JPS63172136U - - Google Patents
Info
- Publication number
- JPS63172136U JPS63172136U JP6565187U JP6565187U JPS63172136U JP S63172136 U JPS63172136 U JP S63172136U JP 6565187 U JP6565187 U JP 6565187U JP 6565187 U JP6565187 U JP 6565187U JP S63172136 U JPS63172136 U JP S63172136U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- small
- board
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000012212 insulator Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は、本考案による半導体パツケージの断
面図、第２図は第１図の半導体パツケージの底面
図である。 １……半導体パツケージの絶縁体、２……突起
、３……金属メツキ面。
面図、第２図は第１図の半導体パツケージの底面
図である。 １……半導体パツケージの絶縁体、２……突起
、３……金属メツキ面。
Claims (1)
- ケースや基板等の上にはんだ付けされる面と、
この面に設けた少なくとも３つの小さな突起とを
有することを特徴とする小形半導体パツケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6565187U JPS63172136U (ja) | 1987-04-28 | 1987-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6565187U JPS63172136U (ja) | 1987-04-28 | 1987-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63172136U true JPS63172136U (ja) | 1988-11-09 |
Family
ID=30902923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6565187U Pending JPS63172136U (ja) | 1987-04-28 | 1987-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63172136U (ja) |
-
1987
- 1987-04-28 JP JP6565187U patent/JPS63172136U/ja active Pending