JPS63184397A - Radiator of electronic component - Google Patents
Radiator of electronic componentInfo
- Publication number
- JPS63184397A JPS63184397A JP1524887A JP1524887A JPS63184397A JP S63184397 A JPS63184397 A JP S63184397A JP 1524887 A JP1524887 A JP 1524887A JP 1524887 A JP1524887 A JP 1524887A JP S63184397 A JPS63184397 A JP S63184397A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- board
- refrigerant
- metal
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- 239000003507 refrigerant Substances 0.000 claims description 20
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 238000001816 cooling Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000013341 scale-up Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
電子計算機、電子交換機等のＬＳ Ｉ化装置ではＬＳＩ
パッケージ相互間の実装遅延で小さくするよう近接して
配置する。そのため単位面積当たシの配線密度が高くな
り多層基板化、細線化、外部記報の小型化、全体の高密
度化等が必要とされる。[Detailed description of the invention] [Industrial application field] LSI integrated devices such as electronic computers and electronic switching equipment
The packages are placed close to each other to minimize the mounting delay between the packages. Therefore, the wiring density per unit area increases, requiring multilayer substrates, thinner wires, miniaturization of external storage, and higher overall density.
またＬＳＩ自体は高密度のため動作状態での単位体積当
たりの発熱量が非常に大きく、素子の温度上昇は信頼度
を低下させるのみならず、雑音マージンの減少、スイッ
チング速度の低下等の各種の弊害をもたらすため、この
発熱量を効率よく外部へ放出する冷却技術が要求される
。Furthermore, since the LSI itself has a high density, it generates a very large amount of heat per unit volume during operation, and a rise in the temperature of the device not only reduces reliability, but also causes various problems such as a reduction in noise margin and a reduction in switching speed. Since this causes harmful effects, a cooling technology is required to efficiently release this calorific value to the outside.
以上のような要求からＬＳＩパッケージを冷却するため
、冷却方法として空冷方式と液冷方式があるが液冷方式
の場合の代表的な例を第２図（ａ）、 （ｂ）に示す。In order to cool the LSI package in response to the above requirements, there are air cooling methods and liquid cooling methods as cooling methods, and a typical example of the liquid cooling method is shown in FIGS. 2(a) and 2(b).
第１図（−）はＬＳＩパッケージを装着した基板に第３
図に示すように冷媒を流す金属・ζイブが接着して装備
されており、このパイプに流す冷媒によりＬＳＩパッケ
ージを冷却する間接型であり、第２図（ｂ）はＬＳＩパ
ッケージを直接冷媒中に浸漬する直接型である。Figure 1 (-) shows the third
As shown in the figure, a metal ζ-eve that flows through the refrigerant is attached and equipped, and the LSI package is cooled by the refrigerant flowing through this pipe.It is an indirect type. It is a direct type that is immersed in water.
本発明は液冷の間接型方式においてＬＳＩパツケ−ジ等
の電子部品を装着した基板に放熱板を容易にかつ安定に
固定して支持すると共に効率的な冷却を行い、まだ実装
密度を高めるものである。The present invention is a liquid-cooled indirect method that easily and stably fixes and supports a heat sink on a board on which electronic components such as an LSI package are mounted, and performs efficient cooling, thereby increasing the packaging density. It is.
〔従来の技術及び発明が解決しようとする問題点〕第一
図（ａ）に示す液冷方式の構造は第３図に示すようにＬ
ＳＩが搭載された基板の表面または裏面にこれらＬＳＩ
を冷却するため金属製パイプを基板に接着させ、冷媒と
する水等を流し冷却を行うが、従来この種の構造におい
ては
（１）冷媒を流す金属パイプと基板を金属ろう材で浴接
する方法、
（２）基板の一部に孔を開けた熱伝導体の板を接着し、
その孔の中に冷媒を流す方法、
（３）基板の一部にコの字型の金属板材等を組合わせ、
冷媒流路を形成する方法
等がある。[Problems to be solved by the prior art and the invention] The structure of the liquid cooling system shown in Figure 1 (a) is L as shown in Figure 3.
These LSIs are placed on the front or back side of the board on which the SI is mounted.
In order to cool the substrate, a metal pipe is bonded to the substrate, and water, etc., used as a refrigerant is flowed to cool it. Conventionally, in this type of structure, (1) the metal pipe through which the refrigerant flows and the substrate are bath-bonded with a metal brazing material. , (2) Glue a heat conductor plate with holes in a part of the board,
(3) Combining a U-shaped metal plate etc. with a part of the board,
There are methods of forming refrigerant channels.
以下に各方法を説明する。Each method will be explained below.
第７図は（１）の方法の構造例である。冷媒用金属パイ
プ／の中に冷媒、たとえば水を流す。基板夕にこのパイ
プをろう利／／たとえば銀ろう等により固定させている
。この方法ではろう付は作業を全面にわたって順番に行
なわなければならず、作業時間がかかること、局部的な
温度上昇により熱ひずみが残り精密な加工ができないこ
七、パイプの半面は十分な熱伝導材料に接しておらず、
有効な熱伝達がはかられないこと等の欠点がある。FIG. 7 shows an example of the structure of method (1). A refrigerant, such as water, is passed through the refrigerant metal pipe. This pipe is fixed to the substrate using solder/for example, silver solder. With this method, brazing must be performed sequentially over the entire surface, which takes time, and the local temperature rise causes thermal distortion, making it impossible to perform precise machining. not in contact with the material,
There are drawbacks such as inability to measure effective heat transfer.
４５図は（２）の構造の例で、熱伝導性の良い金属厚板
／２に孔／弘を開けこの孔に冷媒を流す。金属厚板／、
２は基板！に接している。この方法では金属厚板／２に
孔／グを開ける作業が必要となり、ドリルの大きさ等の
制約から大型化しにくいこと、所望の形に製造しにくい
こと、製造が困離で量産に向かないこと等の欠点を有す
る。Figure 45 shows an example of the structure (2), in which a hole is made in a thick metal plate 2 with good thermal conductivity, and a refrigerant is allowed to flow through the hole. Metal thick plate/
2 is the board! is in contact with This method requires the work of drilling holes in the metal plate/2, making it difficult to scale up due to constraints such as the size of the drill, difficult to manufacture into the desired shape, and difficult to manufacture, making it unsuitable for mass production. It has drawbacks such as:
第２図は（３）の構造の例である。この方法は基板夕に
コの字型の金属薄板／３を組合せ、ろう材／／で接合し
た後冷媒流路／夕に冷媒を流すものである。この方法は
接合の方法により任意の形状にできない、残留熱応力、
接合の不完全性、作業が煩雑、時間がかかる、等の問題
点を有する。FIG. 2 is an example of the structure (3). In this method, a U-shaped thin metal plate 3 is combined with a substrate, and after bonding with a brazing filler metal, a coolant is flowed through a coolant flow path. This method does not allow for arbitrary shapes due to the joining method, residual thermal stress,
There are problems such as incomplete joining, complicated work, and time-consuming work.
本発明は前記のような従来の種々の欠点を解決すると同
時に冷却の効率を上げまた製作の容易性、低価格性、機
械的構造の強固性、装着の容易さ等の向上を図るもので
ある。The present invention solves the various drawbacks of the conventional devices as described above, and at the same time improves cooling efficiency, ease of manufacturing, low cost, rigidity of mechanical structure, ease of installation, etc. .
本発明はＬＳＩパッケージ等を搭載している基板に放す
金属パイプを埋設して冷却効果を高めると同時に実装密
度を上げるものである。The present invention improves the cooling effect and increases the packaging density by embedding a metal pipe in the board on which an LSI package or the like is mounted.
他方ＬＳＩパッケージ等の電子部品の熱が容易に且つ効
率的に放熱板から支持部の冷媒用金属パイプに移動する
ため電子部品と放熱板との接触に軽い圧力を加えること
が効果的である。このため基板と電子部品の間に発条を
設置し放熱板と電子部品の接触を良好ならしめている。On the other hand, it is effective to apply light pressure to the contact between the electronic component and the heat sink so that the heat of the electronic component such as an LSI package can be easily and efficiently transferred from the heat sink to the coolant metal pipe of the support section. For this reason, a spring is installed between the board and the electronic component to ensure good contact between the heat sink and the electronic component.
以下に実施例を用いて本発明を説明する。The present invention will be explained below using Examples.
第１図（ａ）は本発明の実施例の７っで、放熱板の支持
部の製作において放熱板を固定するのに便利なように放
熱板の支持部に段差または溝をっけ、かつ支持部の中に
冷媒用金属パイプを埋設して形成する。このため第１図
（ａ）に示す断面の鋳型又は枠型を用い、この中の所足
の位置に金属パイプを設置し溶融金属を流しこみ成形し
た後固化させるものである。FIG. 1(a) shows a seventh embodiment of the present invention, in which steps or grooves are provided in the support part of the heat sink for convenience in fixing the heat sink when manufacturing the support part of the heat sink. It is formed by embedding a metal pipe for refrigerant in the support part. For this purpose, a mold or frame having the cross section shown in FIG. 1(a) is used, metal pipes are installed in the required positions within the mold, and molten metal is poured into the mold and solidified after being formed.
／は冷媒用金属パイプ、たとえば銅パイプまたはステン
レスパイプ等である。この中に冷媒例えば水等を流す。/ is a refrigerant metal pipe, such as a copper pipe or a stainless steel pipe. A refrigerant such as water is passed through this.
２はＬＳＩチップを装荷したパッケージ等の電子部品で
ある。３は銅板等よりなる放熱板である。グは放熱板支
持部、夕は基板である。2 is an electronic component such as a package loaded with an LSI chip. 3 is a heat sink made of a copper plate or the like. G is the heat sink support part, Y is the board.
実際の使用においては基板夕にＬｆ９エバッヶージ等の
電子部品！のリード線７をハンダ付けして装着するが、
この時ＬＳＩパッケージのリード線７をハンダ付けした
時の基板夕からの高さを支持部／の旨さよりやや高めに
してリード線をハンダ付けする。In actual use, electronic components such as Lf9 evangege are used on the board! Solder and attach the lead wire 7 of
At this time, the lead wires 7 of the LSI package are soldered so that the height from the base of the board is slightly higher than that of the support part.
この後放熱板３をＬＳＩパッケージ２を軽く押える程度
の圧力をかけて接触させて放熱板３を支持部／にとりつ
けるものである。とりつけには例えばネジどをもちいる
。Thereafter, the heat sink 3 is brought into contact with the LSI package 2 by applying a slight pressure to the LSI package 2, and the heat sink 3 is attached to the support portion. Use screws, for example, to attach it.
軽い圧力を作る構成として第１図（ｂ）に示すように発
条乙を基板夕とＬＳＩパッケージ２の間に設置する。発
条には同図に示すスプリングでも、第１図（ｃ）に示す
曲げだバネ状のものｚ′等種々のものが考えられる。ま
たこれらの発条で電子部品を放熱板に押しつける圧力を
加減するため第１図（ｄ）に示すように基板夕の電子部
品−の真下に孔を開けこの中にスプリング乙を設置しネ
ジ蓋りで閉じるようにして上記の圧力を加減できるよう
な構造としてもよい。また他の実施例として、第７図（
ａ）、 （ｂ）に示すようなフィンをつけた放熱板、放
熱板をとりつけ易い構造の支持部等がある。To create a light pressure, a spring is installed between the board and the LSI package 2 as shown in FIG. 1(b). Various types of springs can be considered as the springs, such as the spring shown in the figure, and a bent spring-like spring z' shown in FIG. 1(c). In addition, in order to adjust the pressure that presses the electronic components against the heat sink using these springs, a hole is made just below the electronic component on the board, as shown in Figure 1 (d), and a spring is installed in this hole, and the screw cap is closed. It is also possible to have a structure in which the above pressure can be adjusted by closing with the pressure. In addition, as another example, FIG. 7 (
There are heat dissipation plates with fins as shown in a) and (b), and support parts with a structure that makes it easy to attach the heat dissipation plate.
以上に述べたような放熱装置の構造及び製作法になって
いるので冷媒用金属パイプと放熱板とは直接に接続され
すぐれた伝熱特性が得られ、冷却効果が高まる。Since the structure and manufacturing method of the heat dissipation device are as described above, the refrigerant metal pipe and the heat dissipation plate are directly connected, and excellent heat transfer characteristics are obtained, thereby increasing the cooling effect.
また冷媒用の金属パイプは既製品のパイプを使用できる
ため安価かつ容易に入手出来、液漏れの心配がない、曲
げ加工の際加工が容易で任意の形状に整形できる等の長
所を有する。In addition, metal pipes for refrigerants are inexpensive and easily available because ready-made pipes can be used, and have advantages such as there is no fear of liquid leakage, and they are easy to bend and can be shaped into any shape.
更には冷媒用金属パイプをＬ Ｓ エパッケージ等の電
子部品の近傍に配置することができ冷却効果が高捷ると
同時に近接配置のため実装密度も高まるという二重の効
果を有する。Furthermore, the refrigerant metal pipe can be placed near electronic components such as the L S e-package, which has the dual effect of increasing the cooling effect and increasing the packaging density due to the close placement.
製作面からみた他の効果として、金属パイプを熱溶融性
金属で一括して接合するため作業時間が短縮できること
、温度変化が全体で同時に進むため残留熱応力が少なく
、高い寸法精度が得られること、従来の銀ろう等を使用
していないことから機械的強度が高いこと等の利点があ
る。Other benefits from a manufacturing perspective are that work time can be shortened because the metal pipes are joined all at once using hot-melt metal, and that temperature changes occur simultaneously throughout the pipe, resulting in less residual thermal stress and higher dimensional accuracy. Since it does not use conventional silver solder, it has the advantage of high mechanical strength.
以上アルミニウムまたはその合金を用いた実施例につい
て述べたが、アルミニウム合金トしてＡ１−Ｐｂ合金、
Ａｌ−８ｉ合金、Ａｌ−Ａｇ合金。Examples using aluminum or its alloys have been described above, but aluminum alloys, A1-Pb alloys,
Al-8i alloy, Al-Ag alloy.
Ａ１−Ｉｎ合金 等があり、又他の例として Ａｇ−Ｍｇ合金、Ａｇ−０ｕ合金、Ａｇ−８ｎ合金。A1-In alloy etc., and as another example Ag-Mg alloy, Ag-0u alloy, Ag-8n alloy.
■ｎｓｎ合金
等の合金を用いても同様の効果があることは勿論である
。(2) It goes without saying that the same effect can be obtained by using an alloy such as an nsn alloy.
第１図（ａ）〜（ｄ）は本発明の実施例を示す図、第２
図は代表的な液冷方式の構成図、第３図は従来の冷媒用
パイプの基板への装着の一例を示す図、第グ図、第！図
、第ｚ図は従来の液体冷却方式の冷媒用金属パイプの例
、第７図は本発明の他の実施例である。
／・・・冷媒用金属パイプ、！・・・ＬＳＩ・Ｚノケー
ジ等の電子部品、３・・・放熱板、≠・・・放熱板支持
部、！・・・基板、乙・・・発条、７・・・リード線、
と・・・止めネジ、２・・・ネジ蓋、１０・・・フィン
、／／・・・ろう材（銀ろう等）、／２・・・金属厚板
、／３・・・金属薄板、／グ・・・（冷媒を流す）孔、
／夕・・・冷媒流路。1(a) to 1(d) are diagrams showing embodiments of the present invention, and FIG.
The figure is a configuration diagram of a typical liquid cooling system, Figure 3 is a diagram showing an example of mounting a conventional refrigerant pipe to a board, Figures 1 and 2 are diagrams. Fig. z shows an example of a metal pipe for refrigerant of a conventional liquid cooling type, and Fig. 7 shows another embodiment of the present invention. /...Metal pipe for refrigerant! ...Electronic components such as LSI/Z cage, etc., 3... Heat sink, ≠... Heat sink support part,! ... Board, B... Spring, 7... Lead wire,
and...set screw, 2...screw cap, 10...fin, //...brazing filler metal (silver solder, etc.), /2...metal thick plate, /3...metal thin plate, /G...(refrigerant flow) hole,
/ Evening... Refrigerant flow path.
Claims (2)
を固定する支持部を有する基板からなり、前記支持部の
内部に冷媒用の金属パイプを埋設し基板と電子部品の間
に該電子部品を前記放熱板に押さえつける手段を有する
ことを特徴とする電子部品放熱装置。(1) It consists of a board that has a heat sink that cools electronic components and a support part that fixes the heat sink, and a metal pipe for refrigerant is buried inside the support part so that the metal pipe is inserted between the board and the electronic parts. An electronic component heat dissipation device comprising means for pressing an electronic component against the heat dissipation plate.
けられた発条であることを特徴とする特許請求の範囲第
１項記載の電子部品放熱装置。(2) The electronic component heat dissipation device according to claim 1, wherein the pressing means is a spring provided between the electronic component and the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1524887A JPS63184397A (en) | 1987-01-27 | 1987-01-27 | Radiator of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1524887A JPS63184397A (en) | 1987-01-27 | 1987-01-27 | Radiator of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63184397A true JPS63184397A (en) | 1988-07-29 |
Family
ID=11883551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1524887A Pending JPS63184397A (en) | 1987-01-27 | 1987-01-27 | Radiator of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63184397A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0536896U (en) * | 1991-10-17 | 1993-05-18 | 株式会社アドバンテスト | Semiconductor IC cooling structure |
| US6771509B2 (en) | 1992-05-20 | 2004-08-03 | Seiko Epson Corporation | Cartridge for electronic devices |
| US7804688B2 (en) | 1992-05-20 | 2010-09-28 | Seiko Epson Corporation | Apparatus including processor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5580399A (en) * | 1978-12-13 | 1980-06-17 | Fujitsu Ltd | Electronic device cooling structure |
| JPS5667949A (en) * | 1979-11-07 | 1981-06-08 | Hitachi Ltd | Cooling body of electrical parts |
| JPS5822746B2 (en) * | 1981-05-14 | 1983-05-11 | 株式会社東芝 | cleaning equipment |
-
1987
- 1987-01-27 JP JP1524887A patent/JPS63184397A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5580399A (en) * | 1978-12-13 | 1980-06-17 | Fujitsu Ltd | Electronic device cooling structure |
| JPS5667949A (en) * | 1979-11-07 | 1981-06-08 | Hitachi Ltd | Cooling body of electrical parts |
| JPS5822746B2 (en) * | 1981-05-14 | 1983-05-11 | 株式会社東芝 | cleaning equipment |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0536896U (en) * | 1991-10-17 | 1993-05-18 | 株式会社アドバンテスト | Semiconductor IC cooling structure |
| US6771509B2 (en) | 1992-05-20 | 2004-08-03 | Seiko Epson Corporation | Cartridge for electronic devices |
| US6845014B2 (en) | 1992-05-20 | 2005-01-18 | Seiko Epson Corporation | Cartridge for electronic devices |
| US7035108B2 (en) | 1992-05-20 | 2006-04-25 | Seiko Epson Corporation | Information processing device |
| US7345883B2 (en) | 1992-05-20 | 2008-03-18 | Seiko Epson Corporation | Processing device |
| US7359202B2 (en) | 1992-05-20 | 2008-04-15 | Seiko Epson Corporation | Printer apparatus |
| US7583505B2 (en) | 1992-05-20 | 2009-09-01 | Seiko Epson Corporation | Processor apparatus |
| US7804688B2 (en) | 1992-05-20 | 2010-09-28 | Seiko Epson Corporation | Apparatus including processor |
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