JPS63178553A - Circuit element module - Google Patents
Circuit element moduleInfo
- Publication number
- JPS63178553A JPS63178553A JP1041987A JP1041987A JPS63178553A JP S63178553 A JPS63178553 A JP S63178553A JP 1041987 A JP1041987 A JP 1041987A JP 1041987 A JP1041987 A JP 1041987A JP S63178553 A JPS63178553 A JP S63178553A
- Authority
- JP
- Japan
- Prior art keywords
- clip
- substrate
- board
- terminal
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052802 copper Inorganic materials 0.000 abstract description 8
- 239000010949 copper Substances 0.000 abstract description 8
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 238000007747 plating Methods 0.000 abstract description 6
- 238000007373 indentation Methods 0.000 abstract 2
- 238000007493 shaping process Methods 0.000 abstract 2
- 238000009434 installation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 235000003801 Castanea crenata Nutrition 0.000 description 1
- 244000209117 Castanea crenata Species 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
回路素子モジュールの基板の端面部にサイドタッチを設
け、このサイドノツチの窪んだ所に金属の連結部を形成
し、これと基板の面上の端にあるパッドを接続するもの
で、クリップ端子と半田付けする部位のパッドのめ（れ
を防止し、クリップ端子の位置決めを容易にし、クリッ
プ端子の半田付は強度を大とし、連結部の面積を大きく
することが出来るので配線の信頼性が向上する。[Detailed Description of the Invention] [Summary] A side touch is provided on the end surface of the substrate of the circuit element module, a metal connection portion is formed in the recessed part of the side notch, and a metal connection portion is formed between this and the pad on the edge of the surface of the substrate. It is used to connect the clip terminal and the pad at the part to be soldered to prevent slippage, to make positioning of the clip terminal easier, to increase the strength of the soldering of the clip terminal, and to increase the area of the connecting part. This improves the reliability of wiring.
本発明は基板上に集積回路パッケージ等を搭載する回路
素子モジュールに係り、詳しくはモジュール基板の端子
接続部の構造に関する。The present invention relates to a circuit element module in which an integrated circuit package or the like is mounted on a substrate, and more particularly to the structure of a terminal connection portion of a module substrate.
第３図はＤＩＰ （口ｕａｌ−Ｉｎ−１ｉｎｅ Ｐａｃ
ｋａｇｅ ）型プラスチックモジュールの概略を示す斜
視図である。この図において、１なるプラスチック基板
の上には、回路素子例えばＬ ＣＣ（Ｌｅａｄｌｅｓｓ
ＣｈｉｐＣａｒｒｉｅｒ ）等の集積回路パッケー
ジやチップコンデンサが搭載され、基板１自身は多層構
造で、その各層基板には前記の回路素子等を接続する配
線が形成され、その配線の一部は基板１の面の両端近く
に設けられたパッド２を介してクリップ端子３に接続さ
れている。Figure 3 shows DIP (mouthual-In-1ine Pac
FIG. In this figure, a circuit element such as LCC (Leadless) is mounted on a plastic substrate 1.
The board 1 itself has a multilayer structure, and each layer of the board has wiring for connecting the circuit elements, etc., and some of the wiring is on the surface of the board 1. It is connected to a clip terminal 3 via pads 2 provided near both ends.
しかし、従来のものにあっては、クリップ端子３は、基
板１をクリップ部で挟むようにして、基板１の上下両表
面上のパッド２に接続され、ディツブによる半田付けで
固定されるが、クリップ端子３のクリップ部で基板１を
挟む時にクリップ部でパッド２をこすり、基板１からパ
ッド２がめくれる欠点がある。また、クリップ端子が左
右にふれて、パッド２の上に正しく入らず、クリップ端
子相互の間隔がバラツキ易い欠点があり、また、そのク
リップ端子３の固定は、基板上下両表面のパッド２と、
クリップ部の半田付けのみによるので、固定強度が充分
でないと云う欠点がある。However, in the conventional type, the clip terminal 3 is connected to the pads 2 on both the upper and lower surfaces of the board 1 so that the board 1 is sandwiched between the clip parts, and is fixed by soldering with a dip. There is a drawback that when the board 1 is held between the clip parts 3, the pad 2 is rubbed by the clip parts, and the pad 2 is turned over from the board 1. In addition, the clip terminals touch from side to side and do not fit properly onto the pads 2, and the distance between the clip terminals tends to vary.
Since the clip portion is only soldered, there is a drawback that the fixing strength is not sufficient.
また、プラスチックモジュールには、クリップ端子を基
板の片側のみにつけたＳ Ｉ Ｐ （Ｓｉｎｇｌｅ−Ｉ
ｎ−１ｉｎｅ Ｐａｃｋａｇｅ ）型のものもあるが、
パッドとクリップ端子の関係の本質はＤＩＰ型のものと
変わらない。In addition, plastic modules have SIP (Single-I) clip terminals attached to only one side of the board.
There are also n-1ine Package) types,
The essence of the relationship between the pad and the clip terminal is the same as that of the DIP type.
〔従来の技術〕
第４図は従来例におけるプラスチックモジュールの端子
取付は前の斜視図で、（ａ）は基板端部付近、（ｂ）は
クリップ端子である。[Prior Art] FIG. 4 is a perspective view of the front terminal attachment of a plastic module in a conventional example, where (a) shows the vicinity of the end of the board, and (b) shows the clip terminal.
第４図（ａ）は基板端部の一部で断面部１６はパッド２
の中央部の所で切断した断面を示す。FIG. 4(a) shows a part of the edge of the board, and the cross section 16 is the pad 2.
A cross section taken at the center of is shown.
この図において、■はプラスチック製の基板で、３枚の
基板１が、間に接着剤６を挾んで積層され、積層基板１
１を形成する。In this figure, ■ is a plastic substrate, and three substrates 1 are laminated with adhesive 6 in between.
form 1.
積層基板１１の上面と下面には夫々クリップ端子の数だ
けのパッド２が形成されている。このパッド２は基板１
の表面に約２０μｍの銅を下地とし、その上に半田メッ
キなどを施したもので、端面部８の縁より僅か内側に入
った所に形成され、必要に応じ、その基板の内側に形成
した配線と接続される。As many pads 2 as there are clip terminals are formed on the upper and lower surfaces of the laminated substrate 11, respectively. This pad 2 is the substrate 1
The surface of the substrate is coated with approximately 20 μm of copper as a base layer, and solder plating is applied thereon.It is formed slightly inside the edge of the end face portion 8, and may be formed inside the substrate as necessary. Connected to wiring.
また、積層基板１１の中層の基板１にも必要に応じ内層
配線パターン７が形成される。Furthermore, inner layer wiring patterns 7 are formed on the intermediate layer substrate 1 of the laminated substrate 11 as required.
このパッド２には、積層後、基板１のプラスチック部と
共に穿孔したスルーホールが設けられ、このスルーホー
ル表面に銅メツキー半田メッキして連結部５を形成する
ことにより、積層基板１１の上面、下面のパッド２およ
び中層基板１の内層配線パターン７を電気的に接続する
。This pad 2 is provided with a through hole bored together with the plastic part of the board 1 after lamination, and the surface of this through hole is plated with copper metal key solder to form a connecting part 5. The pad 2 and the inner layer wiring pattern 7 of the intermediate layer substrate 1 are electrically connected.
第５図は従来例におけるプラスチックモジュールの端子
取付は後の斜視図である。FIG. 5 is a perspective view showing the terminal attachment of the plastic module in the conventional example.
第４図のようにして形成された、積層基板１１の表面の
パッド２を挟むようにしてクリップ端子３が挿入される
。The clip terminals 3 are inserted so as to sandwich the pads 2 on the surface of the laminated substrate 11 formed as shown in FIG.
この後、半田ディツブによりクリップ端子１１は接着固
定される。Thereafter, the clip terminal 11 is adhesively fixed with solder dips.
個々のモジュール基板は、広い基板にパッド２を形成後
、切断分離して作られるが、端面部８は、このときの切
断面である。この切断のとき、パッド２の端が切断面に
近いので、ストレスを受けて剥がれやすくなり勝ちであ
る。Individual module substrates are made by forming pads 2 on a wide substrate and then cutting and separating them, and the end surface portion 8 is the cut surface at this time. During this cutting, since the edge of the pad 2 is close to the cutting surface, it is likely to be exposed to stress and easily peel off.
更に、クリップ端子３を挿入するとき、このクリップ端
子３の上部クリップ水平片３１および下部クリップ片３
３でパッド２を擦るようになるので、パッド２の端面部
８に近い所が基板１から更にめくれるようになる。Furthermore, when inserting the clip terminal 3, the upper clip horizontal piece 31 and the lower clip piece 3 of this clip terminal 3
3 rubs the pad 2, so that the part of the pad 2 near the end surface 8 is further turned over from the substrate 1.
ここで、クリップ端子３で基板１を挟む場合、基板１が
プラスチックであると、特に基板からパッド２が剥がれ
易い。Here, when the board 1 is held between the clip terminals 3, the pads 2 are particularly likely to be peeled off from the board if the board 1 is made of plastic.
したがって、このようなパッド２に半田付けしたクリッ
プ端子３は、強度的に信頼性充分とは云い難いものであ
る。Therefore, the clip terminal 3 soldered to such a pad 2 cannot be said to have sufficient strength and reliability.
クリップ端子３相互は、端子の先に設けられたタイバー
３４で連結されているが、端子の太さが細いため、クリ
ップ部の相互の間隔が変わりやすくパッド２との相対位
置も狂いやすく、接続に精度の高い治具を使用する等特
別の配慮を必要とする。The clip terminals 3 are connected to each other by a tie bar 34 provided at the tip of the terminal, but because the thickness of the terminal is thin, the mutual spacing between the clip parts is likely to change, and the relative position with the pad 2 is also likely to be distorted, making the connection difficult. special consideration is required, such as using high-precision jigs.
〔発明が解決しようとする問題点〕
従来例のようなパッドを形成した基板では、クリップ端
子接続時、パッドがめくれ易く、基板に対するクリップ
端子の接着強度が低下しやすい。[Problems to be Solved by the Invention] In a board on which a pad is formed as in the conventional example, the pad is easily turned over when a clip terminal is connected, and the adhesive strength of the clip terminal to the board is likely to decrease.
また、クリップ端子の接続位置規制の特別の治具を要す
る。Additionally, a special jig is required to regulate the connection position of the clip terminal.
更に、基板とクリップ端子との接着面積を増やし、クリ
ップ端子の強度の信頼性を向上する。Furthermore, the adhesive area between the board and the clip terminal is increased, and the reliability of the strength of the clip terminal is improved.
上記問題点の解決は、配線パターンを有する基板上に、
回路素子を搭載する回路素子モジュールにおいて、 基
板の端面にサイドノツチを設け、該サイドノツチの窪み
に基板両面上のパッドを連結する金属の連結部が形成さ
れ、該サイドノツチの窪みを通り、基板両面上のパッド
および連結部に接続されるクリップ部をもつ端子を有し
てなる本発明による回路素子モジュールにより達成され
る。To solve the above problem, on the board having the wiring pattern,
In a circuit element module that mounts a circuit element, a side notch is provided on the end surface of the board, and a metal connecting part is formed in the recess of the side notch to connect the pads on both sides of the board, and the metal connecting part that connects the pads on both sides of the board passes through the recess of the side notch and connects the pads on both sides of the board. This is achieved by a circuit element module according to the invention comprising a terminal with a pad and a clip part connected to the coupling part.
回路素子モジュールの基板の端面部にサイドノツチを設
け、このサイドノツチの窪んだ所に基板両面のパッドを
接続する金属の連結部を形成するので、クリップ端子接
続時、パッドがめくれにくくなる。A side notch is provided on the end surface of the substrate of the circuit element module, and a metal connecting part for connecting the pads on both sides of the substrate is formed in the recessed part of the side notch, so that the pads are not easily turned over when connecting clip terminals.
また、クリップ端子は接続時、サイドノツチの窪みによ
り自然と左右の位置規制を受け、位置決めが容易となる
。Furthermore, when connecting the clip terminal, the recess of the side notch naturally restricts the left and right position, making positioning easier.
更に、クリップ端子は基板の上下両表面のパッドおよび
連結部で半田付けされるので、基板に対してのクリップ
端子の接着強度を増加させることが出来る。Furthermore, since the clip terminals are soldered to the pads and connecting portions on both the upper and lower surfaces of the substrate, the adhesive strength of the clip terminals to the substrate can be increased.
第１図は本発明一実施例のプラスチックモジュールの端
子取付は前の斜視図で、（ａ）は基板端部付近、（ｂ）
はクリップ端子である。FIG. 1 is a front perspective view of terminal installation of a plastic module according to an embodiment of the present invention, (a) near the edge of the board, (b)
is a clip terminal.
この図において、第４図と同一対象物は同じ符号で示す
。In this figure, objects that are the same as those in FIG. 4 are designated by the same reference numerals.
第１図（ａ）は基板端部の一部で断面部９はパッド２の
中央部の所で切断した断面を示す。FIG. 1(a) shows a cross section of a part of the edge of the substrate, where a cross section 9 is taken at the center of the pad 2. As shown in FIG.
この図において、■はプラスチック製の基板で、３枚の
基板１が、間に接着剤６を挟んで積層され積層基板１１
を形成している。In this figure, ■ is a plastic board, and three boards 1 are stacked with adhesive 6 in between.
is formed.
積層基板１１の上面と下面には夫々クリップ端子の数だ
けのパッド２が形成されている。このパッド２は基板１
の表面に約２０μｍの銅を下地とし、その上に半田メッ
キなどを施したもので、端面部８の縁に沿って並列して
形成され、必要に応じその基板の内側に形成した配線と
接続される。As many pads 2 as there are clip terminals are formed on the upper and lower surfaces of the laminated substrate 11, respectively. This pad 2 is the substrate 1
The surface of the board is coated with approximately 20 μm of copper as a base layer, and solder plating is applied on top of the copper.The board is formed in parallel along the edge of the end face part 8, and is connected to the wiring formed inside the board as necessary. be done.
また、積層した中間の基板１にも必要に応じ内層配線パ
ターン７が形成される。Furthermore, an inner layer wiring pattern 7 is formed on the laminated intermediate substrate 1 as necessary.
このようにパッド２を形成した基板１を積層した後、端
面部８にサイドノツチ４の半円形の窪みを設けて、この
サイドノツチ４の部分に銅メツキー半田メッキして連結
部５を形成する。これにより、上部基板ｌの上面、下部
基板の下面のパッド２および中層の基板１の内層配線パ
ターン７が電気的に接続される。After the substrates 1 having the pads 2 formed thereon are laminated, a semicircular recess of a side notch 4 is provided in the end face portion 8, and a connecting portion 5 is formed by plating the side notch 4 with copper metal key solder. Thereby, the upper surface of the upper substrate l, the pad 2 on the lower surface of the lower substrate, and the inner layer wiring pattern 7 of the intermediate layer substrate 1 are electrically connected.
第２図は本発明一実施例のプラスチックモジュールの端
子取付は後の斜視図であ。FIG. 2 is a perspective view of a plastic module according to an embodiment of the present invention after terminal attachment.
前記、第１図の積層基板１１の表面のパッド２を挟むよ
うにしてクリップ端子３が接続される。The clip terminals 3 are connected to sandwich the pads 2 on the surface of the multilayer substrate 11 shown in FIG. 1.
ついで、半田ディツプによりクリップ端子３の半田付け
が行われる。Next, the clip terminals 3 are soldered using a solder dip.
このとき、クリップ端子３の接続は、積層基板上１の端
面部８には半円筒形の富みをもつ連結部５があるため、
クリップ端子３の上部クリップ垂直片３２が、この窪み
に入るように接続される。At this time, the connection of the clip terminal 3 is performed because there is a connecting part 5 having a semi-cylindrical shape on the end surface part 8 of the laminated board 1.
The upper clip vertical piece 32 of the clip terminal 3 is connected to fit into this recess.
したがって、クリップ端子３の接続時の左右の位置決め
は、窪みによって自動的に行われるので挿入が容易とな
る。Therefore, the left and right positioning of the clip terminal 3 during connection is automatically performed by the recesses, making insertion easy.
クリップ端子３の半田付けは、上部クリップ水平片３１
、下部クリップ片３３と、積層基板１１の上下両面のパ
ッド２とが、また上部クリップ垂直片３２と連結部５と
が夫々半田付けされるので、半田付は接着面積が増加し
、接着強度が増加する。To solder the clip terminal 3, attach the upper clip horizontal piece 31.
Since the lower clip piece 33 and the pads 2 on both the upper and lower surfaces of the laminated board 11 are soldered, and the upper clip vertical piece 32 and the connecting part 5 are soldered, the bonding area increases and the bonding strength increases. To increase.
また、クリップ端子接続時、積層基板１１の表面上のパ
ッド２は連結部５により結合されているので、クリップ
端子のクリップ部が擦ってもめくれることがない。Further, when the clip terminals are connected, the pads 2 on the surface of the multilayer substrate 11 are connected by the connecting portions 5, so that the clip portions of the clip terminals do not turn over even if rubbed.
従来のものは、スルーホールをつくって、これにより連
結部５を形成していたが、本実施例のものは、基板サイ
ドノツチ部へ連結部５の形成しているため、パッド２と
の接合面積を大きくすることが出来る。 即ち、従来の
ものは多くのものが０．５ｍｍ程度の直径のスルーホー
ルにより連結部５を形成していたが、本実施例のものは
、サイドノツチ４の窪みの半円形の半径を０．５〜０．
７５１Ｉｕｎ程度と大きくすることが出来、パターン配
線との接合信頬度をより一層向上することが出来る。In the conventional device, a through hole is made and the connecting portion 5 is formed by this, but in this example, the connecting portion 5 is formed in the board side notch, so the bonding area with the pad 2 is reduced. can be made larger. That is, in many conventional devices, the connecting portion 5 is formed by a through hole with a diameter of about 0.5 mm, but in this embodiment, the radius of the semicircle of the recess of the side notch 4 is 0.5 mm. ~0.
It can be made as large as about 751 Iun, and the degree of bonding with pattern wiring can be further improved.
本実施例のモジュールにけるサイドノツチの形成の一つ
の方法としては、広い面積の基板にパッドを形成し、こ
れを積層した後、直径０．５〜０．７５ｍｍのスルーホ
ー１ルを穿孔し、これに銅メツキー半田メッキして、ス
ルーホールの真中で積層基板を切断分離して形成する方
法がある。このときの切断面が端面部８となる。積層基
板の切断時、端面部８に近いところのパッド２および連
結部５に多少のめくれが発生するも、クリップ端子３を
接続し半田付けする部分からは離れており、また、スル
ーホール径も大きいのでメッキ品質もよくなり、接合信
頗度は向上する。One method for forming the side notches in the module of this example is to form pads on a wide area substrate, stack them, and then drill a through hole with a diameter of 0.5 to 0.75 mm. There is a method in which the multilayer board is formed by plating with copper metal key solder and cutting and separating the laminated board in the middle of the through hole. The cut surface at this time becomes the end surface portion 8. When cutting the laminated board, some curling occurs in the pad 2 and the connecting part 5 near the end face part 8, but it is far from the part where the clip terminal 3 is connected and soldered, and the through hole diameter is also small. Since it is larger, the plating quality is also better and the joint reliability is improved.
尚、本実施例ではプラスチックの基板を用いるモジュー
ルについて説明したが、本発明はセラミック等を基板に
用いる場合でも適用出来る。Although this embodiment describes a module using a plastic substrate, the present invention can also be applied to a case where a ceramic or the like is used for the substrate.
端面部の窪みによりクリップ端子の位置決めが出来、接
続が容易となる。クリップ端子はパッド、連結部と半田
付けするので接着面積が増加し、接合強度が増加する。The recess in the end surface allows positioning of the clip terminal, making connection easier. Since the clip terminal is soldered to the pad and connecting portion, the bonding area increases and the bonding strength increases.
クリップ端子接続時のパッドのめ（れがなくなる。さら
に、連結部の面積大となりパターン配線との接合信顛度
が向上する。There is no pad misalignment when connecting clip terminals.Furthermore, the area of the connecting portion is increased, improving the connection reliability with pattern wiring.
パッドは擦ってもめくれることがない。The pad will not peel up even if you rub it.
第１図は本発明一実施例のプラスチックモジュールの端
子取付は前の斜視図で、（ａ）は基板端部付近、（ｂ）
はクリ・７ブ端子、
第２図は本発明一実施例のプラスチックモジュールの端
子取付は後の斜視図、
第３図はＤＩＰ型プラプラスチックモジュール略を示す
斜視図、
第４図は従来例におけるプラスチックモジュールの端子
取付は前の斜視図で、（ａ）は基板端部付近、（ｂ）は
クリップ端子・
第５図は従来例におけるプラスチックモジュールの端子
取付は後の斜視図である。
これら図において、
１は基板、
２はパッド、
３はクリップ端子、
４はサイドノツチ、
５は連結部、
６は接着剤、
７は内層配線パターン、
１１は積層基板、
８は端面部、
９は断面部、
３１は上部クリップ水平片、
３２は上部クリップ垂直片、
３３は下部クリップ片
（ｂ）クリ・ｌブダ嶋ジ
オ（治ト日月−突先伊１１°う又子・・、７ｔジユー２
し刀ブ皓チＭ灸イ４１プ豹め斬蜆回
８１ 日
本沁明−史扼伴・ｊめプラス千・ソフ七シトルの鳩チに
イボ１フれしカ羽現口
も ２ 図
示す斬履口
第 ３ 図
看ｒ、刃（イン・ｊに・Ｊ３１するプラス千・ソ２（−
ジ’ｚ−）しの立ボビト万ズイ１′ｆＥｔ力滞呼ネ活図
第 ４ｉ
イ芝釆停・１１；お１１ろプラス千・ンフモジ゛ニール
／１１）漏子１又ｆｌ゛ブイｔめオを羽り目
躬 ５ 図FIG. 1 is a front perspective view of terminal installation of a plastic module according to an embodiment of the present invention, (a) near the edge of the board, (b)
Figure 2 is a rear perspective view of the terminal installation of a plastic module according to one embodiment of the present invention, Figure 3 is a perspective view showing a DIP type plastic module, and Figure 4 is a conventional example. A front perspective view of terminal attachment on a plastic module; (a) near the edge of the board; (b) a clip terminal; FIG. 5 is a rear perspective view of terminal attachment on a plastic module in a conventional example. In these figures, 1 is a board, 2 is a pad, 3 is a clip terminal, 4 is a side notch, 5 is a connecting portion, 6 is an adhesive, 7 is an inner layer wiring pattern, 11 is a laminated board, 8 is an end surface, and 9 is a cross section Part, 31 is the upper clip horizontal piece, 32 is the upper clip vertical piece, 33 is the lower clip piece (b) Kuri・L Budajima Geo (Jito Sun Moon - Tip I 11° Umatako..., 7t Jyu 2
Shitobu Hakuchi M Moxibustion I 41 Pu Leopard Zanshi 81 Nihon Qimming-shi 扼迹 jme plus 1000 soph 7 Shituru's Hatochi and Ibo 1 Fureshika Hagenguchi also 2 Illustrations of Zan 3rd figure, blade (in, j, J31, plus 1,000, so, 2 (-
Ji'z-) Shin's Standing Bobbit Manzui 1'fEt Force Stagnation Negative Diagram No. 4i A Shiba Tank Stop・11; Figure 5
Claims (1)
載する回路素子モジュールにおいて、基板（１）の端面
にサイドノッチ（４）を設け、該サイドノッチ（４）の
窪みに基板（１）再面上のパッド（２）を連結する金属
の連結部（５）が形成され、 該サイドノッチ（４）の窪みを通り、基板（１）両面上
のパッドおよび連結部（５）に接続されるクリップ部を
もつ端子（３）を有してなる ことを特徴とする回路素子モジュール。[Claims] In a circuit element module in which a circuit element is mounted on a substrate (1) having a wiring pattern, a side notch (4) is provided on the end surface of the substrate (1), and a depression in the side notch (4) is provided. A metal connecting part (5) is formed to connect the pad (2) on the surface of the substrate (1), and the metal connecting part (5) passes through the recess of the side notch (4) and connects the pad and the connecting part (2) on both sides of the substrate (1). 5) A circuit element module comprising a terminal (3) having a clip portion connected to the terminal (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1041987A JPS63178553A (en) | 1987-01-20 | 1987-01-20 | Circuit element module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1041987A JPS63178553A (en) | 1987-01-20 | 1987-01-20 | Circuit element module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63178553A true JPS63178553A (en) | 1988-07-22 |
Family
ID=11749627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1041987A Pending JPS63178553A (en) | 1987-01-20 | 1987-01-20 | Circuit element module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63178553A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06166212A (en) * | 1992-11-30 | 1994-06-14 | Kyocera Corp | Image device |
| JPH07263615A (en) * | 1995-02-23 | 1995-10-13 | Ngk Spark Plug Co Ltd | Integrated circuit package and connecting member |
-
1987
- 1987-01-20 JP JP1041987A patent/JPS63178553A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06166212A (en) * | 1992-11-30 | 1994-06-14 | Kyocera Corp | Image device |
| JPH07263615A (en) * | 1995-02-23 | 1995-10-13 | Ngk Spark Plug Co Ltd | Integrated circuit package and connecting member |
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