JPS63216976A - Pretreatment by reduction under heating before plating - Google Patents
Pretreatment by reduction under heating before platingInfo
- Publication number
- JPS63216976A JPS63216976A JP4958987A JP4958987A JPS63216976A JP S63216976 A JPS63216976 A JP S63216976A JP 4958987 A JP4958987 A JP 4958987A JP 4958987 A JP4958987 A JP 4958987A JP S63216976 A JPS63216976 A JP S63216976A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- reducing atmosphere
- gas
- pretreatment
- under heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 13
- 238000010438 heat treatment Methods 0.000 title abstract 2
- 239000002184 metal Substances 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000011282 treatment Methods 0.000 claims description 7
- 150000002739 metals Chemical class 0.000 claims description 5
- 230000004913 activation Effects 0.000 claims description 2
- 239000007789 gas Substances 0.000 abstract description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 4
- 239000007769 metal material Substances 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 239000003925 fat Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 239000003921 oil Substances 0.000 abstract description 2
- 238000003912 environmental pollution Methods 0.000 abstract 2
- 239000001257 hydrogen Substances 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 238000007772 electroless plating Methods 0.000 description 3
- 238000002203 pretreatment Methods 0.000 description 3
- 239000010953 base metal Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Landscapes
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、各種メッキ方法の前処理作業に係るものであ
る。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to pretreatment operations for various plating methods.
〈従来の技術〉
金属材料にメッキをする場合には、その金属材料を活性
化させメッキ反応が確実に起る状態にすること、則ち前
処理が大切である。<Prior Art> When plating a metal material, it is important to activate the metal material and bring it into a state where the plating reaction occurs reliably, that is, pretreatment.
従来の方法は、脱脂から金属の活性化までに多くの工程
が組まれ、金属の種類によってその手法も多様に分かれ
ている。Conventional methods include many steps from degreasing to metal activation, and the methods vary depending on the type of metal.
このための各種薬液の管理、及び作業管理が複雑で大変
である。Management of various chemical solutions and work management for this purpose are complicated and difficult.
〈発明が解決しようとする問題点〉
本発明は以上の問題点に鑑みてなされたもので、これら
前処理のための各種薬液使用を減らして工程を簡素化し
、且つ公害防止にもなるメッキ前処理方法を提供せんと
するものである。<Problems to be Solved by the Invention> The present invention has been made in view of the above problems, and it reduces the use of various chemicals for these pre-treatments, simplifies the process, and also prevents pollution. This paper aims to provide a processing method.
〈問題点を解決するための手段〉 本発明の手段は、次の構成を特徴とする。〈Means for solving problems〉 The means of the present invention is characterized by the following configuration.
１）メッキを実施せんとする金属に付着する油脂類を従
来の手法と同様の方法によって完全に脱脂する。1) Completely remove fats and oils adhering to the metal to be plated using a method similar to the conventional method.
２）脱脂が完了した金属を、還元雰囲気炉によって加熱
還元処理を行なった後還元雰囲気中で常温近く冷却し、
直ちにメッキ作業を行なう。2) After the degreased metal is heated and reduced in a reducing atmosphere furnace, it is cooled to near room temperature in a reducing atmosphere,
Start plating immediately.
３）還元雰囲気炉はパッチ式、又は連続式の何れでもよ
い。3) The reducing atmosphere furnace may be either a patch type or a continuous type.
く作用〉
通常メッキを行なう金属は、何らかの加工を旅された後
に空気中に放置されるか、又は空気に接触して取扱われ
金属によっては急速に酸化膜を形成している。これら酸
化膜の形成状態、及びその形成された酸化膜の母材金属
に対する結合性は金属によって異なる。Effect> Metals to be plated are usually left in the air after undergoing some kind of processing, or are handled in contact with the air, and depending on the metal, an oxide film is rapidly formed. The state of formation of these oxide films and the bonding properties of the formed oxide films to the base metal differ depending on the metal.
メッキを完全に行なうためには、これらの膜を完全に除
去し母材金属の状態のままの姿に戻すこと、則ち活性化
が必要である。空気中で形成された被膜は殆どが酸化物
被膜であり、これを除去するためには反応が１＆通な温
度のもとでの還元処理が通している。In order to perform complete plating, it is necessary to completely remove these films and restore the base metal to its original state, that is, to activate it. Most of the films formed in the air are oxide films, and in order to remove them, reduction treatment is performed at a temperature that allows the reaction to occur.
還元処理を行なうためのガスは、比較的安価で還元力に
富み、人体や器物に有害でなく取扱いの容易なものが選
ばれる。The gas used for the reduction treatment is selected from a gas that is relatively inexpensive, has high reducing power, is not harmful to the human body or property, and is easy to handle.
一般に、これらの目的に適正なガスとしては市販されて
いる水素ガスが使用出来きる。又、使用する炉としては
、バッチ式、又は連続式の雰囲気炉が使用される。Generally, commercially available hydrogen gas can be used as a suitable gas for these purposes. Further, as the furnace used, a batch type or continuous type atmosphere furnace is used.
〈実施例１〉
モリブデンの加工完了品に対し、１０００℃で５分水素
ガスを０．２気圧の圧力で流しながら還元処理を行ない
、５０℃以下になった時に炉から出して直ちにＮ１−Ｐ
の無電解メッキを行なった。<Example 1> A processed molybdenum product was subjected to reduction treatment at 1000°C for 5 minutes while flowing hydrogen gas at a pressure of 0.2 atm, and when the temperature dropped to below 50°C, it was removed from the furnace and immediately replaced with N1-P.
Electroless plating was performed.
結果は、剥離などの現象もなくきれにメッキが出きた。As a result, the plating came out cleanly without any phenomena such as peeling.
〈実施例２〉
セラミックのメタライズのために、各種所定温度で水素
ガスを流しながら、還元雰囲気で加工したものを常温近
くになった時に炉から出してＮ１−Ｐの無電解メッキを
行なった。<Example 2> In order to metallize ceramics, the materials were processed in a reducing atmosphere while flowing hydrogen gas at various predetermined temperatures, and when the temperature reached near room temperature, they were taken out of the furnace and electroless plating with N1-P was performed.
結果は、メタライズ面に密着性のよいメッキが出きた。The result was a plating with good adhesion to the metallized surface.
〈実施例３〉
純アルミニューム板の空気中に放置したものちにＮ１−
Ｐの無電解メッキを行なった結果メッキはきれいについ
た。<Example 3> A pure aluminum plate left in the air later became N1-
As a result of electroless plating of P, the plating adhered neatly.
〈発明の効果〉
１）特殊処理を行なっていない金属のメッキ前処理とし
ての還元雰囲気での処理は、各種金属に対して従来の各
種の複雑なる前処理工程を省略出き金属の活性化が可能
である。<Effects of the Invention> 1) Treatment in a reducing atmosphere as a pre-plating treatment for metals that have not undergone special treatment can omit the various conventional complicated pre-treatment steps for various metals, and can activate the metals. It is possible.
２）従来の工程の簡素化が可能で、公害防止に対しても
効果がある。2) It is possible to simplify the conventional process and is also effective in preventing pollution.
３）連続処理も可能で複雑な管理を要しない。3) Continuous processing is possible and does not require complicated management.
特許出願人 若松熱棟株式会社
手続補正書（方式）
％式％
１、事件の表示
昭和６２年 特許願 第０４９５８９号２、発明の名称
加熱還元法によるメッキ前処理方法
３、補正をする者
事件との関係 実用新案登録出願人住所（居所）
北九州市若松区大字安瀬６３番地の５６、補正
の内容
明細書１頁２行 考案の名称の項目及び内容明細書１
頁２行 項目胤
明細書５頁６行 項目凪Patent applicant Wakamatsu Netsudo Co., Ltd. Procedural amendment (method) % formula % 1. Indication of the case 1988 Patent application No. 049589 2. Name of the invention Plating pre-treatment method by thermal reduction method 3. Case of the person making the amendment Relationship with Utility model registration applicant address (residence)
56, 63-Oaza Anze, Wakamatsu-ku, Kitakyushu City, 1 page 2 lines of the amended statement of contents Item of the name of the invention and statement of contents 1
Page 2 lines Item Seed Specification Page 5 Line 6 Item Nagi
Claims (1)
還元性雰囲気処理を行なうことを特徴とする被メッキ物
の前処理方法。As a metal activation method for plating various metals,
A method for pre-treating an object to be plated, characterized by performing a reducing atmosphere treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4958987A JPS63216976A (en) | 1987-03-03 | 1987-03-03 | Pretreatment by reduction under heating before plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4958987A JPS63216976A (en) | 1987-03-03 | 1987-03-03 | Pretreatment by reduction under heating before plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63216976A true JPS63216976A (en) | 1988-09-09 |
Family
ID=12835414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4958987A Pending JPS63216976A (en) | 1987-03-03 | 1987-03-03 | Pretreatment by reduction under heating before plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63216976A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04329892A (en) * | 1991-05-01 | 1992-11-18 | Nippon Steel Corp | Fused salt electrolytic plating method for steel products |
| WO1997045569A1 (en) * | 1996-05-31 | 1997-12-04 | Kawasaki Steel Corporation | Plated steel plate |
| JP2008502806A (en) * | 2004-06-10 | 2008-01-31 | アプライド マテリアルズ インコーポレイテッド | Barrier layer surface treatment method enabling direct copper plating on barrier metal |
| JP2009235455A (en) * | 2008-03-26 | 2009-10-15 | Nippon Telegr & Teleph Corp <Ntt> | Method of forming metallic structure |
-
1987
- 1987-03-03 JP JP4958987A patent/JPS63216976A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04329892A (en) * | 1991-05-01 | 1992-11-18 | Nippon Steel Corp | Fused salt electrolytic plating method for steel products |
| WO1997045569A1 (en) * | 1996-05-31 | 1997-12-04 | Kawasaki Steel Corporation | Plated steel plate |
| US6087019A (en) * | 1996-05-31 | 2000-07-11 | Kawasaki Steel Corporation | Plated steel sheet |
| JP2008502806A (en) * | 2004-06-10 | 2008-01-31 | アプライド マテリアルズ インコーポレイテッド | Barrier layer surface treatment method enabling direct copper plating on barrier metal |
| JP2009235455A (en) * | 2008-03-26 | 2009-10-15 | Nippon Telegr & Teleph Corp <Ntt> | Method of forming metallic structure |
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