JPS6321190A - Thermal stencil paper - Google Patents
Thermal stencil paperInfo
- Publication number
- JPS6321190A JPS6321190A JP16526486A JP16526486A JPS6321190A JP S6321190 A JPS6321190 A JP S6321190A JP 16526486 A JP16526486 A JP 16526486A JP 16526486 A JP16526486 A JP 16526486A JP S6321190 A JPS6321190 A JP S6321190A
- Authority
- JP
- Japan
- Prior art keywords
- film
- energy
- fusion
- polyester copolymer
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002844 melting Methods 0.000 claims abstract description 20
- 230000008018 melting Effects 0.000 claims abstract description 20
- 229920000728 polyester Polymers 0.000 claims abstract description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract description 19
- 238000000034 method Methods 0.000 abstract description 13
- 239000002253 acid Substances 0.000 abstract description 11
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 abstract description 10
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 abstract description 8
- 239000000835 fiber Substances 0.000 abstract description 6
- 230000004927 fusion Effects 0.000 abstract description 6
- 239000000178 monomer Substances 0.000 abstract description 4
- 229920001577 copolymer Polymers 0.000 abstract description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract description 2
- -1 polyethylene Polymers 0.000 description 5
- 229920003002 synthetic resin Polymers 0.000 description 5
- 239000000057 synthetic resin Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 240000000907 Musa textilis Species 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 240000006248 Broussonetia kazinoki Species 0.000 description 1
- 240000009253 Morus australis Species 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229920002978 Vinylon Polymers 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000025 natural resin Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/245—Stencils; Stencil materials; Carriers therefor characterised by the thermo-perforable polymeric film heat absorbing means or release coating therefor
Landscapes
- Printing Plates And Materials Therefor (AREA)
Abstract
Description
【発明の詳細な説明】
発明の目的
（産業上の利用分野）
この発明はサーマルヘッドにより穿孔して印刷用孔版を
作成するための感熱孔版原紙に関するものである。DETAILED DESCRIPTION OF THE INVENTION Object of the Invention (Field of Industrial Application) This invention relates to a thermal stencil paper for producing a printing stencil by perforating it with a thermal head.
（従来技術及び発明が解決しようとする問題点）一般に
、この種の感熱孔版原紙は多孔性支持体と合成樹脂フィ
ルムとを貼合わせて構成されており、この原紙をそのフ
ィルム側において原稿に重ね合わせて支持体側から赤外
線やキセノンフラッシュ光を照射し、その照射光の光エ
ネルギーを原稿の画像部分において熱エネルギーに変換
して前記フィルムを溶融・穿孔するようにした閃光製版
方式が知られている。(Prior Art and Problems to be Solved by the Invention) Generally, this type of heat-sensitive stencil paper is constructed by laminating a porous support and a synthetic resin film, and this base paper is stacked on the original on the film side. In addition, a flash plate making method is known in which infrared rays or xenon flash light is irradiated from the support side, and the optical energy of the irradiated light is converted into thermal energy in the image area of the original to melt and perforate the film. .
ところが、この従来の方式においては、原稿の画像部分
が色付けされていると、その色により光吸収度が異なる
ため、穿孔が不完全になる場合があり、色付けされた原
稿に基づいて孔版を行う場合には、乾式複写機によって
コピーしたものを使用したり、照射光の強度を調整した
りする必要があって面倒であった。However, in this conventional method, if the image part of the original is colored, the light absorption varies depending on the color, so the perforation may be incomplete, and stencil printing is performed based on the colored original. In some cases, it is necessary to use a copy made with a dry copying machine or to adjust the intensity of the irradiated light, which is troublesome.
これに対し、最近ではサーマルヘッドによる製版方式が
注目されている。すなわち、この方式は、画像読み取り
装置によって読み取られた画像情報や、ワードプロセッ
サによって作成された文字情報に基づいてサーマルヘッ
ドの発熱体を発熱させ、その熱により合成樹脂フィルム
を／８融して穿孔するものである。In contrast, plate making methods using thermal heads have recently been attracting attention. In other words, in this method, the heating element of the thermal head generates heat based on image information read by an image reading device or character information created by a word processor, and the heat is used to melt the synthetic resin film by 80% and perforate it. It is something.
ところが、この方式においては、単位面積当たりの熱エ
ネルギーが閃光製版方式に比べて少ないため、確実な穿
孔を行えないという問題がある。However, in this method, there is a problem that reliable perforation cannot be performed because the thermal energy per unit area is less than that in the flash plate making method.
また、多くの熱エネルギーを得るために、サーマルヘッ
ドに印加する電圧を上げると、サーマルヘッドに対し、
て設定された適正電圧以上の電圧が印加される場合が生
じ、その場合には、サーマルヘッドが損傷したり、寿命
を縮めたりすることになるという問題があった。Also, if you increase the voltage applied to the thermal head in order to obtain more thermal energy,
There are cases where a voltage higher than the appropriate voltage set is applied, and in that case, there is a problem that the thermal head is damaged or its life is shortened.
さらに、少ない熱エネルギーによっても穿孔を可能にす
るには、例えばポリ塩化ビニル（融点。Furthermore, to enable perforation even with low thermal energy, for example polyvinyl chloride (melting point.
１７０℃）、ポリ塩化ビニリデン（融点、１９０“Ｃ）
、ポリエチレン（融点、８−５〜１１０Ｊ”Ｃ）。170°C), polyvinylidene chloride (melting point, 190"C)
, polyethylene (melting point, 8-5 to 110 J"C).
ポリプロピレン（融点、１６５℃）等の低融点合成樹脂
製のフィルムを使用するｔとも考えられるが、この場合
には、穿孔性能は向上するものの、加熱時における経時
変化が大きいばかりでなく、耐油性が低いという問題が
ある。It is also possible to use a film made of a low melting point synthetic resin such as polypropylene (melting point, 165°C), but in this case, although the perforation performance is improved, not only does it change over time during heating, but also the oil resistance There is a problem of low
また、熱安定性及び耐油性の高いフィルムを使用し、そ
の厚さを薄（して穿孔性能を向上させることも考えられ
るが、フィルムを薄くすると、多孔性支持体への貼り合
わせ時に、フィルムにシワが入り、加工がしにくくなる
という問題がある。It is also possible to improve perforation performance by using a film with high heat stability and oil resistance and reducing its thickness. There is a problem that wrinkles appear on the surface, making it difficult to process.
この発明は上記の事情に鑑みてなされたものであって、
その目的はフィルムの厚さを従来の閃光製版方式に使用
する感熱孔版原紙と同じにして、容易に加工することが
できるとともに、少ない熱エネルギーで確実に穿孔する
ことができ、穿孔性能に優れた感熱孔版原紙を提供する
ことにある。This invention was made in view of the above circumstances, and
The purpose of this is to make the film thickness the same as that of the thermal stencil paper used in conventional flash plate making, making it easier to process, ensuring reliable perforation with less thermal energy, and providing excellent perforation performance. Our objective is to provide heat-sensitive stencil paper.
発明の構成
（問題点を解決するための手段）
上記の目的を達成するために、この発明においては、融
解エネルギーが９５ｃａｌ／ｇ以下で、かつ融点が２３
０℃以下のポリエステル系共重合体よりなるフィルムと
多孔性支持体とを貼合わせ、サーマルヘッドにより穿孔
できるように構成している。Structure of the Invention (Means for Solving the Problems) In order to achieve the above object, in this invention, the melting energy is 95 cal/g or less and the melting point is 23
A film made of a polyester copolymer having a temperature of 0° C. or lower is laminated to a porous support, and is configured to be perforated with a thermal head.
（作用）
従って、フィルムの厚さを従来の閃光製版方式に使用す
る感熱孔版原紙と間じにして、容易に加工することがで
きるとともに、少ない熱エネルギーで確実に穿孔するこ
とができる。(Function) Therefore, it is possible to easily process the film by adjusting the thickness of the film to that of the heat-sensitive stencil paper used in the conventional flash plate making method, and it is also possible to reliably perforate with less thermal energy.
（実施例）
さて、次にこの発明を具体化した実施例の概要を説明す
る。(Example) Next, an outline of an example embodying the present invention will be explained.
この発明において、多孔性支持体としては、繊度が３デ
ニール以下の各種の繊維によって紙状に成形されたもの
が使用される。すなわち、繊維材料としてはポリエステ
ル繊維、ビニロン繊維、ナイロン繊維等の合成繊維、あ
るいはマニラ麻、コウゾ、ミツマタ、パルプ等の天然繊
維を単独でもしくは混合して使用することができる。そ
して、それらの坪量が６〜１４ｇ／ｒｒｆ好ましくは７
〜１３ｇ／ｒｄで、その厚さが２０〜５０μ好ましくは
２５〜５０μのものを使用できる。又天然繊維単独のも
のは湿潤強度を向上させる為に天然及び合成樹脂を内添
、含浸したものを用いることもできる。In this invention, the porous support used is a paper-like material made of various fibers having a fineness of 3 deniers or less. That is, as the fiber material, synthetic fibers such as polyester fibers, vinylon fibers, and nylon fibers, or natural fibers such as Manila hemp, paper mulberry, Japanese mulberry, and pulp can be used alone or in combination. And their basis weight is 6 to 14 g/rrf, preferably 7
-13g/rd, and the thickness is 20-50μ, preferably 25-50μ. In addition, when using natural fibers alone, natural or synthetic resins may be added or impregnated to improve the wet strength.
この多孔性支持体に貼り合わされるフィルムは、ポリエ
ステル系共重合体から構成され、その厚さが閃光製版方
式で使用されるものと同様に１． ５μ以上４μ以下に
設定される。共重合される七ツマー成分の内、主酸成分
としては、テレフタル酸が使用され、副酸成分としては
、イソフタル酸。The film laminated to this porous support is made of a polyester copolymer, and its thickness is 1.5 mm, similar to that used in flash plate making. It is set to 5μ or more and 4μ or less. Among the heptamer components to be copolymerized, terephthalic acid is used as the main acid component, and isophthalic acid is used as the subsidiary acid component.
セバシン酸、アジピン酸等が使用される。一方、グリコ
ール成分としては、エチレングリコール。Sebacic acid, adipic acid, etc. are used. On the other hand, the glycol component is ethylene glycol.
プロピレングリコール、ブタンジオール等が使用される
。Propylene glycol, butanediol, etc. are used.
また、一般に、合成樹脂の融解エネルギーは次式で表さ
れる。Further, in general, the melting energy of a synthetic resin is expressed by the following formula.
Ｅ ＝ Ｃｐ （Ｔ ｍ −Ｔ ｏ ） ＋λｍ−
ＸｃＥ：融解エネルギー（ｃａｌ／ｇ ）
Ｃｐ：比熱（ｃａｌ／ｇ ・℃）
Ｔｍ：融点（”Ｃ）
ＴＯ：室温（’Ｃ）
λｍ：融解潜熱（ｃａｌ／ｇ ）
ＸＣ：結晶化度
ちなみに、一般に使用されているポリエステル樹脂（す
なわち、ポリエチレンテレフタレート）の場合、結晶化
度Ｘｃが１００％の時の融解潜熱λｍは３０ｃａｌ／ｇ
であり、通常、結晶化度Ｘｃが４０〜５５％前後のもの
が使用されている。また、共重合体になると、結晶化度
Ｘｃが低下し、融解エネルギーも低下する。ζ点が低下
することはいうまでもない。E = Cp (T m −T o ) +λm−
XcE: Melting energy (cal/g) Cp: Specific heat (cal/g ・℃) Tm: Melting point ('C) TO: Room temperature ('C) λm: Latent heat of fusion (cal/g) XC: Crystallinity Incidentally, in general In the case of the polyester resin used (i.e. polyethylene terephthalate), the latent heat of fusion λm when the degree of crystallinity Xc is 100% is 30 cal/g
Generally, those having a crystallinity Xc of about 40 to 55% are used. Moreover, when it becomes a copolymer, the crystallinity Xc decreases and the melting energy also decreases. Needless to say, the ζ point decreases.
そこで、ポリエステル系の共重合体と単独重合体とにお
いて、その融解エネルギーを前記の式に基づいて比較し
たところ、共重合体の主副側酸成分の比率を９＝１〜７
：３にすると、所望の結果が得られた。すなわち、この
比率より副酸成分を少なくすると、融点及び融解エネル
ギーが単独重合体より低くなる割合が少なく、反対に多
くすると、耐熱性の低下を招き、加熱時における経時変
化が大きくなる。Therefore, when we compared the melting energy of a polyester copolymer and a homopolymer based on the above formula, we found that the ratio of the main and subside acid components of the copolymer was 9 = 1 to 7.
:3, the desired results were obtained. That is, if the amount of the secondary acid component is less than this ratio, the melting point and melting energy will be less likely to be lower than that of the homopolymer, and if it is increased, the heat resistance will decrease and changes over time during heating will increase.
以下、この発明を具体化した実施例を詳細に説明する。Hereinafter, embodiments embodying the present invention will be described in detail.
〔実施例 １〕
テレフタル酸（主酸成分）８５ｍｏｌχ、イソフタル酸
（副酸成分）１５ｍｏｌχ、エチレングジエチレングリ
コール成分）１００ｍｏｌχよりなるモノマー成分を共
重合させてポリエステル樹脂を調製し、これを２゛４０
℃で溶融押出しして未延伸シートを製造した。この実施
例におけるポリエステル系共重合体の物性は表に示す。[Example 1] A polyester resin was prepared by copolymerizing monomer components consisting of terephthalic acid (main acid component) 85 molχ, isophthalic acid (auxiliary acid component) 15 molχ, and ethylene glycol component) 100 molχ.
An unstretched sheet was produced by melt extrusion at °C. The physical properties of the polyester copolymer in this example are shown in the table.
次に、このシートを８５℃で延伸した後、１８０℃で熱
固定して１３μの二軸延伸フィルムを作成した。この時
の延伸率は縦横ともに３．５倍である。Next, this sheet was stretched at 85°C and then heat-set at 180°C to produce a 13μ biaxially stretched film. The stretching ratio at this time was 3.5 times in both length and width.
そして、マニラ麻よりなり、坪量’ｌ Ｏｇ／ｍ。It is made of Manila hemp and has a basis weight of '10g/m.
厚さ３５μの多孔性支持体に、このフィルムをアクリル
系エマルジョン（乾燥塗布量１．０ｇ／ｒｒｆ）で貼り
合わせて感熱孔版原紙を作成した。This film was laminated with an acrylic emulsion (dry coating amount: 1.0 g/rrf) to a porous support having a thickness of 35 μm to prepare a heat-sensitive stencil paper.
サーマルヘッドとの融着を防止するため、この原紙のフ
ィルム表面に、シリコンオイル（乾燥塗布量１．０ ｇ
／ ｍ）を塗布した後、ビデオプリンター セレクト
ＵＡ−４５５（株式会社 日本アレク製）に装着し、サ
ーマルヘッドの印加電圧を適正電圧１６Ｖより低い１４
Ｖに設定して製版したところ、良好な穿孔原紙が得られ
た。To prevent fusion with the thermal head, apply silicone oil (dry application amount: 1.0 g) to the film surface of this base paper.
/m), attach it to the video printer Select UA-455 (manufactured by Nihon Alec Co., Ltd.), and set the applied voltage of the thermal head to 14V, which is lower than the appropriate voltage of 16V.
When plate making was performed with the setting at V, a good perforated base paper was obtained.
〔実施例 ２〕
テレフタル酸（主酸成分）８０ｍｏｌχ、イソフタル酸
（副酸成分）２０ｍｏｌχ、エチレングジエチレングリ
コール成分）１００ｍｏｌχよりなるモノマー成分を共
重合させてポリエステル樹脂を調製し、他の条件は前記
実施例１と同一にして孔版原紙を作成し、前記実施例と
同様の使用試験を行った。[Example 2] A polyester resin was prepared by copolymerizing monomer components consisting of 80 mol χ of terephthalic acid (main acid component), 20 mol χ of isophthalic acid (auxiliary acid component), and 100 mol χ of ethylene glycol component, and the other conditions were as described above. A stencil paper was prepared in the same manner as in Example 1, and the same usage test as in the previous example was conducted.
その結果、良好な穿孔性能が得られた２゜ポリエステル
系共重合体の物性は表に示す。As a result, the physical properties of the 2° polyester copolymer that showed good perforation performance are shown in the table.
テレフタル酸１００ｍｏｌχ、エチレングリコールＩＱ
Ｏｍｏｌχよりなるモノマー成分を単独重合させて調製
されたポリエチレンテレフタレートで、厚さ３μのフィ
ルムを作成し、そのフィルムを使用して前記各実施例と
同一の条件で原紙を作成した。Terephthalic acid 100molχ, ethylene glycol IQ
A film with a thickness of 3 μm was prepared from polyethylene terephthalate prepared by homopolymerizing a monomer component consisting of Omolχ, and the film was used to prepare base paper under the same conditions as in each of the above examples.
各実施例と同様の使用試験を行ったところ、穿孔性能は
充分でなかった。ポリエチレンテレフタレートの物性は
表に示す。When the same usage test as in each example was conducted, the perforation performance was not sufficient. The physical properties of polyethylene terephthalate are shown in the table.
以下＃、釦
上記のように、この実施例においては、フィルムをポリ
エステル系共重合体によ；て構成したので、その厚さを
閃光製版方式で使用する原紙と同じ厚さにすることがで
き、貼合わせ時にシワが入ることなく、容易に加工する
ことができ、また、融解エネルギーが９５ ｃａｌ／ｇ
以下で、かつ融点が２３０℃以下のポリエステル系共重
合体によりフィルムを形成したので、サーマルヘッドか
ら得られる熱エネルギーが少な（でも、確実な穿孔を行
うことができ、それによって穿孔作業の高速化に対処す
ることもできる。As mentioned above, in this example, the film was made of a polyester copolymer, so its thickness could be made to be the same as the base paper used in flash plate making. , can be easily processed without wrinkles during lamination, and has a melting energy of 95 cal/g.
Since the film was formed from a polyester copolymer with a melting point of 230°C or less, the thermal energy obtained from the thermal head is small (but it is possible to perform reliable drilling, thereby speeding up the drilling process. can also be dealt with.
（発明の効果）
以上詳述したように、この発明はフィルムの厚さを従来
の閃′光製版方式に使用する感熱孔版原紙と同じにして
、容易に加工することができるとともに、少ない熱エネ
ルギーで確実に穿孔することができるという優れた効果
を奏する。(Effects of the Invention) As detailed above, the present invention allows the film to have the same thickness as the heat-sensitive stencil paper used in the conventional flash photolithographic process, making it easy to process and requiring less heat energy. It has the excellent effect of being able to reliably drill holes.
Claims (1)
が２３０℃以下のポリエステル系共重合体よりなるフィ
ルムと多孔性支持体とを貼合わせ、サーマルヘッドによ
り穿孔できるように構成したことを特徴とする感熱孔版
原紙。 ２ 前記フィルムの厚さが１．５μ以上、４μ以下であ
ることを特徴とする特許請求の範囲第１項に記載の感熱
孔版原紙。[Scope of Claims] 1 A film made of a polyester copolymer having a melting energy of 95 cal/g or less and a melting point of 230°C or less is laminated to a porous support, and configured to be perforated with a thermal head. A heat-sensitive stencil paper that is characterized by: 2. The heat-sensitive stencil paper according to claim 1, wherein the thickness of the film is 1.5 μm or more and 4 μm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16526486A JPS6321190A (en) | 1986-07-14 | 1986-07-14 | Thermal stencil paper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16526486A JPS6321190A (en) | 1986-07-14 | 1986-07-14 | Thermal stencil paper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6321190A true JPS6321190A (en) | 1988-01-28 |
Family
ID=15809025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16526486A Pending JPS6321190A (en) | 1986-07-14 | 1986-07-14 | Thermal stencil paper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6321190A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62149496A (en) * | 1985-09-20 | 1987-07-03 | Toray Ind Inc | Film for thermal stencil paper |
| JPH01234294A (en) * | 1988-03-16 | 1989-09-19 | Asahi Chem Ind Co Ltd | High-sensitivity thermal stencil film and stencil paper |
| JPH02307790A (en) * | 1989-05-23 | 1990-12-20 | Diafoil Co Ltd | Film for thermally sensitive stencil paper |
| JPH02307788A (en) * | 1989-05-23 | 1990-12-20 | Diafoil Co Ltd | Polyester film for thermally sensitive stencil paper |
| JPH04126293A (en) * | 1989-11-14 | 1992-04-27 | Toray Ind Inc | Laminated polyester film |
| US5417156A (en) * | 1992-10-02 | 1995-05-23 | Ricoh Company, Ltd. | Thermal stencil plate making method |
| US5491655A (en) * | 1993-07-08 | 1996-02-13 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor memory device having non-selecting level generation circuitry for providing a low potential during reading mode and high level potential during another operation mode |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5433117A (en) * | 1977-08-18 | 1979-03-10 | Riso Kagaku Corp | Method of making recorded image |
| JPS6048398A (en) * | 1983-08-29 | 1985-03-16 | Ricoh Co Ltd | Thermal screen printing stencil paper |
| JPS6097891A (en) * | 1983-11-04 | 1985-05-31 | Ricoh Co Ltd | Thermal stencil paper |
-
1986
- 1986-07-14 JP JP16526486A patent/JPS6321190A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5433117A (en) * | 1977-08-18 | 1979-03-10 | Riso Kagaku Corp | Method of making recorded image |
| JPS6048398A (en) * | 1983-08-29 | 1985-03-16 | Ricoh Co Ltd | Thermal screen printing stencil paper |
| JPS6097891A (en) * | 1983-11-04 | 1985-05-31 | Ricoh Co Ltd | Thermal stencil paper |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62149496A (en) * | 1985-09-20 | 1987-07-03 | Toray Ind Inc | Film for thermal stencil paper |
| JPH01234294A (en) * | 1988-03-16 | 1989-09-19 | Asahi Chem Ind Co Ltd | High-sensitivity thermal stencil film and stencil paper |
| JPH02307790A (en) * | 1989-05-23 | 1990-12-20 | Diafoil Co Ltd | Film for thermally sensitive stencil paper |
| JPH02307788A (en) * | 1989-05-23 | 1990-12-20 | Diafoil Co Ltd | Polyester film for thermally sensitive stencil paper |
| JPH04126293A (en) * | 1989-11-14 | 1992-04-27 | Toray Ind Inc | Laminated polyester film |
| US5417156A (en) * | 1992-10-02 | 1995-05-23 | Ricoh Company, Ltd. | Thermal stencil plate making method |
| US5491655A (en) * | 1993-07-08 | 1996-02-13 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor memory device having non-selecting level generation circuitry for providing a low potential during reading mode and high level potential during another operation mode |
| US5506805A (en) * | 1993-07-08 | 1996-04-09 | Mitsubishi Denki Kabushiki Kaisha | Static semiconductor memory device having circuitry for enlarging write recovery margin |
| US5515326A (en) * | 1993-07-08 | 1996-05-07 | Mitsubishi Denki Kabushiki Kaisha | Static semiconductor memory device having circuitry for lowering potential of bit lines at commencement of data writing |
| US5629900A (en) * | 1993-07-08 | 1997-05-13 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor memory device operable to write data accurately at high speed |
| US5659513A (en) * | 1993-07-08 | 1997-08-19 | Mitsubishi Denki Kabushiki Kaisha | Static semiconductor memory device having improved characteristics |
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