JPS63193801U - - Google Patents
Info
- Publication number
- JPS63193801U JPS63193801U JP8597187U JP8597187U JPS63193801U JP S63193801 U JPS63193801 U JP S63193801U JP 8597187 U JP8597187 U JP 8597187U JP 8597187 U JP8597187 U JP 8597187U JP S63193801 U JPS63193801 U JP S63193801U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- covering material
- chip component
- adhering
- except
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図ａ，ｂは本考案による一実施例の斜視図
、第２図は第１図の実装状態を示す側断面図、第
３図ａ，ｂは従来技術による斜視図、第４図は第
３図の実装状態を示す側断面図、である。
図において、１はチツプ部品（チツプコンデンサ
、チツプ抵抗）、１ａは電極、１ａ―１は端面、
１ａ―２は取付面、１ａ―３は側面、１ａ―４は
上面、２は被覆材、３は半田、４は回路基板、４
ａは導体パターン、を示す。
1A and 1B are perspective views of an embodiment of the present invention, FIG. 2 is a side sectional view showing the mounting state of FIG. 4 is a side sectional view showing the mounting state of FIG. 3. FIG. In the figure, 1 is a chip component (chip capacitor, chip resistor), 1a is an electrode, 1a-1 is an end surface,
1a-2 is the mounting surface, 1a-3 is the side surface, 1a-4 is the top surface, 2 is the covering material, 3 is the solder, 4 is the circuit board, 4
a indicates a conductor pattern.
Claims (1)
１ａ―２とを残して全表面に半田を付着させない
被覆材２を被着したことをすることを特徴とする
チツプ部品。 A chip component characterized in that a covering material 2 that prevents solder from adhering is applied to the entire surface of an electrode 1a provided at both ends, except for the end surface 1a-1 and the mounting surface 1a-2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8597187U JPS63193801U (en) | 1987-06-01 | 1987-06-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8597187U JPS63193801U (en) | 1987-06-01 | 1987-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63193801U true JPS63193801U (en) | 1988-12-14 |
Family
ID=30941857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8597187U Pending JPS63193801U (en) | 1987-06-01 | 1987-06-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63193801U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0346310A (en) * | 1989-07-14 | 1991-02-27 | Murata Mfg Co Ltd | Chip component and manufacture thereof |
| JP2014116570A (en) * | 2012-12-11 | 2014-06-26 | Samsung Electro-Mechanics Co Ltd | Multilayer ceramic capacitor and manufacturing method of the same |
-
1987
- 1987-06-01 JP JP8597187U patent/JPS63193801U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0346310A (en) * | 1989-07-14 | 1991-02-27 | Murata Mfg Co Ltd | Chip component and manufacture thereof |
| JP2014116570A (en) * | 2012-12-11 | 2014-06-26 | Samsung Electro-Mechanics Co Ltd | Multilayer ceramic capacitor and manufacturing method of the same |
| US8879238B2 (en) | 2012-12-11 | 2014-11-04 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and method of manufacturing the same |