JPS63170282A - Joining method - Google Patents
Joining methodInfo
- Publication number
- JPS63170282A JPS63170282A JP40087A JP40087A JPS63170282A JP S63170282 A JPS63170282 A JP S63170282A JP 40087 A JP40087 A JP 40087A JP 40087 A JP40087 A JP 40087A JP S63170282 A JPS63170282 A JP S63170282A
- Authority
- JP
- Japan
- Prior art keywords
- materials
- insert
- joining
- joined
- insert material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005304 joining Methods 0.000 title claims description 16
- 238000000034 method Methods 0.000 title claims description 15
- 239000000463 material Substances 0.000 claims description 49
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 7
- 150000002739 metals Chemical class 0.000 claims description 5
- 230000003213 activating effect Effects 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000001659 ion-beam spectroscopy Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Ceramic Products (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は金属やセラミックスなどを接合する方法に係シ
、特に多層構造体を作成するのく好適な接合方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of joining metals, ceramics, etc., and particularly to a joining method suitable for creating a multilayer structure.
金属やセラミックスなどからなる多層構造体を接合によ
って作成する方法として、従来は後の工程になるに従い
、順次融点の低めインサート材を用いて接合する方法が
採用されてきた。しかし被接合体の耐熱性、接合部強度
や耐食性などの観点から、使用可能なインサート材が制
限されることが多く、多層構造体における層の積み重ね
数に限度が生じていた。これに対処する方法として特開
昭５０−４４９４７号に記載のように、接合部の再溶融
温度を接合温度よシも高くする方法がある。Conventionally, as a method for creating a multilayer structure made of metals, ceramics, etc. by bonding, a method has been adopted in which insert materials with lower melting points are sequentially bonded in later steps. However, from the viewpoint of heat resistance, joint strength, corrosion resistance, etc. of the objects to be joined, usable insert materials are often limited, and there is a limit to the number of stacked layers in a multilayer structure. As a method for dealing with this, there is a method of increasing the remelting temperature of the joint part to a higher temperature than the joining temperature, as described in Japanese Patent Laid-Open No. 50-44947.
上記従来技術では、セラミックスの接合については考慮
されておらず％ま九使用するインサート材によってはフ
ラックスを必要とするなどの問題があった。 □
本発明の目的は、接合部の再溶融温度が接合温度よシも
高くなる接合方法において、金属やセラミックスなどを
７ラツクスを用いずに接合することＫるる。The above-mentioned conventional technology does not take into account the bonding of ceramics, and there are problems such as the need for flux depending on the insert material used. □ An object of the present invention is to bond metals, ceramics, etc. without using 7 lux in a bonding method in which the remelting temperature of the bonded portion is higher than the bonding temperature.
ｃ問題点を解決するための手段〕
上記目的は、インサート材として融点の異なる複数の金
属インサート材を組み合わせたものを被接合材間に挿入
し１粒子ビームによって被接合材及びインサート材の接
合表面を活性化したのち密着化し、かつ密着化前あるい
は後にインサート材中の接合面に接している金属インサ
ート材のみが溶融する温度範囲にて加熱することにより
達成される。c) Means for Solving Problems] The above purpose is to insert a combination of multiple metal insert materials with different melting points as insert materials between the materials to be joined, and to apply a single particle beam to the joining surfaces of the materials to be joined and the insert materials. This is accomplished by activating the metal insert, bonding it, and heating it in a temperature range that melts only the metal insert material that is in contact with the joint surface of the insert material before or after bonding.
接合面を粒子ビームによって清浄化・活性化することに
より、接合面に形成されている酸化膜や汚染物質が除去
され、被接合材及びインサート材の新生面が露出する。By cleaning and activating the bonding surface with a particle beam, oxide films and contaminants formed on the bonding surface are removed, and new surfaces of the materials to be bonded and the insert material are exposed.
これらを密着させれば、新生面相互が接触するため、反
応が十分に進行し。If these are brought into close contact, the new surfaces will come into contact with each other, allowing the reaction to proceed sufficiently.
７ラツクスなしに強固な接合部を得ることができる。A strong joint can be obtained without 7 lux.
以下、本発明の一実施例を第１図により説明する。 An embodiment of the present invention will be described below with reference to FIG.
第１図は本実施例の正面図であシ１図示された装置は１
図示しない真空容器内に設置されている。Figure 1 is a front view of this embodiment.
It is installed in a vacuum container (not shown).
接合にあたっては、まず、銅製被接合材５０表面に融点
の異なるインサート材を組み合わせたインサート材４を
メッキあるいはイオンビームスパッタリング等の手法を
用いて配置する。このとき、インサート材４０嵌面が接
合温度にて液相となるような材料選定を行うことが必要
である。このインサート材４を配置した被接合材５とア
ルミナ族 □被接合材３とを接合治具６，７及び２に
取り付け。For joining, first, the insert material 4, which is a combination of insert materials having different melting points, is placed on the surface of the copper material to be joined 50 using a technique such as plating or ion beam sputtering. At this time, it is necessary to select a material such that the insert material 40 fitting surface becomes a liquid phase at the bonding temperature. The material to be welded 5 with the insert material 4 arranged thereon and the alumina group material 3 to be welded are attached to the welding jigs 6, 7 and 2.
図示しない排気装置によって雰囲気圧力を約１０−”’
ｌ’ｏｒｒとする。次にインサート材４及び被接合材３
の表面をイオンガン１によって清浄化・活性化し、接合
治具２を降下させ、インサート材４及び被接合材３を密
着させる。さらにヒータ８を用いてインサート材の接合
面に接する部分のみが液相となる温度範囲にて加熱すれ
ば、インサート材４及び被接合材３の表面は清浄化・活
性化されておシ、かつインサート材４０表面が溶融して
いるので、インサート材４と被接合材３との間で容易に
灰地が生じ、加熱を続行すればインサート材は該インサ
ート材中での固液相間拡散によって等温凝固し、強固な
接合が得られる。本実施例では、インサート材４を被接
合材５０表面に予め配置したが１両方の被接合材の表面
に配置してもよく、またインサート材のみを別途作成し
、接合時に被接合材間に挿入する方法をとってもよい。The atmospheric pressure is reduced to approximately 10-"' by an exhaust device (not shown).
Let it be l'orr. Next, the insert material 4 and the material to be joined 3
The surface of the bonding member is cleaned and activated by the ion gun 1, and the welding jig 2 is lowered to bring the insert material 4 and the material to be welded 3 into close contact with each other. Furthermore, if the heater 8 is used to heat the insert material in a temperature range where only the portion in contact with the joining surface becomes liquid, the surfaces of the insert material 4 and the material to be joined 3 will be cleaned and activated, and Since the surface of the insert material 40 is molten, a gray area easily forms between the insert material 4 and the material to be joined 3, and if heating is continued, the insert material will dissipate due to solid-liquid phase diffusion within the insert material. It solidifies isothermally and provides a strong bond. In this embodiment, the insert material 4 is placed in advance on the surface of the material to be joined 50, but it may be placed on the surfaces of both materials to be joined. Alternatively, only the insert material may be prepared separately and placed between the materials to be joined at the time of joining. You may also use the method of insertion.
また、イオンガンによって接合面を清浄化・活性化する
際の雰囲気圧力は、被接合材３及びインサート材４の材
料によっては１０°”ｌ’ｏｒｒＱ度であっても接合が
可能である。Further, depending on the materials of the materials to be joined 3 and the insert material 4, joining can be performed even if the atmospheric pressure when cleaning and activating the joining surfaces with an ion gun is 10°"l'orrQ degrees.
末完！によれば、セラミックスにメタライズ処理を施す
ことなく、ま九フラックスを用−ることなく、再溶融温
度が接合温度よ〕も高いセラミックス及び金属の接合が
可能であるので、メタライズ処理を省略することによる
コストダウン及び７ラツクスを用いないことによる接合
部の長期信頼性の向上が実現できる。Finished! According to this method, it is possible to join ceramics and metals whose remelting temperature is higher than the bonding temperature without metalizing the ceramics or using flux, so the metallizing process can be omitted. It is possible to realize cost reduction by this method and improvement of long-term reliability of the joint by not using 7 lux.
第１図は本発明の一実施例を示す正面図である。
１・・・イオンガン、２・・・接合治具、３・・・被接
合材。FIG. 1 is a front view showing an embodiment of the present invention. 1... Ion gun, 2... Joining jig, 3... Material to be joined.
Claims (1)
する方法において、インサート材として融点の異なる複
数の金属インサート材を組み合わせたものを被接合材間
に挿入し、粒子ビームによつて被接合材及びインサート
材の接合表面を活性化したのち密着化し、かつ密着化前
あるいは後にインサート材中の接合面に接している金属
インサート材のみが溶融する温度範囲にて加熱すること
を特徴とする接合方法。1. In a method of joining metals and ceramics using insert materials, a combination of multiple metal insert materials with different melting points is inserted between the materials to be joined as the insert material, and the materials to be joined and the insert are bonded using a particle beam. A joining method characterized by activating the joining surfaces of the materials, bringing them into close contact, and heating in a temperature range such that only the metal insert material in contact with the joining surface in the insert material melts before or after joining.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40087A JPS63170282A (en) | 1987-01-07 | 1987-01-07 | Joining method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40087A JPS63170282A (en) | 1987-01-07 | 1987-01-07 | Joining method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63170282A true JPS63170282A (en) | 1988-07-14 |
Family
ID=11472751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP40087A Pending JPS63170282A (en) | 1987-01-07 | 1987-01-07 | Joining method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63170282A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0375277A (en) * | 1989-04-28 | 1991-03-29 | Hitachi Ltd | Method and device for bonding |
| US5188280A (en) * | 1989-04-28 | 1993-02-23 | Hitachi Ltd. | Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals |
-
1987
- 1987-01-07 JP JP40087A patent/JPS63170282A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0375277A (en) * | 1989-04-28 | 1991-03-29 | Hitachi Ltd | Method and device for bonding |
| US5188280A (en) * | 1989-04-28 | 1993-02-23 | Hitachi Ltd. | Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals |
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