JPS62126866U - - Google Patents
Info
- Publication number
- JPS62126866U JPS62126866U JP1290286U JP1290286U JPS62126866U JP S62126866 U JPS62126866 U JP S62126866U JP 1290286 U JP1290286 U JP 1290286U JP 1290286 U JP1290286 U JP 1290286U JP S62126866 U JPS62126866 U JP S62126866U
- Authority
- JP
- Japan
- Prior art keywords
- mounting structure
- slit
- conductor land
- chip component
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims 1
- 238000013022 venting Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案が適用されるプリント基板の要
部拡大断面図、第２図はその部分拡大斜視図、第
３図〜第５図はプリント基板に対するチツプ部品
の取付順序を示す断面図、第６図イ〜ホは導体ラ
ンド部に形成するスリツト形状の他の例を示す部
分平面図である。
１０…プリント基板、１１…導体ランド部、１
００…チツプ部品、１０２…リード部、１２…ス
リツト。
FIG. 1 is an enlarged cross-sectional view of the main part of a printed circuit board to which the present invention is applied, FIG. 2 is a partially enlarged perspective view thereof, and FIGS. 3 to 5 are cross-sectional views showing the order in which chip parts are attached to the printed circuit board. FIGS. 6A to 6E are partial plan views showing other examples of the slit shape formed in the conductor land portion. 10...Printed circuit board, 11...Conductor land portion, 1
00... Chip parts, 102... Lead portion, 12... Slit.
Claims (1)
シングに一体化されたリード部を設置し、半田付
け接合されるチツプ部品の取付構造において、前
記導体ランド部の前記リード部設置位置から外側
方にスリツトを延出形成し、このスリツトにより
ガス抜き通路を形成するようにしたことを特徴と
するチツプ部品の取付構造。 In a mounting structure for a chip component that is soldered and joined by installing a lead part integrated into a casing on a conductor land part formed on a printed circuit board, a slit is formed outward from the lead part installation position of the conductor land part. A mounting structure for a chip component, characterized in that the chip part is formed in an extending manner, and the slit forms a gas venting passage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1290286U JPS62126866U (en) | 1986-01-31 | 1986-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1290286U JPS62126866U (en) | 1986-01-31 | 1986-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62126866U true JPS62126866U (en) | 1987-08-12 |
Family
ID=30801462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1290286U Pending JPS62126866U (en) | 1986-01-31 | 1986-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62126866U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011243853A (en) * | 2010-05-20 | 2011-12-01 | Panasonic Corp | Mounting structure |
| WO2019159521A1 (en) * | 2018-02-15 | 2019-08-22 | 株式会社村田製作所 | Multilayer substrate and electric element |
-
1986
- 1986-01-31 JP JP1290286U patent/JPS62126866U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011243853A (en) * | 2010-05-20 | 2011-12-01 | Panasonic Corp | Mounting structure |
| WO2019159521A1 (en) * | 2018-02-15 | 2019-08-22 | 株式会社村田製作所 | Multilayer substrate and electric element |
| JPWO2019159521A1 (en) * | 2018-02-15 | 2020-08-27 | 株式会社村田製作所 | Multilayer substrate and electric element |
| US11064606B2 (en) | 2018-02-15 | 2021-07-13 | Murata Manufacturing Co., Ltd. | Multilayer substrate and electric element |
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