CN1274518A - Burn-in board with adaptable heat sink device - Google Patents
Burn-in board with adaptable heat sink device Download PDFInfo
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- CN1274518A CN1274518A CN98809918A CN98809918A CN1274518A CN 1274518 A CN1274518 A CN 1274518A CN 98809918 A CN98809918 A CN 98809918A CN 98809918 A CN98809918 A CN 98809918A CN 1274518 A CN1274518 A CN 1274518A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
A system and method for burning-in an integrated circuit chip including at least a socket capable of receiving and supporting the chip, electrical leads in the socket for connecting to corresponding leads on the chip, and a heat sink in thermal contact with a cooling medium. The heat sink includes a thermal interface in releasable thermal contact with the integrated circuit in the socket. The heat sink removes more heat from the integrated circuit than is generated during the burn-in process and the integrated circuit is maintained within a predetermined desired temperature range by monitoring the temperature of the integrated circuit and supplying make-up heat as needed. Multiple sockets can be grouped together and cooled by a manifolded cooling system, with the temperature of each integrated circuit being individually monitored and controlled.
Description
The application require on October 7th, 1997 application 60/061,305, in application on October 21st, 1997 60/062,555, in the rights and interests of 60/062,673 U.S. Provisional Application of application on October 22nd, 1997, quote these documents here.
The present invention relates generally to the device of the aging of integrated circuit (IC) chip (IC) and test, specifically, the present invention relates to be used to guarantee the cooling technology of the IC device on the burn-in board that the chip of coming of new can be suitable for using.More specifically say, the present invention includes the socket of the cooling capacity that is used to provide raising and can cool off the system of IC and socket effectively.
The electronic device field of making all knows, before being assembled into various electronics subelements than bigger device, test and/or " wearing out " they.For example, computer chip is connected in the ageing system usually, can work so that guarantee all electronic circuits that need in each chip.Aging technique can speed-up chip aging, so can be in manufacturing process: early discern and abandon defective chip.Because this technology can allow the producer to avoid under other situation formation contain defective chip more greatly, your device expense of wasting, so need do like this.Except that aging, computer chip and other integrated circuit can also carry out various other test operations.Here used term " test " is intended to comprise and comprises aging operation.
In aging operation, each chip, integrated circuit (IC) or the other electron component that after this are called " measured device " or " DUT " are connected on several electrical leads.These lead-in wires are generally taked the form of little array of solder balls, and these little solder balls are positioned to corresponding to the electrical lead on the DUT lower surface.DUT places on the lead-in wire of array, so that form electrical connection at each point that needs.
During the aging or test operation, electric current produces heat when passing each circuit on the DUT by each lead-in wire.Up to now, the power of IC is less, thereby the amount of power consumption between the computer chip aging period is less.For this reason, the heat that is produced makes that aging equipment in most cases can be by air cooling.Along with the appearance of new more high-power die, the heat that produces between aging period increases by ten times, is increased to 30-100 watt or more from about 3-10 watt.
In addition, the increase of Chip Packaging cost has promoted manufacturer and has gone to improve aging step, so that before last encapsulation rather than wearing out thereafter.This can make manufacturer save the cost of the defective chip of encapsulation, but means that aging operation must carry out the IC of part encapsulation, and silicon chip self may expose in this encapsulation.Compare with the chip of encapsulation fully, the IC of part encapsulation is not firmer, more subject to damage.So aging operation can not add excessive or uneven power to DUT.
Because aging must under the temperature of control, carrying out, and because chip can not be exposed to temperature extremes, so must remove the big calorimetric that produces between aging period.Do not have very large heat sinkly, air cooling can't provide sufficient cooling.Attempted utilizing the liquid cools of electrical insulation fluids, but proved that for very high-power DUT be impracticable.Simultaneously, compare with chip aging or that test encapsulates fully, aging or part of detecting packaged chip has produced new problem.For example, the chip of part encapsulation generally is unsuitable for easily heating on request the rate set.
Known, high power transistor produces and wears out sizable heat of operating period.Yet transistor and conventional Transistor packages structure make the cooling system that designs for the transistor ageing device be not easy to be applicable to cooling IC device.In addition, transistor generally is sealed in durability metal or the Plastic Package, and occurrence does not occur in the transistor ageing device in aging chip so this processing relates to.And, to compare with the volume of the high power transistor of needs tests, the big manyfold of volume of IC that must test is so the not too high cost factor relevant with transistor testing is being used for can becoming very high when chip is measured.
Except with sufficient cooling capacity is provided for given aging equipment and provides the relevant problem in the transmission surface of not limiting this ability heat, the reason of problem is that also the heat aging or that test period produces of each DUT differs widely to each other.Find that in some cases, the difference of the heat that produces has more than two orders of magnitude.Owing to be suitable for the cooling system that fully cooling produces the DUT of more heat transfer, the meeting sub-cooled produces the DUT of less heat, causes that their temperature drops to the aging temperature scope that is lower than requirement, so the result of this deviation is difficult to aging simultaneously several devices.On the contrary, be suitable for cooling off the cooling system of the DUT that produces less heat, not enough to the DUT cooling that produces more heat transfer, cause their temperature to be raised to the aging temperature scope that is higher than requirement.
Therefore, be desirable to provide a kind of DUT aging equipment, can remove watt heat of 30-300 at least of several chips in each simultaneously, can keep the temperature of each DUT in the close limit of hope simultaneously.In addition, even if the heat that a plurality of DUT produces has the above deviation of an order of magnitude, even and if some DUT can produce few heat to 3 watts, preferred embodiment also should be able to remain on DUT in the predetermined temperature range.Preferred embodiment also should be incorporated into easily and can handle simultaneously in the system of a plurality of DUT.These targets need this device can compensate the deviation of the heat that produces between aging simultaneously a plurality of DUT.Preferred embodiment should be able to before the aging technique, during or afterwards, unpackaged chip is handled on damage ground.It would also be desirable to provide a kind of from cost, labour and the economical and practical aging equipment of reliability aspect consideration.
The present invention relates to a kind of aging equipment, it can remove watt heat of 30-100 at least in each of several DUT simultaneously, can compensate simultaneously the deviation of the heat that produces between a plurality of DUT, and the temperature that keeps each chip is in the close limit of hope, and said DUT comprises the DUT that produces 3 watts or more heats.The easy introducing of the present invention can be worn out in the system of a plurality of DUT simultaneously.Preferred embodiment is to the damage minimum of DUT, and considers economical and practical from cost, labour and reliability aspect.
The present invention relates to a kind ofly be used for holding between aging period and the novel socket that contacts each chip, and support and cool off the system of several sockets.Said socket comprises that can remove is the heat doubly of 3-10 at least of previous system from chip.Said cooling system comprises the heat sink parts of high heat conduction with the good thermo-contact of chip or measured device (DUT) at least.
The present invention includes the device and the technology that can realize good thermo-contact between heat sink parts and DUT.Preferred embodiment provides any irregular conformal interface that adapts on the DUT upper surface.In first embodiment, this thermo-contact realizes by an elasticity heat pad and a radiator of constituting socket cover together.Elasticity heat pad is better covered by thin metal film.In another embodiment, the conformal interface comprises the low-melting-point metal that is contained in the top layer that is made of refractory metal more.In less preferred embodiment, this interface comprises super level and smooth, press polished metal surface.
According to the present invention, the burn-in sockets of separation holds each DUT.Each socket better is to constitute the bias force that control allows good thermo-contact between heat sink and DUT, makes it to be distributed on the whole DUT, thereby avoids mechanical damage to DUT.Preferred socket also provides multiple device, and this device applies enough contact forces between socket base and DUT, and to produce excellent electric contact, restriction simultaneously puts on the pressure on the DUT, to avoid damaging DUT.
Near the temperature and the temperature sensor that provides about the data of this temperature of the cooling system the monitoring DUT also is provided the preferred embodiments of the present invention, reaches the thermal source that DUT adds the heat of control of exporting in response to temperature sensor.Said temperature sensor better be embedded in the radiator near with the interface of DUT.Said thermal source better is to be embedded in the radiator.In response to the signal that temperature sensor produces, controller is controlled this thermal source.
The preferred embodiment of cooling system of the present invention also comprises and the heat sink and liquid-vapour cooling system socket thermo-contact.Liquid-vapour cooling system better is to comprise a plurality of liquid-vapour conduits by single controller control, and compared with prior art, cost and running expense obviously reduce.In another embodiment, liquid-vapour cooling system is replaced by the ring-shaped liquid system that is called liquid cooling unit (LCU).LCU can make aging temperature be lower than 60 ℃.
On detailed introduction below having read and the basis with reference to the accompanying drawings, other purpose of the present invention and advantage will become clearer, wherein:
Fig. 1 is the profile according to the aging or test jack of first embodiment of the invention formation;
Fig. 2 is the amplification diagrammatic sketch of the optional embodiment at hot interface of the present invention;
Fig. 3 A is the decomposition diagram of the radiator portion of socket shown in Figure 1;
Fig. 3 B is the decomposition diagram of optional embodiment of the radiator portion of socket shown in Figure 1;
Fig. 4 is the end view that the line 4-4 along Fig. 3 gets, and shows the inner member that part is analysed and observe;
Fig. 5 A-B is respectively the vertical view that is located in and is located in corresponding burn-in board on heat sink;
Fig. 6 is the front perspective view of whole test system, shows many group sockets and a plurality of heat sink.
The device that should be understood that following detailed introduction can be in any orientation work.For example " on ", relational language such as D score, " on " or " under " is meant illustrated each element, be used for just in order to show and discuss the usefulness of purpose.Do not want to come these relations among any embodiment of requirement the present invention with these terms.
Now referring to Fig. 1, a device of the present invention relates to the aging or test jack 10 of satisfying above-mentioned requirements.Specifically, ageing system of the present invention comprises socket 10, and this socket 10 comprises socket base 12 and the compression stop of using with socket cover 20, heat pad 22, pressing plate 24, spring 26 and radiator 30 16.Among Fig. 1, show DUT 40 and be contained in the socket 10.In certain embodiments, can utilize other device to add enough pressure, then can omit pressing plate 24 and spring 26 to DUT if socket and lid constitute.Socket
The upper surface 13 of socket base 12 better is to comprise being used as DUT is directed to the blind flange 17 of the bevel of the position on the socket base 12, but is not must be like this.Flange 17 better is to limit the zone corresponding to the basal surface of DUT.This zone generally be the area heat transfer area of being a bit larger tham DUT squared region.For example, every side in the zone that limits by flange 17 can be than the length of DUT one side long 0.005-0.010 inch.Compression stop 16 better is to extend farther than flange 17 on upper surface 13.Compression stop 16 better is to comprise the rigidity incompressible material, and it constitutes and limits or corresponding to the periphery of socket base 12.In optional embodiment, compression stop 16 is integrally formed by the sheet identical with pedestal 12.Pedestal 12 and block 16 constitute the part that two parts have the socket 10 of lid together.
The other parts of socket 10 are made of socket cover 20, radiator 30, heat pad 22, spring 26 and pressing plate 24.These parts interconnect, and move to together with socket and DUT engagement with them to throw off.Socket cover 20 better is made of high temperature plastics or other similar material.Socket cover 20 is suitable for being supported on the compression stop 16, comprises the lower surface 27 that is used for this purpose.Radiator 30 has a core 32, and this part has the contact surface 33 that is fixed with heat pad 22 on it, thereby limits a high thermally-conductive interface.Radiator 30 also comprises the bead 36 that is supported on the compression stop 16.
In addition, radiator 30 comprises the middle shoulder 34 of at least two springs 26 that extend of support downwards.According to a preferred embodiment, eight springs 26 are fixed on the shoulder 34 along the both sides of core 32.At least one pressure distribution device for example pressing plate 24 is fixed in the opposed end of each spring 26.Each pressing plate 24 can be separated from each other as shown in the figure, maybe can form the monolithic shape (not shown) with any claimed structure.Provide the system that comprises spring 26 and pressing plate 24 in order that exert pressure, thereby guarantee the excellent electric contact of 14 in electric contact on the DUT and the lead-in wire in the socket to DUT.Also can exert pressure to DUT with the various mechanical systems except that above-mentioned spring and pressing plate.Own together and simultaneously the application the application that is entitled as " burn-in board " with suitable heat sink device _ _ middle write up some in these optional systems, quote the document here.
According to the present invention, the INTERFACE DESIGN of DUT 40 and 30 in radiator becomes to provide the maximum heat transfer from DUT to the radiator.In order to realize maximum heat transfer, this interface must adapt to the uneven upper surface of DUT.In a word, hot interface must be conformal, heat conduction, durable and recycling.In addition, also must consider for example factor of labour, material cost and manufacturing complexity.The system that should be understood that following introduction only is an illustration, does not get rid of the various systems that satisfy these requirements.
According to first preferred embodiment, heat pad 22 is fixed on the lower surface of radiator 30 cores 32 (as shown in the figure).Heat pad 22 better is to comprise the material with high-termal conductivity.Say that more specifically the material that forms heat pad 22 better is to have 0.2BTU/ft at least, is more preferably the thermal conductivity of 0.5BTU/ft at least.Some are rough and uneven in surface because the upper surface of DUT has easily, so heat pad 22 better is in a way can also conformal or have elasticity.The preferable material classification can be the heat conduction polymer composite material.A kind of preferred material that satisfies these conditions is to be located at Bergquist Company of Minneapolis with trade name SIL-PAD 2000
The silicone elastomer of selling of filling out boron nitride, better being to use thick thousand/4-20 inch that is about better is about 5/10
3The SIL-PAD 2000 of inch
Another preferred material is Thermagon, Inc., and 3256West 25th Street, Cleveland, OH 44109 fill out the aluminium silicone elastomer with what trade name T-Flex sold.Elasticity heat pad 22 better is provided as sheet form, and the thickness of heat pad 22 better is about 4-5 mil.
Because the surface that contacts with the upper surface of DUT better is not stay residue on DUT, so better be on the elastic heat conducting body that constitutes heat pad 22, to provide thin foil coating 23 (Fig. 3 A).Another preferred embodiment uses the Copper Foil of the gold layer that is electroplate with 50 microns on its of 2 mil thick.A preferred embodiment uses the 1 mil thick nickel foil that is electroplate with gold again.Other less preferred paper tinsel comprises the copper that is coated with platinum, the copper that is coated with palladium and brass.
Second preferred embodiment that is used for hot interface comprises the conformal pad that is made of the low-melting-point metal that melts under the working temperature of system, as shown in Figure 2.As shown in the figure, hot interface comprises the low-melting-point metal body 35 that is contained in the metal forming top layer 37.Top layer 37 better is the nickel foil that comprises 1 mil.If desired, the top layer metal can comprise different metals, and for example gold-plated copper maybe can comprise maybe being coated with platinum, gold or palladium.Better be with not staying residue or not polluting the metal-plated metal forming on DUT surface.Metal surface better is to utilize guard ring 39 to be sandwiched in and to be sealed on the contact surface 33 of radiator 30, or seals with scolder packing ring (not shown).When it melted, top layer 37 and guard ring 39 held LMPM 35 together.In optional embodiment shown in Fig. 3 B, LMPM 35 be contained in top layer 37 and be clipped in top layer 37 and radiator 30 between packing ring 38 in.Packing ring 48 can be made of any suitable gasket materials of sealing that can keep under the working temperature of interface.Under every kind of situation, comprise an expansion hatch 30a who passes radiator 30 at least, so that the thermal expansion of LMPM 35.If desired, available embolism 30b clogs a mouthful 30a, as shown in the figure.
When it melted, top layer 37 held LMPM together with guard ring 39 or top layer, packing ring 38 and guard ring 39.Low-melting-point metal (LPMM) can be any suitable LMPM, example as is known in the art those.LMPM is called fusible metal alloy sometimes.They comprise the alloy of bismuth and lead, tin, cadmium, gallium and/or indium.By changing the ratio of these elements, LMPM can be designed to have the fusing point in requiring temperature range.According to the present invention, the LMPM at the hot interface of formation and radiator 30 melts between 29 ℃-65 ℃.
Because the fusing point that holds the scolder packing ring 39 of LMPM must be higher than the fusing point of LMPM, so if use solder method, better be before the LMPM placed in position, adheres to top layer 37 on scolder packing ring 39.In case the periphery on top layer 37 is sealed on the contact surface 33 fully, then can melt the LMPM of requirement, and the casting or be injected under the top layer.This better is to finish by passing heat sink admission passage, shown in the cut-away section among Fig. 2 41.The LMPM of requirement places after 37 back, top layer, and admission passage better is the appropriate device sealing that can keep sealing by any under working temperature, for example scolder.Because LMPM generally has the thermal conductivity that 100BTU/ft at least is at least 200BTU/ft usually, so this embodiment provides the excellent heat conducting from DUT.
An embodiment again at hot interface can constitute without the conformal parts at the interface.(not shown) in this embodiment, the lower surface of radiator 30 better are directly to cover with metal forming as mentioned above.This example depends on the slight conformality of heat sink material and metal forming and because of saving the better heat transmitting that the conformal parts can produce, to guarantee fully to transmit heat from DUT.The thermal compensation system
Ageing system of the present invention is applicable to aging DUT with different capabilities.Also known, even in each DUT of same size, also can have actual spread in performance.Simultaneously, the thermal capacitance difference of DUT is less, better is to wear out in narrow temperature range.For example, chip manufacturer can be defined in and wear out in 60 ℃-125 ℃ the temperature range or test.If cooling system provides fixedly cooling capacity for each socket, then the heat that does not wait between each DUT can produce uneven temperature between DUT.Because the operating temperature range of one group of given DUT easily surpasses the aging temperature scope of regulation, must comprise the system that one group of temperature on the DUT is equated.
In native system, by extra cooling capacity being provided and reaching this purpose for each DUT provides additional heat simultaneously.Say that more specifically this design of Cooling System of below introducing becomes and work is Duoed about 10% heat to remove than the heat of the hottest DUT generation from each socket.Now referring to Fig. 3 and 4, each radiator 30 better is to comprise a hot coupling 42 or other the suitable temperature sensor that is embedded in close its contact-making surface 33 in the heat sink body.Hot coupling 42 better is detachable and removable, and is connected to appropriate signal treatment facility (not shown) by hot coupling lead-in wire 43.Hot coupling 42 can be any suitable hot coupling, for example under the field known those.Hot coupling 42 better is by fixed screw 42a fix in position.
The heater 44 that can also comprise in addition, a small resistor heater or other type in the radiator 30.Heater 44 can be any suitable heater, as long as just have the quickish response time can.Heater 44 better is to be positioned at hot coupling 42 back with respect to contact-making surface 33, so that hot coupling is surveyed the temperature of the point on very close DUT surface.Heater 44 better also is detachable and removable, and links to each other with power supply by heater lead 45.The power supply of providing for heater 44 better is by the output control of signal handling equipment in response to hot coupling 42.Among the present invention, better be that each heater 44 can produce at least 30 watts, be more preferably at least 50 watts, at least 55 watts of heats preferably.Heater 44 better is by fixed screw 44a fix in position.Liquid vapour cooling system
Now referring to Fig. 5 A-B, radiator 30 is gone out heat conduction from DUT, and radiator is by heat sink 50 coolings.Each is heat sink 50 the cooling a plurality of sockets.In a preferred embodiment, heat sink 50 comprise liquid-vapour (LV) conduit 52 that passes wherein.LV conduit 52 is as for example for water (liquid state and steam state) but be not limited to the conduit of the coolant of water.Water electrically contacts and the loop (not shown) circulation of the mechanical device of mechanical thermo-contact by comprising conduit 52, container, heater, controller and forming simultaneously electric connector 53 and 54.
Up to now, liquid-vapour cooling system has been used to cool off the aging equipment of high power transistor, silicon controlled rectifier etc.In the United States Patent (USP) 3,756,903 of authorizing Jones, put down in writing the operation principle of LV cooling system, quoted in full the document here.Yet as discussed above, processing, cost and the other problem relevant with these devices cause the cooling LV system of previously known not to be suitable for cooling integrated circuit chip among the application.
Up to the present, need, with the cooling of another group device in not influence of the cooling system that guarantees one group of device for each conduit 52 provides a controller that separates all the time.According to the present invention, by providing with one group at least two better is that 4 mode provides the conduit 52 that manifold all is housed, can allow whole system up to 72 sockets with a container, heater and controller work, realized the saving of tangible cost and running expense thus.
Now, should be understood that and in an ageing system 100, to repeat socket and heat sink combination for several times referring to Fig. 6.According to a preferred embodiment, LV conduit 52 grouping, and manifold all is housed so that they can work, and is subjected to the control of a controller in a system.LV conduit 52 can be grouped into and make all conduits that come out from ageing system 100 controlled together, maybe can be divided into and contain the group that is less than all conduits.
Although introduced system of the present invention in conjunction with preferred LV cooling system, should be understood that without departing from the scope of the invention, can use any other cooling system.For example, air, cooling water (for example LCU) or other cooling fluid can be directly or indirectly and radiator 30 thermo-contacts, to take away the heat of requirement.Work
When needs wore out operation, DUT 40 placed in the zone that is limited by flange 7 on the socket base 12, so that the electric contact on the DUT is aimed at the appropriate contacts 15 on the socket base 12.Radiator 30 and each parts that is fixed thereon drop on the pedestal then, lean against on the compression stop 16 up to lid 20.Referring to Fig. 1 and 5A-B, heat sink 50 are clipped between one or more pairs of relative sockets 10, act on power F on the relative socket and act on pressure on each parts that comprises the DUT in each socket.After each aging operation, socket opens each socket from throwing off with heat sink 50 contact condition relatively, takes out DUT.
When the size of radiator 30 and shaped design Cheng Zaili F are applied to it by heat sink 50, heat pad 22 are pressed into the upper surface of DUT produce good thermo-contact, spring 26 is pressurized slightly.Heat pad 22 is pressed between DUT and the radiator 30, but is not pressed onto the limit of its degree of compression.In addition, spring 26 is not pressed onto its elastic limit yet, and is used for from radiator 30 pressure that limits being passed to DUT by pressing plate 24.Therefore, the power that is added on the DUT is controlled in the scope that needs, and any excessive power is all directly passed to socket base by compression stop 16.Simultaneously, pressurized heat pad 22 forms good thermo-contact at DUT and 30 in radiator, allows radiator 30 and heat sink 50 to remove all heats (30 watts or more) that produce among the DUT between aging period effectively.
As added power, aging operating period, the temperature of each DUT is accurately controlled in predetermined prescribed limit.As mentioned above, this can be by providing extra cooling capacity, and realize for each DUT provides additional heat as required.The LV default is for removing the heat more than the maximum heat that any one DUT produced from each socket.When each DUT of cooling, hot coupling 42 is surveyed its temperature.If the temperature of given DUT drops to the aging temperature scope that is lower than regulation, then signal processor makes heater 44 that heat supplement is provided, thereby the temperature of maintenance DUT is in the scope that requires.Should be understood that this control loop can comprise the microprocessor realization with any suitable controller, and can comprise any suitable control algolithm, those that for example affiliated middle field is known.Example 1 thermal gauge lattice
Below be thermal gauge lattice and operational detail according to an embodiment of ageing system 60 of the present invention:
Power control: each LVU can control 2,500 watts device power consumption.The standard testing system that has 8 LVU can dissipate 20,000 watts.Each LCU may command 5,000 earthenware spare power consumption, the standard LCU test macro that then has 8 LCU can dissipate 40,000 watts.Have in the peak power control structure of 4 DUT each DUT average power that can dissipate up to 100 watts at its each working plate.The maximum device density of each test macro is 576 devices (8 LVU of each system, each test macro always has 48 blocks of plates, contains 576 DUT for 12 devices of each working plate, 6 working plates of each LVU).This system can reduce to and allow big device power consumption.Power supply can give each device input up to 75 watts of power, 30 devices that each dissipation of LVU may command is 75 watts.
For LVU, the optimum decision system density that each device is 75 watts is 240 devices.Say that for LCU is flat the optimum decision system density that each device is 75 watts is 480 devices.In a LVU, if on average DUT power is less than 27 watts, then device density can increase to 15 DUT of each working plate.Under this load, under the situation of the Board position of equal number, there are 15 devices can make each test macro that 720 DUT are arranged on each plate.System DUT power supply of the present invention can be given the DUT of each high power mode or 75 watts DC power is provided for the device of every pair of low-power mode.
Plate density: as mentioned above, working plate density with the need average device power and change.For the device of power consumption, allow 12 parts on each working plate up to 34 watts of average powers.For power consumption 35-52 watt device, allow 8 parts on each working plate.
Claims (26)
1. the system of testing integrated circuits comprises:
Socket can hold and supports the DUT that has integrated circuit, and said socket comprises the electrical lead that connects the respective lead on the DUT;
Heat sink with the coolant thermo-contact, and
With the radiator of said heat sink and DUT thermo-contact, said radiator comprise can with the hot interface of DUT in socket machinery and thermo-contact releasedly.
2. system according to claim 1, wherein said hot interface comprises that thermal conductivity is at least 0.2BTU/ft.Material.
3. system according to claim 1, wherein said hot interface comprises that thermal conductivity is at least 100BTU/ft.Material.
4. system according to claim 2, wherein said material comprises the heat conduction polymer composite material.
5. system according to claim 1, wherein said hot interface comprises the skin that contains metal forming.
6. system according to claim 1, wherein said hot interface comprises a large amount of low-melting-point metals that are contained in the metal forming top layer.
7. system according to claim 6, wherein said metal forming top layer has and is sealed to said periphery on heat sink.
8. system according to claim 1 also comprises heater and hot coupling, and said hot coupling is adjacent with said hot interface, and said heater is output-controlled in response to said hot coupling.
9. system according to claim 1 also comprises and the adjacent heater in said hot interface.
10. system according to claim 1 also comprises the liquid-vapour cooling system with said heat sink thermo-contact.
11. test the system of a plurality of integrated circuits, comprising:
A plurality of sockets, each socket is suitable for holding and supporting to have the DUT of integrated circuit;
A plurality of radiators, each radiator comprises heater;
Be positioned to from the hot interface of each DUT to radiator conduction heat;
The cooling system that contacts with said radiator heat.
12. system according to claim 11 also comprises the hot coupling of the temperature that is positioned to detect each DUT.
13. system according to claim 11, wherein said hot interface is conformal.
14. system according to claim 11, wherein said hot interface comprises the heat conduction polymer composite material.
15. system according to claim 14, wherein said material comprises the skin with metal forming.
16. system according to claim 11, wherein said hot interface comprises a large amount of low-melting-point metals that are contained in the metal forming top layer.
17. the method for testing integrated circuits comprises:
(a) provide socket, hold and support to have the DUT of integrated circuit;
(b) in socket, provide electric contact, be used to electrically contact the respective lead on the DUT;
(c) realize DUT and have heat sink the thermo-contact at the hot interface of conformal;
(d) for integrated circuit provides predetermined electrical signals, simultaneously by hot interface with heat be removed to heat sink in, thereby keep integrated circuit in predetermined temperature range.
18. method according to claim 17, wherein step (d) is included under the action of electric signals, removes the step of the heat of Duoing than the thermal conductance that is produced from DUT.
19. method according to claim 18, wherein step (d) comprises the step that applies additional heat by the heat hot interface to DUT.
20. method according to claim 18, wherein step (d) comprises and applies the step of additional heat to DUT in response to the signal from temperature sensor.
21. method according to claim 17, wherein step (d) comprises and makes coolant flow through heat sink step.
22. method according to claim 17 also comprises providing manifold can be removed the cooling system of heat simultaneously from a plurality of sockets step is housed.
23. method according to claim 17 also comprises the stressed step to DUT.
24. be arranged to the thermally-conductive interface that contacts with thermal transfer surface, comprise:
First Heat Conduction Material; And
Be fixed on the said Heat Conduction Material and be positioned to contact the metal surface of thermal transfer surface.
25. interface according to claim 24, wherein said first Heat Conduction Material comprises polymeric material.
26. method according to claim 24, wherein said first Heat Conduction Material comprises low-melting-point metal.
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US6130597P | 1997-10-07 | 1997-10-07 | |
| US60/061,305 | 1997-10-07 | ||
| US6255597P | 1997-10-21 | 1997-10-21 | |
| US60/062,555 | 1997-10-21 | ||
| US6267397P | 1997-10-22 | 1997-10-22 | |
| US60/062,673 | 1997-10-22 | ||
| US09/167,238 US6323665B1 (en) | 1997-10-07 | 1998-10-06 | Apparatus capable of high power dissipation during burn-in of a device under test |
| US09/167,238 | 1998-10-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1274518A true CN1274518A (en) | 2000-11-22 |
Family
ID=27490191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98809918A Pending CN1274518A (en) | 1997-10-07 | 1998-10-06 | Burn-in board with adaptable heat sink device |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6323665B1 (en) |
| KR (1) | KR20010024445A (en) |
| CN (1) | CN1274518A (en) |
| IL (1) | IL135485A0 (en) |
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| CN104919325A (en) * | 2012-11-12 | 2015-09-16 | 马维尔国际贸易有限公司 | Heat sink blade pack for device test testing |
| CN116224037A (en) * | 2023-01-06 | 2023-06-06 | 法特迪精密科技（苏州）有限公司 | Base of chip temperature cycle aging test bench |
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- 1998-10-06 KR KR1020007003750A patent/KR20010024445A/en not_active Application Discontinuation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104919325A (en) * | 2012-11-12 | 2015-09-16 | 马维尔国际贸易有限公司 | Heat sink blade pack for device test testing |
| CN116224037A (en) * | 2023-01-06 | 2023-06-06 | 法特迪精密科技（苏州）有限公司 | Base of chip temperature cycle aging test bench |
| CN116224037B (en) * | 2023-01-06 | 2023-10-03 | 法特迪精密科技（苏州）有限公司 | Chip temperature cycle aging test method implemented on chip temperature cycle aging test bench |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20010024445A (en) | 2001-03-26 |
| IL135485A0 (en) | 2001-05-20 |
| US6323665B1 (en) | 2001-11-27 |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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