JPS63249664A - Substrate for thermal head and manufacture thereof - Google Patents
Substrate for thermal head and manufacture thereofInfo
- Publication number
- JPS63249664A JPS63249664A JP8298687A JP8298687A JPS63249664A JP S63249664 A JPS63249664 A JP S63249664A JP 8298687 A JP8298687 A JP 8298687A JP 8298687 A JP8298687 A JP 8298687A JP S63249664 A JPS63249664 A JP S63249664A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- thermal head
- glass
- layer
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 44
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000000919 ceramic Substances 0.000 claims abstract description 22
- 239000011521 glass Substances 0.000 claims abstract description 20
- 239000012790 adhesive layer Substances 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 abstract description 15
- 238000000926 separation method Methods 0.000 abstract description 4
- 239000011148 porous material Substances 0.000 abstract description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000005373 porous glass Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000011534 incubation Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はサーマルヘッド用基板およびその製造方法に関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a substrate for a thermal head and a method for manufacturing the same.
従来のサーマルヘッド用の基板の一例は第２図に示すよ
うに、セラミックス基板１上に保温層２を設けたもので
あって、保温層２はガラスで構成されていた。As shown in FIG. 2, an example of a conventional substrate for a thermal head is one in which a heat insulating layer 2 is provided on a ceramic substrate 1, and the heat insulating layer 2 is made of glass.
しかし最近サーマルヘッドに対しより高精細でより高速
にかつより小さなパワーで印字の可能な性能が・求めら
れており、上記の従来のサーマルヘッド用基板では、ド
ツト間の熱分離、熱のこちりの問題から限界があった。However, recently there has been a demand for thermal heads to have the ability to print with higher precision, faster speeds, and with less power. There was a limit due to the problem.
つまり、パワーを小さくて済むようにするためには保温
層２を厚くする必要があるが、こうすると発熱部の通電
をオフにした時の温度が十分速かに減少しない。また熱
分離も悪化する。逆に保温層２を薄くすると高速の印字
は可能となるが、印字に大ぎなパワーを必要とする。That is, in order to reduce the power, it is necessary to make the heat insulating layer 2 thicker, but if this is done, the temperature will not decrease sufficiently quickly when the power to the heat generating section is turned off. Thermal separation also worsens. On the other hand, if the heat insulating layer 2 is made thinner, high-speed printing becomes possible, but printing requires a large amount of power.
これらの問題を解決するためには、発熱部に通電した時
、基板上に十分熱が蓄えられ、その後オフにした時十分
速やかに基板に熱が吸収されるサーマルヘッドの構造が
必要となる。In order to solve these problems, a thermal head structure is required that allows sufficient heat to be stored on the substrate when the heat generating section is energized, and then absorbs the heat sufficiently quickly into the substrate when the heat generating section is turned off.
この問題を解決するために、実開昭６１−１４８６４０
公報に開示されているごとく、多孔質ガラスを接着した
基板が考案されたが、多孔質ガラスの薄板は高価であり
、また強度が低く、製造上の困難があった。In order to solve this problem,
As disclosed in the publication, a substrate to which porous glass is bonded has been devised, but thin plates of porous glass are expensive, have low strength, and are difficult to manufacture.
この発明は以上述べた従来のサーマルヘッド用基板の欠
点を除去し、保温性に優れ、かつ熱分離の良好なサーマ
ルヘッド用基板を提供することを目的とする。It is an object of the present invention to eliminate the drawbacks of the conventional thermal head substrates described above, and to provide a thermal head substrate with excellent heat retention and good thermal isolation.
本発明のサーマルヘッド用基板は、セラミクス基板と、
該セラミクス基板上に設けられたガラス薄板と、両者間
に少なくとも発熱体形成予定領域を除いて設けられた接
着剤層とを備えたことを特徴とする。The thermal head substrate of the present invention includes a ceramic substrate,
It is characterized by comprising a glass thin plate provided on the ceramic substrate and an adhesive layer provided between the two except for at least the area where the heating element is to be formed.
本発明のサーマルヘッド用基板の製造方法は、セラミク
ス基板上にそのうちの、少なくとも発熱体形成予定領域
を除いて接着剤を塗布する工程と、これにガラス薄板を
密着させる工程と、これをプレスしながら接着剤を硬化
させる工程とを含むことを特徴とするものである。The method for manufacturing a thermal head substrate of the present invention includes the steps of applying an adhesive onto a ceramic substrate except for at least the area where the heating element is to be formed, adhering a thin glass plate to the adhesive, and pressing this. The method is characterized in that it includes a step of curing the adhesive.
（作 用）
上記のように、抵抗発熱体形成予定領域を除いて接着剤
層を介在させると、抵抗発熱形成予定領域においては、
セラミクス基板とガラス薄板との間に微細な細孔の群か
ら成る空間が形成される。(Function) As described above, when the adhesive layer is interposed except for the area where the resistance heating element is planned to be formed, in the area where the resistance heating element is planned to be formed,
A space consisting of a group of fine pores is formed between the ceramic substrate and the thin glass plate.
これはセラミクス基板の表面に微細な凹凸が存在するか
らである。このため、保温層とセラミクス基板を含めた
基板全体としての見掛は上の熱伝導率が小さくなり、熱
し易く冷め易くなる。即ち熱応答性が良好となる。従っ
て上記のようなサーマルヘッド用基板を用いてサーマル
ヘッドを構成すれば、少ない電力で印字が可能であり、
逆に同一の電力を用いれば従来に比べより薄い保温層で
よく、従って、ドツト間の熱分離が良好となり、熱的な
尾引きが減少する。即ち、印加電力をオフしたときの温
度の低下が迅速になる。This is because there are fine irregularities on the surface of the ceramic substrate. For this reason, the apparent thermal conductivity of the entire substrate including the heat insulating layer and the ceramic substrate is low, making it easier to heat up and cool down. In other words, the thermal response is improved. Therefore, if a thermal head is constructed using the above-mentioned thermal head substrate, printing can be performed with less power.
On the contrary, if the same electric power is used, a thinner heat insulating layer is required than in the past, and therefore thermal separation between dots is improved and thermal tailing is reduced. That is, the temperature decreases quickly when the applied power is turned off.
また、上記の製造方法によれば、接着剤層によりガラス
薄板をセラミクス基板に接合することとしているので、
用いるガラス板に材質的な制約が少なくなり、所望のサ
ーマルヘッド特性を得るため最適な種類のガラスを選ぶ
ことができる。Furthermore, according to the above manufacturing method, the thin glass plate is bonded to the ceramic substrate using an adhesive layer.
There are fewer restrictions on the material of the glass plate used, and the optimal type of glass can be selected to obtain the desired thermal head characteristics.
第１図は本発明の一実施例のサーマルヘッド用基板の構
造を示す断面図である。FIG. 1 is a sectional view showing the structure of a thermal head substrate according to an embodiment of the present invention.
セラミクス基板１１上に、一部即ち抵抗発熱体形成予定
領域１４を除いて、接着剤層１２が設けられ、これをも
ってガラス薄板１３が基板上に接着されている。セラミ
クス基板１１の表面には、微視的にみれば０．５〜数μ
ｍの細かい凸凹が存在するため、接着剤層１２が存在し
ない部分１４では、ガラス層１３からセラミクス層１１
の間に、細孔の群から成る空間が生ずる。従って、ガラ
ス層１３からセラミクス層１１への熱伝導率が低下する
。以下、本発明一実施例の製造方法を述べる。An adhesive layer 12 is provided on the ceramic substrate 11 except for a portion, that is, a region 14 where the resistance heating element is to be formed, and a thin glass plate 13 is bonded to the substrate using the adhesive layer 12. Microscopically, the surface of the ceramic substrate 11 has a thickness of 0.5 to several μ.
Since there are fine irregularities of m, in the part 14 where the adhesive layer 12 is not present, the ceramic layer 11 is removed from the glass layer 13.
In between, a space is created consisting of a group of pores. Therefore, the thermal conductivity from the glass layer 13 to the ceramic layer 11 decreases. A manufacturing method according to an embodiment of the present invention will be described below.
セラミクス基板１１上に一部即ち抵抗発熱体形成予定領
域１４を除いてエポキシ樹脂系熱硬化性接着剤１２を薄
く塗布した。この上に厚さ５０μｍの薄板ガラス１３（
旭硝子社製）を密着させ、０．１ＫＩ／ｃｔｉｔの圧力
でプレスしながら加熱し、接着剤１２を硬化させ所望の
基板を得た。An epoxy resin-based thermosetting adhesive 12 was applied thinly onto a portion of the ceramic substrate 11, except for a region 14 where a resistance heating element was to be formed. On top of this, a thin plate glass 13 with a thickness of 50 μm (
(manufactured by Asahi Glass Co., Ltd.) and heated while pressing at a pressure of 0.1 KI/ctit to harden the adhesive 12 and obtain a desired substrate.
次に上記のようにして得た基板を用い、接着剤層１２の
介在しない部分（発熱体形成予定領域）の直上に発熱体
を形成してサーマルヘッドを構成し、比較試料として石
塀硝子社製グレーズアルミナ基板（グレーズ厚５０μｍ
）上にも同様に発熱体を形成してサーマルヘッドを構成
した。サーマルヘッドの発熱体は５０Ｘ７５μｍの矩形
とし、１６ｄＯ１Ｓ／ｌ１ｌｎの密度で配置した。これ
を、パルス巾が０．８ｍＳ 、 ＜り返し周期が５ｍｓ
のパルスで駆動し、その印加電力と、赤外線温度ｈ１を
用いて計測した発熱体部のピーク温度との関係を調べた
。その結果を第３図に示す。Next, using the substrate obtained as described above, a heating element was formed directly above the area where the adhesive layer 12 was not present (area where the heating element was to be formed) to configure a thermal head, and a comparison sample was prepared using Ishibe Glass Co., Ltd. glazed alumina substrate (glaze thickness 50μm)
) A heating element was similarly formed on the top of the thermal head to constitute a thermal head. The heating element of the thermal head had a rectangular shape of 50×75 μm and was arranged at a density of 16 dO1S/l1ln. The pulse width is 0.8 mS, and the repetition period is 5 mS.
The relationship between the applied power and the peak temperature of the heating element measured using the infrared temperature h1 was investigated. The results are shown in FIG.
この図から明らかなように本発明の基板を用いて作製し
たサーマルヘッドは、従来のサーマルヘラドに比べ同一
の印加電力に対してピーク温度が高く、逆にピーク温度
を同一とすれば印加電力は小さくてよい。即ち、熱効率
が良好である。従って、保温層を厚くしても、印加電力
を比較的小さくすることができ、熱応答性が良好となり
、また空間的な熱分離も良好となる。As is clear from this figure, the thermal head fabricated using the substrate of the present invention has a higher peak temperature for the same applied power than the conventional thermal head, and conversely, for the same peak temperature, the applied power is lower. It's fine. That is, thermal efficiency is good. Therefore, even if the heat insulating layer is thick, the applied power can be made relatively small, the thermal response is good, and the spatial thermal isolation is also good.
尚、上記の実施例では接着剤１２としてエポキシ樹脂系
のものを用いたが、本発明はこれに限定されず、他の樹
脂系接着剤、無機系接着剤を用いてもよい。In the above embodiment, an epoxy resin adhesive was used as the adhesive 12, but the present invention is not limited thereto, and other resin adhesives or inorganic adhesives may be used.
またアルミナ基板１１は、その表面を荒研磨等により所
望の表面粗度に荒らし所望の大きさの凹凸を表面に形成
した後、用いてもよい。Further, the alumina substrate 11 may be used after roughening the surface to a desired surface roughness by rough polishing or the like to form irregularities of a desired size on the surface.
以上述べたように本発明によるサーマルヘッド用基板を
用いてサーマルヘッドを構成すれば、小さい印加電力で
高い温度の発熱が可能なサーマルヘッドを構成すること
ができる。また、本発明の製造方法によれば、用いるガ
ラス板に材質的な制約がないので、所望のサーマルヘッ
ドの特性を得るため最適な種類のガラスを選ぶことがで
きる。As described above, by constructing a thermal head using the thermal head substrate according to the present invention, a thermal head capable of generating heat at a high temperature with small applied power can be constructed. Further, according to the manufacturing method of the present invention, there are no material restrictions on the glass plate used, so it is possible to select the optimal type of glass to obtain the desired characteristics of the thermal head.
第１図は本発明一実施例のサーマルヘッド用基板を示す
断面図、第２図は従来のサーマルヘッド用基板を示す断
面図、第３図は印加電力とピーク温度の関係を示す線図
でおる。
１１・・・セラミクス基板、１２・・・接着剤層、１３
・・・ガラス薄板。
一実 ｉ８Ｌイタ１１
茶 ｌ 図
従来Ｏプーマルへ・ンド用′基版
第 ２ 目
θ θ：５ ／、０ １５
２．０ＥＴｊ刀ｆｆｔ７Ｊ
印〃ｕ電力とご−り温浸
第 ３ 悶FIG. 1 is a sectional view showing a thermal head substrate according to an embodiment of the present invention, FIG. 2 is a sectional view showing a conventional thermal head substrate, and FIG. 3 is a diagram showing the relationship between applied power and peak temperature. is. 11... Ceramics substrate, 12... Adhesive layer, 13
...Thin glass plate. Kazumi i8L Ita 11 Brown l Figure Conventional O Pumaru/nd 'Basic version 2nd item θ θ: 5 /, 0 15
2.0ETj sword fft7J Indus electric power togori incubation 3rd agony
Claims (1)
に少なくとも発熱体形成予定領域を除いて設けられた接
着剤層とを備えたことを特徴とするサーマルヘッド用基
板。 ２、セラミクス基板上にそのうちの、少なくとも発熱体
形成予定領域を除いて接着剤を塗布する工程と、 これにガラス薄板を密着させる工程と、これをプレスし
ながら接着剤を硬化させる工程と を含むことを特徴とするサーマルヘッド用基板の製造方
法。[Claims] 1. The invention is characterized by comprising a ceramic substrate, a thin glass plate provided on the ceramic substrate, and an adhesive layer provided between the two except for at least an area where the heating element is to be formed. Thermal head substrate. 2. It includes the steps of applying an adhesive onto the ceramic substrate except for at least the area where the heating element is to be formed, a step of adhering a thin glass plate to this, and a step of curing the adhesive while pressing this. A method of manufacturing a substrate for a thermal head, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8298687A JPS63249664A (en) | 1987-04-06 | 1987-04-06 | Substrate for thermal head and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8298687A JPS63249664A (en) | 1987-04-06 | 1987-04-06 | Substrate for thermal head and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63249664A true JPS63249664A (en) | 1988-10-17 |
Family
ID=13789537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8298687A Pending JPS63249664A (en) | 1987-04-06 | 1987-04-06 | Substrate for thermal head and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63249664A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007083532A (en) * | 2005-09-22 | 2007-04-05 | Seiko Instruments Inc | Heating resistor element, thermal head, printer, and method for manufacturing heating resistor element |
| JP2009119851A (en) * | 2007-10-23 | 2009-06-04 | Seiko Instruments Inc | Heating resistor element, manufacturing method for the same, thermal head, and printer |
| JP2009262439A (en) * | 2008-04-25 | 2009-11-12 | Seiko Instruments Inc | Manufacturing method for heating resistor element component |
| JP2010100022A (en) * | 2008-10-27 | 2010-05-06 | Seiko Instruments Inc | Heating resistance element part |
| JP2010125751A (en) * | 2008-11-28 | 2010-06-10 | Seiko Instruments Inc | Thermal head, thermal printer, and method of manufacturing the thermal head |
| JP2010125749A (en) * | 2008-11-28 | 2010-06-10 | Seiko Instruments Inc | Thermal head, thermal printer, and method of manufacturing the thermal head |
| JP2010125750A (en) * | 2008-11-28 | 2010-06-10 | Seiko Instruments Inc | Thermal head, thermal printer, and method of manufacturing the thermal head |
| JP2011116136A (en) * | 2011-03-14 | 2011-06-16 | Seiko Instruments Inc | Heating resistor element, thermal head, and printer |
| JP2011121337A (en) * | 2009-12-14 | 2011-06-23 | Seiko Instruments Inc | Thermal head and printer |
| JP2011126135A (en) * | 2009-12-17 | 2011-06-30 | Seiko Instruments Inc | Thermal head and printer |
-
1987
- 1987-04-06 JP JP8298687A patent/JPS63249664A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007083532A (en) * | 2005-09-22 | 2007-04-05 | Seiko Instruments Inc | Heating resistor element, thermal head, printer, and method for manufacturing heating resistor element |
| JP2009119851A (en) * | 2007-10-23 | 2009-06-04 | Seiko Instruments Inc | Heating resistor element, manufacturing method for the same, thermal head, and printer |
| JP2009262439A (en) * | 2008-04-25 | 2009-11-12 | Seiko Instruments Inc | Manufacturing method for heating resistor element component |
| JP2010100022A (en) * | 2008-10-27 | 2010-05-06 | Seiko Instruments Inc | Heating resistance element part |
| JP2010125751A (en) * | 2008-11-28 | 2010-06-10 | Seiko Instruments Inc | Thermal head, thermal printer, and method of manufacturing the thermal head |
| JP2010125749A (en) * | 2008-11-28 | 2010-06-10 | Seiko Instruments Inc | Thermal head, thermal printer, and method of manufacturing the thermal head |
| JP2010125750A (en) * | 2008-11-28 | 2010-06-10 | Seiko Instruments Inc | Thermal head, thermal printer, and method of manufacturing the thermal head |
| JP2011121337A (en) * | 2009-12-14 | 2011-06-23 | Seiko Instruments Inc | Thermal head and printer |
| JP2011126135A (en) * | 2009-12-17 | 2011-06-30 | Seiko Instruments Inc | Thermal head and printer |
| JP2011116136A (en) * | 2011-03-14 | 2011-06-16 | Seiko Instruments Inc | Heating resistor element, thermal head, and printer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1582360B1 (en) | Thermal head having adhesive interposed between adhesion surface of heat-dissipation plate and adhesion surface of head substrate and method for producing the same | |
| JPS63249664A (en) | Substrate for thermal head and manufacture thereof | |
| WO1995035213A1 (en) | Thermal printing head, substrate used therefor and method for producing the substrate | |
| EP0244643A3 (en) | Process for manufacturing thermal ink jet printheads and structures produced thereby | |
| CN102166887A (en) | Thermal head, producing method thereof and printer | |
| JPH1134376A (en) | Thermal head and fabrication thereof | |
| JPS6042069A (en) | Thermal print head | |
| JPH078578B2 (en) | Method for joining piezoelectric body and glass in ink jet recording head | |
| JPH0612928Y2 (en) | Thermal head | |
| JP2962374B2 (en) | Method of manufacturing glazed substrate | |
| JP3114790B2 (en) | Thermal head | |
| US6456312B1 (en) | Thermal head, method of manufacturing the same, and thermal stencil making apparatus using the same | |
| JPH0343259A (en) | Manufacture of thermal head and manufacture of glaze substrate | |
| JPH09100183A (en) | Thick film grazed substrate and its production | |
| JPH0848049A (en) | Thermal printing head and production of substrate therefor | |
| JPS5931276B2 (en) | Manufacturing method of honeycomb diaphragm | |
| JPS60234862A (en) | Thermal head | |
| JPH07329329A (en) | Thermal print board | |
| JP2599907B2 (en) | Thermal head | |
| JPS62173266A (en) | Manufacture of thermal print head | |
| JP5905225B2 (en) | Manufacturing method of thermal print head | |
| JPS62292261A (en) | Hard brazing method | |
| JPH01182062A (en) | Manufacture of end thermal head | |
| JPH0525176B2 (en) | ||
| JPS62109667A (en) | Manufacture of thermal head |