JPS63226048A - Conduction cooling structure for semiconductor element - Google Patents
Conduction cooling structure for semiconductor elementInfo
- Publication number
- JPS63226048A JPS63226048A JP62058724A JP5872487A JPS63226048A JP S63226048 A JPS63226048 A JP S63226048A JP 62058724 A JP62058724 A JP 62058724A JP 5872487 A JP5872487 A JP 5872487A JP S63226048 A JPS63226048 A JP S63226048A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- semiconductor element
- lead
- spring
- conduction cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 238000001816 cooling Methods 0.000 title claims abstract description 16
- 229910000906 Bronze Inorganic materials 0.000 abstract description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010974 bronze Substances 0.000 abstract description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 239000002826 coolant Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
半導体素子の伝導冷却構造であって、プリント板と半導
体素子をばね状のリードで電気的に接続することにより
、プリント板に所定の間隔を隔てて設けられたヒートシ
ンクに押圧密着させることができ、簡単な構造で良好な
冷却を可能とする。[Detailed Description of the Invention] [Summary] A conductive cooling structure for semiconductor elements, which is provided on a printed board at a predetermined interval by electrically connecting the printed board and the semiconductor element with spring-like leads. It can be press-fitted to a heat sink, which enables good cooling with a simple structure.
本発明は半導体素子の伝導冷却構造に関するものである
。The present invention relates to a conduction cooling structure for semiconductor devices.
従来大型コンピュータ等では、例えば１５Ｃ１１角程度
の大きさのプリント板に発熱量の大きい（例えばｌ０Ｗ
） ＩＣ、ＬＳＩ等の半導体素子を１０個程度搭載した
ユニットを用いるようになって来ているためその冷却が
重要な課題となっている。Conventionally, in large computers, etc., a printed board with a size of about 15C11 square has a large amount of heat (for example, 10W).
) As units equipped with about 10 semiconductor elements such as ICs and LSIs are being used, cooling them has become an important issue.
第２図は従来の大型コンピュータの半導体素子の伝導冷
却構造を示す図である。同図ａに示すものは、プリント
板１に実装されたＩＣ、ＬＳＩ等の半導体素子２の上面
よりと一部シンク３に設けられたピストン４をスプリン
グ５で押圧接触させ、素子２を冷却するようになってい
る。また同図すに示すものはヒートシンク３に伝熱板６
を有するベローズ７を設け、ヒートシンク３内に冷却媒
体を流し、その圧力とベローズ７の張力で伝熱板６を半
導体素子２に押圧し冷却するようになっている。FIG. 2 is a diagram showing a conventional conduction cooling structure for semiconductor elements of a large-sized computer. In the device shown in FIG. 1A, a piston 4 provided in a sink 3 is brought into pressure contact with the upper surface of a semiconductor element 2 such as an IC or LSI mounted on a printed circuit board 1 by a spring 5 to cool the element 2. It looks like this. In addition, the one shown in the same figure has a heat transfer plate 6 on the heat sink 3.
A cooling medium is flowed into the heat sink 3, and the heat exchanger plate 6 is pressed against the semiconductor element 2 by the pressure of the cooling medium and the tension of the bellows 7, thereby cooling the semiconductor element 2.
そして上記ａ、ｂ共、ユニットの保守上しばしば半導体
素子２とヒートシンク３とを切り放す必要があるため、
ヒートシンク３はプリント板１に対してボルト８等で着
脱自在に取り付けられている。In both a and b above, it is often necessary to separate the semiconductor element 2 and the heat sink 3 for maintenance of the unit.
The heat sink 3 is detachably attached to the printed board 1 with bolts 8 or the like.
上記従来の半導体素子の伝導冷却構造において、第２図
ａに示すものは、構造が複雑であり、またヒートシンク
３とピストン４との間にあるすきまにより熱の伝導が阻
害されるという欠点があり、第２図すに示すものは熱伝
導は良いが構造が複雑であるという欠点がある。Among the conventional conduction cooling structures for semiconductor devices, the structure shown in FIG. , the one shown in Figure 2 has good thermal conductivity but has the disadvantage of a complicated structure.
本発明はこのような点にかんがみて創作されたもので、
構造が簡単で冷却効率の良い半導体素子の伝導冷却構造
を提供することを目的としている。The present invention was created in view of these points.
The object of the present invention is to provide a conduction cooling structure for semiconductor elements that has a simple structure and high cooling efficiency.
このため本発明においては第１図に例示するように、プ
リント板１０に実装した半導体素子１１を、該プリント
板１０に所定の間隔を隔てて着脱自在に設けられたヒー
トシンクエ２により冷却する半導体素子の伝導冷却構造
において、上記半導体素子１１とプリント板１０との電
気的接続にばね状のり一ド１３を用い、該ばね状リード
１３により前記半導体素子１１を前記ヒートシンク１２
に押圧密着させるように付勢したことを特徴としている
。For this reason, in the present invention, as illustrated in FIG. 1, a semiconductor element 11 mounted on a printed board 10 is cooled by a heat sink 2 detachably provided on the printed board 10 at a predetermined interval. In the element conduction cooling structure, a spring-like lead 13 is used to electrically connect the semiconductor element 11 and the printed board 10, and the spring-like lead 13 connects the semiconductor element 11 to the heat sink 12.
It is characterized by being biased so that it presses into close contact with the.
プリント板１０と半導体素子１１とをばね状リード１３
で接続することにより電気的接続とヒートシンク１２へ
の押圧用ばねを兼用させることができ、構造が簡単で良
好な伝導冷却が可能となる。A spring-like lead 13 connects the printed board 10 and the semiconductor element 11.
By making the connection, the spring can serve both as an electrical connection and as a spring for pressing the heat sink 12, allowing for a simple structure and good conduction cooling.
第１図は本発明の実施例を示す側面図である。 FIG. 1 is a side view showing an embodiment of the present invention.
本実施例は同図に示すように、ヒートシンク１２がプリ
ント板１０に所定の間隔を隔ててボルト１４等で着脱自
在に設けられていることは従来と同様であり、本実施例
の要点は、半導体素子１１を、例えばリン青銅等のばね
性の有る材料で形成したばね状リード１３を用いてプリ
ント機工０に電気的に接続するとともに、そのばね性を
利用してヒートシンク１２に押圧するように付勢してい
ることである。As shown in the figure, this embodiment is the same as the conventional one in that the heat sink 12 is detachably provided on the printed board 10 at a predetermined interval with bolts 14, etc., and the main points of this embodiment are as follows. The semiconductor element 11 is electrically connected to the printing machine 0 using a spring-like lead 13 made of a material with spring properties such as phosphor bronze, and is pressed against the heat sink 12 by using the spring property. It is something that is energizing.
このように構成された本実施例は、ヒートシンク１２に
半導体素子１１がばね状リード１３で押圧され密着する
ので、半導体素子１１で発生した熱はヒートシンク１２
に効率良く伝導される。In this embodiment configured in this way, the semiconductor element 11 is pressed against the heat sink 12 by the spring-like leads 13 and is in close contact with the heat sink 12, so that the heat generated in the semiconductor element 11 is transferred to the heat sink 12.
is efficiently conducted.
以上述べてきたように、本発明によれば、極めて簡易な
構成で半導体素子の伝導冷却ができ、実用的には極めて
有用である。As described above, according to the present invention, a semiconductor element can be conductively cooled with an extremely simple configuration, and is extremely useful in practice.
第１図は本発明の実施例を示す図、
第２図は従来の半導体素子の伝導冷却構造を示す図であ
る。
第１図において、
１０はプリント板、
１１は半導体素子、
１２はヒートシンク、
１３はばね状リード、
１４はボルトである。FIG. 1 is a diagram showing an embodiment of the present invention, and FIG. 2 is a diagram showing a conventional conduction cooling structure for a semiconductor element. In FIG. 1, 10 is a printed board, 11 is a semiconductor element, 12 is a heat sink, 13 is a spring-shaped lead, and 14 is a bolt.
Claims (1)
を、該プリント板（１０）に所定の間隔を隔てて着脱自
在に設けられたヒートシンク（１２）により冷却する半
導体素子の伝導冷却構造において、 上記半導体素子（１１）とプリント板（１０）との電気
的接続にばね状のリード（１３）を用い、該ばね状リー
ド（１３）により前記半導体素子（１１）を前記ヒート
シンク（１２）に押圧密着させるように付勢したことを
特徴とした半導体素子の伝導冷却構造。[Claims] 1. Semiconductor element (11) mounted on printed board (10)
In a conductive cooling structure for a semiconductor element, in which the semiconductor element (11) and the printed board (10) are cooled by a heat sink (12) detachably provided at a predetermined interval on the printed board (10), A semiconductor device characterized in that a spring-like lead (13) is used for electrical connection, and the spring-like lead (13) biases the semiconductor device (11) so as to press it into close contact with the heat sink (12). Conduction cooling structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62058724A JPS63226048A (en) | 1987-03-16 | 1987-03-16 | Conduction cooling structure for semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62058724A JPS63226048A (en) | 1987-03-16 | 1987-03-16 | Conduction cooling structure for semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63226048A true JPS63226048A (en) | 1988-09-20 |
Family
ID=13092449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62058724A Pending JPS63226048A (en) | 1987-03-16 | 1987-03-16 | Conduction cooling structure for semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63226048A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06349134A (en) * | 1993-06-11 | 1994-12-22 | Nippon Chemicon Corp | Supporting and connecting mechanism of magnetic field modulating head |
| JPH06349133A (en) * | 1993-06-11 | 1994-12-22 | Nippon Chemicon Corp | Supporting and connecting mechanism of magnetic field modulating head |
| US7450389B2 (en) | 2004-09-06 | 2008-11-11 | Infineon Technologies Ag | Sub-assembly |
| WO2020037467A1 (en) * | 2018-08-20 | 2020-02-27 | 海能达通信股份有限公司 | Heat dissipation assembly and electronic device |
-
1987
- 1987-03-16 JP JP62058724A patent/JPS63226048A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06349134A (en) * | 1993-06-11 | 1994-12-22 | Nippon Chemicon Corp | Supporting and connecting mechanism of magnetic field modulating head |
| JPH06349133A (en) * | 1993-06-11 | 1994-12-22 | Nippon Chemicon Corp | Supporting and connecting mechanism of magnetic field modulating head |
| US7450389B2 (en) | 2004-09-06 | 2008-11-11 | Infineon Technologies Ag | Sub-assembly |
| WO2020037467A1 (en) * | 2018-08-20 | 2020-02-27 | 海能达通信股份有限公司 | Heat dissipation assembly and electronic device |
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