JPS63215394A - Method for processing substrate - Google Patents
Method for processing substrateInfo
- Publication number
- JPS63215394A JPS63215394A JP62047023A JP4702387A JPS63215394A JP S63215394 A JPS63215394 A JP S63215394A JP 62047023 A JP62047023 A JP 62047023A JP 4702387 A JP4702387 A JP 4702387A JP S63215394 A JPS63215394 A JP S63215394A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- laser light
- glass substrate
- glass
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims description 19
- 239000011521 glass Substances 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims description 9
- 238000003672 processing method Methods 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 10
- 239000010409 thin film Substances 0.000 abstract description 9
- 238000004544 sputter deposition Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 abstract 2
- 238000003754 machining Methods 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 230000002411 adverse Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はレーザ等の高エネルギービームによりガラス
等の基板も加工できる基板の加工方法に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for processing a substrate that can also process a substrate such as glass using a high-energy beam such as a laser beam.
第２図は例えば「ガラスハンドブック」（朝倉書店刊）
第４５３頁に記載された従来のガラス基板の加工方法を
示す側面図である。Figure 2 is an example of "Glass Handbook" (published by Asakura Shoten)
FIG. 45 is a side view showing the conventional glass substrate processing method described on page 453.
図において、Ｃ１）は例えばガラス基板、（２）は先端
にダイヤモンドのチップを有する工具である。In the figure, C1) is, for example, a glass substrate, and (2) is a tool having a diamond tip at its tip.
上記のように構成された装置において、まず工具（２）
をガラス基板（１）に適当な圧力で押しつけ、ガラス基
板（１）か工具（２）を移動させることによりガラス基
板（１）上に切削溝を形成する。In the device configured as above, first the tool (2)
A cut groove is formed on the glass substrate (1) by pressing the glass substrate (1) with an appropriate pressure and moving the glass substrate (1) or the tool (2).
従来の例えばガラス基板の加工方法は以上のように構成
されているため、切削溝の巾と位置決め精度にはおのず
と限界があった。Since the conventional method for processing glass substrates, for example, is configured as described above, there is a natural limit to the width and positioning accuracy of the cutting groove.
さらに、従来の加工方法は機械加工であるため、加工速
度を速くできず、ま之加工による切りくずが発生し、後
の工程で除去できず悪影響を及はすという問題点があっ
た。Furthermore, since the conventional machining method is mechanical machining, the machining speed cannot be increased, and chips are generated due to machining, which cannot be removed in subsequent steps and has an adverse effect.
また、他の部品を実装した基板では加工が困難であると
いう問題点があった。Another problem is that it is difficult to process a board on which other components are mounted.
一方、高エネルギービーム、例えばレーザ光のエネルギ
ーはガラス基板には吸収されにく−ため、レーザ光によ
るガラス基板の加工は困難とされていた。On the other hand, since the energy of a high-energy beam, such as a laser beam, is difficult to be absorbed by a glass substrate, it has been difficult to process a glass substrate using a laser beam.
この発明は上記のような問題点を解消するためになされ
たもので、ガラス等の基板にも高精度で高性能な加工が
行なえる方法を提供することを目的とする。The present invention was made to solve the above-mentioned problems, and an object of the present invention is to provide a method that can process substrates such as glass with high precision and high performance.
この発明に係る基板の加工方法は基板面上にエネルギー
ビームを吸収する材料を付着形成し、上記基板面上の材
料にエネルギービームを照射して基板を加工するように
したものである。A substrate processing method according to the present invention is such that a material that absorbs an energy beam is deposited on a substrate surface, and the material on the substrate surface is irradiated with an energy beam to process the substrate.
この発明においては１基板上に他の材料を付着形成し、
しかる後にこのガラス基板に高エネルギービームを照射
すると、高エネルギービームのエネルギーは、基板に付
着形成した他の材料に吸収され微細な発熱部を形成する
から、基板も同時に微細加工される。In this invention, another material is deposited on one substrate,
When this glass substrate is then irradiated with a high-energy beam, the energy of the high-energy beam is absorbed by other materials deposited on the substrate and forms fine heat generating parts, so that the substrate is also finely processed at the same time.
このため容易に基板を微細加工することが可能となり、
加工時間も短縮される。さらに、加工による切りくずが
発生しないので、後６エ程に悪影響を及はさず、他の部
品を実装した基板の加工も容易である。This makes it possible to easily microfabricate the substrate,
Processing time is also reduced. Furthermore, since no chips are generated during machining, the subsequent six steps are not adversely affected, and substrates on which other components are mounted can be easily machined.
この発明の一実施を図について説明する。第１図はこの
発明の一実施例によるガラス基板の加工方法を示す側面
構成図である。図において（１）はガラス基板、Ｃ３）
はイオンスパッタ装置（図示せず）により蒸着形成した
厚み５μｍのアルミニウム薄膜、（４）は高エネルギー
ビームで、この場合にけＹＡＧレーザ光を使用する。One implementation of the invention will be described with reference to the drawings. FIG. 1 is a side view showing a method of processing a glass substrate according to an embodiment of the present invention. In the figure, (1) is a glass substrate, C3)
(4) is a 5 μm thick aluminum thin film deposited by ion sputtering equipment (not shown), and (4) is a high energy beam, in which case a YAG laser beam is used.
まず、ＹＡＧレーザ光を適当な光学系を用いて集光し、
ガラス基板（１）上のアルミニウム薄膜（３）上に焦点
を合わせる。ＹＡＧレーザ光（４）を出力１０μＪで、
アルミニウム薄膜（４）に照射し、ガラス基板（１）を
速度ＩＱ ｍｒｒｌ ７秒で走査した結果ガラス基板（
１）に巾２０μｍ深さ１００μｍの切削溝が形成された
。First, YAG laser light is focused using a suitable optical system,
Focus on the aluminum thin film (3) on the glass substrate (1). YAG laser beam (4) with an output of 10 μJ,
The aluminum thin film (4) was irradiated and the glass substrate (1) was scanned at a speed IQ mrrl of 7 seconds, resulting in the glass substrate (
1) A cutting groove with a width of 20 μm and a depth of 100 μm was formed.
これはガラス基板（１）のみでけレーザ光（４）のエネ
ルギーはガラス基板（１）に吸収しないが、アルミニウ
ム薄膜（４）を蒸着形成したことによって、レーザ光（
４） ＋７）エネルギーは優先的にアルミニウム薄膜（
４）に吸収され、瞬時に溶融、蒸発する。この際形成す
る微細な発熱部は同時にガラス基板（１）をも溶融する
からガラス基板（１）の微細な加工が可能となる。This is because the energy of the laser beam (4) is only absorbed by the glass substrate (1), but the energy of the laser beam (4) is not absorbed by the glass substrate (1).
4) +7) Energy is preferentially transferred to the aluminum thin film (
4) is absorbed, instantly melts and evaporates. Since the fine heat-generating portions formed at this time also melt the glass substrate (1), fine processing of the glass substrate (1) becomes possible.
また加工による切りくずが発生しないので、後の工程に
悪影響を及はさない。とくに他の部品を実装した後でも
、スクライビング等の加工を１１度よく容易に行うこと
ができる。この場合、薄膜（３）の形成工程を部品の形
成工程中に同時に行えば、加工工程がより簡単となる。Furthermore, since no chips are generated during machining, subsequent processes will not be adversely affected. In particular, even after mounting other parts, processing such as scribing can be easily performed. In this case, if the process of forming the thin film (3) is performed simultaneously during the process of forming the component, the processing process will be simpler.
なお、上記実施例では、基板（１）がガラス基板である
場合についてのみ述べているが、他の材料の基板につい
ても応用が可能であり、例えばＹＡＧレーザやａｏ２レ
ーザ光を吸収しないセラミック等に対しても、この発明
による方法を用いれば一般的に使われるＹ Ａ ’Ｇレ
ーザやａｏ２レーザ光を用いて加工を施すことが可能と
なる。In addition, although the above embodiment describes only the case where the substrate (1) is a glass substrate, it can also be applied to substrates made of other materials, such as ceramics that do not absorb YAG laser or AO2 laser light. However, if the method according to the present invention is used, processing can be performed using commonly used YA'G laser or AO2 laser light.
また、基板面に付着形成する材料としては、アルミニウ
ム薄膜の他、エネルギービームを吸収する金属層、例え
ばＯｒ等でもよい。In addition to the aluminum thin film, the material deposited on the substrate surface may be a metal layer that absorbs energy beams, such as Or.
さらに、エネルギービームとしてはＹＡＧレーザ光の他
００２レーザ光でもよい。Furthermore, the energy beam may be a 002 laser beam in addition to a YAG laser beam.
また、上記実施例ではガラス基板（１）を走査している
が、エネルギービーム（４）を走査してもよく、加工時
間かより短縮される。Further, in the above embodiment, the glass substrate (1) is scanned, but the energy beam (4) may also be scanned, which further reduces the processing time.
また、上記実施例ではＹＡＧレーザ光（４）の照射方向
としては、アルミニウム薄膜（３）形成面より行なって
いるが、その裏面より行なってもよい。Further, in the above embodiment, the YAG laser beam (4) is irradiated from the surface on which the aluminum thin film (3) is formed, but it may be irradiated from the back surface thereof.
以上述べたように、この発明によれば基板上にエネルギ
ービームを吸収する材料を付着形成し、しかる後にこの
基板面にエネルギービームラ照射することによって加工
するようにしたので、ガラス基板等に対しても微細な加
工が可能となり、加工速度も速くすることができる。As described above, according to the present invention, a material that absorbs an energy beam is deposited on a substrate, and then the surface of the substrate is processed by irradiating the energy beam. It is also possible to perform fine processing, and the processing speed can be increased.
また、加工による切りくずが発生しないので、後の工程
に悪影響を及はさず、部品実装後の加工も容易となる効
果がある。Further, since no chips are generated during machining, there is no adverse effect on subsequent steps, and machining after component mounting is also facilitated.
第１図はこの発明の一実施例による基板の加工方法を示
す側面構成図、及び第２図は従来の基板の加工方法を示
す側面図である。
図において、（１）・・・基板、Ｃ３）・・・アルミニ
ウム薄膜、（４）・・・レーザ光である。
なお、図中、同一符号は同−又は相当部分を示す。FIG. 1 is a side configuration diagram showing a substrate processing method according to an embodiment of the present invention, and FIG. 2 is a side view showing a conventional substrate processing method. In the figure, (1)...substrate, C3)...aluminum thin film, and (4)...laser light. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (4)
着形成し、上記基板面の上記材料に上記エネルギービー
ムを照射して上記基板面に加工を施す基板の加工方法。(1) A method of processing a substrate, in which a material that absorbs an energy beam is deposited on a substrate surface, and the material on the substrate surface is irradiated with the energy beam to process the substrate surface.
載の基板の加工方法。(2) The method for processing a substrate according to claim 1, wherein the substrate is a glass substrate.
着形成した特許請求の範囲第１項又は第２項記載の基板
の加工方法。(3) A method of processing a substrate according to claim 1 or 2, wherein a metal layer that absorbs energy beams is deposited on the substrate surface.
の範囲第１項ないし第３項のいずれかに記載の基板の加
工方法。(4) The substrate processing method according to any one of claims 1 to 3, wherein the energy beam is a laser beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62047023A JPS63215394A (en) | 1987-03-02 | 1987-03-02 | Method for processing substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62047023A JPS63215394A (en) | 1987-03-02 | 1987-03-02 | Method for processing substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63215394A true JPS63215394A (en) | 1988-09-07 |
Family
ID=12763583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62047023A Pending JPS63215394A (en) | 1987-03-02 | 1987-03-02 | Method for processing substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63215394A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0332486A (en) * | 1989-06-29 | 1991-02-13 | Jujo Paper Co Ltd | Optical processing method |
| JPH04182093A (en) * | 1990-11-14 | 1992-06-29 | Mitsubishi Electric Corp | Laser beam machining method |
| JPH09192857A (en) * | 1995-08-16 | 1997-07-29 | Santa Barbara Res Center | Laser beam scribing on glass with using nd:yag laser beam |
| WO2002081142A1 (en) * | 2001-04-02 | 2002-10-17 | Taiyo Yuden Co., Ltd. | Method for machining translucent material by laser beam and machined translucent material |
| JP2006150499A (en) * | 2004-11-29 | 2006-06-15 | Fujitsu Ltd | Laminate body cutting method and laminate body |
| GB2569031A (en) * | 2017-12-04 | 2019-06-05 | General Atomics | Method of cutting glass using a laser |
-
1987
- 1987-03-02 JP JP62047023A patent/JPS63215394A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0332486A (en) * | 1989-06-29 | 1991-02-13 | Jujo Paper Co Ltd | Optical processing method |
| JPH04182093A (en) * | 1990-11-14 | 1992-06-29 | Mitsubishi Electric Corp | Laser beam machining method |
| JPH09192857A (en) * | 1995-08-16 | 1997-07-29 | Santa Barbara Res Center | Laser beam scribing on glass with using nd:yag laser beam |
| WO2002081142A1 (en) * | 2001-04-02 | 2002-10-17 | Taiyo Yuden Co., Ltd. | Method for machining translucent material by laser beam and machined translucent material |
| JP2006150499A (en) * | 2004-11-29 | 2006-06-15 | Fujitsu Ltd | Laminate body cutting method and laminate body |
| GB2569031A (en) * | 2017-12-04 | 2019-06-05 | General Atomics | Method of cutting glass using a laser |
| US10919794B2 (en) | 2017-12-04 | 2021-02-16 | General Atomics | Method of cutting glass using a laser |
| GB2569031B (en) * | 2017-12-04 | 2023-05-10 | General Atomics | Method of cutting glass using a laser |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2006525874A (en) | Focusing light beam to two focal points | |
| JP2007021528A (en) | Laser beam machining apparatus, and method for controlling the same | |
| JP7150401B2 (en) | Workpiece processing method | |
| JPH05211381A (en) | Manufacture of hybrid integrated circuit | |
| JP3509985B2 (en) | Chip separation method for semiconductor device | |
| JPS63215394A (en) | Method for processing substrate | |
| US6552302B2 (en) | Method for correcting surface shape of magnetic head slider and magnetic head slider | |
| JPS59104287A (en) | Laser working method | |
| JPS63154280A (en) | Laser beam machine | |
| JPS63212084A (en) | Laser beam machine | |
| JPS61283486A (en) | Method and device for piercing by laser | |
| JP2006082232A (en) | Laser processing method | |
| JP2003010991A (en) | Laser beam machining method | |
| JPH0323273B2 (en) | ||
| JPH04142760A (en) | Manufacture of hybrid integrated circuit | |
| JPH03262311A (en) | Frequency adjustment method for piezoelectric vibrator | |
| JPS61238986A (en) | Laser beam processing device | |
| JPS619987A (en) | Laser beam machining | |
| JPH02220508A (en) | Frequency adjustment method for piezoelectric vibrator | |
| JPS5940552B2 (en) | Laser processing method | |
| JPH02197388A (en) | Laser bean machining method | |
| JP2794589B2 (en) | Laser processing of ceramics | |
| JPS61273284A (en) | Laser marking method for compound semiconductor | |
| JPH0775787B2 (en) | Laser drilling method for ceramics | |
| Siekman | Cutting of thin carbon films with a CO2-gas laser—I Theoretical considerations and experiments on flat plates |