JPS63160779A - Energy beam cutting and piercing method - Google Patents
Energy beam cutting and piercing methodInfo
- Publication number
- JPS63160779A JPS63160779A JP61309580A JP30958086A JPS63160779A JP S63160779 A JPS63160779 A JP S63160779A JP 61309580 A JP61309580 A JP 61309580A JP 30958086 A JP30958086 A JP 30958086A JP S63160779 A JPS63160779 A JP S63160779A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- energy beam
- cutting
- mirror
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000005553 drilling Methods 0.000 claims description 20
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 238000003754 machining Methods 0.000 abstract 3
- 230000000694 effects Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野」
この発明は、レーザビームなどのエネルギービームによ
る切断・穿孔方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a cutting and drilling method using an energy beam such as a laser beam.
第４図（ａ）は、従来のレーザビームによる可断・穿孔
方法を示す図で１図において、（１）はシーザ発損器、
（２）はレーザビーム、（３１は集光レンズ、（４）は
切断又は穿孔する被加工物、（６）は被加工物（４）は
めけられた孔、（７）はかえりである。FIG. 4(a) is a diagram showing a conventional cutting/perforating method using a laser beam. In FIG. 1, (1) is a Caesar oscillator,
(2) is a laser beam, (31 is a condenser lens, (4) is a workpiece to be cut or drilled, (6) is a hole fitted in the workpiece (4), and (7) is a burr.
次に動作について説明する。例どば穿孔の場合レーザ発
振器（１）から一方向に平行に放射されたレーザビーム
（２）を集光レンズ（３）で被加工物の表面に集光し、
高密度のエネルギーで被加工物（４）に孔（６）をあけ
る。しかし、このような方法で＃−ｉ、孔あけの際のレ
ーザビーム（２）により蒸発しきれなかっ几ものが、孔
（６）の周辺にいわゆるかえり（７）となって付着し、
またかえり（７）の他に。Next, the operation will be explained. For example, in the case of drilling, a laser beam (2) is emitted parallel to one direction from a laser oscillator (1) and is focused on the surface of the workpiece using a condensing lens (3).
A hole (6) is made in the workpiece (4) using high-density energy. However, with this method #-i, the solids that were not completely evaporated by the laser beam (2) during drilling adhered to the periphery of the hole (6) as so-called burrs (7).
Besides Matakaeri (7).
テーパができる。即ち孔（６）の入口が大きく、中へい
くほど小さくなるという不都合が生じ友。Taper is possible. That is, the entrance of the hole (6) is large and becomes smaller as it goes deeper into the hole, which is an inconvenience.
そこでこの不都合をｐｓ消するため、第４図（６）に示
したような方法が９例えば特公昭５９−４０５５２号公
報で提案された。図において（８）は被加工物（４）の
表面に形成された硬化処理層である。このようにすると
、かえり（７）の発生と表面孔径の拡大を若干抑制でき
るが、孔内部のテーパを抑制することはできなかった。In order to eliminate this inconvenience, a method as shown in FIG. 4 (6) was proposed, for example, in Japanese Patent Publication No. 59-40552. In the figure, (8) is a hardened layer formed on the surface of the workpiece (4). In this way, the occurrence of burrs (7) and the expansion of the surface pore diameter could be somewhat suppressed, but the taper inside the pores could not be suppressed.
さらにテーパを抑制する拳法として、ビームの焦点位置
を加工中に制御する方法が一般に用いられているが、こ
の方法では被加工物（４）にビームを照射する時間が長
くなるなど、投入される熱量が大きくなる。Furthermore, as a method to suppress taper, a method is generally used in which the focal position of the beam is controlled during processing, but this method requires a longer time to irradiate the workpiece (4) with the beam, etc. The amount of heat increases.
〔発明が解決しようとする問題点）
以上のように、従来のエネルギービーム切断・穿孔方法
では、切断面又は孔にテーパがつくか、テーパがつかな
いストレートな状態に切断又は穿孔するには投入熱量が
大きくなるという問題点がめった。このことは、特に被
加工物が厚板材料や高分子材料、複合材料である時に大
きな問題となってい友。[Problems to be Solved by the Invention] As described above, in the conventional energy beam cutting/drilling method, either the cutting surface or the hole is tapered, or the cut surface or the hole is not tapered and cutting or drilling is done in a straight state. The problem was that the amount of heat increased. This becomes a big problem, especially when the workpiece is a thick plate material, polymer material, or composite material.
この発明は１以上のような問題点を解消するためになさ
れたもので、テーパのつかないストレートな切断面又は
孔が優られる投入熱量の少ないエネルギービーム切断・
穿孔方法を提供することを目的としている。This invention was made in order to solve one or more of the problems, and it is an energy beam cutting method that requires less heat input and has a straight cut surface or hole without a taper.
The purpose is to provide a drilling method.
この発明に係るエネルギービーム切断・穿孔方法は、エ
ネルギービームを被加工物の両面から照射して、切断又
は穿孔するようにしたものである。In the energy beam cutting/drilling method according to the present invention, an energy beam is irradiated from both sides of a workpiece to cut or perforate the workpiece.
この発明におけるエネルギービーム切断・穿孔方法では
、エネルギービームを被加工物の表・裏画面より照射し
て切断又は穿孔するので。In the energy beam cutting/drilling method according to the present invention, the energy beam is irradiated from the front and back surfaces of the workpiece to cut or perforate the workpiece.
切断面又は孔のテーパがほとんど無く、かつ投入熱量が
少なくて済む。There is almost no taper in the cut surface or hole, and the amount of heat input is small.
以下、この発明の一実施例のエネルギービーム切断・穿
孔方法を図を用いて説明する。第１図（ａ）、 （ｂ）
、 （Ｃ）はこの発明の一実施例のエネルギービーム切
断・穿孔方法の穿孔の場合を工程順に示す被加工物の拡
大断面図で、第１図（、）において（１）はまず被加工
物（４）の表面側から照射されたエネルギービーム、こ
の場合レーザビームにより形成された表面孔、第１図（
ｂ）において、＠はさらに被加工物（４）の裏面側から
照射されたレーザビームにより形成された裏面孔であり
、第１図（ｃ）において、（２）は貫通した孔である。DESCRIPTION OF THE PREFERRED EMBODIMENTS An energy beam cutting/drilling method according to an embodiment of the present invention will be described below with reference to the drawings. Figure 1 (a), (b)
, (C) is an enlarged cross-sectional view of a workpiece showing the process order of drilling in the energy beam cutting/drilling method according to an embodiment of the present invention. (4) Surface hole formed by an energy beam irradiated from the surface side, in this case a laser beam, Fig. 1 (
In b), @ is a back hole formed by a laser beam irradiated from the back side of the workpiece (4), and in FIG. 1(c), (2) is a penetrating hole.
第１図に示したように、被加工物（４）の表裏両面から
エネルギービームを照射することにより、はぼテーパの
無い真直な孔をあけることができる。As shown in FIG. 1, by irradiating the energy beam from both the front and back surfaces of the workpiece (4), a straight hole without any taper can be made.
またエネルギービームの焦点位置を加工中に特に制御す
る必要が無いためビームの照射エネルギーも増加しない
。厚板材料、高分子材料。Furthermore, since there is no need to particularly control the focal position of the energy beam during processing, the irradiation energy of the beam does not increase. Plate materials, polymer materials.
複合材料に対しても、はとんど変質させずにテーパの少
ない孔あけができる。ここで、エネルギービームとして
、レーザビームだけでなく。Even in composite materials, it is possible to drill holes with little taper without causing any deterioration. Here, as an energy beam, not only a laser beam.
例えば電子ビームでも同様の加工ができる。For example, similar processing can be performed using an electron beam.
また第２図には、第１図に示したエネルギービーム切断
・穿孔方法を行うための具体的なエネルギービーム切断
・穿孔装置の一例を示す。Further, FIG. 2 shows an example of a specific energy beam cutting/drilling apparatus for carrying out the energy beam cutting/drilling method shown in FIG. 1.
図において、（９）はレーザビームを折り曲げるための
反射鏡、（７）はビーム分岐用ミラー、ＯＤはビーム分
岐用ミラーを切り換えるための駆動用モータ、３３は被
加工物（４）を貫通したビームを吸収させる之めのビー
ムダンパでるる。第３図は第２図に示したビーム分岐用
ミラー（７）の斜視図で、（ト）はビーム反射部、Ｇｌ
はビーム通過部でろる。被加工物（４）をはさんで対向
するように集光レンズ（３）を含む２つの加工ヘッドを
配置する。レーザ発振６（ｌ）から発したレーザビーム
（２）がビーム分岐用ミラー■で第１の方向（２，、）
またに第２の方向（２ｂ）に切り換えられ９反射鏡（９
）により。In the figure, (9) is a reflecting mirror for bending the laser beam, (7) is a beam splitting mirror, OD is a drive motor for switching the beam splitting mirror, and 33 is a mirror that penetrates the workpiece (4). Ruru is a beam damper that absorbs the beam. FIG. 3 is a perspective view of the beam splitting mirror (7) shown in FIG.
The beam passes through the area. Two processing heads including condensing lenses (3) are arranged so as to face each other with a workpiece (4) in between. The laser beam (2) emitted from the laser oscillation 6 (l) is directed in the first direction (2,,) by the beam splitting mirror ■.
It is also switched to the second direction (2b) and the 9 reflecting mirror (9
) by.
それぞれ集光レンズに導ひかれ、被加工物（４）の表面
又は裏面からレーザビームを照射することができる。ビ
ーム分岐用ミラー（１）は第３図に示したように、ビー
ム反射部（至）とビーム通過部（至）で構成され、その
裏面も被加工物（４）を貫通したレーザビームを反射さ
せるためにミラーとなっている。すなわち、被加工物（
４）を貫通したレーザビームは、すべてビームダンパ（
至）へ導ひかれるので０貫通したビームが発根器へ戻り
、損傷を与えるといった心配は無い。Each laser beam can be guided by a condenser lens and irradiated from the front or back surface of the workpiece (4). As shown in Figure 3, the beam branching mirror (1) is composed of a beam reflecting part (to) and a beam passing part (to), and its back surface also reflects the laser beam that has passed through the workpiece (4). It is a mirror to make it look like this. In other words, the workpiece (
4) All laser beams that have passed through the beam damper (
Since the beam is guided to 0), there is no need to worry about the beam that has penetrated 0 returning to the rooting machine and causing damage.
なお、エネルギービーム切断・穿孔装置は上記の例に限
定されるものではない。Note that the energy beam cutting/drilling device is not limited to the above example.
また、上記実施例ではエネルギービームによる穿孔の場
合について述べたが、折断の場合もｒｌ’ｒ１様の効果
を奏するものである。Further, in the above embodiment, the case of perforation using an energy beam has been described, but the effect similar to rl'r1 can also be obtained in the case of breaking.
以上のように、この発明によればエネルギービームを被
加工物に照射して、上記被加工物を切断又は穿孔するも
のにおいて、上記エネルギービームを被加工物の両面か
ら照射して、切断又は穿孔するようにしたので、テーパ
のほとんどない切断面又は孔が、少ない投入熱量で得ら
れ、熱変質が起こりにくいエネルギービーム切断・穿孔
方法が得られる効果がある。As described above, according to the present invention, in an apparatus for cutting or perforating a workpiece by irradiating the workpiece with an energy beam, the energy beam is irradiated from both sides of the workpiece to cut or perforate the workpiece. As a result, a cut surface or a hole with almost no taper can be obtained with a small amount of input heat, and an energy beam cutting/drilling method that is less likely to cause thermal alteration can be obtained.
第１図（ａ）、 （ｂ）、 （ｃ）は、この発明の一実
施例のエネルギービーム切断・穿孔方法を工程順に示す
断面図、第２図は第１図に示したエネルギービーム切断
・穿孔方法を実現するための装置の一例を示す構成図、
！＠３図は第２図に示した装置に係るビーム分岐ミラー
の一例を示す斜視図、第４図（ａｌ、 （ｂ）はそれぞ
れ従来のエネルギービーム切断・穿孔方法を示す断面図
である。
（１）・・・レーザ発振器、Ｃ２）・・・レーザビーム
、（３）・・・集光レンズ、（４）・・・被加工物、＠
・・・孔なお１図中同一符号は同−又は相当部分を示す
。FIGS. 1(a), (b), and (c) are cross-sectional views showing the energy beam cutting/drilling method according to an embodiment of the present invention in the order of steps, and FIG. 2 is the energy beam cutting/drilling method shown in FIG. A configuration diagram showing an example of a device for realizing the drilling method,
! @ Figure 3 is a perspective view showing an example of the beam branching mirror according to the device shown in Figure 2, and Figures 4 (al) and (b) are cross-sectional views showing the conventional energy beam cutting and drilling method. ( 1)...Laser oscillator, C2)...Laser beam, (3)...Condensing lens, (4)...Workpiece, @
. . . Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
を切断又は穿孔するものにおいて、上記エネルギービー
ムを被加工物の両面から照射して、切断又は穿孔するよ
うにしたエネルギービーム切断・穿孔方法。An energy beam cutting/drilling method for cutting or perforating a workpiece by irradiating the workpiece with an energy beam, wherein the energy beam is irradiated from both sides of the workpiece to cut or perforate the workpiece. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61309580A JPS63160779A (en) | 1986-12-24 | 1986-12-24 | Energy beam cutting and piercing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61309580A JPS63160779A (en) | 1986-12-24 | 1986-12-24 | Energy beam cutting and piercing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63160779A true JPS63160779A (en) | 1988-07-04 |
Family
ID=17994741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61309580A Pending JPS63160779A (en) | 1986-12-24 | 1986-12-24 | Energy beam cutting and piercing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63160779A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6693201B1 (en) * | 1998-09-08 | 2004-02-17 | The Regents Of The University Of California | Fluorescent photochromic fulgides, particularly for optical memories |
| JP2004533932A (en) * | 2001-07-02 | 2004-11-11 | バーテック レーザー システムズ、インク | Method for forming opening by heating in hard non-metallic substrate |
| JP2006176403A (en) * | 2000-12-15 | 2006-07-06 | Lzh Laserzentrum Hannover Ev | Method of starting cut zone |
| JP2010082631A (en) * | 2008-09-29 | 2010-04-15 | Hitachi Via Mechanics Ltd | Laser processing apparatus |
| US20130269354A1 (en) * | 2010-10-29 | 2013-10-17 | General Electric Company | Substrate with Shaped Cooling Holes and Methods of Manufacture |
| JPWO2020245956A1 (en) * | 2019-06-05 | 2020-12-10 |
-
1986
- 1986-12-24 JP JP61309580A patent/JPS63160779A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6693201B1 (en) * | 1998-09-08 | 2004-02-17 | The Regents Of The University Of California | Fluorescent photochromic fulgides, particularly for optical memories |
| JP2006176403A (en) * | 2000-12-15 | 2006-07-06 | Lzh Laserzentrum Hannover Ev | Method of starting cut zone |
| JP2004533932A (en) * | 2001-07-02 | 2004-11-11 | バーテック レーザー システムズ、インク | Method for forming opening by heating in hard non-metallic substrate |
| JP2010082631A (en) * | 2008-09-29 | 2010-04-15 | Hitachi Via Mechanics Ltd | Laser processing apparatus |
| US20130269354A1 (en) * | 2010-10-29 | 2013-10-17 | General Electric Company | Substrate with Shaped Cooling Holes and Methods of Manufacture |
| US9696035B2 (en) * | 2010-10-29 | 2017-07-04 | General Electric Company | Method of forming a cooling hole by laser drilling |
| JPWO2020245956A1 (en) * | 2019-06-05 | 2020-12-10 | ||
| WO2020245956A1 (en) * | 2019-06-05 | 2020-12-10 | 三菱重工業株式会社 | Laser machining method and laser machining device |
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