JPS63155698U - - Google Patents

Info

Publication number
JPS63155698U
JPS63155698U JP4956087U JP4956087U JPS63155698U JP S63155698 U JPS63155698 U JP S63155698U JP 4956087 U JP4956087 U JP 4956087U JP 4956087 U JP4956087 U JP 4956087U JP S63155698 U JPS63155698 U JP S63155698U
Authority
JP
Japan
Prior art keywords
hybrid
shield case
board
hic
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4956087U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4956087U priority Critical patent/JPS63155698U/ja
Publication of JPS63155698U publication Critical patent/JPS63155698U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第2図は本考案によるシールドケース
付HIC用基板を組み込んだHICの、それぞれ
上面断面図、側面断面図である。 1……本考案によるHIC用基板、2……部品
、3……リード端子、4……シールドケース、5
……HIC用基板切り欠け部。 第3図は本考案によるHIC用基板のリード端
子取付け部上面図である。 1……本考案によるHIC用基板(部分)、3
……リード端子、4……シールドケース。 第4図から第6図は本考案による、その他の実
施例であるHIC用基板を組み込んだ、シールド
ケース付HICの上面断面図である。 21……本考案によるHIC用基板、25……
HIC用基板切り欠け部、31……本考案による
HIC用基板、35……HIC用基板切り欠け部
、41……本考案によるHIC用基板、44……
内形が円であるシールドケース、45……HIC
用基板切り欠け部。
1 and 2 are a top sectional view and a side sectional view, respectively, of an HIC incorporating a HIC substrate with a shield case according to the present invention. 1... HIC board according to the present invention, 2... Parts, 3... Lead terminal, 4... Shield case, 5
...Notch part of the HIC board. FIG. 3 is a top view of the lead terminal mounting portion of the HIC board according to the present invention. 1... HIC substrate (part) according to the present invention, 3
...Lead terminal, 4...Shield case. 4 to 6 are top sectional views of an HIC with a shield case incorporating a HIC substrate according to another embodiment of the present invention. 21... HIC substrate according to the present invention, 25...
HIC substrate notch, 31... HIC substrate according to the present invention, 35... HIC substrate notch, 41... HIC substrate according to the present invention, 44...
Shield case with circular inner shape, 45...HIC
Notch part of the PCB.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リード線を有するシールドケース付ハイブリツ
ドIC用基板において、シールドケース内形を原
形とした該ハイブリツドIC用基板の、少なくと
も1ケ所にリード端子を取り付ける為の切り欠け
部を有することを特徴とするシールドケース付ハ
イブリツドIC用基板形状。
A shield case for a hybrid IC board with a shield case having lead wires, characterized in that the hybrid IC board has a notch for attaching a lead terminal at at least one location on the hybrid IC board whose original shape is the inside shape of the shield case. Substrate shape for hybrid IC with attached.
JP4956087U 1987-03-31 1987-03-31 Pending JPS63155698U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4956087U JPS63155698U (en) 1987-03-31 1987-03-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4956087U JPS63155698U (en) 1987-03-31 1987-03-31

Publications (1)

Publication Number Publication Date
JPS63155698U true JPS63155698U (en) 1988-10-12

Family

ID=30872125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4956087U Pending JPS63155698U (en) 1987-03-31 1987-03-31

Country Status (1)

Country Link
JP (1) JPS63155698U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0365295U (en) * 1989-10-31 1991-06-25

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0365295U (en) * 1989-10-31 1991-06-25

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