JPS63251110A - Inspecting method for printed board - Google Patents
Inspecting method for printed boardInfo
- Publication number
- JPS63251110A JPS63251110A JP8350987A JP8350987A JPS63251110A JP S63251110 A JPS63251110 A JP S63251110A JP 8350987 A JP8350987 A JP 8350987A JP 8350987 A JP8350987 A JP 8350987A JP S63251110 A JPS63251110 A JP S63251110A
- Authority
- JP
- Japan
- Prior art keywords
- light
- printed board
- hole
- holes
- half mirror
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 10
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 239000011889 copper foil Substances 0.000 abstract description 3
- 238000007689 inspection Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 239000006096 absorbing agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Drilling And Boring (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
プリント板の孔明は加工の検査方法であって、孔明けの
未加工個所を検出するため、プリント板の孔部にハーフ
ミラ−を通して光を照射し、未加工の孔部より反射する
光をハーフミラ−で表示板面に屈折させて表示する構成
とし、未加工孔の見落としをなくするようにしている。[Detailed Description of the Invention] [Summary] Printed board perforation is a processing inspection method, and in order to detect unprocessed holes in the printed board, light is irradiated through a half mirror into the holes of the printed board to detect the unprocessed parts. The structure is such that the light reflected from the holes is refracted onto the display panel surface by a half mirror and displayed, thereby eliminating the possibility of overlooking the unprocessed holes.
本発明はプリント板の貫通孔の未加工孔を検査する検査
方法に関し、特に未加工孔の見落としをなくするように
したプリント板の検査方法に関するものである。The present invention relates to an inspection method for inspecting unfinished through-holes of a printed board, and more particularly to a printed board inspection method that prevents overlooking of unfinished holes.
近年、プリント板の両面に形成される回路パターンはま
すます高密度化され、それに伴って両面の回路パターン
間を接続するスルホールの数も多くなり、スルホールを
形成するための孔明は加工において未加工孔が発生する
。In recent years, the circuit patterns formed on both sides of printed circuit boards have become increasingly dense, and the number of through holes connecting the circuit patterns on both sides has also increased, and the holes used to form the through holes are made of raw material during processing. Holes occur.
そこで、多くの加工孔の中から未加工孔を見落としなく
見付けることができる検査方法が必要とされていた。Therefore, there is a need for an inspection method that can detect unprocessed holes from among many processed holes without overlooking them.
第３図はプリント板の貫通孔の模式図を示しており、孔
明は加工工程において、プリント板１の両面に形成され
た回路パターン１−１．１−２を接続するためのスルホ
ールの下孔となる貫通孔２−１〜２−ｎが孔明けされる
。FIG. 3 shows a schematic diagram of the through-holes of the printed board, and the holes are the pilot holes of the through-holes for connecting the circuit patterns 1-1.1-2 formed on both sides of the printed board 1 during the processing process. Through holes 2-1 to 2-n are bored.
これらの貫通孔の検査は、検査員が孔明は加工図面を参
照して目視により、孔明は位置と孔加工の有無を検査し
ている。These through-holes are inspected by an inspector who visually inspects them by referring to the machining drawings and inspecting their positions and the presence or absence of hole machining.
上記、従来の目視による検査方法においては、貫通孔の
数が多い場合、未加工孔を見落とすことがある。In the conventional visual inspection method described above, when there are a large number of through holes, unprocessed holes may be overlooked.
本発明はこのような点に鑑みて創作されたもので、未加
工孔を見落としなく検出することができるプリント板の
検査方法を提供することを目的としている。The present invention was created in view of these points, and an object of the present invention is to provide a printed board inspection method that can detect unprocessed holes without overlooking them.
第１図は本発明のプリント板検査の原理図を示しており
、加工孔３−１〜３−ｎを有する被検査プリント坂（以
後プリント板と記す）３と、標準孔４−１〜４−ｎを有
する遮蔽板４とを対向して配設するとともに、プリント
板３と遮蔽板４との間にハーフミラ−５を設け、標準孔
４−１〜４−ｎとハーフミラ−５を通してプリント板３
の孔部に光を照射し、プリント板３の未加工孔部６より
反射する光をハーフミラ−５で反射させて表示板７に表
示し、未加工孔部を検出する構成としている。FIG. 1 shows a principle diagram of printed board inspection according to the present invention, in which a printed board to be inspected (hereinafter referred to as a printed board) 3 having processed holes 3-1 to 3-n, and standard holes 4-1 to 4-n are shown. A half mirror 5 is provided between the printed board 3 and the shielding board 4, and the printed board is passed through the standard holes 4-1 to 4-n and the half mirror 5. 3
The unprocessed holes are detected by irradiating light into the holes of the printed board 3, and reflecting the light reflected from the unprocessed holes 6 of the printed board 3 by the half mirror 5 and displaying it on the display board 7.
遮蔽板４の各標準孔４−１〜４−ｎを通った光はハーフ
ミラ−５を通過し、プリント板３の加工孔３−１〜３−
ｎに入射される。いま、加工孔３−１〜３− ｎを入射
した光は番孔を通過するが、未加工孔部６に入射した光
はプリント板３上に形成されたパターン銅箔で反射され
、点線で示すように、入射光路と同じ光路を通ってハー
フミラ−５に至り、ハーフミラ−５で反射されて表示板
７に入射する。表示板７は未加工孔部６の位置を表示す
る。The light passing through each standard hole 4-1 to 4-n of the shielding plate 4 passes through the half mirror 5, and then passes through the processed holes 3-1 to 3-n of the printed board 3.
n. Now, the light that has entered the processed holes 3-1 to 3-n passes through the holes, but the light that has entered the unprocessed hole 6 is reflected by the patterned copper foil formed on the printed board 3, and is reflected by the dotted line. As shown, the light passes through the same optical path as the incident light path, reaches the half mirror 5, is reflected by the half mirror 5, and enters the display panel 7. The display board 7 displays the position of the unprocessed hole 6.
第２図は本発明の一実施例のプリント板検査の模式図を
示しており、光を放射する光源９と、光源９より放射さ
、れた光を平行光とするレンズ１０を設けている。また
、加工孔３−１〜３−ｎを有するプリント板３と、標準
孔４−１〜４−ｎを有するマスクフィルムから成る遮蔽
板４とを対向して配設するとともに、プリント板３と遮
蔽板４との間にハーフミラ−５を傾斜を持たせて配設し
、ハーフミラ−５の反射方向に対向して表示板７面を配
設している。また、加工孔３−１〜３−ｎを透過した光
を吸収する吸収体１１をプリント板３の下部に設けてい
る。FIG. 2 shows a schematic diagram of a printed board inspection according to an embodiment of the present invention, in which a light source 9 that emits light and a lens 10 that converts the light emitted from the light source 9 into parallel light are provided. . Further, a printed board 3 having processed holes 3-1 to 3-n and a shielding plate 4 made of a mask film having standard holes 4-1 to 4-n are arranged facing each other, and the printed board 3 and A half mirror 5 is arranged with an inclination between it and the shielding plate 4, and a display plate 7 is arranged facing the reflection direction of the half mirror 5. Further, an absorber 11 is provided at the bottom of the printed board 3 to absorb the light transmitted through the processed holes 3-1 to 3-n.
光源９より放射された光は、レンズ１０で平行光となり
遮蔽板４の標準孔４−１〜４− ｎとハーフミラ−５を
通ってプリント板３の加工孔３−１〜３−ｎに入射され
る。いま、加工孔３−１〜３−ｎに入射した光は番孔を
通過して光吸収体１１で吸収される。The light emitted from the light source 9 becomes parallel light at the lens 10, passes through the standard holes 4-1 to 4-n of the shielding plate 4 and the half mirror 5, and enters the processed holes 3-1 to 3-n of the printed board 3. be done. Now, the light incident on the processed holes 3-1 to 3-n passes through the holes and is absorbed by the light absorber 11.
一方、図中の標準孔４−ｎを通った光は、実線で示すよ
うに、ハーフミラ−５を通って未加工孔部６に入射し、
プリント板３上に形成されたパターン銅箔８で反射され
、点線で示すように、入射光路と同じ光路を通ってハー
フミラ−５に至り、ハーフミラ−５で反射されて表示板
７に入射する。On the other hand, the light passing through the standard hole 4-n in the figure passes through the half mirror 5 and enters the unprocessed hole 6, as shown by the solid line.
The light is reflected by the patterned copper foil 8 formed on the printed board 3, passes through the same optical path as the incident light path, reaches the half mirror 5, is reflected by the half mirror 5, and enters the display board 7, as shown by the dotted line.
ハーフミラ−５を傾斜させてその反射光路を変えること
により、反射光と対向して設けられた表示板７面には未
加工孔部６の位置を表示する。この表示により、プリン
ト板に存在する未加工孔部を検出する。By tilting the half mirror 5 and changing the reflected light path, the position of the unprocessed hole 6 is displayed on the surface of the display plate 7 provided facing the reflected light. Based on this display, unprocessed holes existing in the printed board are detected.
以上説明したように本発明によれば、未加工孔を見落と
しなく検出でき、高精度のプリント板検査が可能となる
。As explained above, according to the present invention, it is possible to detect unprocessed holes without overlooking them, and it is possible to inspect printed boards with high precision.
第１図は本発明のプリント板検査の原理図、第２図は一
実施例のプリント板検査の模式図、第３図はプリント板
の貢通孔の模式図である。
図において、１はプリント板、１−１．１−２は回路パ
ターン、２−１〜２−ｎは言通孔、３は被検査プリント
板、３−１〜３−ｎは加工孔、４は遮蔽板、４−１〜４
−ｎは標準孔、５はハーフミラ−１６は未加工孔部、７
は表示板、８はｆｌ箔、９は光源、１０はレンズ、１１
は光吸収体を示している。
第４ミロ月ダブリシト販孜イト丙ｌとＪｕｌ第１図FIG. 1 is a principle diagram of a printed board inspection according to the present invention, FIG. 2 is a schematic diagram of an embodiment of a printed board inspection, and FIG. 3 is a schematic diagram of a tributary hole in a printed board. In the figure, 1 is a printed board, 1-1.1-2 is a circuit pattern, 2-1 to 2-n are communication holes, 3 is a printed board to be inspected, 3-1 to 3-n are processed holes, 4 is a shielding plate, 4-1~4
-n is a standard hole, 5 is a half mirror, 16 is an unprocessed hole, 7
is a display board, 8 is a fl foil, 9 is a light source, 10 is a lens, 11
indicates a light absorber. 4th Miro month dub sales Koito Hei and Jul Fig. 1
Claims (1)
と、標準孔（４−１〜４−ｎ）を有する遮蔽板（４）と
を対向して配設するとともに、前記プリント板と前記遮
蔽板との間にハーフミラー（５）を設け、前記標準孔と
ハーフミラーを通して前記プリント板の孔部に光を照射
し、前記プリント板の未加工孔部（６）より反射する光
を前記ハーフミラーで反射させて表示板（７）に表示し
、前記プリント板の未加工孔を検出するようにしたこと
を特徴とするプリント板の検査方法。Printed board (3) with processed holes (3-1 to 3-n)
and a shielding plate (4) having standard holes (4-1 to 4-n) are disposed facing each other, and a half mirror (5) is provided between the printed board and the shielding plate, and a half mirror (5) is provided between the printed board and the shielding plate. Irradiating light into the hole of the printed board through the standard hole and the half mirror, and reflecting the light reflected from the unprocessed hole (6) of the printed board by the half mirror and displaying it on the display board (7); A method for inspecting a printed board, comprising detecting unprocessed holes in the printed board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8350987A JPS63251110A (en) | 1987-04-03 | 1987-04-03 | Inspecting method for printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8350987A JPS63251110A (en) | 1987-04-03 | 1987-04-03 | Inspecting method for printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63251110A true JPS63251110A (en) | 1988-10-18 |
Family
ID=13804453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8350987A Pending JPS63251110A (en) | 1987-04-03 | 1987-04-03 | Inspecting method for printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63251110A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015010850A (en) * | 2013-06-26 | 2015-01-19 | 日本電信電話株式会社 | End face observation device |
| US9201015B2 (en) | 2011-07-14 | 2015-12-01 | International Business Machines Corporation | Plated through hole void detection in printed circuit boards by detecting a pH-sensitive component |
-
1987
- 1987-04-03 JP JP8350987A patent/JPS63251110A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9201015B2 (en) | 2011-07-14 | 2015-12-01 | International Business Machines Corporation | Plated through hole void detection in printed circuit boards by detecting a pH-sensitive component |
| US9250192B2 (en) | 2011-07-14 | 2016-02-02 | International Business Machines Corporation | Plated through hole void detection in printed circuit boards by detecting a pH-sensitive component |
| JP2015010850A (en) * | 2013-06-26 | 2015-01-19 | 日本電信電話株式会社 | End face observation device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1226348A (en) | Inspection system utilizing dark-field illumination | |
| JPH10300448A (en) | Device and method for inspection of printed circuit board assembly | |
| US4664525A (en) | Method and apparatus for detecting inferior container | |
| JPS63251110A (en) | Inspecting method for printed board | |
| JP2007107960A5 (en) | ||
| US4330712A (en) | Inspection apparatus for defects on patterns | |
| JP2537543B2 (en) | Circuit pattern inspection device for printed wiring boards | |
| JPS61207953A (en) | Automatic appearance inspecting device | |
| JPS62119444A (en) | Pattern inspector | |
| Bentley | The inspectron: An automatic optical printed circuit board (PCB) inspector | |
| CN220289430U (en) | AOI light source | |
| JPH04136747A (en) | Inspecting apparatus for external appearance of plate body | |
| JPS59180315A (en) | Through-hole inspecting method | |
| JPH0469511A (en) | Visual inspection device for soldering part and packaging component | |
| JP2801657B2 (en) | Package inspection equipment with pins | |
| JPH03210410A (en) | Pin grid array inspecting instrument | |
| JPS6144309A (en) | Pattern detecting method | |
| JP4389754B2 (en) | Board inspection equipment | |
| US4765743A (en) | Method of inspecting a master member | |
| JPS6145955A (en) | Inspecting method of through hole | |
| JPH04320951A (en) | Method and device for inspecting defect on glass plate surface | |
| WO2019239501A1 (en) | Foreign matter inspection device and foreign matter inspection method | |
| JPH04221747A (en) | Method and device for inspecting through-hole | |
| JPS638417B2 (en) | ||
| JPH01304305A (en) | Pattern shape observing device |