JPS63202620A - Epoxy resin molding material - Google Patents
Epoxy resin molding materialInfo
- Publication number
- JPS63202620A JPS63202620A JP3472787A JP3472787A JPS63202620A JP S63202620 A JPS63202620 A JP S63202620A JP 3472787 A JP3472787 A JP 3472787A JP 3472787 A JP3472787 A JP 3472787A JP S63202620 A JPS63202620 A JP S63202620A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- molding material
- filler
- length
- silica
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 19
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 19
- 239000012778 molding material Substances 0.000 title claims abstract description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 9
- 239000011256 inorganic filler Substances 0.000 claims abstract description 7
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 7
- 239000000945 filler Substances 0.000 claims abstract description 6
- 239000005011 phenolic resin Substances 0.000 claims abstract description 6
- 239000003365 glass fiber Substances 0.000 claims abstract description 5
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 5
- 229920001568 phenolic resin Polymers 0.000 abstract description 5
- 238000007789 sealing Methods 0.000 abstract description 5
- 229920003986 novolac Polymers 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 239000000835 fiber Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- -1 glycidyl ester Chemical class 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は電気部品や電子部品を封止する樹脂モールド品
に主として用すられるエポキシ樹脂成形材料に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an epoxy resin molding material mainly used for resin molded products for sealing electrical and electronic components.
近年、電気、電子機器の高性能化、高信頼性、生産性向
上のため、プラスチヴクによる封止がなされるようにな
ってきた。これらの電気部品や電子部品には例えばトラ
ンジスタ、ダイオード、コンデンサー、フィルター、整
流器、抵抗体、コイル等があり、広く応用されているが
半田浸漬時にバ９ケージクラブクを発生する場合があり
、耐クラツク性に優れた成形材料が強く要望されている
。In recent years, in order to improve the performance, reliability, and productivity of electrical and electronic equipment, plastic packaging has come to be used for sealing. These electrical and electronic components include, for example, transistors, diodes, capacitors, filters, rectifiers, resistors, coils, etc., and although they are widely used, they may generate bar cage cracks when immersed in solder, and their durability is limited. There is a strong demand for molding materials with excellent crack resistance.
従来はゴム、可塑剤等を派別することによって耐クラツ
ク性を向上させることが試みられたが各れも耐熱性が低
下するという欠点があった。Conventionally, attempts have been made to improve crack resistance by separating rubber, plasticizers, etc., but each method has the drawback of decreasing heat resistance.
本発明の目的とするところは、封止成形品の加熱時耐ク
ラツク性に優れたエポキシ樹脂成形材料を提供すること
にある。An object of the present invention is to provide an epoxy resin molding material that has excellent resistance to cracking during heating of sealed molded products.
本発明はフェノール樹脂を硬化剤とし、充填剤中５０〜
９０東ｆｉｌ（以下単に憾と記す）のシリカと、１０−
５０’ｌの憂さが３００ミクロン以下で長さ／直径（以
下単にＬ／Ｄと記す）が５以上の無機充填剤を含有した
ことを特徴とするエポキシ樹脂成形材料のため、耐熱性
を維持したままで熱時耐クラック性を向上せしめること
ができたもので、以下本発明の詳細な説明する。The present invention uses phenolic resin as a curing agent, and contains 50 to 50% of the filler.
Silica of 90 East fil (hereinafter simply referred to as "regret") and 10-
It is an epoxy resin molding material characterized by containing an inorganic filler with a diameter of 50'l below 300 microns and a length/diameter (hereinafter simply referred to as L/D) of 5 or more, which maintains heat resistance. The present invention will now be described in detail.
本発明では硬化剤としてフェノール樹脂を用ｂルカ、好
ましくはノボラック型フェノール樹脂を用することか１
ｉｔ熱性の点でよく望ましいことである。充填剤として
は結晶シリカ、溶融シリカ等のシリカ全段と、長さが３
００ミクロン以下でＬ／Ｄが５以上のガラス線維、アス
ベスト繊維、石膏繊維、セラミック繊維、スチール繊維
、チタン繊維等の無機充填剤全般であるが好ましくはガ
ラス線維を用いることが望ましｂ０無機充填剤の長さが
３００ミクロンをこえると封止素子の全線が破断しやす
くなり、 Ｌ／Ｄが５未満であっても封止素子の全線が
破断しやすくなるためである。エポキシ樹脂トしては１
分子中に２１固以上のエポキシ基を有する硬化可能なエ
ポキシ樹脂であるならばビスフェノールＡ型エポキシ樹
脂、ノボラック型エポキシ樹脂、可撓性エポキシ樹脂、
ハロゲン化エポキシ樹脂、グリシジルエステル型エポキ
シ樹脂、高分子型エポキシ樹脂各れでもよく特に限定す
るものではない。エポキシ樹脂、硬化剤、充填剤以外の
添加剤としては、難燃剤、硬化促進剤、′ａ型剤、カリ
ブリング剤、着色剤等を混合、混練、粉砕し更に必要に
応じて造粒して成ｔｈ材料を得るものである。更に該成
形材料の成形につめては、トランスファー成形、射出成
形等によるトランジスター、ダイオード、コンデンサー
、フィルター、整流器、抵抗体、コイル等の電子部品の
多数個取り成形に適することは勿論、圧縮成形等にも適
用できるものである。以下本発明を実権例にもとずｂて
詳細に説明する。In the present invention, a phenolic resin is used as a curing agent, preferably a novolak type phenolic resin.
It is highly desirable from a thermal standpoint. Fillers include crystalline silica, fused silica, etc. in all stages and lengths of 3
Inorganic fillers such as glass fibers, asbestos fibers, gypsum fibers, ceramic fibers, steel fibers, and titanium fibers with a diameter of 00 microns or less and an L/D of 5 or more, but it is preferable to use glass fibers.B0 inorganic fillers This is because if the length of the agent exceeds 300 microns, all lines of the sealing element are likely to break, and even if L/D is less than 5, all lines of the sealing element are likely to break. If you use epoxy resin 1
Curable epoxy resins having 21 or more epoxy groups in the molecule include bisphenol A epoxy resins, novolak epoxy resins, flexible epoxy resins,
It may be a halogenated epoxy resin, a glycidyl ester type epoxy resin, or a polymer type epoxy resin, and is not particularly limited. Additives other than the epoxy resin, curing agent, and filler include flame retardants, curing accelerators, 'a type agents, calibrating agents, coloring agents, etc., which are mixed, kneaded, pulverized, and granulated if necessary. This is to obtain the growth material. Furthermore, regarding the molding of this molding material, it is suitable for multi-cavity molding of electronic components such as transistors, diodes, capacitors, filters, rectifiers, resistors, coils, etc. by transfer molding, injection molding, etc., as well as compression molding, etc. It can also be applied to Hereinafter, the present invention will be explained in detail based on actual examples.
実施例１乃至３と比較例
第１表の配合表に従って材料を配合、混合、混練してエ
ポキシ樹脂成形材料を得、トランス７丁−成形機を用す
て金型温度１７５℃、成形圧力５ｏ’ｑ／ｄ−硬化時間
３分間でハイブリリドＩＣを封止成形した。Examples 1 to 3 and Comparative Example The materials were blended, mixed, and kneaded according to the formulation table in Table 1 to obtain an epoxy resin molding material, and then molded at a mold temperature of 175°C and a molding pressure of 5o using a transformer 7-mold molding machine. The hybrid IC was sealed and molded with a q/d-curing time of 3 minutes.
第 １ 表
重量部
注
※１ エポキシ当Ｊｉｔ２２０．軟化点８０℃のクレゾ
ール ノボラック型エポキシ樹脂。Table 1 Parts by weight Note 1 Epoxy weight Jit220. Cresol novolac type epoxy resin with a softening point of 80°C.
※２ 水酸基当量１０４、軟化点８７℃のノボラック型
フェノール樹脂。*2 Novolac type phenolic resin with a hydroxyl equivalent of 104 and a softening point of 87°C.
秦３ 長さ２００ミクロン、Ｌ／Ｄが８のガラス繊維。Qin 3 Glass fiber with a length of 200 microns and L/D of 8.
実施例１乃至３と比較例の加熱時耐クラツク性は第２表
で明白なように本発明のものの性能はよく、本発明のエ
ポキシ樹脂成形４材料の浸れて論ることを確認した。As is clear from Table 2, the crack resistance during heating of Examples 1 to 3 and the comparative example shows that the properties of the present invention were good, and the properties of the four epoxy resin molding materials of the present invention were confirmed.
Claims (2)
０重量％のシリカと、１０−５０重量％の長さが３００
ミクロン以下で長さ／直径が５以上の無機充填剤を含有
したことを特徴とするエポキシ樹脂成形材料。(1) Phenol resin as hardening agent, 50-9 in filler
0 wt% silica and 10-50 wt% length 300
An epoxy resin molding material characterized by containing an inorganic filler having a length/diameter of 5 or more microns or less.
特許請求の範囲第１項記載のエポキシ樹脂成形材料。(2) The epoxy resin molding material according to claim 1, wherein the inorganic filler is glass fiber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3472787A JPS63202620A (en) | 1987-02-18 | 1987-02-18 | Epoxy resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3472787A JPS63202620A (en) | 1987-02-18 | 1987-02-18 | Epoxy resin molding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63202620A true JPS63202620A (en) | 1988-08-22 |
Family
ID=12422350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3472787A Pending JPS63202620A (en) | 1987-02-18 | 1987-02-18 | Epoxy resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63202620A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60207353A (en) * | 1984-03-31 | 1985-10-18 | Toshiba Corp | Resin sealed type semiconductor device |
| JPS61166823A (en) * | 1985-01-19 | 1986-07-28 | Toshiba Chem Corp | Resin composition for sealing |
| JPS62106953A (en) * | 1985-11-06 | 1987-05-18 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
| JPS62209128A (en) * | 1986-03-11 | 1987-09-14 | Toshiba Corp | Epoxy resin composition for sealing semiconductor device |
-
1987
- 1987-02-18 JP JP3472787A patent/JPS63202620A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60207353A (en) * | 1984-03-31 | 1985-10-18 | Toshiba Corp | Resin sealed type semiconductor device |
| JPS61166823A (en) * | 1985-01-19 | 1986-07-28 | Toshiba Chem Corp | Resin composition for sealing |
| JPS62106953A (en) * | 1985-11-06 | 1987-05-18 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
| JPS62209128A (en) * | 1986-03-11 | 1987-09-14 | Toshiba Corp | Epoxy resin composition for sealing semiconductor device |
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