。又必要に応じて、この反応系中に不活性溶媒を
加えることも反応の制御などが容易に行えるようになる
ので好ましい方法である。By adding these oxidizing agent catalysts to the alkyl-substituted five-membered heterocyclic compound, the five-membered heterocyclic compound polymer used in the present invention can be easily produced at room temperature. It is also a preferable method to add an inert solvent to the reaction system, if necessary, since this makes it easier to control the reaction.
本発明では複素5員環式化合物重合体を、その軟化点以
上に温度を上げて重合体を軟化または溶融せしめ、次い
で適当な形に成形することにより容易に成形物を得るこ
とができる。In the present invention, a molded article can be easily obtained by raising the temperature of a five-membered heterocyclic compound polymer to a temperature higher than its softening point to soften or melt the polymer, and then molding it into a suitable shape.
このような方法としては具体的には、いわゆる熱可塑性
樹脂の一般的な成形加工方法が利用可能であり、例えば
、押出成形、射出成形、インフレーション成形、ロール
成形やカレンダー成形などが挙げられる。Specifically, as such a method, a general molding method for so-called thermoplastic resins can be used, and examples thereof include extrusion molding, injection molding, inflation molding, roll molding, and calendar molding.
本発明では、さらに必要に応じてこのようにして成形加
工した重合体に適当なドーパントをドープする工程によ
り導電性の製品を製造することができる。According to the present invention, conductive products can be manufactured by further doping the thus formed polymer with a suitable dopant, if necessary.
ここで使用されるドーパントとしては特に制限はな(、
導電性の複素5員環式化合物重合体を形成するためにド
ープする際に使用されるドーパントとして公知の化合物
が使用可能である。このようなドーパントとしてはヨウ
素、臭素、塩素、三塩化ヨウ素などのハロゲン化合物、
硫酸、硝酸、過塩素酸、はうフッ化水素酸等のプロトン
酸、三塩化アルミニウム、三塩化鉄、塩化モリブデン、
塩化タングステン、塩化アンチモン、五フッ化ヒ素、三
酸化イオウなどのルイス酸、ヘキサフルオロアンチモン
酸ニトロシル(No S b Fe ) 、ヘキサフル
オロヒ酸ニトロシル(NOA s Fs )、トリフル
オロメタンスルホン酸ニトロシル(N。There are no particular restrictions on the dopant used here (,
Known compounds can be used as dopants for doping to form electrically conductive five-membered heterocyclic compound polymers. Such dopants include halogen compounds such as iodine, bromine, chlorine, and iodine trichloride;
Protic acids such as sulfuric acid, nitric acid, perchloric acid, and hydrofluoric acid, aluminum trichloride, iron trichloride, molybdenum chloride,
Lewis acids such as tungsten chloride, antimony chloride, arsenic pentafluoride, sulfur trioxide, nitrosyl hexafluoroantimonate (No S b Fe ), nitrosyl hexafluoroarsenate (NOA s Fs ), nitrosyl trifluoromethanesulfonate (N.
CF3503)、ヘキサフルオロアンチモン酸ニトロイ
ル(NO2S b Fe ) 、トリフルオロメタンス
ルホン酸ニトロイル(NO2CF3 S O:] )な
どの酸化剤、リチウム(Li)、ナトリウム(Na)
、カリウム(K)、ルビジウム(Rb)、セシウム(C
s)などのアルカリ金属、R4NAで表されるテトラ−
アルキルアンモニウム塩(ここで、Aは陰イオン基を示
す。)など各種のドーパント物質が使用可能である。CF3503), nitroyl hexafluoroantimonate (NO2S b Fe ), nitroyl trifluoromethanesulfonate (NO2CF3 SO:] ), oxidizing agents, lithium (Li), sodium (Na)
, potassium (K), rubidium (Rb), cesium (C
alkali metals such as s), tetra- represented by R4NA
Various dopant substances such as alkylammonium salts (where A represents an anionic group) can be used.
これらのドーパントを成形品にドープする方法について
は特に制限はなく、一般的には成形品とドーパント物質
とを接触させればよく、気相、或いは液相中で行われる
ことが多い。There are no particular restrictions on the method of doping these dopants into a molded article, and generally it is sufficient to bring the molded article into contact with the dopant substance, which is often carried out in a gas phase or a liquid phase.
或いは過塩素酸リチウム(LiC1o4)、テトラフル
オロホウ酸リチウム(LiBF4)、ヘキサフルオロヒ
酸リチウム(LiAsFe)、テトラフルオロホウ酸テ
トラブチルアンモニウム(Bu4NBF4)、過塩素酸
テトラブチルアンモニウム(B u4 NC104)な
どの電解質塩を含む電解溶液中で電気化学的にドープす
る方法も採用できる。Or lithium perchlorate (LiC1o4), lithium tetrafluoroborate (LiBF4), lithium hexafluoroborate (LiAsFe), tetrabutylammonium tetrafluoroborate (Bu4NBF4), tetrabutylammonium perchlorate (Bu4 NC104), etc. A method of electrochemical doping in an electrolyte solution containing an electrolyte salt of
本発明の他の実施態様としては、複素5員環式化合物重
合体およびドーパントとの混合物、またはあらかじめド
ープ処理をしてドーパントを含有する該重合体、或いは
このあらかじめドープ処理をしてドーパントを含有する
該重合体に更にドーパントを混合したものを、その軟化
点(融点)以上に温度を上げて重合体を軟化または溶融
せしめ、次いで適当な形に成形することにより容易に導
電性成形物を成形することができる。Other embodiments of the invention include a mixture of a five-membered heterocyclic compound polymer and a dopant, or a pre-doped polymer containing a dopant, or a pre-doped polymer containing a dopant. A conductive molded product can be easily formed by mixing the polymer with a dopant, raising the temperature above its softening point (melting point) to soften or melt the polymer, and then molding it into an appropriate shape. can do.
具体的な成形方法としては前述の方法と同様である。The specific molding method is the same as the method described above.
なお、必要により、これらの成形物を更にドーパントで
ドープ処理をしてもよい。Note that, if necessary, these molded products may be further doped with a dopant.
本発明において、成形時の流動性や成形物の機械的強度
などの物理的性質を改良する目的で成形加工時に適当な
可塑剤や無機充舅材を添加することは本発明の意図の中
に含まれることは容易に理解される。In the present invention, it is within the intention of the present invention to add an appropriate plasticizer or inorganic filler during the molding process for the purpose of improving the physical properties such as fluidity during molding and mechanical strength of the molded product. The inclusion is easily understood.
以下に合成例及び実施例により更に詳しく本発明を説明
する。The present invention will be explained in more detail with reference to Synthesis Examples and Examples below.
合成例13−オクチルチオフェンの合成例3−ブロモチ
オフェン81.5g (0,5mol )とジフェニル
ホスフィノペンクンニッケルジクロライド1gを含む無
水エーテル300 ml中に、オクチルマグネシウム
ブロマイド108.5 g (0,5mol )を含む
エーテル250 mlを0℃で滴下し、滴下終了後5
時間還流してから、水を加えて加水分解した。Synthesis Example 13 - Synthesis Example of Octylthiophene 3 - In 300 ml of anhydrous ether containing 81.5 g (0.5 mol) of bromothiophene and 1 g of diphenylphosphinopenknickel dichloride, 108.5 g (0.5 mol) of octylmagnesium bromide was added. ) was added dropwise at 0°C.
After refluxing for an hour, water was added for hydrolysis.
次いで、有機層をエーテル抽出した後、得られたエーテ
ル溶液を減圧蒸留して、3−オクチルチオフェンを75
%の収率(理論)で得た。Next, the organic layer was extracted with ether, and the resulting ether solution was distilled under reduced pressure to obtain 75% of 3-octylthiophene.
% yield (theory).
同様にして、種々のグリニヤール試薬を用いることによ
り、3−ドデシルチオフェン、3−ヘキサデシルチオフ
ェンおよび3−トコシルチオフェンを得た。Similarly, 3-dodecylthiophene, 3-hexadecylthiophene and 3-tocosylthiophene were obtained by using various Grignard reagents.
(注)ニッケル触媒の存在下、カップリング反応でもモ
ノマーが得られる。(Note) Monomers can also be obtained by coupling reactions in the presence of nickel catalysts.
合成例2 複素5員環式化合物重合体の合成例クロロ
ホルム3.000m1中に無水塩化第二鉄240 gを
入れた後、さらに3−オクチルチオフェン60gを加え
て室温で24時間かきまぜた。Synthesis Example 2 Synthesis Example of Polymer of 5-Membered Heterocyclic Compound After 240 g of anhydrous ferric chloride was added to 3.000 ml of chloroform, 60 g of 3-octylthiophene was further added and stirred at room temperature for 24 hours.
反応混合物をメタノール10,000 rail中に加
えて良くかきまぜた後、不溶物をろ過により集め、メタ
ノール、希塩酸、水、アンモニア水で洗浄してから減圧
下、80℃で10時間乾燥した。After the reaction mixture was added to 10,000 rails of methanol and stirred well, insoluble matter was collected by filtration, washed with methanol, diluted hydrochloric acid, water, and aqueous ammonia, and then dried under reduced pressure at 80° C. for 10 hours.
暗緑色のポリマーが51 g得られた。51 g of dark green polymer was obtained.
このポリマーの軟化点を測定したところ156℃であっ
た。The softening point of this polymer was measured and found to be 156°C.
又、このポリマーの分子量(MW)をテトラヒドロフラ
ン溶媒によるゲルパーミエイションクロマトグラフィー
により、ポリスチレン換算値で求めたところ、146.
000であった。Furthermore, the molecular weight (MW) of this polymer was determined in terms of polystyrene by gel permeation chromatography using a tetrahydrofuran solvent, and was found to be 146.
It was 000.
同様にして、ポリ−3−ドデシルチオフェン(Mw :
109.000 ) 、ポリ−3−ヘキサデシルチオ
フェン、ポリ−3−トコシルチオフェン(MW : 1
35.000)などの3位にアルキル基を有するポリチ
オフェンが得られた。Similarly, poly-3-dodecylthiophene (Mw:
109.000), poly-3-hexadecylthiophene, poly-3-tocosylthiophene (MW: 1
Polythiophenes having an alkyl group at the 3-position such as 35.000) were obtained.
実施例1
ポリ−3−トコシルチオフェンを165℃で5分間加熱
して溶融した後、テフロンシート上に流延して冷却した
ところ、厚さl amのシート状成形物が得られた。Example 1 Poly-3-tocosylthiophene was melted by heating at 165° C. for 5 minutes, and then cast onto a Teflon sheet and cooled to obtain a sheet-like molded product with a thickness of 1 am.
このシートを室温で飽和蒸気圧のヨウ素ガスに24時間
接触させたところ0.2 S/amの電気伝導度を示
した。When this sheet was brought into contact with iodine gas at saturated vapor pressure at room temperature for 24 hours, it exhibited an electrical conductivity of 0.2 S/am.
実施例2
ポリ−3−ヘキサデシルチオフェンを185℃で5分間
加熱して溶融した後、内径511のガラス管中に注入し
て冷却した。ガラス管を取り除くと、直径5uのロンド
状の成形物が得られた。Example 2 Poly-3-hexadecylthiophene was heated at 185° C. for 5 minutes to melt it, then poured into a glass tube with an inner diameter of 511 and cooled. When the glass tube was removed, a rondo-shaped molded product with a diameter of 5u was obtained.
このロンドを室温で飽和蒸気圧のヨウ素ガスに24時間
接触させたところI S/amの電気伝導度を示した
。When this Rondo was brought into contact with iodine gas at saturated vapor pressure at room temperature for 24 hours, it exhibited an electrical conductivity of IS/am.
実施例3
ポリ−3−オクチルチオフェンの粉末を0.1鶴の空隙
を有する二枚の鉄板の間にはさんで200℃で5分間ホ
ットプレスしたところ、厚さ0.1鶴のシ−ト状成形物
が得られた。Example 3 Poly-3-octylthiophene powder was sandwiched between two iron plates having a gap of 0.1 mm and hot pressed at 200°C for 5 minutes, resulting in a sheet with a thickness of 0.1 mm. A molded product was obtained.
このシートを室温で飽和蒸気圧のヨウ素ガスに24時間
接触させたところ16S/cmの電気伝導度を示した。When this sheet was brought into contact with iodine gas at saturated vapor pressure at room temperature for 24 hours, it exhibited an electrical conductivity of 16 S/cm.
実施例4
ポリ−3−ドデシルチオフェンを165℃で加熱して熔
融した(麦、内径0.5mmのノズルより押し出し1:
5の割で延伸を行いながら巻取ることにより太さ0.1
■1の繊維状の成形物が得られた。Example 4 Poly-3-dodecylthiophene was heated and melted at 165°C (wheat, extruded through a nozzle with an inner diameter of 0.5 mm 1:
By winding while stretching at a rate of 5%, the thickness is 0.1
(1) A fibrous molded product was obtained.
この繊維を室温で飽和蒸気圧のヨウ素ガスに24時間接
触させたところ13 S/ amの電気伝導度を示した
。When this fiber was brought into contact with iodine gas at saturated vapor pressure at room temperature for 24 hours, it exhibited an electrical conductivity of 13 S/am.
実施例5
実施例3においてポリ−3−オクチルチオフェンの代わ
りにヨウ素をドープしたポリ−3−オクチルチオフェン
を用いて実施例3と同様にしてホットプレスしたところ
厚さQ、1mmのシート状の成形物が得られた。このシ
ートの電気伝導度を測定したところ12S/cmであっ
た。Example 5 In Example 3, poly-3-octylthiophene doped with iodine was used instead of poly-3-octylthiophene, and hot pressing was performed in the same manner as in Example 3, resulting in a sheet-like molding with a thickness of Q and 1 mm. I got something. The electrical conductivity of this sheet was measured and found to be 12 S/cm.
比較例
実施例3においてポリ−3−オクチルチオフェンの代わ
りにポリ−3−ブチルチオフェンを用いて実施例3と同
様にしてホットプレスしたが粉末のままで成形物は得ら
れなかった。さらに400“Cまで温度を上げてみたが
粉末は溶融せず、成形物は得られなかった。Comparative Example In Example 3, poly-3-butylthiophene was used instead of poly-3-octylthiophene and hot pressing was carried out in the same manner as in Example 3, but the powder remained and no molded product was obtained. Although the temperature was further increased to 400"C, the powder did not melt and no molded product was obtained.
本発明の方法を実施することにより、従来、困難であっ
た複素5員環式化合物重合体の成形が容易に行なえ、複
素5員環式化合物重合体の成形物および導電性の成形物
を安価に製造することが可能となり、工業上極めて価値
がある。By carrying out the method of the present invention, it is possible to easily mold a 5-membered heterocyclic compound polymer, which has been difficult in the past, and to produce molded products of a 5-membered heterocyclic compound polymer and conductive molded products at low cost. It is extremely valuable industrially.
Claims (1)
は酸素、硫黄、セレン、テルル又は−NR′で表わされ
るアミノ基、但し、ここでR′は水素、アルキル基又は
アリール基を示す〕で表わされる単量体単位を繰り返し
単位とする複素5員環式化合物重合体、或いはドーパン
トで予めドープ処理された該重合体をドーパントと併用
或いは併用することなく、該複素5員環式化合物重合体
或いはドープ処理された該重合体の軟化点以上の温度に
加熱し、所望の形状に成形する方法であって、更に必要
に応じ、これら成形物をドーパントでドープ処理するこ
とを特徴とする複素5員環式化合物重合体の成形方法。[Claims] General formula (I) ▲Mathematical formulas, chemical formulas, tables, etc.▼(I) [In formula (I), R is an alkyl group having 8 or more carbon atoms,
is an amino group represented by oxygen, sulfur, selenium, tellurium, or -NR', where R' is hydrogen, an alkyl group, or an aryl group. A cyclic compound polymer, or a doped polymer pre-doped with a dopant, with or without a dopant, at a temperature equal to or higher than the softening point of the 5-membered heterocyclic compound polymer or a doped polymer. 1. A method for molding a five-membered heterocyclic compound polymer, the method comprising: heating the polymer to form a desired shape, and further comprising doping the molded product with a dopant, if necessary.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9727287A JPH0778132B2 (en) | 1987-04-22 | 1987-04-22 | Method for molding hetero 5-membered cyclic compound polymer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9727287A JPH0778132B2 (en) | 1987-04-22 | 1987-04-22 | Method for molding hetero 5-membered cyclic compound polymer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63264642A true JPS63264642A (en) | 1988-11-01 |
JPH0778132B2 JPH0778132B2 (en) | 1995-08-23 |
Family
ID=14187892
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9727287A Expired - Lifetime JPH0778132B2 (en) | 1987-04-22 | 1987-04-22 | Method for molding hetero 5-membered cyclic compound polymer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0778132B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001319789A (en) * | 2000-02-29 | 2001-11-16 | Semiconductor Energy Lab Co Ltd | Light emission device and its preparation method |
-
1987
- 1987-04-22 JP JP9727287A patent/JPH0778132B2/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001319789A (en) * | 2000-02-29 | 2001-11-16 | Semiconductor Energy Lab Co Ltd | Light emission device and its preparation method |
JP4601843B2 (en) * | 2000-02-29 | 2010-12-22 | 株式会社半導体エネルギー研究所 | Light emitting device |
Also Published As
Publication number | Publication date |
---|---|
JPH0778132B2 (en) | 1995-08-23 |
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