JPS63154398A - Manufacture of ic card - Google Patents
Manufacture of ic cardInfo
- Publication number
- JPS63154398A JPS63154398A JP61303362A JP30336286A JPS63154398A JP S63154398 A JPS63154398 A JP S63154398A JP 61303362 A JP61303362 A JP 61303362A JP 30336286 A JP30336286 A JP 30336286A JP S63154398 A JPS63154398 A JP S63154398A
- Authority
- JP
- Japan
- Prior art keywords
- card
- resin
- module
- base material
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 238000000034 method Methods 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 17
- 238000000465 moulding Methods 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 239000004645 polyester resin Substances 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 2
- 229920001225 polyester resin Polymers 0.000 claims description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000015654 memory Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920006230 thermoplastic polyester resin Polymers 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Credit Cards Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明はＩＣモジュールを装着もしくは内蔵したＩＣカ
ードの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for manufacturing an IC card with an IC module mounted or built therein.
近年、マイクロコンピュータ、メモリなどのＩＣチップ
をモジュール化したＩＣモジュールが装備されたチップ
カード、メモリカード、マイコンカードあるいは電子カ
ードと呼ばれるカード（以下、単にＩＣカードという）
の研究が進められている。In recent years, cards called chip cards, memory cards, microcomputer cards, or electronic cards (hereinafter simply referred to as IC cards) are equipped with IC modules that are modularized IC chips such as microcomputers and memories.
Research is underway.
このようなＩＣカードは、従来の磁気カードに比べて、
その記憶容量が大きいことがら、銀行関係では貯金通帳
に代り預貯金の履歴を、そのクレジット関係で買物など
の取引履歴を記憶させようと考えられている。Compared to conventional magnetic cards, such IC cards have
Because of their large storage capacity, banks are considering storing the history of deposits and savings in place of a savings passbook, and storing the history of transactions such as shopping in the case of credit cards.
ところで従来のＩＣカードにおいては、ＩＣモジュール
はカード基材と異なる材料がら構成されており、このよ
うなＩＣモジュールをカード基材中に埋設する方法とし
ては、積層形成されたカード基材にエンドミル、ドリル
等の方法によりＩＣモジュール大の凹部を設け、この凹
部中に接着剤を介してＩＣモジュールを埋設する方法が
ある。By the way, in conventional IC cards, the IC module is made of a material different from the card base material, and the method of embedding such an IC module in the card base material is to use an end mill, an end mill, etc. in the laminated card base material. There is a method in which a recess the size of an IC module is provided using a method such as a drill, and the IC module is buried in the recess using an adhesive.
あるいは、ＩＣモジュール相当の厚さを存する積層用シ
ートの所望位置に打抜き、エンドミル、ドリル等により
ＩＣモジュール大の埋設孔を設けた後にＩＣモジュール
支持用の積層用シートを仮貼り積層し、この後にＩＣモ
ジュールを上記埋設孔中に埋設しプレスラミネートを行
なう方法が採用されている。Alternatively, after punching out a hole the size of an IC module using an end mill, drill, etc. at a desired position on a lamination sheet with a thickness equivalent to that of an IC module, a lamination sheet for supporting the IC module is temporarily pasted and laminated. A method has been adopted in which the IC module is buried in the hole and then press laminated.
しかしながら、従来法で製造されるＩＣカードは、前述
のように、ＩＣモジュールとこれを埋設するＩＣカード
基材の材質が異なるため、両者の弾性率、膨張係数等の
特性の違いにより、カードを湾曲させた場合に、ＩＣモ
ジュールが離脱したリカード基材に亀裂やカールが発生
したりするという問題がある。However, as mentioned above, IC cards manufactured using conventional methods are made of different materials for the IC module and the IC card base material in which it is embedded. When it is bent, there is a problem that cracks or curls occur in the Ricardo base material from which the IC module has been detached.
〔発明の概要〕 ・
本発明は上述した従来技術の問題点に鑑みてなされたも
のであり、ＩＣ，モジュールの脱落、亀裂やカールの発
生の防止が図られ、曲げに対する機械的強度と柔軟性に
すぐれたＩＣカードを簡易かつ迅速に製造する方法を提
供することを目的としいている。[Summary of the invention] - The present invention has been made in view of the problems of the prior art described above, and is intended to prevent ICs and modules from falling off, cracking, and curling, and to improve mechanical strength and flexibility against bending. The purpose of the present invention is to provide a method for simply and quickly manufacturing an IC card with excellent quality.
本発明に係るＩＣカードの製造方法は、カード基材中に
ＩＣモジュールが埋設されてなるＩＣカードを製造する
に際し、ＩＣモジュールを構成するＩＣチップ等のデバ
イスが所定位置に配置されたＩＣカード基材型の中に樹
脂を注入し成形することにより、ＩＣモジュール部の樹
脂封止とＩＣカード基材の成形とを実質的に同一の工程
で行なうことを特徴としている。The method for manufacturing an IC card according to the present invention is a method for manufacturing an IC card in which an IC module is embedded in a card base material. By injecting resin into a material mold and molding it, resin sealing of the IC module part and molding of the IC card base material are performed in substantially the same process.
上記ＩＣカード基材型中に配置するデバイスとしては、
単層または多層基板からなるチップオンボード形態のも
の、チップオンボードをキャリアテープ形状にしたもの
、リードボンディングを利用したキャリアテープ状基板
、リードフレームにＩＣデバイスをマウントしたもの等
様々な形態のものが使用され得る。The devices placed in the above IC card base mold include:
Chip-on-board types made of single-layer or multi-layer substrates, chip-on-board shaped into carrier tapes, carrier tape-shaped substrates using lead bonding, IC devices mounted on lead frames, etc. may be used.
ＩＣデバイス部の樹脂封止とカード基材の成形は実質的
に同一の工程で行なわれ得るが、この時に使用する樹脂
材料としては、熱硬化性樹脂、熱可塑性樹脂の別は問わ
ない。熱硬化性樹脂としては、エポキシ樹脂、熱可塑性
樹脂としてはポリエステル樹脂、ポリフェニレンサルフ
ァイド樹脂が特に好ましく用いられる。Resin sealing of the IC device portion and molding of the card base material can be performed in substantially the same process, but the resin material used at this time does not matter whether it is a thermosetting resin or a thermoplastic resin. As the thermosetting resin, epoxy resin is particularly preferably used, and as the thermoplastic resin, polyester resin and polyphenylene sulfide resin are particularly preferably used.
これらの樹脂は、いずれもその熱変形温度が１００℃以
上であり、従来の塩化ビニル樹脂製カードに比べて耐熱
性にすぐれている。したがって、この特性を利用して自
動車搭載用ＩＣカード、工場内の工程管理用ＩＣカード
等比較的過酷な条件下で使用さるカードとして用いるこ
とが可能となる。All of these resins have a heat distortion temperature of 100° C. or higher, and have superior heat resistance compared to conventional vinyl chloride resin cards. Therefore, by utilizing this characteristic, it is possible to use the card as an IC card for use in a car, an IC card for process control in a factory, etc., which is used under relatively harsh conditions.
封止成形方法としては、熱硬化性樹脂の場合には、トラ
ンスファーモールド法、熱可塑性樹脂の場合には、イン
ジェクション法が好ましく用いられる。これらの方法で
得たＩＣカードは、ＩＣモジュールの離脱やカード基材
の亀裂発生防止の点で特にすぐれている。As the sealing molding method, a transfer molding method is preferably used in the case of a thermosetting resin, and an injection method is preferably used in the case of a thermoplastic resin. IC cards obtained by these methods are particularly excellent in preventing detachment of the IC module and cracking of the card base material.
また、ＩＣデバイスの信頼性を向上させる上では、上記
トランスファー成形ないしインジェクション成形の前工
程で、ＩＣデバイス部の表面にエポキシ樹脂、ポリイミ
ド樹脂等の樹脂をあらかじめ塗布してチップコードを行
なっておくことが好ましい。In addition, in order to improve the reliability of IC devices, it is recommended to apply a resin such as epoxy resin or polyimide resin to the surface of the IC device part in advance in the process before the transfer molding or injection molding to perform chip coding. is preferred.
樹脂の封入、成形工程を経たのち表面研摩等、所定の後
処理を行なってＩＣカードを得る。After the resin encapsulation and molding steps, predetermined post-processing such as surface polishing is performed to obtain an IC card.
更に、本発明においては、付加的に磁気ストライブを所
望の位置に設けることによって他の記録媒体を組み合わ
せたカードとすることもできる。Furthermore, in the present invention, by additionally providing magnetic stripes at desired positions, it is also possible to create a card in which other recording media are combined.
以下、図面を参照しながら、本発明の詳細な説明する。Hereinafter, the present invention will be described in detail with reference to the drawings.
実施例１
第１図に示すようなリードフレーム１のマウント部１ａ
１．ｊＣデバイスを搭載し、所定のワイヤーボンディン
グを行なったのち、トランスファーモールド方法により
エポキシ樹脂を注入してカード形状になるように樹脂封
止を行ない、第２図に示すような封止済カード２を製造
した。Example 1 Mounting part 1a of lead frame 1 as shown in FIG.
1. After mounting the jC device and performing predetermined wire bonding, epoxy resin is injected using a transfer molding method to seal the card into a card shape, resulting in a sealed card 2 as shown in Figure 2. Manufactured.
次に、カード外部端子を設けるために、カード部以外の
リードフレームのＩＣデバイズ搭載側と反対側の面を研
磨することによりカードを所定の厚さに成形するととも
にリードフレーム部を露出させて端子を設け、第３図に
示すようなＩＣカードを得た。Next, in order to provide card external terminals, the card is molded to a predetermined thickness by polishing the surface of the lead frame other than the card section opposite to the side on which the IC device is mounted, and the lead frame section is exposed to provide terminals. An IC card as shown in FIG. 3 was obtained.
上記のような方法で得たＩＣカードは、耐熱性にすぐれ
るとともに、耐ベンディング性にもすぐれていてた。The IC card obtained by the above method had excellent heat resistance and bending resistance.
実施例２
第４図に示すように、両面に電極が形成された１１１層
基板２０にＩＣチップ２１をマウントし、ワイヤーボン
ディングを行なったのち、これらの表面にエポキシ樹脂
を塗布してチップコート層２２を形成し、チップオンボ
ードを作成した（第５図）。Example 2 As shown in FIG. 4, an IC chip 21 is mounted on a 111-layer substrate 20 with electrodes formed on both sides, wire bonding is performed, and then epoxy resin is applied to these surfaces to form a chip coat layer. 22 was formed, and a chip-on-board was created (FIG. 5).
次いで、上記チップオンボードを射出成形機の金型内に
真空装着し、ポリエステル樹脂（ユニチカ社製ｒＧＰＮ
３２１０ＥＪ ）によってＩＣデバイス部の樹脂封止と
カード基材の成形を同時に行ない、第６図に示すＩＣカ
ード３を得た。Next, the chip-on-board was vacuum mounted in a mold of an injection molding machine, and polyester resin (rGPN manufactured by Unitika Co., Ltd.
3210EJ), resin sealing of the IC device portion and molding of the card base material were performed simultaneously to obtain the IC card 3 shown in FIG.
」二記方法により作成されたＩＣカードは、耐屈曲性に
すぐれるとともに生産性が極めてすぐれていた。 。The IC card produced by the method described in Section 2 had excellent bending resistance and extremely high productivity. .
本発明の方法によれば、ＩＣデバイス部の樹脂封止とカ
ード基材の成形が実質的に同一の工程で行なわれるので
、迅速にしかも簡易な手段でＩＣカードを製造すること
ができ、得られるＩＣカードは耐屈曲性に極めてすぐれ
ている。According to the method of the present invention, the resin sealing of the IC device part and the molding of the card base material are performed in substantially the same process, so that the IC card can be manufactured quickly and with simple means, and it is advantageous. This IC card has extremely high bending resistance.
第１図〜第６図は、本発明に係るＩＣカードの製造方法
の製造工程を示す平面図ないし斜視図である。
１・・・リードフレーム、２・・・封止済ＩＣカード、
３・・・ＩＣカード、２１・・・ＩＣチップ出願人代理
人 佐 藤 −雄
第３図
嵩６図1 to 6 are plan views and perspective views showing the manufacturing steps of the IC card manufacturing method according to the present invention. 1... Lead frame, 2... Sealed IC card,
3...IC card, 21...IC chip applicant's agent Mr. Sato Figure 3, Figure 6
Claims (2)
ＩＣカードを製造するに際し、ＩＣモジュールを構成す
るＩＣチップ等のデバイスが所定位置に配置されたＩＣ
カード基材型の中に樹脂を注入し成形することにより、
ＩＣモジュール部の樹脂封止とＩＣカード基材の成形と
を実質的に同一の工程で行なうことを特徴とする、ＩＣ
カードの製造方法。1. When manufacturing an IC card in which an IC module is embedded in a card base material, an IC in which devices such as an IC chip constituting the IC module are placed in a predetermined position.
By injecting resin into the card base mold and molding,
An IC characterized in that resin sealing of an IC module part and molding of an IC card base material are performed in substantially the same process.
How to make cards.
たはポリフェニレンサルファイド樹脂からなる、特許請
求の範囲第１項に記載の方法。2. 2. The method of claim 1, wherein the resin comprises an epoxy resin, a polyester resin or a polyphenylene sulfide resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61303362A JPH0761754B2 (en) | 1986-12-19 | 1986-12-19 | Method of manufacturing IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61303362A JPH0761754B2 (en) | 1986-12-19 | 1986-12-19 | Method of manufacturing IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63154398A true JPS63154398A (en) | 1988-06-27 |
| JPH0761754B2 JPH0761754B2 (en) | 1995-07-05 |
Family
ID=17920073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61303362A Expired - Lifetime JPH0761754B2 (en) | 1986-12-19 | 1986-12-19 | Method of manufacturing IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0761754B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0288298A (en) * | 1988-09-27 | 1990-03-28 | Matsushita Electron Corp | Ic card |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS607760A (en) * | 1983-06-28 | 1985-01-16 | Toshiba Corp | Manufacture of ic card |
| JPS61222715A (en) * | 1985-03-28 | 1986-10-03 | Mitsubishi Electric Corp | Manufacture of resin molded body |
| JPS61248795A (en) * | 1985-04-26 | 1986-11-06 | 菱電化成株式会社 | Integrated circuit card |
-
1986
- 1986-12-19 JP JP61303362A patent/JPH0761754B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS607760A (en) * | 1983-06-28 | 1985-01-16 | Toshiba Corp | Manufacture of ic card |
| JPS61222715A (en) * | 1985-03-28 | 1986-10-03 | Mitsubishi Electric Corp | Manufacture of resin molded body |
| JPS61248795A (en) * | 1985-04-26 | 1986-11-06 | 菱電化成株式会社 | Integrated circuit card |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0288298A (en) * | 1988-09-27 | 1990-03-28 | Matsushita Electron Corp | Ic card |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0761754B2 (en) | 1995-07-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |