JPS5978793A - Laser working device - Google Patents
Laser working deviceInfo
- Publication number
- JPS5978793A JPS5978793A JP57187564A JP18756482A JPS5978793A JP S5978793 A JPS5978793 A JP S5978793A JP 57187564 A JP57187564 A JP 57187564A JP 18756482 A JP18756482 A JP 18756482A JP S5978793 A JPS5978793 A JP S5978793A
- Authority
- JP
- Japan
- Prior art keywords
- work
- workpiece
- laser light
- moving
- speed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、レーザ光による加工装置に係υ、符に、尚速
度で多数の穴あけを行なうに好適な穿孔装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a processing device using a laser beam, and particularly to a drilling device suitable for drilling a large number of holes at high speed.
レーザビームを被加工物上を走査して、加工する方法と
して、第１図に示す構成のものか提案されている。（実
開昭５３−１１７８６）図において、レーザ発振器１か
らのレーザ光２は、回転ミラー３で反射され集光レンズ
４で集光され、被加工物５上に至る。回転ミ２−３の回
転によって、被加工物５上の加工点６が移動し、被加工
物を移動する事無く、高速度で加工が行なわれ、レーザ
発振器ｌをパルス発振させると、穿孔加工が連続的に行
なわれることになる。しかし、この方法では、
■ 走査距離が大きくなると、集光レンズ４での焦点位
置の補正が困難になる。As a method of scanning a workpiece with a laser beam for processing, a structure shown in FIG. 1 has been proposed. In the figure, a laser beam 2 from a laser oscillator 1 is reflected by a rotating mirror 3, condensed by a condensing lens 4, and reaches a workpiece 5. The machining point 6 on the workpiece 5 is moved by the rotation of the rotary machine 2-3, and machining is performed at high speed without moving the workpiece. When the laser oscillator l is pulsed, drilling is performed. will be performed continuously. However, with this method, (1) When the scanning distance becomes large, it becomes difficult to correct the focal position of the condenser lens 4;
■ 被加工物の板厚が厚くなると、穿孔に必要なエネル
ギーも大となるので、ｌパルスでの穿孔は難しく、複数
パルスでの穿孔作業となるが、回転ミラー３は回転、停
止を伴うため、多数の穿孔には適さない。■ As the thickness of the workpiece increases, the energy required for drilling increases, so it is difficult to drill with one pulse, and the drilling work must be done with multiple pulses. However, since the rotating mirror 3 involves rotation and stopping, , not suitable for large number of holes.
などの問題がおった。There were problems such as:
本発明の目的は、複数・くルスによる穿孔作業を高速度
で処理できる穿孔装置を提供するにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a drilling device that can perform drilling operations using multiple holes at high speed.
本発明の要点は被加工物を一定速度で移動している状態
で、レーザビームを限られｆｃ、範囲で走査し、両者の
移動速度、方向を一致させて、被加工物を停止させる事
無く、複数パルスによる穿孔作業ができるようにしたこ
とにある。The main point of the present invention is to scan the laser beam over a limited fc range while the workpiece is moving at a constant speed, and to match the moving speed and direction of both, without stopping the workpiece. , the ability to perform drilling operations using multiple pulses.
実施例 以下、本発明の一実施例を第２図にょシ説明する。Example An embodiment of the present invention will be described below with reference to FIG.
レーザ光発生装置１からパルス的に発振されるレーザ光
２は、振動平面鏡３にょシ反射され、集光レンズ７によ
フ集光されて、被加工物５上の加工点８へ照射される。A laser beam 2 emitted in a pulsed manner from a laser beam generator 1 is reflected by a vibrating plane mirror 3, focused by a condensing lens 7, and irradiated onto a processing point 8 on a workpiece 5. .
振動平面ｆｉ１．ａは、支点６を中心として、図示しな
い振動装置により矢印７の方向へ回転されるため、加工
点８は矢印９の方向へ移動する。一方、被加工物５は移
動台車ｌｏ上に載ぜられておシ、駆動装［１１にょジや
はシ矢印９方向に一定速度で移動する。加工点８の移動
速度と、移動台車の移動速度を一致させておくと、レー
デ光２は、被加工物５上の同一点に照射される事になシ
、被加工物５を停止することなく複数個のパルスによム
ー個の穴あけ作業が可能となる。−個の穿孔作業が完了
すると、振動平面鏡３は、スタート点にもどり、次の穿
孔作業が始まる。Vibration plane fi1. Since a is rotated in the direction of arrow 7 about the fulcrum 6 by a vibration device (not shown), the processing point 8 moves in the direction of arrow 9. On the other hand, the workpiece 5 is placed on a moving carriage lo and is moved at a constant speed in the direction of arrow 9 by a drive unit 11. If the moving speed of the processing point 8 and the moving speed of the moving cart are made to match, the Radical light 2 will not be irradiated to the same point on the workpiece 5, and the workpiece 5 will be stopped. It is possible to drill multiple holes using multiple pulses. - When the drilling operation is completed, the vibrating plane mirror 3 returns to the starting point and the next drilling operation begins.
振動平面鏡３の移動方法の一実施例金弟３図ないし第５
図に示す。One embodiment of the method of moving the vibrating plane mirror 3 Figures 3 to 5
As shown in the figure.
一部に突起をもつ回転体１２は、支点１３を中心として
、矢印１４の方向に回転している。（第３図）
そして、只起の頂点を迎える′まで、レーザビームは、
振動平面鏡３の回転と共に右方向へ移動される。（第４
図）。突起の頂点を過ぎると、（第５図）振動平面鏡３
はスタート点にもどる。レーザ光２はパルス的に発振し
ているが、発振状態と、振動モ面鏡３の位置関係を第６
図に示す。（３パルス（２Ａ、２Ｂ（図示せず）、２Ｃ
）孔をあける作業の場合）
第６図では、パルス休止時間Ｔ、と、振動平面鏡３がス
タート点にもどるための時間Ｔ！はＴ。A rotating body 12 having a protrusion partially rotates about a fulcrum 13 in the direction of an arrow 14. (Fig. 3) The laser beam then reaches its peak,
As the vibrating plane mirror 3 rotates, it is moved to the right. (4th
figure). After passing the top of the protrusion (Fig. 5), the vibrating plane mirror 3
returns to the starting point. The laser beam 2 oscillates in a pulsed manner, and the oscillation state and the positional relationship of the vibrating movable mirror 3 are
As shown in the figure. (3 pulses (2A, 2B (not shown), 2C
) In the case of drilling a hole) In Fig. 6, the pulse pause time T and the time T for the vibrating plane mirror 3 to return to the starting point are shown. is T.
くＴ、となっているが、回転体１２の突起の数を増す事
によりＴ、＝Ｔ、とすることも可能である。However, by increasing the number of protrusions on the rotating body 12, it is also possible to set T,=T.
なお、上述の実施例では、振動モ面−３の振動方法とし
て、一部に突起をもった回転体１２を使用する場合につ
いて述べたが、本方法に駆足されるものではない。In addition, in the above-mentioned embodiment, as a method of vibrating the vibrating surface 3, a case has been described in which the rotary body 12 having a projection on a part is used, but this method is not required.
本発明によれば、被加工物を停止する挙なく、複数個の
パルスによる穿孔作業が可能となるため、厚物材を、＾
速贋で穿孔することができる。According to the present invention, it is possible to perform drilling using multiple pulses without stopping the workpiece, so thick materials can be
It can be perforated by fast counterfeiting.
第１図は従来の側面図、第２図は本発明の一実施例の側
面図、第３図ないし第５図は振動平面鏡の振動状況の説
明図、第６図は、振動平面鏡とレーザ出力の関係説明図
である。
１・・・レーザ光発生装置、２・・・レーザ光、３・・
・振動平面鏡、５・・・被加工物。
第５品
峙問Fig. 1 is a side view of the conventional device, Fig. 2 is a side view of an embodiment of the present invention, Figs. 3 to 5 are explanatory diagrams of the vibration status of the vibrating plane mirror, and Fig. 6 is the vibrating plane mirror and laser output. FIG. 1... Laser light generator, 2... Laser light, 3...
- Vibrating plane mirror, 5... Workpiece. Fifth item question
Claims (1)
光を、レーザ光走査装置、集光装置を経て被加工物上へ
照射するものくおいて、前記被加工物上のレーザ光移動
速度と、前記被加工物の移動速度を同一となして、前記
被加工物を停止することなく複数パルスにより穿孔する
ように構成した事を特徴とするレーザ加工装置。1. When a laser beam emitted in pulses from a laser beam generator is irradiated onto a workpiece through a laser beam scanning device and a condensing device, the speed of laser beam movement on the workpiece and . A laser processing apparatus, characterized in that the workpiece is moved at the same speed and is configured to drill holes with a plurality of pulses without stopping the workpiece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57187564A JPS5978793A (en) | 1982-10-27 | 1982-10-27 | Laser working device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57187564A JPS5978793A (en) | 1982-10-27 | 1982-10-27 | Laser working device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5978793A true JPS5978793A (en) | 1984-05-07 |
Family
ID=16208287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57187564A Pending JPS5978793A (en) | 1982-10-27 | 1982-10-27 | Laser working device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5978793A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6120687A (en) * | 1984-07-10 | 1986-01-29 | Japan Tobacco Inc | Laser drilling device |
| JPH07193374A (en) * | 1993-12-27 | 1995-07-28 | Taiyo Yuden Co Ltd | Method of processing ceramic green sheet |
| US6894250B2 (en) * | 2000-09-27 | 2005-05-17 | Eberhard Kertscher | Method for continuous manufacture of drip irrigation tubes utilizing a laser beam |
| USRE44886E1 (en) * | 2001-05-17 | 2014-05-13 | Preco, Inc. | Method and apparatus for improving laser hole resolution |
| WO2023048109A1 (en) * | 2021-09-22 | 2023-03-30 | 川崎重工業株式会社 | Laser processing method |
-
1982
- 1982-10-27 JP JP57187564A patent/JPS5978793A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6120687A (en) * | 1984-07-10 | 1986-01-29 | Japan Tobacco Inc | Laser drilling device |
| JPH07193374A (en) * | 1993-12-27 | 1995-07-28 | Taiyo Yuden Co Ltd | Method of processing ceramic green sheet |
| US6894250B2 (en) * | 2000-09-27 | 2005-05-17 | Eberhard Kertscher | Method for continuous manufacture of drip irrigation tubes utilizing a laser beam |
| USRE44886E1 (en) * | 2001-05-17 | 2014-05-13 | Preco, Inc. | Method and apparatus for improving laser hole resolution |
| WO2023048109A1 (en) * | 2021-09-22 | 2023-03-30 | 川崎重工業株式会社 | Laser processing method |
| TWI833362B (en) * | 2021-09-22 | 2024-02-21 | 日商川崎重工業股份有限公司 | Laser processing method |
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